TPS732xx
GND EN NR
IN OUT
V
IN
V
OUT
Optional
Optional Optional
Typical Application Circuit for Fixed-Voltage Versions
DCQ PACKAGE
SOT223
(TOP VIEW)
1 2 3 4 5
IN
OUT
GND
NR/FB
EN
TAB IS GND
DBV PACKAGE
SOT23
(TOP VIEW)
IN
GND
EN NR/FB
OUT 1
2
3 4
5
查询TPS73201供应商
Cap-Free, NMOS, 250mA Low Dropout Regulator
with Reverse Current Protection
FEATURES DESCRIPTION
• Stable with No Output Capacitor or Any Value
or Type of Capacitor
• Input Voltage Range: 1.7V to 5.5V
• Ultralow Dropout Voltage: 40mV Typ at 250mA
• Excellent Load Transient Response—with or
without Optional Output Capacitor
• New NMOS Topology Provides Low Reverse
Leakage Current
• Low Noise: 30µV
• 0.5% Initial Accuracy
• 1% Overall Accuracy (Line, Load, and
Temperature)
• Less Than 1µA Max I Qin Shutdown Mode
• Thermal Shutdown and Specified Min/Max
Current Limit Protection
• Available in Multiple Output Voltage Versions
– Fixed Outputs of 1.2V, 1.5V, 1.6V, 1.8V, 2.5V,
3.0V, 3.3V, and 5.0V
– Adjustable Outputs From 1.20V to 5.5V
– Custom Outputs Available
RMS
Typ (10kHz to 100kHz)
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
The TPS732xx family of low-dropout (LDO) voltage
regulators uses a new topology: an NMOS pass
element in a voltage-follower configuration. This topology is stable using output capacitors with low ESR,
and even allows operation without a capacitor. It also
provides high reverse blockage (low reverse current)
and ground pin current that is nearly constant over all
values of output current.
The TPS732xx uses an advanced BiCMOS process
to yield high precision while delivering very low
dropout voltages and low ground pin current. Current
consumption, when not enabled, is under 1µA and
ideal for portable applications. The extremely low
output noise (30µV
powering VCOs. These devices are protected by
thermal shutdown and foldback current limit.
RMS
with 0.1µF C
) is ideal for
NR
APPLICATIONS
• Portable/Battery-Powered Equipment
• Post-Regulation for Switching Supplies
• Noise-Sensitive Circuitry such as VCOs
• Point of Load Regulation for DSPs, FPGAs,
ASICs, and Microprocessors
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003–2004, Texas Instruments Incorporated
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGE-LEAD PACKAGE ORDERING
PRODUCT V
TPS73201
TPS73215 1.5V
TPS73216 1.6V SOT23-5 (DBV) -40 ° C to +125 ° C T50
TPS73218 1.8V
TPS73225 2.5V
TPS73230 3.0V
TPS73233 3.3V
TPS73250 5.0V
(1) Custom output voltages from 1.3V to 4V in 100mV increments are available on a quick-turn basis for prototyping. Production quantities
are available; minimum order quantities apply. Contact factory for details and availability.
(2) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet.
(3) For fixed 1.2V operation, tie FB to OUT.
