TEXAS INSTRUMENTS UCC1800, UCC1801, UCC1802, UCC1803, UCC1804 Technical data

...

Download

Low-Power BiCMOS Current-Mode PWM

application

INFO

available

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

FEATURES

µA Typical Starting Supply Current

100

•

500

µA Typical Operating Supply

•

Current Operation to 1MHz

•

Internal Soft Start

•

Internal Fault Soft Start

•

DESCRIPTION

The UCC1800/1/2/3/4/5 family of high-speed, low-power integrated cir cuits contain all of the control and drive components required for off-line and DC-to-DC fixed frequency current-mode switching power supplies with minimal parts count.

These devices have the same pin configuration as the UC1842/3/4/5 family, and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.

The UCC1800/1/2/3/4/5 family offers a variety of package options, tem

Internal Leading-Edge Blanking of the

•

Current Sense Signal 1 Amp Totem-Pole Output

•

perature range options, choice of maximum duty cycle, and choice of critical voltage levels. Lower reference parts such as the UCC1803 and UCC1805 fit best into battery operated systems, while the higher refer ence and the higher UVLO hysteresis of the UCC1802 and UCC1804

70ns Typical Response from

•

Current-Sense to Gate Drive Output

1.5% Tolerance Voltage Reference

•

• Same Pinout as UC3842 and

make these ideal choices for use in off-line power supplies. The UCC180x series is specified for operation from –55

the UCC280x series is specified for operation from –40 the UCC380x series is specified for operation from 0

Cto+70oC.

UC3842A

Part Number Maximum Duty Cycle Reference Voltage Turn-On Threshold Turn-Off Threshold

UCCx800 100% 5V 7.2V 6.9V UCCx801 50% 5V 9.4V 7.4V UCCx802 100% 5V 12.5V 8.3V UCCx803 100% 4V 4.1V 3.6V UCCx804 50% 5V 12.5V 8.3V UCCx805 50% 4V 4.1V 3.6V

C to +125oC,

Cto+85oC, and

BLOCK DIAGRAM

SLUS270C - MARCH 1999 - REVISED JANUARY 2005

UDG92009-3

ABSOLUTE MAXIMUM RATINGS (Note 1)

VCCVoltage (Note 2) ............................ 12.0V

Current (Note 2) .......................... 30.0mA

OUT Current...................................±1.0A

OUT Energy (Capacitive Load) ................... 20.0µJ

Analog Inputs (FB, CS).................... –0.3Vto 6.3V

Power Dissipation at T Power Dissipation at T Power Dissipation at T

Storage Temperature Range.............

Lead Temperature (Soldering, 10 Seconds) ........ +300°C

Note 1: Values beyond which damage may occur. All voltages

are with respect to GND. All currents are positive into the specified terminal. Consult Unitrode databook for information regarding thermal specifications and limita tions of packages.

Note 2: In normal operation V

limiting resistor. Absolute maximum of 12V applies when V that I

does not exceed 30mA (which includes gate

drive current requirement). The resistor should be sized so that the V tions is below 12V but above the turn off threshold.

< +25°C (N or J Package) ..... 1.0W

< +25°C (D Package)........ 0.65W

< +25°C (L Package) .......1.375W

–65°C to +150°C

is powered through a current

is driven from a low impedance source such

voltage, under operating condi

CONNECTION DIAGRAMS

TSSOP-8 (Top View) PW Package

COMP

DIL-8, SOIC-8 (Top View) J or N, D Package

COMP

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

REF

VCC

OUT

GND

REF

TEMPERATURE AND PACKAGE SELECTION

Temperature Range Available Packages

UCC180X –55°C to +125°C J, L UCC280X –40°C to +85°C N, D, PW UCC380X 0°C to +70°C N, D, PW

ORDERING INFORMATION

UCC

P AC KAGE

PRODUCT OPTION

TE MP E RAT UR E R ANG E

LCC-20 (TOP VIEW) L Package

VCC

OUT

GND

PACKAGE PIN FUNCTION

FUNCTION PIN

N/C 1

Comp 2

N/C 3-4

FB 5

N/C 6

CS 7 N/C 8-9 RC 10 N/C 11

PWR GND 12

GND 13

N/C 14

OUT 15

N/C 16

VCC 17

N/C 18-19

REF 20

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

ELECTRICAL CHARACTERISTICS

UCC180x; –40°C ≤ T CT=330pF from RC to GND; 0.1 F capacitor from V

PARAMETER TEST CONDITIONS UCC180X

≤ +85°C for UCC280x; 0°C ≤ TA≤ +70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;

Unless otherwise stated, these specifications apply for –55°C ≤ TA≤ +125°C for

to GND; 0.1 F capacitor from V

to GND. TA=TJ.

