(1)ForconditionsshownasMINorMAX,usetheappropriatevaluespecifiedunderrecommendedoperatingconditions.
(2)Alltypicalvalues,exceptforparameterchangeswithtemperature,areatTA=25° C.
(3)Durationofshortcircuitshouldnotexceedonesecond.
(1)ForconditionsshownasMINorMAX,usetheappropriatevaluespecifiedunderrecommendedoperatingconditions.
(2)Alltypicalvalues,exceptforparameterchangeswithtemperature,areatTA=25° C.
(3)Standarddeviationisameasureofthestatisticaldistributionaboutthemeanasderivedfromtheformula:
(1)Alltypicalvalues,exceptfortemperaturecoefficient,areatTA=25° C.
5
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Test
Inputs
DTC
FEEDBACK
RT
CT
GND
50 kΩ
12 kΩ
0.01 µF
V
CC
REF
OUTPUT
CTRL
E2
C2
E1
C1
Output 1
Output 2
150 Ω
2 W
150 Ω
2 W
VCC = 15 V
TEST CIRCUIT
1IN+
V
CC
V
CC
0 V
0 V
Voltage
at C1
Voltage
at C2
Voltage
at CT
DTC
FEEDBACK
0 V
0.7 V
0%
MAX
0%
Threshold Voltage
Threshold Voltage
VOLTAGE WA VEFORMS
Duty Cycle
Error
Amplifiers
7
14
12
8
9
11
10
4
3
6
5
1
2
16
15
13
1IN−
2IN−
2IN+
TL494
PULSE-WIDTH-MODULATIONCONTROLCIRCUITS
SLVS074E– JANUARY1983– REVISEDFEBRUARY2005
PARAMETERMEASUREMENTINFORMATION
6
Figure1.OperationalTestCircuitandWaveforms
www.ti.com
PARAMETERMEASUREMENTINFORMATION
+
−
+
−
V
I
V
ref
FEEDBACK
Amplifier Under Test
Other Amplifier
Output
Each Output
Circuit
68 Ω
2 W
15 V
CL = 15 pF
(See Note A)
90%
10%
90%
10%
t
f
t
r
TEST CIRCUITOUTPUT VOLTAGE WAVEFORM
NOTE A: CL includes probe and jig capacitance.
Output
Each Output
Circuit
68 Ω
2 W
15 V
CL = 15 pF
(See Note A)
90%
10%
90%
10%
t
f
t
r
TEST CIRCUITOUTPUT VOLTAGE WAVEFORM
NOTE A: CL includes probe and jig capacitance.
Figure2.AmplifierCharacteristics
TL494
PULSE-WIDTH-MODULATIONCONTROLCIRCUITS
SLVS074E– JANUARY1983– REVISEDFEBRUARY2005
Figure3.Common-EmitterConfiguration
Figure4.Emitter-FollowerConfiguration
7
www.ti.com
Df = 1%
†
40
10
100
1 k4 k10 k40 k 100 k400 k 1 M
f − Oscillator Frequency and Frequency Variation − Hz
OSCILLATOR FREQUENCY AND
FREQUENCY VARIATION
†
vs
TIMING RESISTANCE
400
1 k
4 k
10 k
40 k
100 k
RT − Timing Resistance − Ω
0.1 µF
−2%
−1%
0%
0.01 µF
0.001 µF
VCC = 15 V
TA = 25°C
CT = 1 µF
†
Frequency variation (∆f) is the change in oscillator frequency that occurs over the full temperature range.
10
0
100
20
110 1001 M
A − Amplifier V oltage Amplification − dB
30
f − Frequency − Hz
AMPLIFIER VOLT AGE AMPLIFICATION
vs
FREQUENCY
1 k
VCC = 15 V
∆VO = 3 V
TA = 25°C
10 k
40
50
60
70
80
90
100 k
TL494
PULSE-WIDTH-MODULATIONCONTROLCIRCUITS
SLVS074E– JANUARY1983– REVISEDFEBRUARY2005
TYPICALCHARACTERISTICS
Figure5.
8
Figure6.
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable DeviceStatus
TL494CDACTIVESOICD1640Green (RoHS &
TL494CDBRACTIVESSOPDB162000 Green (RoHS &
TL494CDBRE4ACTIVESSOPDB162000 Green (RoHS &
TL494CDE4ACTIVESOICD1640Green (RoHS &
TL494CDRACTIVESOICD162500 Green (RoHS &
TL494CDRE4ACTIVESOICD162500 Green (RoHS &
TL494CJOBSOLETECDIPJ16TBDCall TICall TI
TL494CNACTIVEPDIPN1625Pb-Free
TL494CNE4ACTIVEPDIPN1625Pb-Free
TL494CNSRACTIVESONS162000 Green (RoHS &
TL494CNSRG4ACTIVESONS162000 Green (RoHS &
TL494CPWACTIVETSSOPPW1690Green (RoHS &
TL494CPWG4ACTIVETSSOPPW1690Green (RoHS &
TL494CPWLEOBSOLETETSSOPPW16TBDCall TICall TI
TL494CPWRACTIVETSSOPPW162000 Green (RoHS &
TL494CPWRG4ACTIVETSSOPPW162000 Green (RoHS &
TL494IDACTIVESOICD1640Green (RoHS &
TL494IDE4ACTIVESOICD1640Green (RoHS &
TL494IDRACTIVESOICD162500 Green (RoHS &
TL494IDRE4ACTIVESOICD162500 Green (RoHS &
TL494INACTIVEPDIPN1625Pb-Free
TL494INE4ACTIVEPDIPN1625Pb-Free
TL494MJOBSOLETECDIPJ16TBDCall TICall TI
TL494MJBOBSOLETECDIPJ16TBDCall TICall TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-NC-NC-NC
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
17-Oct-2005
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60
6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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