1 2
3
4
5
6
7
8
HSD–
HSD+
OE
D
–
D+
N.C.
GND
V
CC
RSEPACKAGE
(TOP VIEW)
1 2
3
4
5
6
7
8
RSEPACKAGE
(BOTTOMVIEW)
HSD+
N.C.
D+
D–
OE
GND
V
CC
HSD–
N.C. Nointernalconnection -
www.ti.com
1
FEATURES
• V
Operation at 3 V and 4.3 V
CC
• 1.8-V Compatible Control-Pin Inputs
• I
Supports Partial Power-Down Mode
OFF
Operation
• r on= 10 Ω Maximum
• Δ r on<0.35 Ω Typical
• C
= 6 pF Typical
io(ON)
• Low Power Consumption (1 µ A Maximum)
• ESD Performance Tested Per JESD 22
– 6000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)
• Wide – 3-dB Bandwidth = 1220 MHz Typical
• Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
DESCRIPTION/ORDERING INFORMATION
The TS3USB31 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (750 MHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
– 40 ° C to 85 ° C QFN – RSE Tape and reel TS3USB31RSER L9
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
T
A
website at www.ti.com .
ORDERING INFORMATION
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PIN DESCRIPTION
NAME DESCRIPTION
OE Bus-switch enable
D+, D – ,
HSD+, HSD –
NC No connect
Data ports
1
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2007 – 2008, Texas Instruments Incorporated
HSD1+
HSD1–
Control
D+
D–
OE
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
TRUTH TABLE
OE FUNCTION
H Disconnect
L D+, D – = HSD+, HSD –
BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
V
IN
V
I/O
I
IK
I
I/OK
I
I/O
T
stg
Supply voltage range – 0.5 7 V
(2) (3) (4)
(2) (3)
HSD+, HSD – – 0.5 V
D+, D – when V
D+, D – when V
> 0 – 0.5 V
CC
= 0 5.25
CC
– 0.5 7 V
+ 0.3
CC
+ 0.3 V
CC
Control input voltage range
Switch I/O voltage range
Control input clamp current VIN< 0 – 50 mA
I/O port clamp current V
ON-state switch current
Continuous current through V
(5)
or GND ± 100 mA
CC
< 0 – 50 mA
I/O
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for V
(5) IIand IOare used to denote specific conditions for I
.
I/O
.
I/O
PACKAGE THERMAL IMPEDANCE
θ
JA
Package thermal impedance
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(1)
RSE package 253 ° C/W
± 64 mA
TYP UNIT
2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
TS3USB31
RECOMMENDED OPERATING CONDITIONS
(1)
MIN MAX UNIT
V
V
V
V
T
(1) All unused control inputs of the device must be held at V
ELECTRICAL CHARACTERISTICS
Supply voltage 3.0 4.3 V
CC
V
= 3 V to 3.6 V 1.3
High-level control input voltage V
IH
Low-level control input voltage V
IL
Data input/output voltage 0 V
I/O
Operating free-air temperature – 40 85 ° C
A
Implications of Slow or Floating CMOS Inputs , literature number SCBA004.
(1)
CC
CC
V
= 4.3 V 1.7
CC
V
= 3 V to 3.6 V 0.5
CC
V
= 4.3 V 0.7
CC
or GND to ensure proper device operation. Refer to the TI application report,
CC
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
V
IK
I
IN
I
OZ
I
OFF
I
CC
Δ I
C
C
C
r
on
Δ r
r
on(flat)
(3)
(4)
CC
in
io(OFF)
io(ON)
(5)
on
Control inputs V
D+ and D – V
Control inputs V
Control inputs V
V
= 3 V, II= – 18 mA – 1.2 V
CC
= 4.3 V, VIN= 0 to 4.3 V, V
CC
V
= 4.3 V, VO= 0 to 3.6 V, VI= 0, Switch OFF ± 1 µ A
CC
= 0 V, VO= 0 to 4.3 V, VI= 0, VIN= V
CC
V
= 4.3 V, I
CC
= 4.3 V, VIN= 2.6 V 10 µ A
CC
= 0 V, VIN= V
CC
V
= 3.3 V, V
CC
V
= 3.3 V, V
CC
V
= 3 V, VI= 0.4 V, IO= – 8 mA 6 10 Ω
CC
V
= 3 V, VI= 0.4 V, IO= – 8 mA 0.35 Ω
CC
V
= 3 V, VI= 0 V or 1 V, IO= – 8 mA 2 Ω
CC
= 0, Switch ON or OFF 1 µ A
I/O
or GND 1 pF
CC
= 3.3 V or 0, Switch OFF 2 pF
I/O
= 3.3 V or 0, Switch ON 6 pF
I/O
= 0 V ± 1 µ A
CC
or GND ± 2 µ A
CC
(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at V
(3) For I/O ports, the parameter IOZincludes the input leakage current.
= 3.3 V (unless otherwise noted), TA= 25 ° C.
CC
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
(2)
MAX UNIT
or GND.