REF

UCC380X UNITS

UCC280X

MIN TYP MAX MIN TYP MAX

Reference Section

Output Voltage T

=+25°C, I=0.2mA, UCCx800/1/2/4 4.925 5.00 5.075 4.925 5.00 5.075 V

=+25°C, I=0.2mA, UCCx803/5 3.94 4.00 4.06 3.94 4.00 4.06

Load Regulation 0.2mA<I<5mA 10 30 10 25 mV Line Regulation T

=+25°C,

=10V to Clamp (I

=–55°C to +125°C,

=10V to Clamp (I

VCC

=25mA)

1.9 1.9 mV/V

2.5 2.1 mV/V

Total Variation UCCx800/1/2/4 (Note 7) 4.88 5.00 5.10 4.88 5.00 5.10 V

UCCx803/5 (Note 7) 3.90 4.00 4.08 3.90 4.00 4.08 V Output Noise Voltage 10Hz ≤ f ≤ 10kHz, T Long Term Stability T

=+125°C, 1000 Hours (Note 9) 5 5 mV

=+25°C (Note 9) 130 130 µV

Output Short Circuit –5 –35 –5 –35 mA

Oscillator Section

Oscillator Frequency UCCx800/1/2/4 (Note 4) 40 46 52 40 46 52 kHz

UCCx803/5 (Note 4) 26 31 36 26 31 36 kHz Temperature Stability (Note 9) 2.5 2.5 % Amplitude peak-to-peak 2.25 2.40 2.55 2.25 2.40 2.55 V Oscillator Peak Voltage 2.45 2.45 V

Error Amplifier Section

Input Voltage COMP=2.5V; UCCx800/1/2/4 2.44 2.50 2.56 2.44 2.50 2.56 V

COMP=2.0V; UCCx803/5 1.95 2.0 2.05 1.95 2.0 2.05 Input Bias Current

–11–11µA

Open Loop Voltage Gain 60 80 60 80 dB COMP Sink Current FB=2.7V, COMP=1.1V 0.3 3.5 0.4 2.5 mA COMP Source Current FB=1.8V, COMP=REF–1.2V –0.2 –0.5 –0.8 –0.2 –0.5 –0.8 mA Gain Bandwidth Product (Note 9) 2 2 MHz

PWM Section

Maximum Duty Cycle UCCx800/2/3 97 99 100 97 99 100 %

UCCx801/4/5 48 49 50 48 49 50 Minimum Duty Cycle COMP=0V 0 0 % Current Sense Section Gain (Note 5) 1.10 1.65 1.80 1.10 1.65 1.80 V/V Maximum Input Signal COMP=5V (Note 6) 0.9 1.0 1.1 0.9 1.0 1.1 V Input Bias Current

–200 200 –200 200 nA

CS Blank Time 50 100 150 50 100 150 ns Over-Current Threshold 1.42 1.55 1.68 1.42 1.55 1.68 V COMP to CS Offset CS=0V 0.45 0.90 1.35 0.45 0.90 1.35 V

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

ELECTRICAL CHARACTERISTICS

UCC180x; –40°C ≤ T CT=330pF from RC to GND; 0.1 F capacitor from V

PARAMETER TEST CONDITIONS UCC180X

≤ +85°C for UCC280x; 0°C ≤ TA≤ +70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;

Unless otherwise stated, these specifications apply for –55°C ≤ TA≤ +125°C for

to GND; 0.1 F capacitor from V

to GND. TA=TJ.