(1)
OUT
Adjustable
or 1.2V
(DESIGNATOR)
SOT23-5 (DBV) -40 ° C to +125 ° C PJEQ
(3)
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73201
SOT23-5 (DBV) -40 ° C to +125 ° C T38
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73215
SOT23-5 (DBV) -40 ° C to +125 ° C T37
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73218
SOT23-5 (DBV) -40 ° C to +125 ° C T36
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73225
SOT23-5 (DBV) -40 ° C to +125 ° C T39
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73230
SOT23-5 (DBV) -40 ° C to +125 ° C T40
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73233
SOT23-5 (DBV) -40 ° C to +125 ° C T41
SOT223-5 (DCQ) -40 ° C to +125 ° C PS73250
(2)
SPECIFIED
TEMPERATURE TRANSPORT MEDIA,
RANGE QUANTITY
MARKING NUMBER
TPS73201DBVT Tape and Reel, 250
TPS73201DBVR Tape and Reel, 3000
TPS73201DCQT Tube, 80
TPS73201DCQR Tape and Reel, 2500
TPS73215DBVT Tape and Reel, 250
TPS73215DBVR Tape and Reel, 3000
TPS73215DCQT Tube, 80
TPS73215DCQR Tape and Reel, 2500
TPS73216DBVT Tape and Reel, 250
TPS73216DBVR Tape and Reel, 3000
TPS73218DBVT Tape and Reel, 250
TPS73218DBVR Tape and Reel, 3000
TPS73218DCQT Tube, 80
TPS73218DCQR Tape and Reel, 2500
TPS73225DBVT Tape and Reel, 250
TPS73225DBVR Tape and Reel, 3000
TPS73225DCQT Tube, 80
TPS73225DCQR Tape and Reel, 2500
TPS73230DBVT Tape and Reel, 250
TPS73230DBVR Tape and Reel, 3000
TPS73230DCQT Tube, 80
TPS73230DCQR Tape and Reel, 2500
TPS73233DBVT Tape and Reel, 250
TPS73233DBVR Tape and Reel, 3000
TPS73233DCQT Tube, 80
TPS73233DCQR Tape and Reel, 2500
TPS73250DBVT Tape and Reel, 250
TPS73250DBVR Tape and Reel, 3000
TPS73250DCQT Tube, 80
TPS73250DCQR Tape and Reel, 2500
2
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS
over operating junction temperature range unless otherwise noted
VINrange -0.3 to 6.0 V
V
range -0.3 to 6.0 V
EN
V
range -0.3 to 5.5 V
OUT
Peak output current Internally limited
Output short-circuit duration Indefinite
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, T
Storage temperature range -65 to +150 ° C
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
(1) Stresses beyond those listedunder absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, andfunctional operation of the device at these or any other conditions beyondthose indicated under the Electrical Characteristics is
not implied. Exposureto absolute maximum rated conditions for extended periods may affect devicereliability.
J
(1)
TPS732xx UNIT
-55 to +150 ° C
POWER DISSIPATION RATINGS
BOARD PACKAGE R
(2)
Low-K
(3)
High-K
(2)
Low-K
(1) See Power Dissipation in the Applications section formore information related to thermal design.
(2) The JEDEC Low-K (1s) boarddesign used to derive this data was a 3 inch x 3 inch, two-layer board with2-ounce copper traces on top of
the board.
(3) The JEDEC High-K (2s2p)board design used to derive this data was a 3 inch x 3 inch, multilayer boardwith 1-ounce internal power and
ground planes and 2-ounce copper traces on thetop and bottom of the board.
DBV 64 ° C/W 255 ° C/W 3.9mW/ ° C 390mW 215mW 155mW
DBV 64 ° C/W 180 ° C/W 5.6mW/ ° C 560mW 310mW 225mW
DCQ 15 ° C/W 53 ° C/W 18.9mW/ ° C 1.89W 1.04W 0.76W
Θ JC
(1)
R
Θ JA
DERATING FACTOR TA≤ 25 ° C TA= 70 ° C TA= 85 ° C
ABOVE TA= 25 ° C POWER RATING POWER RATING POWER RATING
3
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
Over operating temperature range (T
C
= 0.1µF, unless otherwise noted. Typical values are at TJ= 25 ° C.
OUT
= -40 ° C to +125 ° C), V
