TEXAS INSTRUMENTS TS3USB30 Technical data

RSWPACKAGE

(TOP VIEW)

1 2

5

8

4

9

3

10

6

7

D1+

D2+

D1

–

D2

–

D–

GND

D+

OE

V

CC

S

RSWPACKAGE

(BOTTOMVIEW)

D1+

D1–

D+

1 2

310

4

9

5

8

6

7

D2+

D2–

GND

D–

S

V

CC

OE

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

www.ti.com

1

FEATURES

• V

• 1.8-V Compatible Control-Pin Inputs

• I

• ron= 10 Ω Max

• Δ ron<0.35 Ω Typ

• C

• Low Power Consumption (1 µ A Max)

• ESD Performance Tested Per JESD 22

• – 3-dB Bandwidth = 955 MHz Typ

• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)

Operation at 3 V and 4.3 V

CC

Supports Partial Power-Down-Mode

OFF

Operation

= 7 pF Typ

io(ON)

– 6000-V Human-Body Model (HBM)

(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)

TS3USB30

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION/ORDERING INFORMATION

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).

– 40 ° C to 85 ° C TQFN – RSW Tape and reel TS3USB30RSWR L6O

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

T

A

website at www.ti.com .

PACKAGE

ORDERING INFORMATION

(1) (2)

PIN DESCRIPTION

NAME DESCRIPTION

OE Bus-switch enable

S Select input

D+, D – , Dn+, Dn – Data ports

ORDERABLE PART NUMBER TOP-SIDE MARKING

1

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2007 – 2008, Texas Instruments Incorporated

www.ti.com

D1+

D1–

D2+

D2–

Control

D+

D–

S

OE

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

TRUTH TABLE

S OE FUNCTION

X H Disconnect
L L D = D1
H L D = D2

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

V

IN

V

I/O

I

IK

I

I/OK

I

I/O

T

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for V
(5) IIand IOare used to denote specific conditions for I

PACKAGE THERMAL IMPEDANCE

θ

JA

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

Supply voltage range – 0.5 7 V
Control input voltage range

(2) (3)

– 0.5 7 V

Dn+, Dn – – 0.5 V

Switch I/O voltage range

(2) (3) (4)

D+, D – when V
D+, D – when V

> 0 – 0.5 V

CC

= 0 – 0.5 5.25

CC

Control input clamp current VIN< 0 – 50 mA
I/O port clamp current V
ON-state switch current
Continuous current through V

(5)

or GND ± 100 mA

CC

< 0 – 50 mA

I/O

Storage temperature range – 65 150 ° C

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

.

I/O

.

I/O

(1)

Package thermal impedance RSW package 175 ° C/W

+ 0.3

CC

+ 0.3 V

CC

TYP UNIT

± 64 mA

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Product Folder Link(s): TS3USB30

www.ti.com

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

TS3USB30

RECOMMENDED OPERATING CONDITIONS

(1)

MIN MAX UNIT

V

CC

V

IH

V

IL

V

I/O

T

A

(1) All unused control inputs of the device must be held at V

ELECTRICAL CHARACTERISTICS

Supply voltage 3 4.3 V

V

= 3 V to 3.6 V 1.3

High-level control input voltage V

Low-level control input voltage V

CC

V

= 4.3 V 1.7

CC

V

= 3 V to 3.6 V 0.5

CC

V

= 4.3 V 0.7

CC

Data input/output voltage 0 V
Operating free-air temperature – 40 85 ° C

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

CC

CC

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

V

IK

I

IN

I

OZ

I

OFF

I

CC

Δ I
C
C
C
r

on

Δ r
r

on(flat)

Control inputs V

(3)

D+ and D – ± 2 µ A

(4)

Control inputs V

CC

Control inputs V

in
io(OFF)
io(ON)

(5)

on

V

= 3 V, II= – 18 mA – 1.2 V

CC

= 4.3 V, 0 V, VIN= 0 to 4.3 V ± 1 µ A

CC

V

= 4.3 V, VO= 0 to 3.6 V,

CC

VI= 0, Switch OFF
V

= 0 V, VO= 0 to 4.3 V,

CC

VI= 0, VIN= V
V

= 4.3 V, I

CC

= 4.3 V, VIN= 2.6 V 10 µ A

CC

= 0 V, VIN= V

CC

V

= 3.3 V, V

CC

V

= 3.3 V, V

CC

V

= 3 V, VI= 0.4, IO= – 8 mA 6 10 Ω

CC

V

= 3 V, VI= 0.4, IO= – 8 mA 0.35 Ω

CC

V

= 3 V, VI= 0 V or 1 V, IO= – 8 mA 2 Ω

CC

I/O

I/O
I/O

or GND

CC

= 0, Switch ON or OFF 1 µ A

or GND 1 pF

CC

= 3.3 V or 0, Switch OFF 2 pF
= 3.3 V or 0, Switch ON 7 pF

(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at V
(3) For I/O ports, the parameter IOZincludes the input leakage current.

= 3.3 V (unless otherwise noted), TA= 25 ° C.

CC

(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

(2)

MAX UNIT

± 2 µ A

or GND.

CC

V

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP

X

TALK

O

ISO

BW Bandwidth ( – 3 dB) RL= 50 Ω , CL= 5 pF, See Figure 11 955 MHz

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3

Crosstalk RL= 50 Ω , f = 240 MHz, See Figure 10 – 56 dB
OFF isolation RL= 50 Ω , f = 240 MHz, See Figure 9 – 39 dB

= 3.3 V ± 10%, GND = 0 V

CC

Product Folder Link(s): TS3USB30

(1)

UNIT

www.ti.com

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS MIN TYP

t

pd

t

ON

t

OFF

t

ON

t

OFF

t

SK(O)

t

SK(P)

t

J

Propagation delay

Line enable time, SEL to D, nD 30 ns

Line disable time, SEL to D, nD 25 ns

Line enable time, OE to D, nD 30 ns

Line disable time, OE to D, nD 25 ns

Output skew between center port to any other port
Skew between opposite transitions of the same output RL= 50 Ω , CL= 5 pF,

(t

– t

PHL

PLH

Total jitter

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

(2)

)

(2)

= 3.3 V ± 10%, GND = 0 V

CC

RL= 50 Ω , CL= 5 pF,
See Figure 12

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,
See Figure 8

RL= 50 Ω , CL= 5 pF,

(2)

See Figure 13

See Figure 13
RL= 50 Ω , CL= 5 pF,

tR= tF= 500 ps at 480 Mbps 20 ps
(PRBS = 215– 1)

(1)

0.25 ns

MAX UNIT

50 ps

20 ps

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Product Folder Link(s): TS3USB30

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–8

–7

–6

–5

–4

–3

–2

–1

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Gain (dB)

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

APPLICATION INFORMATION

TS3USB30

Figure 1. Gain vs Frequency

Figure 2. OFF Isolation

Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Link(s): TS3USB30

www.ti.com

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

USB

Connector

SetTopBox

(STB)CPU

orDSP

Processor

USB2.0

Controller

DVRor

MassStorage

Controller

TS3USB30

Control

1D+

1D–

V

CC

2D+

2D–

D+

D–

S

OE

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE

SCDS237C – AUGUST 2007 – REVISED JANUARY 2008

Figure 3. Crosstalk

6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated

Figure 4. Application Diagram

Product Folder Link(s): TS3USB30