REF

UCC380X UNITS

UCC280X

Output Section

OUT Low Level I=20mA, all parts 0.1 0.4 0.1 0.4 V

I=200mA, all parts 0.35 0.90 0.35 0.90 V

I=50mA, VCC=5V, UCCx803/5 0.15 0.40 0.15 0.40 V

I=20mA, VCC=0V, all parts 0.7 1.2 0.7 1.2 V OUT High V

(VCC-OUT)

SAT

I=–20mA, all parts 0.15 0.40 0.15 0.40 V

I=–200mA, all parts 1.0 1.9 1.0 1.9 V

I=–50mA,VCC=5V, UCCx803/5 0.4 0.9 0.4 0.9 V Rise Time C Fall Time C

=1nF 41 70 41 70 ns

=1nF 44 75 44 75 ns

Undervoltage Lockout Section

Start Threshold (Note 8) UCCx800 6.6 7.2 7.8 6.6 7.2 7.8 V

UCCx801 8.6 9.4 10.2 8.6 9.4 10.2 V

UCCx802/4 11.5 12.5 13.5 11.5 12.5 13.5 V

UCCx803/5 3.7 4.1 4.5 3.7 4.1 4.5 V Stop Threshold (Note 8) UCCx1800 6.3 6.9 7.5 6.3 6.9 7.5 V

UCCx1801 6.8 7.4 8.0 6.8 7.4 8.0 V

UCCx802/4 7.6 8.3 9.0 7.6 8.3 9.0 V

UCCx803/5 3.2 3.6 4.0 3.2 3.6 4.0 V

Undervoltage Lockout Section (cont.)

Start to Stop Hysteresis UCCx800 0.12 0.3 0.48 0.12 0.3 0.48 V

UCCx801 1.6 2 2.4 1.6 2 2.4 V

UCCx802/4 3.5 4.2 5.1 3.5 4.2 5.1 V

UCCx803/5 0.2 0.5 0.8 0.2 0.5 0.8 V

Soft Start Section

COMP Rise Time FB=1.8V, Rise from 0.5V to REF–1V 4 10 4 10 ms

Overall Section

Start-up Current V

< Start Threshold 0.1 0.2 0.1 0.2 mA

Operating Supply Current FB=0V, CS=0V 0.5 1.0 0.5 1.0 mA VCC Internal Zener Voltage I VCC Internal Zener Voltage Minus

=10mA (Note 8), (Note 10) 12 13.5 15 12 13.5 15 V

UCCx802/4 (Note 8) 0.5 1.0 0.5 1.0 V

Start Threshold Voltage

Note 3: Adjust VCC above the start threshold before setting at 10V. Note 4: Oscillator frequency for the UCCx800, UCCx802 and UCCx803 is the output frequency.

Oscillator frequency for the UCCx801, UCCx804 and UCCx805 is twice the output frequency.

Note 5: Gain is defined by:

COMP

=≤≤

∆

008.

∆

Note 6: Parameter measured at trip point of latch with Pin 2 at 0V. Note 7: Total Variation includes temperature stability and load regulation. Note 8: Start Threshold, Stop Threshold and Zener Shunt Thresholds track one another. Note 9: Guaranteed by design. Not 100% tested in production. Note 10: The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.

PIN DESCRIPTIONS

COMP: COMP is the output of the error amplifier and the

input of the PWM comparator. Unlike other devices, the error amplifier in the UCC3800

family is a true, low output-impedance, 2MHz operational amplifier. As such, the COMP terminal can both source and sink current. However, the error amplifier is internally current limited, so that you can command zero duty cycle by externally forcing COMP to GND.

The UCC3800 family features built-in full cycle Soft Start. Soft Start is implemented as a clamp on the maximum COMP voltage.

CS: CS is the input to the current sense comparators. The UCC3800 family has two different current sense comparators: the PWM comparator and an over-current comparator.

The UCC3800 family contains digital current sense filter ing, which disconnects the CS terminal from the current sense comparator during the 100ns interval immediately following the rising edge of the OUT pin. This digital filtering, also called leading-edge blanking, means that in most applications, no analog filtering (RC filter) is required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller effective CS to OUT propagation delay. Note, however, that the minimum non-zero On-Time of the OUT signal is directly affected by the leading-edge-blanking and the CS to OUT propagation delay.

The over-current comparator is only intended for fault sensing, and exceeding the over-current threshold will cause a soft start cycle.

FB: FB is the inverting input of the error amplifier. For best stability, keep FB lead length as short as possible and FB stray capacitance as small as possible.

GND: GND is reference ground and power ground for all functions on this part.