J
= V
IN
OUT(nom)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(nom) - 0.1V)
(1)
(2)
Nominal TJ= 25 ° C -0.5 +0.5
V
+ 0.5V ≤ VIN≤ 5.5V;
VIN, I
(1)
(3)
GND
, and T -1.0 ± 0.5 +1.0
OUT
(4)
(-I
) V
IN
) V
OUT
10 mA ≤ I
V
OUT(nom)
1mA ≤ I
10mA ≤ I
I
OUT
OUT
OUT
≤ 0.5V, 0V ≤ VIN≤ V
EN
I
OUT
I
OUT
≤ 0.5V, V
EN
f = 100Hz, I
f = 10kHz, I
C
OUT
C
OUT
V
OUT
C
OUT
≤ 250mA
OUT
+ 0.5V ≤ VIN≤ 5.5V 0.01 %/V
≤ 250mA 0.002
OUT
≤ 250mA 0.0005
OUT
= 250mA 40 150 mV
+ V
OUT
DO
= 0.9 × V
OUT(nom)
= 0V 300 mA
= 10mA (IQ) 400 550
= 250mA 650 950
≤ VIN≤ 5.5 0.02 1 µA
OUT
= 250 mA 58
OUT
= 250 mA 37
OUT
= 10µF, No C
= 10µF, C
NR
= 0.01µF 8.5 × V
NR
= 3V, RL= 30 Ω
= 1 µF, C
NR
= 0.01 µF
V
IN
V
FB
Input voltage range
Internal reference (TPS73201) TJ= 25 ° C 1.198 1.20 1.210 V
Output voltage range (TPS73201)
V
OUT
∆ V
%/ ∆ V
OUT
∆ V
%/ ∆ I
OUT
V
DO
Accuracy
Line regulation
IN
Load regulation %/mA
OUT
Dropout voltage
(V
(1)
= V
IN
OUT
ZO(DO) Output impedance in dropout 1.7 V ≤ VIN≤ V
I
CL
I
SC
I
REV
I
GND
I
SHDN
I
FB
PSRR dB
V
N
t
STR
Output current limit V
Short-circuit current V
Reverse leakage current
Ground pin current µA
Shutdown current (I
FB pin current (TPS73201) .1 .3 µA
Power-supply rejection ratio
(ripple rejection)
Output noise voltage
BW = 10Hz - 100kHz
Startup time 600 µs
VEN(HI) Enable high (enabled) 1.7 V
VEN(LO) Enable low (shutdown) 0 0.5 V
IEN(HI) Enable pin current (enabled) V
T
SD
T
J
Thermal shutdown temperature ° C
Operating junction temperature -40 125 ° C
= 5.5V 0.02 0.1 µA
EN
Shutdown Temp increasing 160
Reset Temp decreasing 140
(1)
+ 0.5V
, I
OUT
= 10mA, V
= 1.7V, and
EN
1.7 5.5 V
V
FB
5.5-V
DO
0.25 Ω
250 425 600 mA
OUT
0.1 10 µA
27 × V
OUT
OUT
IN
V
%
µV
RMS
V
(1) Minimum VIN= V
(2) TPS73201 is tested atV
(3) V
(4) Fixed-voltage versions only;refer to Applications section for more information.
is not measured for the TPS73214, TPS73215 orTPS73216 since minimum VIN=1.7V.
DO
+V
OUT
or 1.7V, whichever isgreater.
DO
OUT
= 2.5V.
4
Servo
Error
Amp
Ref
27k
Ω
8k
Ω
Current
Limit
Charge
Pump
Thermal
Protection
Bandgap
NR
OUT
R
1
R
2
EN
GND
IN
R1+ R2= 80k
Ω
V
OUT
1.2V
1.5V
1.8V
2.5V
2.8V
3.0V
3.3V
5.0V
R
1
Short
23.2kΩ
28.0kΩ
39.2kΩ
44.2kΩ
46.4kΩ
52.3kΩ
78.7kΩ
R
2
Open
95.3kΩ
56.2kΩ
36.5kΩ
33.2kΩ
30.9kΩ
30.1kΩ
24.9kΩ
Table 1. Standard 1%
Resistor Values for
Common Output Voltages
NOTE: V
OUT
= (R1 + R2)/R2 × 1.2 04;
R1R2 ≅ 19kΩ for best
accuracy.
Servo
Error
Amp
Ref
Current
Limit
Charge
Pump
Thermal
Protection
Bandgap
OUT
FB
R
1
R
2
EN
GND
IN
80k
Ω
8k
Ω
27k
Ω
FUNCTIONAL BLOCK DIAGRAMS
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
Figure 1. Fixed Voltage Version
Figure 2. Adjustable Voltage Version
5
DCQ PACKAGE
SOT223
(TOP VIEW)
1 2 3 4 5
IN
OUT
GND
NR/FB
EN
TAB IS GND
DBV PACKAGE
SOT23
(TOP VIEW)
IN
GND
EN NR/FB
OUT 1
2
3 4
5
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
PIN ASSIGNMENTS
TERMINAL FUNCTIONS
TERMINAL
NAME (DBV) (DCQ)
SOT23 SOT223
PIN NO. PIN NO.
IN 1 1 Unregulated input supply
GND 2 3 Ground
EN 3 5 Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. Refer to the Shutdown section under Applications Information for more details.
EN can be connected to IN if not used.
NR 4 4 Fixed voltage versions only—connecting an external capacitor to this pin bypasses noise
generated by the internal bandgap. This allows output noise to be reduced to very low levels.
FB 4 4 Adjustable voltage version only—this is the input to the control loop error amplifier, and is used to
set the output voltage of the device.