CC
V
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS TYP
X
TALK
O
IRR
BW Bandwidth ( – 3 dB) RL= 50 Ω , CL= 5 pF, See Figure 10 1220 MHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Crosstalk RL= 50 Ω , f = 240 MHz, See Figure 9 – 53 dB
OFF isolation RL= 50 Ω , f = 240 MHz, See Figure 8 – 30 dB
= 3.3 V ± 10%, GND = 0 V
CC
Product Folder Link(s): TS3USB31
(1)
UNIT
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
SWITCHING CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS MIN TYP
t
t
t
t
t
t
Propagation delay
pd
Line enable time, OE to D, nD 30 ns
ON
Line disable time, OE to D, nD 25 ns
OFF
Output skew between center port to any other port
SK(O)
Skew between opposite transitions of the same output RL= 50 Ω , CL= 5 pF,
SK(P)
(t
– t
PHL
PLH
Total jitter
J
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
(2) (3)
(2)
)
(2)
= 3.3 V ± 10%, GND = 0 V
CC
RL= 50 Ω , CL= 5 pF,
See Figure 11
RL= 50 Ω , CL= 5 pF,
See Figure 7
RL= 50 Ω , CL= 5 pF,
See Figure 7
(2)
RL= 50 Ω , CL= 5 pF,
See Figure 12
See Figure 12
RL= 50 Ω , CL= 5 pF,
tR= tF= 500 ps at 480 Mbps 200 ps
(PRBS = 215– 1)
(1)
0.25 ns
50 ps
20 ps
MAX UNIT
4 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency(Hz)
Attenuation(dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10
Frequency(Hz)
Magnitude (dB)
–100
–120
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
TS3USB31
V
CC
USB
Connector
Base Band
Processor
or FS USB
Controller
HS USB
Controller
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
SCDS242D – JULY 2007 – REVISED JANUARY 2008
APPLICATION INFORMATION
Figure 1. Insertion Loss Figure 2. OFF Isolation
TS3USB31
WITH SINGLE ENABLE
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Figure 3. Crosstalk
Figure 4. Application Diagram
Product Folder Link(s): TS3USB31
Time ( 10 ) (s)X
–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Time ( 10 ) (s)X
–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 5. Eye Pattern: 480-Mbps USB Signal With No Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch
Switch (Through Path) NO Path
6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
PARAMETER MEASUREMENT INFORMATION
C
L
(B)
R
L
V
IN
V
CC
GND
1Dor2D
V
OUT1
1Dor2D
D
V
CC
V
IN
50 Ω
R
L
C
L
5pF t
ON
TEST
V
CC
50 Ω 5pF t
OFF
50%
t
ON
t
OFF
50%
90% 90%
Logic
Input
(V
SEL
or VOE)
1.8 V
Switch
Output
(V
OUT1
or V
OUT2
)
0
C
L
(B)
R
L
V
OH
V
OL
OE
V
OUT2
V
OE
(A)
V
SEL
(A)
S
1D
2D
D
V
OUT1
V
IN
Channel OFF: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V
CC
GND
50 W
50 W
Network Analyzer
Source
Signal
V
SEL
+
V
SEL
= V
CC
S
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 7. Turn-On (t
Figure 8. OFF Isolation (O
) and Turn-Off Time (t
ON
)
OFF
)
IRR
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TS3USB31
1D
2D
50 W
50 W
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V
CC
GND
V
OUT2
Source
Signal
Channel OFF: 2D to D
Network Analyzer
V
SEL
+
V
SEL
= V
CC
S
V
CC
GND
1D
V
SEL
2D
D
50 W
50 W
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
V
CTRL
= GND
S
GND
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 9. Crosstalk (X
Figure 10. Bandwidth (BW)
)
TALK
8 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Figure 11. Propagation Delay
Product Folder Link(s): TS3USB31
Pulse Skew t
SK(P)
Output Skew t
SK(P)
V
OL
V
OH
V
OH
V
OL
V
OH
V
OL
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
PARAMETER MEASUREMENT INFORMATION (continued)
TS3USB31
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 12. Skew Test
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TS3USB31
V
CC
I
IN
r
on
+
VIN* V
OUT2
or V
OUT1
I
IN
W
GND
Channel ON
1D
V
SEL
2D
D
V
IN
V
SEL
= V
IH
or V
IL
V
OUT2
V
OUT1
+
+
S
Channel OFF
OFF-State Leakage Current
V
SEL
= V
IH
or V
IL
V
CC
GND
1D
V
SEL
2D
D
V
IN
V
OUT2
V
OUT1
+
+
+
S
V
CC
GND
V
BIAS
V
SEL
V
SEL
= VCC or GND
V
BIAS
= VCC or GND
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
Capacitance
Meter
V
IN
V
OUT2
V
OUT1
D
2D
1D
S
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 13. ON-State Resistance (r
Figure 14. OFF-State Leakage Current
)
on
10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Figure 15. Capacitance
Product Folder Link(s): TS3USB31
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jan-2008
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TS3USB31RSER ACTIVE QFN RSE 8 3000 Green (RoHS &
no Sb/Br)
TS3USB31RSERG4 ACTIVE QFN RSE 8 3000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
Type
TS3USB31RSER QFN RSE 8 3000 179.0 8.4 1.7 1.7 0.76 4.0 8.0 Q2
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3USB31RSER QFN RSE 8 3000 220.0 205.0 50.0
Pack Materials-Page 2
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