OUT:OUT is the output of a high-current power driver ca pable of driving the gate of a power MOSFET with peak

currents exceeding ± 750mA. OUT is actively held low when V

The high-current power driver consists of FET output de vices, which can switch all of the way to GND and all of the way to V low impedance to overshoot and undershoot. This means that in many cases, external schottky clamp diodes are not required.

RC: RC is the oscillator timing pin. For fixed frequency operation, set timing capacitor charging current by con necting a resistor from REF to RC. Set frequency by con necting a timing capacitor from RC to GND. For best

is below the UVLO threshold.

. The output stage also provides a very

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

performance, keep the timing capacitor lead to GND as short and direct as possible. If possible, use separate ground traces for the timing capacitor and all other func tions.

The frequency of oscillation can be estimated with the following equations:

UCCx800/1/2/4:

UCCx803, UCCx805:

where frequency is in Hz, resistance is in ohms, and ca pacitance is in farads. The recommended range of timing resistors is between 10k and 200k and timing capacitor is 100pF to 1000pF. Never use a timing resistor less than 10k.

To prevent noise problems, bypass VCC to GND with a

ceramic capacitor as close to the VCC pin as possible. An electrolytic capacitor may also be used in addition to the ceramic capacitor.

REF: REF is the voltage reference for the error amplifier and also for many other functions on the IC. REF is also used as the logic power supply for high speed switching logic on the IC.

When V

is greater than 1V and less than the UVLO

threshold, REF is pulled to ground through a 5k ohm resistor. This means that REF can be used as a logic output indicating power system status. It is important for reference stability that REF is bypassed to GND with a ceramic capacitor as close to the pin as possible. An electrolytic capacitor may also be used in addition to the

ceramic capacitor. A minimum of 0.1µF ceramic is re quired. Additional REF bypassing is required for external loads greater than 2.5mA on the reference.

To prevent noise problems with high speed switching transients, bypass REF to ground with a ceramic capaci

tor very close to the IC package.

VCC: V

is the power input connection for this device.

In normal operation V limiting resistor. Although quiescent V

low, total supply current will be higher, depending on OUT current. Total V

current and the average OUT current. Knowing the

operating frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from:

=×

IQF

OUT g

There should be a minimum of 1.0mF in parallel with a

0.1mF ceramic capacitor from V

close to the device

15.

•

10.

•

is powered through a current

current is very

current is the sum of quiescent

to ground located

The UCC3800/1/2/3/4/5 oscillator generates a sawtooth waveform on RC. The rise time is set by the time constant of R

T and CT. The fall time is set by CT and an internal tran

sistor on-resistance of approximately 125 . During the fall time, the output is off and the maximum duty cycle is re duced below 50% or 100% depending on the part number. Larger timing capacitors increase the discharge time and re duce the maximum duty cycle and frequency.

Figure 1. Oscillator.

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

Figure 2. Error amplifier gain/phase response.

4.00

3.98

3.96

3.94

3.92

REF

3.90

V (V)

3.88

3.86

3.84

3.82 4 4.2 4.4 4.6 4.8

Figure 3. UCC1803/5 V

vs. VCC;I

REF

5.2 5.4 5.6 5.8 6

V (V)

LOAD

= 0.5mA.

1000

100pF

100

200pF

Oscillator Freq. (kHz)

10 100 1000

330pF

1nF

R(k)

Figure 4. UCC1800/1/2/4 oscillator frequency vs. RTand

1000

100

Oscillator Freq. (kHz)

100pF

200pF 330pF

1nF

10 100 1000

R(k)

Figure 5. UCC1803/5 oscillator frequency vs. RTand C

100

99.5 99

98.5 98

97.5 97

96.5

Maximum Duty Cycle (%)

95.5 95

10 100 1000

Oscillator Frequency (kHz)

Figure 6. UCC1800/2/3 maximum duty cycle vs.

C = 200pF

C = 330pF

oscillator frequency.

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

C = 100pF

49.5

48.5

47.5

Maximum Duty Cycle (%)

46.5 10 100 1000

Oscillator Frequency (kHz)

C = 200pF

C = 330pF

C = 100pF

Figure 7. UCC1801/4/5 maximum duty cycle vs. oscillator frequency.