OUT 5 2 Output of the Regulator. There are no output capacitor requirements for stability.
DESCRIPTION
6
0.5
0.4
0.3
0.2
0.1
0
−
0.1
−
0.2
−
0.3
−
0.4
−
0.5
Change in V
OUT
(%)
0 50 100 150 200 250
I
OUT
(mA)
Referred to I
OUT
= 10mA
−
40C
+125C
+25C
0.20
0.15
0.10
0.05
0
−
0.05
−
0.10
−
0.15
−
0.20
Change in V
OUT
(%)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
V
IN
−
V
OUT
(V)
+125C
+25C
−
40C
Referred to VIN= V
OUT
+ 0.5V at I
OUT
= 10mA
100
80
60
40
20
0
V
DO
(mV)
0 50 100 150 200 250
I
OUT
(mA)
+125C
+25C
−
40C
TPS73225DBV
100
80
60
50
20
0
V
DO
(mV)
−
50−25 0 25 50 75 100 125
Temperature (C)
TPS73225DBV
30
25
20
15
10
5
0
Percent of Units (%)
−
1.0
−
0.9
−
0.8
−
0.7
−
0.6
−
0.5
−
0.4
−
0.3
−
0.2
−
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
OUT
Error (%)
I
OUT
= 10mA
18
16
14
12
10
8
6
4
2
0
Percent of Units (%)
−
100
−
90
−
80
−
70
−
60
−
50
−
40
−
30
−
20
−
10
0
10
20
30
40
50
60
70
80
90
100
Worst Case dV
OUT
/dT (ppm/C)
I
OUT
= 10mA
All Voltage Versions
For all voltage versions at TJ= 25 ° C, V
LOAD REGULATION LINE REGULATION
Figure 3. Figure 4.
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS
= V
IN
OUT(nom)
+ 0.5V, I
OUT
= 10mA, V
= 1.7V, and C
EN
OUT
= 0.1µF, unless otherwise
noted.
DROPOUT VOLTAGE vs OUTPUT CURRENT DROPOUT VOLTAGE vs TEMPERATURE
Figure 5. Figure 6.
OUTPUT VOLTAGE ACCURACY HISTOGRAM OUTPUT VOLTAGE DRIFT HISTOGRAM
Figure 7. Figure 8.
7
1000
900
800
700
600
500
400
300
200
100
0
I
GND
(
µ
A)
0 50 100 150 200 250
I
OUT
(mA)
VIN= 5.5V
VIN= 4V
VIN= 2V
800
700
600
500
400
300
200
100
0
I
GND
(
µ
A)
−
50−25 0 25 50 75 100 125
Temperature (C)
I
OUT
= 250mA
VIN= 5.5V
VIN= 4V
VIN= 2V
500
450
400
350
300
250
200
150
100
50
0
Current Limit (mA)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
OUT
(V)
TPS73233
I
CL
I
SC
1
0.1
0.01
I
GND
(
µ
A)
−
50−25 0 25 50 75 100 125
Temperature (C)
V
ENABLE
= 0.5V
VIN= V
OUT
+ 0.5V
600
550
500
450
400
350
300
250
Current Limit (mA)
1.5 2.5 3.0 3.5 4.0 4.5 5.0 2.0 5.5
VIN(V)
600
550
500
450
400
350
300
250
Current Limit (mA)
−
50−25 0 25 50 75 100 125
Temperature (C)
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ= 25 ° C, V
noted.
GROUND PIN CURRENT vs OUTPUT CURRENT GROUND PIN CURRENT vs TEMPERATURE
Figure 9. Figure 10.
= V
IN
OUT(nom)
+ 0.5V, I
OUT
= 10mA, V
= 1.7V, and C
EN
OUT
= 0.1µF, unless otherwise
CURRENT LIMIT vs V
(FOLDBACK) vs TEMPERATURE
OUT
GROUND PIN CURRENT in SHUTDOWN
Figure 11. Figure 12.
CURRENT LIMIT vs V
IN
CURRENT LIMIT vs TEMPERATURE
8
Figure 13. Figure 14.
