TEXAS INSTRUMENTS TS3USB31 Technical data

1 2

3

4

5

6

7

8

HSD–

HSD+

OE

D

–

D+

N.C.

GND

V

CC

RSEPACKAGE

(TOP VIEW)

1 2

3

4

5

6

7

8

RSEPACKAGE

(BOTTOMVIEW)

HSD+

N.C.

D+

D–

OE

GND

V

CC

HSD–

N.C. Nointernalconnection-

www.ti.com

1

FEATURES

• V

Operation at 3 V and 4.3 V

CC

• 1.8-V Compatible Control-Pin Inputs

• I

Supports Partial Power-Down Mode

OFF

Operation

• ron= 10 Ω Maximum

• Δ ron<0.35 Ω Typical

• C

= 6 pF Typical

io(ON)

• Low Power Consumption (1 µ A Maximum)

• ESD Performance Tested Per JESD 22

– 6000-V Human-Body Model

(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)

• Wide – 3-dB Bandwidth = 1220 MHz Typical

• Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

TS3USB31

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION/ORDERING INFORMATION

The TS3USB31 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (750 MHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).

– 40 ° C to 85 ° C QFN – RSE Tape and reel TS3USB31RSER L9

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

T

A

website at www.ti.com .

ORDERING INFORMATION

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

PIN DESCRIPTION

NAME DESCRIPTION

OE Bus-switch enable

D+, D – ,

HSD+, HSD –

NC No connect

Data ports

1

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2007 – 2008, Texas Instruments Incorporated

www.ti.com

HSD1+

HSD1–

Control

D+

D–

OE

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

TRUTH TABLE

OE FUNCTION

H Disconnect

L D+, D – = HSD+, HSD –

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

V

IN

V

I/O

I

IK

I

I/OK

I

I/O

T

stg

Supply voltage range – 0.5 7 V

(2) (3) (4)

(2) (3)

HSD+, HSD – – 0.5 V
D+, D – when V
D+, D – when V

> 0 – 0.5 V

CC

= 0 5.25

CC

– 0.5 7 V

+ 0.3

CC

+ 0.3 V

CC

Control input voltage range

Switch I/O voltage range

Control input clamp current VIN< 0 – 50 mA
I/O port clamp current V
ON-state switch current
Continuous current through V

(5)

or GND ± 100 mA

CC

< 0 – 50 mA

I/O

Storage temperature range – 65 150 ° C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for V
(5) IIand IOare used to denote specific conditions for I

.

I/O

.

I/O

PACKAGE THERMAL IMPEDANCE

θ

JA

Package thermal impedance

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

(1)

RSE package 253 ° C/W

± 64 mA

TYP UNIT

2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TS3USB31

www.ti.com

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

TS3USB31

RECOMMENDED OPERATING CONDITIONS

(1)

MIN MAX UNIT

V

V

V

V
T

(1) All unused control inputs of the device must be held at V

ELECTRICAL CHARACTERISTICS

Supply voltage 3.0 4.3 V

CC

V

= 3 V to 3.6 V 1.3

High-level control input voltage V

IH

Low-level control input voltage V

IL

Data input/output voltage 0 V

I/O

Operating free-air temperature – 40 85 ° C

A

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

CC

CC

V

= 4.3 V 1.7

CC

V

= 3 V to 3.6 V 0.5

CC

V

= 4.3 V 0.7

CC

or GND to ensure proper device operation. Refer to the TI application report,

CC

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

V

IK

I

IN

I

OZ

I

OFF

I

CC

Δ I
C
C
C
r

on

Δ r
r

on(flat)

(3)

(4)

CC
in
io(OFF)
io(ON)

(5)

on

Control inputs V

D+ and D – V

Control inputs V
Control inputs V

V

= 3 V, II= – 18 mA – 1.2 V

CC

= 4.3 V, VIN= 0 to 4.3 V, V

CC

V

= 4.3 V, VO= 0 to 3.6 V, VI= 0, Switch OFF ± 1 µ A

CC

= 0 V, VO= 0 to 4.3 V, VI= 0, VIN= V

CC

V

= 4.3 V, I

CC

= 4.3 V, VIN= 2.6 V 10 µ A

CC

= 0 V, VIN= V

CC

V

= 3.3 V, V

CC

V

= 3.3 V, V

CC

V

= 3 V, VI= 0.4 V, IO= – 8 mA 6 10 Ω

CC

V

= 3 V, VI= 0.4 V, IO= – 8 mA 0.35 Ω

CC

V

= 3 V, VI= 0 V or 1 V, IO= – 8 mA 2 Ω

CC

= 0, Switch ON or OFF 1 µ A

I/O

or GND 1 pF

CC

= 3.3 V or 0, Switch OFF 2 pF

I/O

= 3.3 V or 0, Switch ON 6 pF

I/O

= 0 V ± 1 µ A

CC

or GND ± 2 µ A

CC

(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at V
(3) For I/O ports, the parameter IOZincludes the input leakage current.

= 3.3 V (unless otherwise noted), TA= 25 ° C.

CC

(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

(2)

MAX UNIT

or GND.