I (mA)

0 100 200 300 400 500 600 700 800 900 1000

Oscillator Frequency (kHz)

V = 10V, 1nF

V = 8V, 1nF

V = 10V, No Load

V = 8V, No Load

Figure 8. UCC1800 ICC vs. oscillator frequency.

UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5

I (mA)

0 100 200 300 400 500 600 700 800 900 1000

Oscillator Frequency (kHz)

V = 10V, 1nF

V = 8V, 1nF

V = 10V, No Load

V = 8V, No Load

Figure 8. UCC1805 ICC vs. oscillator frequency.

1.1

1.0

0.9

500 450 400 350 300 250 200

Dead Time (ns)

150 100

100 200 300 400 500 600 700 800 900 1000

C (pF)

UCC1803/5

UCC1800/1/2/4

Figure 9. Dead time vs. CT,RT= 100k.

0.8

Slope = 1.8mV/ C

0.7

COMP to CS Offset (Volts)

0.6

-55-50 -25 0 25 50 75 100 125

Temperature (°C)

Figure 10. COMP to CS offset vs. temperature, CS=0V.

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-9451301MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451302MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451303MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451304MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451305MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

5962-9451305VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type

UCC1800J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1800J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1800L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

UCC1801J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1801J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC1802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1802J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC1803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1803J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC1804J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1804J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC1805J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1805J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC2800D ACTIVE SOIC D 8 75 Green (RoHS &

UCC2800DG4 ACTIVE SOIC D 8 75 Green (RoHS &

UCC2800DTR ACTIVE SOIC D 8 2500 Green (RoHS &

UCC2800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

UCC2800N ACTIVE PDIP P 8 50 Green (RoHS &

UCC2800NG4 ACTIVE PDIP P 8 50 Green (RoHS &

UCC2800PW ACTIVE TSSOP PW 8 150 Green (RoHS &

UCC2800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

UCC2800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

UCC2800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

UCC2801D ACTIVE SOIC D 8 75 Green (RoHS &

UCC2801DG4 ACTIVE SOIC D 8 75 Green (RoHS &

UCC2801DTR ACTIVE SOIC D 8 2500 Green (RoHS &

UCC2801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-2-260C-1 YEAR

Call TI Level-2-260C-1 YEAR

CU NIPDAU Level-1-260C-UNLIM

10-Mar-2008

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

no Sb/Br)

UCC2801N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2801NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2801PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2801PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI

UCC2802D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2802DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2802DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC2802N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2802NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2802PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2802PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2802PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI

UCC2803D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2803DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2803DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2803DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type

UCC2803N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2803NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2803PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2804D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

10-Mar-2008

(3)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

UCC2804D/70021 OBSOLETE SOIC D 8 TBD Call TI Call TI UCC2804D/81221 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804D/81221G4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DR81221G4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DTR/81221 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DTR/81260 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DTR/81260G4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2804N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2804NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2804PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2805D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2805DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2805DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2805DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC2805N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2805NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC2805PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2805PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC2805PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI

UCC3800D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3800DG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

10-Mar-2008

(3)

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

no Sb/Br)

UCC3800DTR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3800N ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3800NG4 ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3800PW ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

UCC3800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

UCC3800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

UCC3800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

UCC3801D ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

UCC3801DG4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

UCC3801DTR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3801N ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3801NG4 ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3801PW ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

UCC3801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

UCC3801PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

UCC3801PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

no Sb/Br)

UCC3802D ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

UCC3802DG4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br)

UCC3802DTR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

UCC3802N ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3802NG4 ACTIVE PDIP P 8 50 Green (RoHS &

no Sb/Br)

UCC3802PW ACTIVE TSSOP PW 8 150 Green (RoHS &

no Sb/Br)

10-Mar-2008

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-2-260C-1 YEAR

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-2-260C-1 YEAR

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-2-260C-1 YEAR

(3)

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

UCC3802PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3802PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI

UCC3803D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3803DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3803DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3803DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3803N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3803NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3803PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3804D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3804DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3804DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3804N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3804NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3804PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3805D ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3805DG4 ACTIVE SOIC D 8 75 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3805DTR ACTIVE SOIC D 8 2500 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

UCC3805DTR/81222G4 PREVIEW SOIC D 8 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

10-Mar-2008

(3)

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

UCC3805DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

10-Mar-2008

(3)

no Sb/Br)

UCC3805N ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3805NG4 ACTIVE PDIP P 8 50 Green (RoHS &