40
35
30
25
20
15
10
5
0
PSRR (dB)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
V
IN
−
V
OUT
(V)
Frequency = 100kHz
C
OUT
= 10µ F
CNR = 0.01µ F
10k 10
90
80
70
60
50
40
30
20
10
0
Ripple Rejection (dB)
100 1k 100k 1M 10M
Frequency (Hz)
I
OUT
= 1mA
C
OUT
= 1µF
I
OUT
= Any
C
OUT
= 0µF
I
OUT
= 1mA
C
OUT
= Any
I
OUT
= 1mA
C
OUT
= 10µF
I
OUT
= 100mA
C
OUT
= Any
I
OUT
= 100mA
C
OUT
= 10µF
IO=100mA
CO=1µF
1
0.1
0.01
e
N
(
µ
V/
√
Hz)
10 100 1k 10k 100k
Frequency (Hz)
C
OUT
= 1µF
C
OUT
= 0µF
C
OUT
= 10µF
I
OUT
= 150mA
1
0.1
0.01
e
N
(
µ
V/
√
Hz)
10 100 1k 10k 100k
Frequency (Hz)
I
OUT
= 150mA
C
OUT
= 1µF
C
OUT
= 0µF
C
OUT
= 10µF
60
50
40
30
20
10
0
V
N
(RMS)
C
OUT
(µF)
0.1 1 10
V
OUT
= 5.0V
V
OUT
= 3.3V
V
OUT
= 1.5V
CNR= 0.01µF
10Hz < Frequency < 100kHz
140
120
100
80
60
40
20
0
V
N
(RMS)
CNR(F)
1p 10p 100p 1n 10n
V
OUT
= 5.0V
V
OUT
= 3.3V
V
OUT
= 1.5V
C
OUT
= 0µF
10Hz < Frequency < 100kHz
TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ= 25 ° C, V
noted.
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
= V
IN
OUT(nom)
+ 0.5V, I
OUT
= 10mA, V
= 1.7V, and C
EN
OUT
= 0.1µF, unless otherwise
PSRR (RIPPLE REJECTION) vs FREQUENCY PSRR (RIPPLE REJECTION) vs VIN- V
Figure 15. Figure 16.
NOISE SPECTRAL DENSITY NOISE SPECTRAL DENSITY
C
= 0µF C
NR
NR
= 0.01µF
OUT
Figure 17. Figure 18.
RMS NOISE VOLTAGE vs C
Figure 19. Figure 20.
OUT
RMS NOISE VOLTAGE vs C
NR
9
10µs/div
50mV/tick
50mV/tick
50mV/tick
50mA/tick
V
IN
= 3.8V C
OUT
= 0µF
C
OUT
= 1µF
C
OUT
= 10µF
10mA
250mA
V
OUT
V
OUT
V
OUT
I
OUT
10µs/div
50mV/div
50mV/div
1V/div
V
OUT
V
OUT
V
IN
I
OUT
= 250mA
5.5V
4.5V
dV
IN
dt
= 0.5V/µs
C
OUT
= 0µF
C
OUT
= 100µF
100µs/div
1V/div
1V/div
RL= 20
Ω
C
OUT
= 10µ F
2V
0V
RL= 1k
Ω
C
OUT
= 0µF
RL= 20Ω
C
OUT
= 1µF
V
OUT
V
EN
100µs/div
1V/div
1V/div
RL= 20Ω
C
OUT
= 10µF
2V
0V
RL= 1k
Ω
C
OUT
= 0µF
RL= 20Ω
C
OUT
= 1µ F
V
OUT
V
EN
6
5
4
3
2
1
0
−
1
−
2
Volts
50ms/div
V
IN
V
OUT
10
1
0.1
0.01
I
ENABLE
(nA)
−
50−25 0 25 50 75 100 125
Temperature (° C)
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ= 25 ° C, V
noted.
= V
IN
OUT(nom)
+ 0.5V, I
OUT
= 10mA, V
= 1.7V, and C
EN
OUT
= 0.1µF, unless otherwise
LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE
TPS73233 TPS73233
Figure 21. Figure 22.
TPS73233 TPS73233
TURN-ON RESPONSE TURN-OFF RESPONSE
POWER UP / POWER DOWN I
10
Figure 23. Figure 24.
TPS73233
vs TEMPERATURE
ENABLE
Figure 25. Figure 26.
