TEXAS INSTRUMENTS TS3USB30 Technical data

RSWPACKAGE

(TOP VIEW)

1 2

5

8

4

9

3

10

6

7

D1+

D2+

D1

–

D2

–

D–

GND

D+

OE

V

CC

S

RSWPACKAGE

(BOTTOMVIEW)

D1+

D1–

D+

1 2

310

4

9

5

8

6

7

D2+

D2–

GND

D–

S

V

CC

OE

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

www.ti.com

1

FEATURES

• V

• 1.8-V Compatible Control-Pin Inputs

• I

• ron= 10 Ω Max

• Δ ron<0.35 Ω Typ

• C

• Low Power Consumption (1 µ A Max)

• ESD Performance Tested Per JESD 22

• – 3-dB Bandwidth = 955 MHz Typ

• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)

Operation at 3 V and 4.3 V

CC

Supports Partial Power-Down-Mode

OFF

Operation

= 7 pF Typ

io(ON)

– 6000-V Human-Body Model (HBM)

(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)

TS3USB30

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION/ORDERING INFORMATION

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).

– 40 ° C to 85 ° C TQFN – RSW Tape and reel TS3USB30RSWR L6O

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

T

A

website at www.ti.com .

PACKAGE

ORDERING INFORMATION

(1) (2)

PIN DESCRIPTION

NAME DESCRIPTION

OE Bus-switch enable

S Select input

D+, D – , Dn+, Dn – Data ports

ORDERABLE PART NUMBER TOP-SIDE MARKING

1

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2007 – 2008, Texas Instruments Incorporated

www.ti.com

D1+

D1–

D2+

D2–

Control

D+

D–

S

OE

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

TRUTH TABLE

S OE FUNCTION

X H Disconnect
L L D = D1
H L D = D2

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

V

IN

V

I/O

I

IK

I

I/OK

I

I/O

T

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for V
(5) IIand IOare used to denote specific conditions for I

PACKAGE THERMAL IMPEDANCE

θ

JA

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

Supply voltage range – 0.5 7 V
Control input voltage range

(2) (3)

– 0.5 7 V

Dn+, Dn – – 0.5 V

Switch I/O voltage range

(2) (3) (4)

D+, D – when V
D+, D – when V

> 0 – 0.5 V

CC

= 0 – 0.5 5.25

CC

Control input clamp current VIN< 0 – 50 mA
I/O port clamp current V
ON-state switch current
Continuous current through V

(5)

or GND ± 100 mA

CC

< 0 – 50 mA

I/O

Storage temperature range – 65 150 ° C

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

.

I/O

.

I/O

(1)

Package thermal impedance RSW package 175 ° C/W

+ 0.3

CC

+ 0.3 V

CC

TYP UNIT

± 64 mA

2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TS3USB30

www.ti.com

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

TS3USB30

RECOMMENDED OPERATING CONDITIONS

(1)

MIN MAX UNIT

V

CC

V

IH

V

IL

V

I/O

T

A

(1) All unused control inputs of the device must be held at V

ELECTRICAL CHARACTERISTICS

Supply voltage 3 4.3 V

V

= 3 V to 3.6 V 1.3

High-level control input voltage V

Low-level control input voltage V

CC

V

= 4.3 V 1.7

CC

V

= 3 V to 3.6 V 0.5

CC

V

= 4.3 V 0.7

CC

Data input/output voltage 0 V
Operating free-air temperature – 40 85 ° C

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

CC

CC

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

V

IK

I

IN

I

OZ

I

OFF

I

CC

Δ I
C
C
C
r

on

Δ r
r

on(flat)

Control inputs V

(3)

D+ and D – ± 2 µ A

(4)

Control inputs V

CC

Control inputs V

in
io(OFF)
io(ON)

(5)

on

V

= 3 V, II= – 18 mA – 1.2 V

CC

= 4.3 V, 0 V, VIN= 0 to 4.3 V ± 1 µ A

CC

V

= 4.3 V, VO= 0 to 3.6 V,

CC

VI= 0, Switch OFF
V

= 0 V, VO= 0 to 4.3 V,

CC

VI= 0, VIN= V
V

= 4.3 V, I

CC

= 4.3 V, VIN= 2.6 V 10 µ A

CC

= 0 V, VIN= V

CC

V

= 3.3 V, V

CC

V

= 3.3 V, V

CC

V

= 3 V, VI= 0.4, IO= – 8 mA 6 10 Ω

CC

V

= 3 V, VI= 0.4, IO= – 8 mA 0.35 Ω

CC

V

= 3 V, VI= 0 V or 1 V, IO= – 8 mA 2 Ω

CC

I/O

I/O
I/O

or GND

CC

= 0, Switch ON or OFF 1 µ A

or GND 1 pF

CC

= 3.3 V or 0, Switch OFF 2 pF
= 3.3 V or 0, Switch ON 7 pF

(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at V
(3) For I/O ports, the parameter IOZincludes the input leakage current.

= 3.3 V (unless otherwise noted), TA= 25 ° C.

CC

(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

(2)

MAX UNIT

± 2 µ A

or GND.

