TEXAS INSTRUMENTS TS3USB31 Technical data

1 2

HSD–

HSD+

–

D+

N.C.

GND

RSEPACKAGE

(TOP VIEW)

1 2

RSEPACKAGE

(BOTTOMVIEW)

HSD+

N.C.

D+

D–

GND

HSD–

N.C. Nointernalconnection-

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FEATURES

• V

Operation at 3 V and 4.3 V

• 1.8-V Compatible Control-Pin Inputs

• I

Supports Partial Power-Down Mode

OFF

Operation

• ron= 10 Ω Maximum

• Δ ron<0.35 Ω Typical

• C

= 6 pF Typical

io(ON)

• Low Power Consumption (1 µ A Maximum)

• ESD Performance Tested Per JESD 22

– 6000-V Human-Body Model

(A114-B, Class II) – 1000-V Charged-Device Model (C101) – 250-V Machine Model (A115-A)

• Wide – 3-dB Bandwidth = 1220 MHz Typical

• Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

TS3USB31

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION/ORDERING INFORMATION

The TS3USB31 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

– 40 ° C to 85 ° C QFN – RSE Tape and reel TS3USB31RSER L9

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

ORDERING INFORMATION

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

PIN DESCRIPTION

NAME DESCRIPTION

OE Bus-switch enable

D+, D – ,

HSD+, HSD –

NC No connect

Data ports

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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HSD1+

HSD1–

Control

D+

D–

TS3USB31 HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

TRUTH TABLE

OE FUNCTION

H Disconnect

L D+, D – = HSD+, HSD –

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

I/O

I/OK

I/O

stg

Supply voltage range – 0.5 7 V

(2) (3) (4)

(2) (3)

HSD+, HSD – – 0.5 V D+, D – when V D+, D – when V

> 0 – 0.5 V

= 0 5.25

– 0.5 7 V

+ 0.3

+ 0.3 V

Control input voltage range

Switch I/O voltage range

Control input clamp current VIN< 0 – 50 mA I/O port clamp current V ON-state switch current Continuous current through V

(5)

or GND ± 100 mA

< 0 – 50 mA

I/O

Storage temperature range – 65 150 ° C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VIand VOare used to denote specific conditions for V (5) IIand IOare used to denote specific conditions for I

I/O

PACKAGE THERMAL IMPEDANCE

Package thermal impedance

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

(1)

RSE package 253 ° C/W

± 64 mA

TYP UNIT

Product Folder Link(s): TS3USB31

www.ti.com

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

TS3USB31

RECOMMENDED OPERATING CONDITIONS

(1)

MIN MAX UNIT

V T

(1) All unused control inputs of the device must be held at V

ELECTRICAL CHARACTERISTICS

Supply voltage 3.0 4.3 V

= 3 V to 3.6 V 1.3

High-level control input voltage V

Low-level control input voltage V

Data input/output voltage 0 V

I/O

Operating free-air temperature – 40 85 ° C

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

= 4.3 V 1.7

= 3 V to 3.6 V 0.5

= 4.3 V 0.7

or GND to ensure proper device operation. Refer to the TI application report,

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

OFF

Δ I C C C r

Δ r r

on(flat)

(3)

(4)

CC in io(OFF) io(ON)

(5)

Control inputs V

D+ and D – V

Control inputs V Control inputs V

= 3 V, II= – 18 mA – 1.2 V

= 4.3 V, VIN= 0 to 4.3 V, V

= 4.3 V, VO= 0 to 3.6 V, VI= 0, Switch OFF ± 1 µ A

= 0 V, VO= 0 to 4.3 V, VI= 0, VIN= V

= 4.3 V, I

= 4.3 V, VIN= 2.6 V 10 µ A

= 0 V, VIN= V

= 3.3 V, V

= 3 V, VI= 0.4 V, IO= – 8 mA 6 10 Ω

= 3 V, VI= 0.4 V, IO= – 8 mA 0.35 Ω

= 3 V, VI= 0 V or 1 V, IO= – 8 mA 2 Ω

= 0, Switch ON or OFF 1 µ A

I/O

or GND 1 pF

= 3.3 V or 0, Switch OFF 2 pF

I/O

= 3.3 V or 0, Switch ON 6 pF

I/O

= 0 V ± 1 µ A

or GND ± 2 µ A

(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins. (2) All typical values are at V (3) For I/O ports, the parameter IOZincludes the input leakage current.

= 3.3 V (unless otherwise noted), TA= 25 ° C.

(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V (5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

(2)

MAX UNIT

or GND.

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP

TALK

IRR

BW Bandwidth ( – 3 dB) RL= 50 Ω , CL= 5 pF, See Figure 10 1220 MHz

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.

Crosstalk RL= 50 Ω , f = 240 MHz, See Figure 9 – 53 dB OFF isolation RL= 50 Ω , f = 240 MHz, See Figure 8 – 30 dB

= 3.3 V ± 10%, GND = 0 V

Product Folder Link(s): TS3USB31

(1)

UNIT

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TS3USB31 HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS MIN TYP

Propagation delay

Line enable time, OE to D, nD 30 ns

Line disable time, OE to D, nD 25 ns

OFF

Output skew between center port to any other port

SK(O)

Skew between opposite transitions of the same output RL= 50 Ω , CL= 5 pF,

SK(P)

– t

PHL

PLH

Total jitter

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. (2) Specified by design (3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

(2)

)

(2)

= 3.3 V ± 10%, GND = 0 V

RL= 50 Ω , CL= 5 pF, See Figure 11

RL= 50 Ω , CL= 5 pF, See Figure 7

(2)

RL= 50 Ω , CL= 5 pF, See Figure 12

See Figure 12 RL= 50 Ω , CL= 5 pF,

tR= tF= 500 ps at 480 Mbps 200 ps (PRBS = 215– 1)

(1)

0.25 ns

50 ps

20 ps

MAX UNIT

Product Folder Link(s): TS3USB31

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–90

–80

–70

–60

–50

–40

–30

–20

–10

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency(Hz)

Attenuation(dB)

-8

-7

-6

-5

-4

-3

-2

-1

1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10

Frequency(Hz)

Magnitude (dB)

–100

–120

–80

–60

–40

–20

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

TS3USB31

USB

Connector

Base Band

Processor

or FS USB

Controller

HS USB

Controller

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

SCDS242D – JULY 2007 – REVISED JANUARY 2008

APPLICATION INFORMATION

Figure 1. Insertion Loss Figure 2. OFF Isolation

TS3USB31

WITH SINGLE ENABLE

Figure 3. Crosstalk

Figure 4. Application Diagram

Product Folder Link(s): TS3USB31

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Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

TS3USB31 HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH WITH SINGLE ENABLE

SCDS242D – JULY 2007 – REVISED JANUARY 2008

Figure 5. Eye Pattern: 480-Mbps USB Signal With No Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch

Switch (Through Path) NO Path

Product Folder Link(s): TS3USB31

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