60
55
50
45
40
35
30
25
20
V
N
(rms)
CFB(F)
10p 100p 1n 10n
V
OUT
= 2.5V
C
OUT
= 0µF
R1= 39.2k
Ω
10Hz < Frequency < 100kHz
160
140
120
100
80
60
40
20
0
I
FB
(nA)
−
50−25 0 25 50 75 100 125
Temperature (C)
5µs/div
100mV/div
100mV/div
V
OUT
V
OUT
V
IN
4.5V
3.5V
C
OUT
= 0µF
V
OUT
= 2.5V
CFB= 10nF
C
OUT
= 10µF
10µs/div
100mV/div
100mV/div
V
OUT
V
OUT
I
OUT
250mA
10mA
C
OUT
= 0µF
CFB= 10nF
R1= 39.2k
Ω
C
OUT
= 10µF
TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ= 25 ° C, V
noted.
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
= V
IN
OUT(nom)
+ 0.5V, I
OUT
= 10mA, V
= 1.7V, and C
EN
OUT
= 0.1µF, unless otherwise
RMS NOISE VOLTAGE vs C
ADJ
IFBvs TEMPERATURE
Figure 27. Figure 28.
TPS73201 TPS73201
LOAD TRANSIENT, ADJUSTABLE VERSION LINE TRANSIENT, ADJUSTABLE VERSION
TPS73101 TPS73201
Figure 29. Figure 30.
11
TPS732xx
GND EN NR
IN OUT
V
IN
V
OUT
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional output capacitor.
May improve load transient,
noise, or PSRR.
Optional bypass
capacitor to reduce
output noise.
VN 32 V
RMS
(R
1
R2)
R
2
32 V
RMS
V
OUT
V
REF
TPS732xx
GND EN FB
IN OUT
V
IN
V
OUT
V
OUT
=
×
1.204
(R1+ R2)
R
1
C
FB
R
2
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional output capacitor.
May improve load transient,
noise, or PSRR.
Optional capacitor
reduces output noise.
R
2
VN( V
RMS
) 27
V
RMS
V
V
OUT
(V)
VN( V
RMS
) 8.5
V
RMS
V
V
OUT
(V)
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
APPLICATION INFORMATION
The TPS732xx belongs to a family of new generation
LDO regulators that use an NMOS pass transistor to
achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor
constraints. These features, combined with low noise
and an enable input, make the TPS732xx ideal for
portable applications. This regulator family offers a
wide selection of fixed output voltage versions and an
adjustable output version. All versions have thermal
and over-current protection, including foldback current limit.
Figure 31 shows the basic circuit connections for the
fixed voltage models. Figure 32 gives the connections
for the adjustable output version (TPS73201).
Figure 31. Typical Application Circuit for
Fixed-Voltage Versions
INPUT AND OUTPUT CAPACITOR
REQUIREMENTS
Although an input capacitor is not required for stability, it is good analog design practice to connect a
0.1µF to 1µF low ESR capacitor across the input
supply near the regulator. This counteracts reactive
input sources and improves transient response, noise
rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load
transients are anticipated or the device is located
several inches from the power source.
The TPS732xx does not require an output capacitor
for stability and has maximum phase margin with no
capacitor. It is designed to be stable for all available
types and values of capacitors. In applications where
V
- V
IN
< 0.5V and multiple low ESR capacitors
OUT
are in parallel, ringing may occur when the product of
C
and total ESR drops below 50n Ω F. Total ESR
OUT
includes all parasitic resistances, including capacitor
ESR and board, socket, and solder joint resistance.
In most applications, the sum of capacitor ESR and
trace resistance will meet this requirement.
OUTPUT NOISE
A precision band-gap reference is used to generate
the internal reference voltage, V
the dominant noise source within the TPS732xx and
it generates approximately 32µVRMS (10Hz to
100kHz) at the reference output (NR). The regulator
control loop gains up the reference noise with the
same gain as the reference voltage, so that the noise
voltage of the regulator is approximately given by:
. This reference is
REF
R
1
using the formula shown in Figure 32 . Sample resistor values for common output voltages are shown
in Figure 2 . For best accuracy, make the parallel
combination of R
12
Figure 32. Typical Application Circuit for
Adjustable-Voltage Versions
and R
can be calculated for any output voltage
2
and R
1
approximately 19k Ω .
2
Since the value of V
is 1.2V, this relationship
REF
reduces to:
for the case of no C
.
NR
An internal 27k Ω resistor in series with the noise
reduction pin (NR) forms a low-pass filter for the
voltage reference when an external noise reduction
capacitor, C
C
= 10nF, the total noise in the 10Hz to 100kHz
NR
, is connected from NR to ground. For
NR
bandwidth is reduced by a factor of ~3.2, giving the
approximate relationship:
for C
= 10nF.