CC

V

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP

X

TALK

O

ISO

BW Bandwidth ( – 3 dB) RL= 50 Ω , CL= 5 pF, See Figure 11 955 MHz

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3

Crosstalk RL= 50 Ω , f = 240 MHz, See Figure 10 – 56 dB
OFF isolation RL= 50 Ω , f = 240 MHz, See Figure 9 – 39 dB

= 3.3 V ± 10%, GND = 0 V

CC

Product Folder Link(s): TS3USB30

(1)

UNIT

www.ti.com

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS MIN TYP

t

pd

t

ON

t

OFF

t

ON

t

OFF

t

SK(O)

t

SK(P)

t

J

Propagation delay

Line enable time, SEL to D, nD 30 ns

Line disable time, SEL to D, nD 25 ns

Line enable time, OE to D, nD 30 ns

Line disable time, OE to D, nD 25 ns

Output skew between center port to any other port
Skew between opposite transitions of the same output RL= 50 Ω , CL= 5 pF,

(t

– t

PHL

PLH

Total jitter

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

(2)

)

(2)

= 3.3 V ± 10%, GND = 0 V

CC

RL= 50 Ω , CL= 5 pF,
See Figure 12

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,

(2)

See Figure 13

See Figure 13
RL= 50 Ω , CL= 5 pF,

tR= tF= 500 ps at 480 Mbps 20 ps
(PRBS = 215– 1)

(1)

0.25 ns

MAX UNIT

50 ps

20 ps

4 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Product Folder Link(s): TS3USB30

www.ti.com

–8

–7

–6

–5

–4

–3

–2

–1

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Gain (dB)

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

APPLICATION INFORMATION

TS3USB30

Figure 1. Gain vs Frequency

Figure 2. OFF Isolation

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Link(s): TS3USB30

www.ti.com

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

USB

Connector

SetTopBox

(STB)CPU

orDSP

Processor

USB2.0

Controller

DVRor

MassStorage

Controller

TS3USB30

Control

1D+

1D–

V

CC

2D+

2D–

D+

D–

S

OE

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

Figure 3. Crosstalk

6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 4. Application Diagram

Product Folder Link(s): TS3USB30

www.ti.com

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

TS3USB30

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7

Figure 5. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path)

Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch NC Path

Product Folder Link(s): TS3USB30

www.ti.com

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

8 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch NO Path

Product Folder Link(s): TS3USB30

www.ti.com

C

L

(B)

R

L

V

IN

V

CC

GND

1Dor2D

V

OUT1

1Dor2D

D

V

CC

V

IN

50 Ω

R

L

C

L

5pFt

ON

TEST

V

CC

50 Ω 5pFt

OFF

50%

t

ON

t

OFF

50%

90% 90%

Logic

Input

(V

SEL

or VOE)

1.8 V

Switch
Output

(V

OUT1

or V

OUT2

)

0

C

L

(B)

R

L

V

OH

V

OL

OE

V

OUT2

V

OE

(A)

V

SEL

(A)

S

1D

2D

D

V

OUT1

V

IN

Channel OFF: 1D to D

Network Analyzer Setup
Source Power = 0 dBm

(632-mV P-P at 50-W load)
DC Bias = 350 mV

50 W

V

CC

GND

50 W

50 W

Network Analyzer

Source

Signal

V

SEL

+

V

SEL

= V

CC

S

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION

A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO= 50 Ω , tr< 5 ns,

tf< 5 ns.

B. CLincludes probe and jig capacitance.

Figure 8. Turn-On (t

) and Turn-Off Time (t

ON

)

OFF

TS3USB30

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9

Figure 9. OFF Isolation (O

Product Folder Link(s): TS3USB30

)

ISO

www.ti.com

1D

2D

50 W

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm
(632-mV P-P at 50-W load)

DC Bias = 350 mV

50 W

V

CC

GND

V

OUT2

Source
Signal

Channel OFF: 2D to D

Network Analyzer

V

SEL

+

V

SEL

= V

CC

S

V

CC

GND

1D

V

SEL

2D

D

50 W

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm
(632-mV P-P at 50-W load)

DC Bias = 350 mV

Network Analyzer

Source

Signal

V

CTRL

= GND

S

GND

400 mV

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 10. Crosstalk (X

Figure 11. Bandwidth (BW)

)

TALK

10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 12. Propagation Delay

Product Folder Link(s): TS3USB30

www.ti.com

Pulse Skew t

SK(P)

Output Skew t

SK(P)

V

OL

V

OH

V

OH

V

OL

V

OH

V

OL

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

PARAMETER MEASUREMENT INFORMATION (continued)

TS3USB30

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

Figure 13. Skew Test

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Link(s): TS3USB30

www.ti.com

V

CC

I

IN

r

on

+

VIN* V

OUT2

or V

OUT1

I

IN

W

GND

Channel ON

1D

V

SEL

2D

D

V

IN

V

SEL

= V

IH

or V

IL

V

OUT2

V

OUT1

+

+

S

Channel OFF

OFF-State Leakage Current

V

SEL

= V

IH

or V

IL

V

CC

GND

1D

V

SEL

2D

D

V

IN

V

OUT2

V

OUT1

+

+

+

S

V

CC

GND

V

BIAS

V

SEL

V

SEL

= VCC or GND

V

BIAS

= VCC or GND

Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.

Capacitance

Meter

V

IN

V

OUT2

V

OUT1

D

2D

1D

S

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 14. ON-State Resistance (r

Figure 15. OFF-State Leakage Current

)

on

12 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 16. Capacitance

Product Folder Link(s): TS3USB30

PACKAGE OPTION ADDENDUM

www.ti.com

17-Jan-2008

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

TS3USB30RSWR ACTIVE QFN RSW 10 3000 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

(3)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

Type

TS3USB30RSWR QFN RSW 10 3000 179.0 8.4 1.7 2.1 0.7 4.0 8.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TS3USB30RSWR QFN RSW 10 3000 220.0 205.0 50.0

Pack Materials-Page 2

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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

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