Toshiba has developed a range of fifth-generation horizontal-deflection-output transistors (HV-Trs). Radical redesign of
the emitter electrode and the contact pattern has yielded significant improvements, resulting in higher current density
and superior electrical characteristics compared to those of fourth-generation products. Toshiba’s propriety glassmesa structure results in a high breakdown voltage.
Thanks to Toshiba’s wealth of experience and the wide variety of products which the company can offer, Toshiba
horizontal-deflection-output transistors are used World-wide in color TVs and video display monitors.
2
Appearance, Package and Weight
The photographs below show the products and their markings. The packages shown are is the straight-lead
packages used for standard products.
Appearance
TO-3P(H)ISTO-3P(LH)
2SC5411
5.5g ( typ. )
2SC5570
9.75g ( typ. )
Package dimensions
3.6 ± 0.33.0 ± 0.315.5 ± 0.5
4.0
2.3 max
0.95 max
5.45
+ 0.25
3.3
4.5
0.9 – 0.1
123
10.0
1.2
2.52.0
5.45
2.0
26.5 ± 0.5
5˚
16.4 min
5.5 ± 0.3
10˚
1. Base
2. Collector
3. Emitter
(Unit : mm)
TO-3P(LH)TO-3P(H)IS
10˚
23.0
22.0 ± 0.5
5˚
5˚
20.5 max 3.3 ± 0.2
2.5
3.0
123
1.5
1.5
1.5
2.50
+ 0.3
1.0 – 0.25
5.45 ± 0.155.45 ± 0.15
– 0.10
+ 0.25
0.6
6.0
± 0.5
4.0
26.0
2.0
11.0
± 0.6
20.0
5.2 max
2.8
1. Base
2. Collector (heat sink)
3. Emitter
2.0
3
Page 3
3
BE
BE
Device Trends
Market trends and the development of horizontal-deflection output transistors
Device Trends
Market requirements
TV
Wide-screen TVs
Wide-screen
•
aspect ratio: (4 : 3) –> (16 : 9)
Large screen size
•
Flat screen
•
Low loss
•
Lower prices
•
Development of Horizontal-Deflection Output Transistors
HDTVs / Projectors
Multimedia-compatible TVs
Digital TV
Improved in screen resolution quality
•
Screen resolution: 525p, 1125i, 780p
Progressive system is improved
Starting grand wave digital
broadcasting
Various appllications such as
DVDs and Cable TVs
Various screen size
•
Flat screen
•
Low loss
•
Emitter contact shape and chip size optimization
Enhancement of 1700 V
•
product line
Low price due to reduction in
•
chip size
Fourth generation of horizontal-
deflection output transistors
Development of 2000-V products
•
Development of products incorporating
•
diodes for use in digital TVs
Shorter t
•
•
V
•
TO-3P(H)IS packages
21-A products available
•
rr
Reduced saturation voltage
(sat) = 3 V (max)
CE
High-current devices housed in
Reduced variation in product characteristics
Fifth generation of horizontal-deflection
s
output transistors
Video display monitors
High horizontal frequency
•
21 inches f
Large screen size
•
Standard size: 15 inches –> 17 inches
Low price
•
Reduced part count
(driving circuit and resonating capacitor are fixed)
Low loss
•
Flat screen
•
Reduced switching loss (tf parts) due to
•
high-frequency operation tf = 150 ns (max)
Reduced saturation voltage at high currents
•
V
CE
High-current devices housed in
•
TO-3P(H)IS packages
21-A products available
Increased allowable power dissipation
•
TO-3P(H) IS 65 W –> 75 W
TO-3P(LH) 200 W –> 220 W
Reduced variation in product characteristics
•
= 120 kHz –> 135 kHz
H
(sat) = 3 V (max)
4
High breakdown capability
1
The product features a glass mesa structure,
the use of which yields a wide forward- and
reverse-biased safe operating area.
Low saturation voltage
2
VCE(sat) = 3 V (max)
Note: Used for 2SC-Series devices without
damper diodes.
Wider range of optimum drive conditions
3
Fluctuation in optimum drive conditions due to variation in device quality has been minimized for
ease of design.
Revised emitter contact shape and optimized chip size
3
Chip design has been optimized using Toshiba simulation technology. The emitter's contact area
has been widened by changing the contact shape below the emitter electrode from comb type to the
new mesh type. As a result, the saturation voltage (V
reduced, thus reducing switching loss.
Device with highest I
High-current version of 2SC5411
1700-V version of 2SC5411
2SC5587 and 2SC5589 use same chip.
2SC5588 and 2SC5590 use same chip.
Equivalent to 2SC5445
2SC5717 and 2SC5695 use same chip.