NR
(1)
(2)
(3)
dV dt
V
OUT
C
OUT
80k
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
This noise reduction effect is shown as RMS Noise
Voltage vs C
in the Typical Characteristics section.
NR
The TPS73201 adjustable version does not have the achieve extremely low dropout. When (V
noise-reduction pin available. However, connecting a less than the dropout voltage (V
feedback capacitor, C
, from the output to the FB pin device is in its linear region of operation and the
FB
will reduce output noise and improve load transient input-to-output resistance is the R
DROPOUT VOLTAGE
The TPS732xx uses an NMOS pass transistor to
IN
), the NMOS pass
DO
of the NMOS
DS-ON
performance. pass element.
The TPS732xx uses an internal charge pump to For large step changes in load current, the TPS732xx
develop an internal supply voltage sufficient to drive requires a larger voltage drop from V
the gate of the NMOS pass element above V
. The avoid degraded transient response. The boundary of
OUT
IN
charge pump generates ~250µV of switching noise at this transient dropout region is approximately twice
~2MHz; however, charge-pump noise contribution is the dc dropout. Values of V
- V
IN
OUT
above this line
negligible at the output of the regulator for most insure normal transient response.
values of I
BOARD LAYOUT RECOMMENDATION TO
IMPROVE PSRR AND NOISE PERFORMANCE
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended that
the PCB be designed with separate ground planes for
V
and V
IN
at the GND pin of the device. In addition, the ground
connection for the bypass capacitor should connect
and C
OUT
, with each ground plane connected only
OUT
.
OUT
Operating in the transient dropout region can cause
an increase in recovery time. The time required to
recover from a load transient is a function of the
magnitude of the change in load current rate, the rate
of change in load current, and the available headroom (V
to V
IN
voltage drop). Under worst-case
OUT
conditions [full-scale instantaneous load change with
(V
- V
IN
) close to dc dropout levels], the TPS732xx
OUT
can take a couple of hundred microseconds to return
to the specified regulation accuracy.
directly to the GND pin of the device.
TRANSIENT RESPONSE
INTERNAL CURRENT LIMIT
The TPS732xx internal current limit helps protect the
regulator during fault conditions. Foldback helps to
protect the regulator from damage during output
short-circuit conditions by reducing current limit when
V
drops below 0.5V. See Figure 11 in the Typical
OUT
Characteristics section for a graph of I
vs V
OUT
OUT
SHUTDOWN
The Enable pin is active high and is compatible with
standard TTL-CMOS levels. V
turns the regulator off and drops the ground pin
current to approximately 10nA. When shutdown capability is not required, the Enable pin can be connected
to V
. When a pull-up resistor is used, and operation
IN
down to 1.8V is required, use pull-up resistor values
below 50 k Ω .
EN
below 0.5V (max)
.
The low open-loop output impedance provided by the
NMOS pass element in a voltage follower configuration allows operation without an output capacitor for
many applications. As with any regulator, the addition
of a capacitor (nominal value 1µF) from the output pin
to ground will reduce undershoot magnitude but
increase duration. In the adjustable version, the
addition of a capacitor, C
, from the output to the
FB
adjust pin will also improve the transient response.
The TPS732xx does not have active pull-down when
the output is over-voltage. This allows applications
that connect higher voltage sources, such as alternate power supplies, to the output. This also results
in an output overshoot of several percent if the load
current quickly drops to zero when a capacitor is
connected to the output. The duration of overshoot
can be reduced by adding a load resistor. The
overshoot decays at a rate determined by output
capacitor C
and the internal/external load resist-
OUT
ance. The rate of decay is given by:
(Fixed voltage version)
- V
) is
OUT
to V
to
OUT
(4)
13
dV dt
V
OUT
C
OUT
80k (R1 R
2
)
PD (VIN V
OUT
) I
OUT
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004
(Adjustable voltage version) reliability, thermal protection should trigger at least
35 ° C above the maximum expected ambient condition of your application. This produces a worst-case
junction temperature of 125 ° C at the highest expected ambient temperature and worst-case load.
The internal protection circuitry of the TPS732xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS732xx into thermal
shutdown will degrade device reliability.
