TEXAS INSTRUMENTS TS2PCIE2212 Technical data

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J H G F E D C B A
8
2
3 4 5 6
5mm
9
1
7
5 mm
ZAHPACKAGE
(BOTTOMVIEW)
TS2PCIE2212
PCI Express™ SIGNAL SWITCH
SCDS209 – JUNE 2006

FEATURES

Offers Bandwidth Allocation of PCI Express™ Excellent Differential Skew (5 ps Max)
Signal Using Two-Lane 1:2 Multiplexer/Demultiplexer
Vcc Operating Range From 1.7 V to 1.9 V
Supports Data Rates of 2.5 Gbps
Port-Port Crosstalk (–39 dB at 1.25 GHz)
OFF Port Isolation (–38 dB at 1.25 GHz)
Low ON-State Resistance (10 Typ)
Low Input/Output Capacitance (3.5 pF Typ)

DESCRIPTION/ORDERING INFORMATION

The TS2PCIE2212 can be used to muxltiplex/demultiplex two PCI Express™ lanes, each representing differential pairs of receive (RX) and transmit (TX) signals. The switch operates at the PCI Express bandwidth standard of 2.5-Gbps signal-processing speed. The device is composed of two banks, with each bank accommodating two sources (source A and source B) and two destinations (destination A and destination B).
When a logic-level low is applied to the control (CTRL) pin, source A is connected to destination A and source B is connected to destination B. When a logic-level high is applied to CTRL, source A is connected to destination B, while source B and destination A are open.
Minimal Propagation Delay
ESD Performance Tested Per JESD 22
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
T
A
0 ° C to 85 ° C BGA ZAH Tape and reel TS2PCIE2212ZAHR
1 2 3 4 5 6 7 8 9
A CTRL0 TxSB:0P TxSA:0P GND TxDA:0P TxDB:0P NC B RxSA:0P GND TxSB:0N TxSA:0N VDD TxDA:0N TxDB:0N GND RxDA:0P C RxSA:0N RxDA:0N D RxSB:0P RxSB:0N RxDB:0N RxDB:0P E GND VDD VDD GND F TxSA:1P TxSA:1N TxDA:1N TxDA:1P G TxSB:1N TxDB:1N H TxSB:1P GND RxSA:1N RxSB:1N VDD RxDB:1N RxDA:1N GND TxDB:1P
J NC RxSA:1P RXSB:1P GND RXDB:1P RxDA:1P CTRL1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PCI Express is a trademark of PCI-SIG.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
ORDERING INFORMATION
PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING
TERMINAL ASSIGNMENTS
Copyright © 2006, Texas Instruments Incorporated
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TxDA:0
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
TxDB:0
RxDA:0
RxDB:0
TxDA:1
TxDB:1
RxDA:1
RxDB:1
TxSA:0
TxSB:0
RxSA:0
RxSB:0
TxSA:1
TxSB:1
RxSA:1
RxSB:1
CTRL1
CTRL0
TS2PCIE2212 PCI Express™ SIGNAL SWITCH
SCDS209 – JUNE 2006
PIN DESCRIPTION
NAME FUNCTION
TxSA:nP, TxSA:nN Source A transmit pair
RxSA:nP, RxSA:nN Source A receive pair
TxSB:nP, TxSB:nN Source B transmit pair RxSB:nP, RxSB:nN Source B receive pair TxDA:nP, TxDA:nN Destination A transmit pair RxDA:nP, RxDA:nN Destination A receive pair TxDB:nP, TxDB:nN Destination B transmit pair RxDB:nP, RxDB:nN Destination B receive pair
CTRL0 Control signal for bank 0 CTRL1 Control signal for bank 1
V
DD
GND Ground (0 V)
NC No internal connection
Positive supply voltage
LOGIC DIAGRAM
2
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FUNCTION TABLE
CTRLn FUNCTION
L SA:n = DA:n, SB:n = DB:n
H SA:n = DB:n, DA:n = open, SBin = open
TS2PCIE2212
PCI Express™ SIGNAL SWITCH
SCDS209 – JUNE 2006