Equivalent to 2SC5411
Equivalent to 2SC5570
Target UseRemarks
Equivalent to 2SD2553
Target UseRemarks
Device with highest I
˜
1700-V version of 2SC5411
2SC5588 and 2SC5590 use same chip.
˜
˜
= 2000 V series
V
CBO
Built-in damper diode (High-current version of 2SC5143)
= 2000 V series
V
CBO
V
= 2000 V series (built-in damper diode)
CBO
Equivalent to 2SC5570
(max) ratings
C
(max) ratings
C
Note
★
★
★: Production schedules are provisional.
Note
Note
★
★
★
★: Production schedules are provisional.
7
Package
P
C
**
IC (sat)
3 A
3.5 A
4 A
4.5 A
5 A
5.5 A
6 A
7 A
8 A
11 A
12 A
14 A
15 A
17 A
22 A
Notes: **: IC(sat) is value of IC for V
( )
6
*
Product Line Matrix
Built-in
damper diode
2SD2599
2SD2586
2SD2499
S2055N
2SD2539
2SC5339
2SC5280
2SD2559
: 3rd generation (old design)
: 4th generation (new design)
: 5th generation (new design)
: 5th generation (new design under development)
thermal resistance
junction to case: Rth (j-c) = 0.625˚C/W (2SC5695)
case to fin (heat-sink): Rth (c-f) = 1˚C/W (supposition)
+) fin (heat-sink) to air: Rth (f-a) = 3.5˚C/W (supposition)
TOTAL (junction on ari): Rth (f-a) = 5.125˚C/W
SW Loss Capasitance (max) = ∆Tj (max)/Rth (j-a) x 80% derating
= 70/5.125 x 0.8
Vcc1 15 V
Vcc2 47 V (@ 32 kHz)
156 V (@ 100 kHz)
Cy = 4500 pF
Ly = 80 µH
HV-Tr
V
I
B
R
CE
4
CyLyL
Damper
diode
1 =
200 Ω
R
2 =
3 Ω
R
3 =
1.85 Ω
R
4 =
15 Ω
R
1 =
200 pF
C
2 =
3.3 µF
C
=
10 mH
L
C
2
Operating waveform example (21-inch ultra-high-resolution monitor) fH = 32 kHz to 100 kHz monitor
: 0
: 0
100 ns / div
I
C
I
B
V
CE
X-axis
Y-axis
@ fH = 32 kHz
Icp = 9 A
I
dI
·
B1
(end) = 0.75 A
·
·
B
/ dt = 3.5 A / µs
·
500 ns / div
: 1 A / div VCE : 200 V / div
I
B
IC : 1 A / div
IB: 0
I
I
B
IC: 0
V
V
: 0
CE
CE
IB : 1 A / div VCE : 10 V / div
IC : 1 A / div
C
I
B
IC: 0
V
CE
@ fH = 100 kHz
Icp = 8 A
·
B1
(end) = 1. 1 A
I
·
·
B
/ dt = 3.8 A / µs
dI
·
V
I
B
IC: 0
CE
: 0
: 0
500 ns / div
I
C
I
B
V
CE
500 ns / div
V
I
B
IC: 0
CE
: 0
: 0
100 ns / div
I
C
I
B
V
CE
100 ns / div
11
Page 11
13
5.45
123
5.45
1. Base
2. Collector
3. Emitter
4.95 ± 0.54.45 ± 0.5
9.4 ± 0.5
7.0 ± 0.5
1.8
(8.5)
(8)
5.45
123
5.45
1. Base
2. Collector
3. Emitter
15 ± 1
6.5 ± 0.5
5.3 ± 0.5
1.25
Lead-Forming
TO-3P(H)IS
2-16E302A2-16E303A
(2.25)(2.75)
10.2±0.6
15.2±0.8
5.45
5.45
4.04.0
8.0
1. Base
123
2. Collector
3. Emitter
2-16E305A2-16E306A
1.25
13.0 ± 0.5
5.45
123
5.45
5.3 ± 0.5
1. Base
2. Collector
3. Emitter
5.45
5.45
123
5.6 ± 0.5
6.9 ± 0.5
1. Base
2. Collector
3. Emitter
(Unit : mm)
2.5
7.0 ± 0.5
6.5 ± 0.5
12
2-16E307A2-16E309A
15.4 ± 0.5
5.45
123
5.45
1. Base
2. Collector
3. Emitter
2-16E311A2-16E313A
1.25
6.5 ± 0.56.55 min
15.4 ± 0.5
5.45
5.45
5.3 ± 0.5
5.45
(10.5)
4.95 ± 0.54.45 ± 0.5
5.45
1. Base
2. Collector
123
3. Emitter
123
9.4 ± 0.5
1. Base
2. Collector
3. Emitter
2.2
3.3 ± 0.5
(11)
Page 12
13
TO-3P(H)IS
2-16E314A2-16E315A
2.0
7.0 ± 0.5
35.4 ± 1.0
5.45
4.95 ± 0.54.45 ± 0.5
5.45
9.4 ± 0.5
5.45
123
1. Base
2. Collector
123
3. Emitter
2-16E316A
5.85 ± 0.5
10.35 ± 0.5
0.82 ± 0.5
4.0 ± 0.5
1. Base
2. Collector
3. Emitter
5.45
123
1.0.5 ± 0.52.95 ± 0.5
5.45
5.45
4 ± 0.5
8.0 ± 0.5
2.25
+ 1.0
4 ± 0.5
1. Base
2. Collector
3. Emitter
2.75
0.5
–
10.2
(Unit : mm)
TO-3P(LH)
5.45 ± 0.155.45 ± 0.155.45 ± 0.6
2-21F208A2-21F218A
3.0
6.5 ± 0.6
17.0 ± 0.8