POWER DISSIPATION
The ability to remove heat from the die is different for
each package type, presenting different considerations in the PCB layout. The PCB area around the
device that is free of other components moves the
heat from the device to the ambient air. Performance
data for JEDEC low- and high-K boards are shown in
the Power Dissipation Ratings table. Using heavier
copper will increase the effectiveness in removing
heat from the device. The addition of plated
through-holes to heat-dissipating layers will also improve the heat-sink effectiveness.
Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
of the output current times the voltage drop across
the output pass element (V
to V
IN
):
OUT
Power dissipation can be minimized by using the
lowest possible input voltage necessary to assure the
required output voltage.
Package Mounting
Solder pad footprint recommendations for the
TPS732xx are presented in Application Bulletin
Solder Pad Recommendations for Surface-Mount Devices (AB-132), available from the Texas Instruments
web site at www.ti.com.
REVERSE CURRENT
The NMOS pass element of the TPS732xx provides
inherent protection against current flow from the
output of the regulator to the input when the gate of
the pass device is pulled low. To ensure that all
charge is removed from the gate of the pass element,
the enable pin must be driven low before the input
voltage is removed. If this is not done, the pass
element may be left on due to stored charge on the
gate.
After the enable pin is driven low, no bias voltage is
needed on any pin for reverse current blocking. Note
that reverse current is specified as the current flowing
out of the IN pin due to voltage applied on the OUT
pin. There will be additional current flowing into the
OUT pin due to the 80k Ω internal resistor divider to
ground (see Figure 1 and Figure 2 ).
For the TPS73201, reverse current may flow when
V
is more than 1.0V above V
FB
.
IN
THERMAL PROTECTION
Thermal protection disables the output when the
junction temperature rises to approximately 160 ° C,
allowing the device to cool. When the junction temperature cools to approximately 140 ° C, the output
circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature,
the thermal protection circuit may cycle on and off.
This limits the dissipation of the regulator, protecting
it from damage due to overheating.
Any tendency to activate the thermal protection circuit
indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to 125 ° C maximum. To
estimate the margin of safety in a complete design
(including heatsink), increase the ambient temperature until the thermal protection is triggered; use
worst-case loads and signal conditions. For good
(5)
(6)
14
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2004
PACKAGING INFORMATION
ORDERABLE DEVICE STATUS(1) PACKAGE TYPE PACKAGE DRAWING PINS PACKAGE QTY
TPS73201DBVR ACTIVE SOP DBV 5 3000
TPS73201DBVT ACTIVE SOP DBV 5 250
TPS73201DCQ ACTIVE SOP DCQ 6 78
TPS73201DCQR ACTIVE SOP DCQ 6 2500
TPS73215DBVR ACTIVE SOP DBV 5 3000
TPS73215DBVT ACTIVE SOP DBV 5 250
TPS73215DCQ ACTIVE SOP DCQ 6 78
TPS73215DCQR ACTIVE SOP DCQ 6 2500
TPS73216DBVR ACTIVE SOP DBV 5 3000
TPS73216DBVT ACTIVE SOP DBV 5 250
TPS73218DBVR ACTIVE SOP DBV 5 3000
TPS73218DBVT ACTIVE SOP DBV 5 250
TPS73218DCQ ACTIVE SOP DCQ 6 78
TPS73218DCQR ACTIVE SOP DCQ 6 2500
TPS73225DBVR ACTIVE SOP DBV 5 3000
TPS73225DBVT ACTIVE SOP DBV 5 250
TPS73225DCQ ACTIVE SOP DCQ 6 78
TPS73225DCQR ACTIVE SOP DCQ 6 2500
TPS73230DBVR ACTIVE SOP DBV 5 3000
TPS73230DBVT ACTIVE SOP DBV 5 250
TPS73230DCQ ACTIVE SOP DCQ 6 78
TPS73230DCQR ACTIVE SOP DCQ 6 2500
TPS73233DBVR ACTIVE SOP DBV 5 3000
TPS73233DBVT ACTIVE SOP DBV 5 250
TPS73233DCQ ACTIVE SOP DCQ 6 78
TPS73233DCQR ACTIVE SOP DCQ 6 2500
TPS73250DBVR ACTIVE SOP DBV 5 3000
TPS73250DBVT ACTIVE SOP DBV 5 250
TPS73250DCQ ACTIVE SOP DCQ 6 78
TPS73250DCQR ACTIVE SOP DCQ 6 2500
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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