Absolute Maximum Ratings

(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
V
IN
V
I/O
I
IK
I
I/OK
I
I/O
θ
JA
T
stg
Supply voltage range –0.5 2.5 V Control input voltage range Switch I/O voltage range Control input clamp current VIN< 0 and V I/O port clamp current VIN< 0 and V ON-state switch current Continuous current through V Package thermal impedance
(2) (3)
(2) (3) (4)
< 0 50 mA
I/O
< 0 50 mA
(5)
or GND ± 100 mA
DD
(6)
I/O
–0.5 2.5 V –0.5 2.5 V
± 100 mA
Storage temperature range –65 150 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VIand VOare used to denote specific conditions for V (5) IIand IOare used to denote specific conditions for I (6) The package thermal impedance is calculated in accordance with JESD 51-7.
.
I/O
.
I/O

Recommended Operating Conditions

MIN TYP MAX UNIT
V V V V T
Supply voltage 1.7 1.8 1.9 V
DD
High-level control input voltage CTRL 0.65 V
IH
Low-level control input voltage CTRL 0.35 V
IL
Data input/output voltage 0 V
IO
Operating free-air temperature 0 85 ° C
A
DD
TBD ° C/W
V V
DD
V
DD
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TS2PCIE2212 PCI Express™ SIGNAL SWITCH
SCDS209 – JUNE 2006

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS UNIT
V I
IN
I
OZ
I
CC
C C C
r
on
r
IK
in IO(OFF) IO(ON)
on(flat)
Control inputs V Control inputs V
Control inputs V SB or DA port V
= 1.7 V, IIN= –18 mA –1.8 V
DD
= 1.9 V, VIN= V
DD
V
= 1.9 V, Switch OFF ± 5 µ A
DD
V
= 1.9 V,
DD
VIN= V
DD I/O
V
I/O
V
DD
V
DD
V
DD
or GND,
DD
= 1.9 V, VIN= V = 0 V, Switch OFF 1.4 1.5 pF = 0 V, Switch ON 3.5 4 pF = 1.7 V, VI= 0 V, IO= 10 mA 10 14 = 1.7 V, VI= 1.5 V, IO= –10 mA 12 17 = 1.7 V, IO= 10 mA, VI= 1.5 V ± 0.4 V 2.5 5
VO= 0 to 1.9 V, VI= 0,
I
I/O
or GND ± 1 µ A
DD
= 0, Switch ON or OFF 160 300 µ A
or GND 0.5 1.0 pF
DD

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER DESCRIPTION TEST CONDITIONS UNIT
DR Data rate per TX or RX pair 2.5 Gbps
t
pd
t
sk
ten(t
, t
PZL
PZH
t
(t
, t
dis
PLZ
PHZ
I
LOSS
R
LOSS
I
LOSS(CM)
O
IFF
X
TALK
Propagation delay, Sx to Dx See Figure 7 250 ps
Intra-pair skew f =1.25 GHz, See Figure 7 5 ps ) Switch turn-on delay, CTRL to DA See Figure 6 5 ns ) Switch turn-off delay, CTRL to DA See Figure 6 2.5 ns
Differential insertion loss –2.5 –3.2 dB
Differential return loss –7.2 –9.5 dB
Common-mode insertion loss –2 dB
Differential OFF isolation –33 –38 dB
Differential crosstalk –33 –39 dB
f =1.25 GHz, R See Figure 1
f =1.25 GHz, R See Figure 2
f =1.25 GHz, R See Figure 3
f =1.25 GHz, R See Figure 4
f =1.25 GHz, R See Figure 5
= 50 ,
LOAD
= 50 ,
LOAD
= 50 ,
LOAD
= 50 ,
LOAD
= 50 ,
LOAD
TA= 0 ° C to 85 ° C
MIN TYP MAX
TA= 0 ° C to 85 ° C
MIN TYP MAX
4
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