20.0 ± 0.6
5.45 ± 0.155.45 ± 0.15
2
1. Base
123
2. Collector (heat sink)
3. Emittor
1
3
3.5 ± 0.5
7.0 ± 0.8
18.5 ± 0.8
4.0 ± 0.54.0 ± 0.5
8.0 ± 1.0
1. Base
2. Collector (heat sink)
3. Emitter
(Unit : mm)
13
Page 13
14
Explanation of markings
Toshiba hor izontal-deflection output transistors are manufactured in Japan (at the Himeji Semiconductor Works)
and in Malaysia (at Toshiba Electronics Malaysia Sdn. Bhd.). Toshiba Electronics Malaysia Sdn. Bhd. only
manufactures T O-3P(H)IS products.
Markings
(As of April 2001)
Place of Manufacture
Package type
Marking Example
Definition
TOSHIBA ELECTRONICS
MALAYSIA SDN. BHD
(made in Malaysia)
TO-3P(H)ISTO-3P(LH)
TOSHIBA
C5411
21A
3
*
Himeji Semiconductor Works
(made in Japan)
1
*
2
*
3
*
4
*
5
TOSHIBA
2SC5570
1A2
JAPAN
1
*
2
*
4
*
*
1: Manufacturer’s marking: “T”, “ ”, “TOSHIBA”
*
2: Product number or abbreviated product number
*
3: Code: “1”, “2”, “3”, “A”, “B”, “C”
*
4: Lot number: month and year of manufacture
*
Month of manufacture: January to December are denoted by the letters A to L respectively.
Year of manufacture: last decimal digit of year of manufacture
“1A”, as shown on the above package, indicates manufacture in January 2001.
5: Country of origin
*
Since TO-3P(LH) packages are only made in Japan, “JAP AN” is displayed.
List of Superseded, Final-Phase and
Discontinued Products
Superseded
Products
Electrical characteristics and packages are same.
Electrical characteristics have are high grade.
Electrical characteristics are low grade.
Package (allowable power disspation) are high grade.
Package (allowable power disspation) are low grade.
Damper diode is built-in or not.
777 East Campbell Rd., Suite 650, Richardson,
TX 75081, U.S.A.
Tel: (972)480-0470 Fax: (972)235-4114
San Jose Engineering Center, CA
1060 Rincon Circle, San Jose, CA 95131, U.S.A.
Tel: (408)526-2400 Fax:(408)526-2410
Wakefield, MA(Boston)
401 Edgewater Place, Suite #360, Wakefield,
MA 01880-6229, U.S.A.
Tel: (781)224-0074 Fax: (781)224-1095
Toshiba Do Brasil S.A.
Electronic Components Div.
Estrada Dos Alvarengas, 5. 500-Bairro Alvarenga
09850-550-Sao Bernardo do campo - SP
Tel: (011)7689-7171 Fax: (011)7689-7189
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the
responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for
the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used
within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind
the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor
Reliability Handbook" etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed
in this document shall be made at the customer’s own risk.
Level 11, Top Glory Insurance Building, Grand Century
Place, No.193, Prince Edward Road West,
Mong Kok, Kowloon, Hong Kong
Tel: 2375-6111 Fax: 2375-0969
Beijing Office
Rm 714, Beijing Fortune Building,
No.5 Dong San Huan Bei-Lu, Chao Yang District,
Beijing, 100004, China
Tel: (010)6590-8795 Fax: (010)6590-8791
Chengdu Office
Unit F, 18th Floor, New Times Plaza, 42 Wenwu Road,
Xinhua Avenue, Chengdu, 610017, China
Tel: (028)675-1773 Fax: (028)675-1065
Shenzhen Office
Rm 3010-3012, Office Tower Shun Hing Square,
Di Wang Commercial Centre, 333 ShenNan
East Road, Shenzhen, 518008, China
Tel: (0755)246-1582 Fax: (0755)246-1581