CC

V

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP

X

TALK

O

IRR

BW Bandwidth ( – 3 dB) RL= 50 Ω , CL= 5 pF, See Figure 10 1220 MHz

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3

Crosstalk RL= 50 Ω , f = 240 MHz, See Figure 9 – 53 dB
OFF isolation RL= 50 Ω , f = 240 MHz, See Figure 8 – 30 dB

= 3.3 V ± 10%, GND = 0 V

CC

Product Folder Link(s): TS3USB31

(1)

UNIT

www.ti.com

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS MIN TYP

t

t

t

t

t

t

Propagation delay

pd

Line enable time, OE to D, nD 30 ns

ON

Line disable time, OE to D, nD 25 ns

OFF

Output skew between center port to any other port

SK(O)

Skew between opposite transitions of the same output RL= 50 Ω , CL= 5 pF,

SK(P)

(t

– t

PHL

PLH

Total jitter

J

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

(2)

)

(2)

= 3.3 V ± 10%, GND = 0 V

CC

RL= 50 Ω , CL= 5 pF,
See Figure 11

RL= 50 Ω , CL= 5 pF,
See Figure 7

RL= 50 Ω , CL= 5 pF,
See Figure 7

(2)

RL= 50 Ω , CL= 5 pF,
See Figure 12

See Figure 12
RL= 50 Ω , CL= 5 pF,

tR= tF= 500 ps at 480 Mbps 200 ps
(PRBS = 215– 1)

(1)

0.25 ns

50 ps

20 ps

MAX UNIT

4 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TS3USB31

www.ti.com

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency(Hz)

Attenuation(dB)

-8

-7

-6

-5

-4

-3

-2

-1

0

1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10

Frequency(Hz)

Magnitude (dB)

–100

–120

–80

–60

–40

–20

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

TS3USB31

V

CC

USB

Connector

Base Band

Processor

or FS USB

Controller

HS USB

Controller

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

SCDS242D – JULY 2007 – REVISED JANUARY 2008

APPLICATION INFORMATION

Figure 1. Insertion Loss Figure 2. OFF Isolation

TS3USB31

WITH SINGLE ENABLE

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5

Figure 3. Crosstalk

Figure 4. Application Diagram

Product Folder Link(s): TS3USB31

www.ti.com

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

Figure 5. Eye Pattern: 480-Mbps USB Signal With No Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch

Switch (Through Path) NO Path

6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TS3USB31

www.ti.com

PARAMETER MEASUREMENT INFORMATION

C

L

(B)

R

L

V

IN

V

CC

GND

1Dor2D

V

OUT1

1Dor2D

D

V

CC

V

IN

50 Ω

R

L

C

L

5pFt

ON

TEST

V

CC

50 Ω 5pFt

OFF

50%

t

ON

t

OFF

50%

90% 90%

Logic

Input

(V

SEL

or VOE)

1.8 V

Switch
Output

(V

OUT1

or V

OUT2

)

0

C

L

(B)

R

L

V

OH

V

OL

OE

V

OUT2

V

OE

(A)

V

SEL

(A)

S

1D

2D

D

V

OUT1

V

IN

Channel OFF: 1D to D

Network Analyzer Setup
Source Power = 0 dBm

(632-mV P-P at 50-W load)
DC Bias = 350 mV

50 W

V

CC

GND

50 W

50 W

Network Analyzer

Source

Signal

V

SEL

+

V

SEL

= V

CC

S

TS3USB31

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

Figure 7. Turn-On (t

Figure 8. OFF Isolation (O

) and Turn-Off Time (t

ON

)

OFF

)

IRR

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Link(s): TS3USB31

www.ti.com

1D

2D

50 W

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm
(632-mV P-P at 50-W load)

DC Bias = 350 mV

50 W

V

CC

GND

V

OUT2

Source
Signal

Channel OFF: 2D to D

Network Analyzer

V

SEL

+

V

SEL

= V

CC

S

V

CC

GND

1D

V

SEL

2D

D

50 W

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm
(632-mV P-P at 50-W load)

DC Bias = 350 mV

Network Analyzer

Source

Signal

V

CTRL

= GND

S

GND

400 mV

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 9. Crosstalk (X

Figure 10. Bandwidth (BW)

)

TALK

8 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 11. Propagation Delay

Product Folder Link(s): TS3USB31

www.ti.com

Pulse Skew t

SK(P)

Output Skew t

SK(P)

V

OL

V

OH

V

OH

V

OL

V

OH

V

OL

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

PARAMETER MEASUREMENT INFORMATION (continued)

TS3USB31

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

Figure 12. Skew Test

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Link(s): TS3USB31

www.ti.com

V

CC

I

IN

r

on

+

VIN* V

OUT2

or V

OUT1

I

IN

W

GND

Channel ON

1D

V

SEL

2D

D

V

IN

V

SEL

= V

IH

or V

IL

V

OUT2

V

OUT1

+

+

S

Channel OFF

OFF-State Leakage Current

V

SEL

= V

IH

or V

IL

V

CC

GND

1D

V

SEL

2D

D

V

IN

V

OUT2

V

OUT1

+

+

+

S

V

CC

GND

V

BIAS

V

SEL

V

SEL

= VCC or GND

V

BIAS

= VCC or GND

Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.

Capacitance

Meter

V

IN

V

OUT2

V

OUT1

D

2D

1D

S

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 13. ON-State Resistance (r

Figure 14. OFF-State Leakage Current

)

on

10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 15. Capacitance

Product Folder Link(s): TS3USB31

PACKAGE OPTION ADDENDUM

www.ti.com

17-Jan-2008

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

TS3USB31RSER ACTIVE QFN RSE 8 3000 Green (RoHS &

no Sb/Br)

TS3USB31RSERG4 ACTIVE QFN RSE 8 3000 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

(3)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

Type

TS3USB31RSER QFN RSE 8 3000 179.0 8.4 1.7 1.7 0.76 4.0 8.0 Q2

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TS3USB31RSER QFN RSE 8 3000 220.0 205.0 50.0

Pack Materials-Page 2

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