CU NIPDAU N / A for Pkg Type

no Sb/Br)

UCC3805PW ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3805PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &

CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UCC3805PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 6

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

19-Mar-2008

*All dimensions are nominal

Device Package

UCC2800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC2800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC2801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC2803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC2804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2804DTR/81221 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2804DTR/81260 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC2804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC2805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC3801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3801PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC3802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package

UCC3804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UCC3804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

UCC3805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

19-Mar-2008

(mm)W(mm)

Pin1

Quadrant

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UCC2800DTR SOIC D 8 2500 340.5 338.1 20.6

UCC2800PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC2801DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2802DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2803DTR SOIC D 8 2500 340.5 338.1 20.6

UCC2803PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC2804DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2804DTR/81221 SOIC D 8 2500 340.5 338.1 20.6 UCC2804DTR/81260 SOIC D 8 2500 340.5 338.1 20.6

UCC2804PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC2805DTR SOIC D 8 2500 340.5 338.1 20.6

UCC3800DTR SOIC D 8 2500 340.5 338.1 20.6

UCC3800PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC3801DTR SOIC D 8 2500 340.5 338.1 20.6

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UCC3801PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC3802DTR SOIC D 8 2500 340.5 338.1 20.6

UCC3803DTR SOIC D 8 2500 340.5 338.1 20.6

UCC3803PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC3804DTR SOIC D 8 2500 340.5 338.1 20.6

UCC3804PWTR TSSOP PW 8 2000 346.0 346.0 29.0

UCC3805DTR SOIC D 8 2500 340.5 338.1 20.6

19-Mar-2008

Pack Materials-Page 3

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

0,30 0,19

4,50 4,30

PINS **

Seating Plane

0,15

0,05

DIM

0,10

6,60 6,20

0,10

0,15 NOM

0°–8°

2016

Gage Plane

0,25

0,75 0,50

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A SQ

B SQ

12826 27

1314151618 17

0.020 (0,51)

0.010 (0,25)

MIN

0.342 (8,69)

0.442

0.640

0.739

0.938

1.141

0.358 (9,09)

0.458

(11,63)

0.660

(16,76)

0.761

(19,32)(18,78)

0.962

(24,43)

1.165

(29,59)

NO. OF

TERMINALS

432

0.020 (0,51)

0.010 (0,25)

(11,23)

(16,26)

(23,83)

(28,99)

MINMAX

0.307 (7,80)

0.406

(10,31)

0.495

(12,58)

0.495

(12,58)

0.850 (21,6)

1.047 (26,6)

0.080 (2,03)

0.064 (1,63)

MAX

0.358

(9,09)

0.458

(11,63)

0.560

(14,22)

0.560

(14,22)

0.858 (21,8)

1.063 (27,0)

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

4040140/D 10/96

MECHANICAL DATA

MPDI001A – JANUARY 1995 – REVISED JUNE 1999

P (R-PDIP-T8) PLASTIC DUAL-IN-LINE

0.400 (10,60)

0.355 (9,02)

0.260 (6,60)

0.240 (6,10)

0.021 (0,53)

0.015 (0,38)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001

0.070 (1,78) MAX

0.020 (0,51) MIN

0.200 (5,08) MAX

0.125 (3,18) MIN

0.100 (2,54)

0.010 (0,25)

Seating Plane

0.325 (8,26)

0.300 (7,62)

0.015 (0,38) Gage Plane

0.010 (0,25) NOM

0.430 (10,92) MAX

4040082/D 05/98

For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.400 (10,16)

0.355 (9,00)

0.063 (1,60)

0.015 (0,38)

0.100 (2,54)

0.065 (1,65)

0.045 (1,14)

0.020 (0,51) MIN

0.023 (0,58)

0.015 (0,38)

0.280 (7,11)

0.245 (6,22)

0.310 (7,87)

0.290 (7,37)

0.200 (5,08) MAX Seating Plane

0.130 (3,30) MIN

0°–15°

0.014 (0,36)

0.008 (0,20)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification. E. Falls within MIL STD 1835 GDIP1-T8

4040107/C 08/96

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Wireless www.ti.com/wireless

TEXAS INSTRUMENTS UCC1800, UCC1801, UCC1802, UCC1803, UCC1804 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual