Texas Instruments OPA2350EA, OPA350EA, OPA2350PA, OPA2350UA, OPA350PA Schematics

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(−40dBc)

0.1

(−60dBc)

0.01

(−80dBc)

0.001

(−100dBc)

0.0001

(−120dBc)

Harmonic Distortion (%)

Frequency (Hz)

1k 10k 100k 1M

G = 1 VO= 2.5V

RL= 600Ω

3rd−Harmonic

2nd−Harmonic

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Technical Documents

Tools & Software

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Reference Design

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

OPAx350 High-Speed, Single-Supply, Rail-to-Rail Operational Amplifiers MicroAmplifier

Series

1 Features 3 Description

• Rail-to-Rail Input

• Rail-to-Rail Output (Within 10 mV)

• Wide Bandwidth: 38 MHz

• High Slew Rate: 22 V/μs

• Low Noise: 5 nV/√Hz

• Low THD+Noise: 0.0006%

• Unity-Gain Stable

• MicroSize Packages

• Single, Dual, and Quad

2 Applications

• Cell Phone PA Control Loops

• Driving A/D Converters is to within 10 mV of the supply rails, with a 10-kΩ

• Video Processing

• Data Acquisition

• Process Controls

• Audio Processing

• Communications

• Active Filters

• Test Equipment

OPAx350 Harmonic Distortion

The OPA350 series of rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analogto-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility.

The OPA350 series operates on a single supply as low as 2.5 V, with an input common-mode voltage range that extends 300 mV below ground and 300 mV above the positive supply. Output voltage swing

load. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction.

The single (OPA350) and dual (OPA2350) come in the miniature MSOP-8 surface mount, SO-8 surface mount, and DIP-8 packages. The quad (OPA4350) packages are in the space-saving SSOP-16 surface mount and SO-14 surface mount. All are specified from −40°C to 85°C and operate from −55°C to 150°C.

Device Information

PART NUMBER PACKAGE BODY SIZE (NOM)

MSOP (8) 3.00 mm × 3.00 mm

OPA350 SOIC (8) 3.91 mm × 4.90 mm

PDIP (8) 6.35 mm × 9.81 mm MSOP (8) 3.00 mm × 3.00 mm

OPA2350 SOIC (8) 3.91 mm × 4.90 mm

PDIP (8) 6.35 mm × 9.81 mm

OPA4350

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

SSOP (16) 3.90 mm × 4.90 mm SOIC (14) 3.91 mm × 8.65 mm

(1)

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings...................................... 4

6.2 ESD Ratings ............................................................ 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information: OPA350 and OPA2350........... 5

6.5 Thermal Information: OPA4350................................ 5

6.6 Electrical Characteristics........................................... 6

6.7 Typical Characteristics.............................................. 8

7 Detailed Description............................................ 12

7.1 Overview ................................................................. 12

7.2 Functional Block Diagram....................................... 12

7.3 Feature Description................................................. 12

7.4 Device Functional Modes........................................ 17

8 Application and Implementation ........................ 18

8.1 Application Information............................................ 18

8.2 Typical Applications ................................................ 18

9 Power Supply Recommendations...................... 22

10 Layout................................................................... 22

10.1 Layout Guidelines ................................................. 22

10.2 Layout Example .................................................... 23

11 Device and Documentation Support................. 24

11.1 Device Support .................................................... 24

11.2 Documentation Support ....................................... 24

11.3 Related Links ........................................................ 24

11.4 Community Resources.......................................... 25

11.5 Trademarks........................................................... 25

11.6 Electrostatic Discharge Caution............................ 25

11.7 Glossary................................................................ 25

12 Mechanical, Packaging, and Orderable

Information........................................................... 25

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (January 2005) to Revision D Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1

Product Folder Links: OPA350 OPA2350 OPA4350

Out D

−In D

+In D

−

+In C

−In C

Out C

Out A

−In A

+In A

+In B

−In B

Out B

A D

B C

V+

Out B

−In B

+In B

Out A

−In A

+In A

−

Out D

−In D

+In D

V−

+In C

−In C

Out C

Out A

−In A

+In A

V+

+In B

−In B

Out B

A D

B C

V+

Output

−In

+In

−

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5 Pin Configuration and Functions

OPA350: P, D, and DGK Packages

8-Pin PDIP, SOIC, and VSSOP

Top View

OPA2350: P, D, and DGK Packages

8-Pin PDIP, SOIC, and VSSOP

Top View

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

D Package

14-Pin SOIC

Top View

DBQ Package

16-Pin SSOP

Top View

Pin Functions

NAME

OPA350 OPA2350 OPA4350 SO-14 OPA4350 SSOP

NO. NO. NO. NO.

NC 1, 5, 8 — — 8, 9 — No internal connection –In 2 — — — I Inverting input +In 3 — — — I Noninverting input V– 4 4 11 13 I Negative power supply Output 6 — — — O Output V+ 7 8 4 4 I Positive power supply Out A — 1 1 1 O Output channel A –In A — 2 2 2 I Inverting input channel A +In A — 3 3 3 I Noninverting input channel A +In B — 5 5 5 I Noninverting input channel B –In B — 6 6 6 I Inverting input channel B Out B — 7 7 7 O Output channel B Out C — — 8 10 O Output channel C –In C — — 9 11 I Inverting input channel C +In C — — 10 12 I Noninverting input channel C +In D — — 12 14 I Noninverting input channel D –In D — — 13 15 I Inverting input channel D Out D — — 14 16 O Output channel D

Product Folder Links: OPA350 OPA2350 OPA4350

I/O DESCRIPTION

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

Supply voltage 7 V

Signal input terminals

(2)

Open short circuit current

(3)

Voltage (V−) − 0.3 (V+) + 0.3 V Current 10 mA

Operating temperature –55 150 °C Lead temperature (soldering, 10 s) 300 °C Junction temperature 150 °C

Storage temperature –55 150 °C

stg

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should

be current-limited to 10 mA or less.

(3) Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

OPA350, OPA2350, OPA4350 (ALL PACKAGE TYPES)

(ESD)

OPA350, OPA2350, OPA4350 (SOIC PACKAGES ONLY)

(ESD)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

Electrostatic discharge ±1500 V

Charged-device model (CDM), per JEDEC specification JESD22-

(2)

C101

(1)

MIN MAX UNIT

Continuous

VALUE UNIT

(1)

±1000 V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Power supply voltage, (V+)-(V-) 2.7 (±1.35) 5 (±2.5) 5.5 (±2.75) V Specified temperature –40 25 85 °C Operating temperature –55 25 150 °C

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

6.4 Thermal Information: OPA350 and OPA2350

OPA350, OPA2350

THERMAL METRIC

(1)

DGK (VSSOP) P (PDIP) D (SOIC) UNIT

8 PINS 8 PINS 8 PINS

R R R

ψ ψ

Junction-to-ambient thermal resistance 169.2 53.1 140.1 °C/W

θJA

Junction-to-case (top) thermal resistance 62.8 42.5 89.8 °C/W

θJC(top)

Junction-to-board thermal resistance 89.8 30.3 80.6 °C/W

θJB

Junction-to-top characterization parameter 7.5 19.7 28.7 °C/W

Junction-to-board characterization parameter 88.2 30.2 80.1 °C/W

Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W

θJC(bot)

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information: OPA4350

OPA4350

THERMAL METRIC

θJA

θJC(top)

θJB

θJC(bot)

Junction-to-ambient thermal resistance 83.8 115.8 °C/W Junction-to-case (top) thermal resistance 70.7 67 °C/W Junction-to-board thermal resistance 59.5 58.3 °C/W Junction-to-top characterization parameter 11.6 19.9 °C/W Junction-to-board characterization parameter 37.7 57.9 °C/W Junction-to-case (bottom) thermal resistance N/A N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(1)

D (SOIC) DBQ (SSOP) UNIT

14 PINS 16 PINS

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

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6.6 Electrical Characteristics

VS= 2.7 V to 5.5 V; All specifications at TA= 25°C, RL= 1 kΩ connected to VS/2 and V

PARAMETER TEST CONDITIONS MIN TYP

OFFSET VOLTAGE

VS= 5 V ±150 ±500 µV

PSRR VS= 2.7 V to 5.5 V, VCM= 0 V µV/V

Input offset voltage ±1 mV

vs Power-supply rejection ratio

Channel separation (dual, quad) DC 0.15 µV/V

INPUT BIAS CURRENT

Input bias current pA

Input offset current ±0.5 ±10 pA

NOISE

Input voltage noise, f = 100 Hz to 400 kHz 4 μVrms

Input voltage noise density, f = 10 kHz 7 nV/√Hz

Input current noise density, f = 100 kHz 5 nV/√Hz

Current noise density, f = 10 kHz 4 fA/√Hz

INPUT VOLTAGE RANGE

Common-mode voltage range TA= −40°C to 85°C –0.1 (V+) + 0.1 V

CMRR Common-mode rejection ratio dB

INPUT IMPEDANCE

Differential Ω || pF Common-mode Ω || pF

OPEN-LOOP GAIN

Open-loop voltage gain

FREQUENCY RESPONSE (CL= 100 pF)

GBW Gain-bandwidth product G = 1 38 MHz SR Slew rate G = 1 22 V/µs

Settling time G = ±1, 2-V Step µs

Overload recovery time VIN× G = V

THD+N Total harmonic distortion + noise RL= 600 Ω, VO= 2.5 V

Differential gain error G = 2, RL= 600 Ω, VO= 1.4 V Differential phase error G = 2, RL= 600 Ω, VO= 1.4 V

OUTPUT

I I C

Voltage output swing

OUT

OUT SC

LOAD

(4)

from rail

Output current ±40 short circuit current ±80 mA Capacitive load drive See Typical Characteristics

TA= −40°C to 85°C

vs Temperature TA= –40°C to 85°C ±4 μV/°C

vs Temperature See Typical Characteristics

VS= 2.7 V, −0.1 V < VCM< 2.8 V 66 84 VS= 5.5 V, −0.1 V < VCM< 5.6 V 74 90 TA= −40°C to 85°C,

VS= 5.5 V, −0.1 V < VCM< 5.6 V

RL= 10 kΩ, 50 mV < VO< (V+) –50 mV 100 122

RL= 10 kΩ, 50 mV < VO< (V+) –50 mV 100 TA= –40°C to 85°C

RL= 1 kΩ, 200 mV < VO< (V+) –200 mV 100 120

RL= 1 kΩ, 200 mV < VO< (V+) –200 mV 100

0.1% 0.22

0.01% 0.5

(2)

, G = 1, f = 1 kHz 0.0006%

(3) (3)

RL= 10 kΩ, AOL≥ 100 dB 10 50 TA= –40°C to

85°C

RL= 10 kΩ, AOL≥ 100 dB 50 mV

RL= 1 kΩ, AOL≥ 100 dB 25 200

= VS/2, unless otherwise noted.

OUT

(1)

40 150

±0.5 ±10

1013|| 2.5 1013|| 6.5

0.1 µs

0.17%

0.17 °

(5)

MAX UNIT

175

(1) VS= 5 V (2) V (3) NTSC signal generator used. See Figure 31 for test circuit.

= 0.25 V to 2.75 V

OUT

(4) Output voltage swings are measured between the output and power supply rails. (5) See Figure 17.

Product Folder Links: OPA350 OPA2350 OPA4350

www.ti.com

Electrical Characteristics (continued)

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

VS= 2.7 V to 5.5 V; All specifications at TA= 25°C, RL= 1 kΩ connected to VS/2 and V

PARAMETER TEST CONDITIONS MIN TYP

POWER SUPPLY

TEMPERATURE RANGE

Operating voltage range TA= −40°C to 85°C 2.7 5.5 V

Minimum operating voltage 2.5 V

Quiescent current

(per amplifier)

Specified range –40 85 °C Operating range –55 150 °C

TA= –40°C to 85°C

IO= 0 mA

= VS/2, unless otherwise noted.

OUT

(1)

5.2 7.5

MAX UNIT

8.5

Product Folder Links: OPA350 OPA2350 OPA4350

0.1

0.01

0.001

0.0001

THD+N (%)

Frequency (Hz)

10 100 1k 10k 100k

RL= 600Ω

G = 100, 3VPP(VO= 1V to 4V)

G = 10, 3VPP(VO= 1V to 4V)

G = 1, 3VPP(VO= 1V to 4V) Input goes through transition region

G = 1, 2.5VPP(VO= 0.25V to 2.75V) Input does NOT go through transition region

(−40dBc)

0.1

(−60dBc)

0.01

(−80dBc)

0.001

(−100dBc)

0.0001

(−120dBc)

Harmonic Distortion (%)

Frequency (Hz)

1k 10k 100k 1M

G = 1 VO= 2.5V

RL= 600Ω

3rd−Harmonic

2nd−Harmonic

Frequency (Hz)

Channel Separation (dB)

140

130

120

110

100

10010 1k 1M100k10k 10M

Dual and quad devices.

100k

10k

100

10k

100

0.1

Voltage Noise (nV

√Hz)

Frequency (Hz)

10 100 1k 10k 100k 1M 10M

Current Noise (fA

√

Hz)

Voltage Noise

Current Noise

100

PSRR, CMRR (dB)

Frequency (Hz)

10 100 1k 10k 100k 1M 10M

PSRR

CMRR

= +5V

=−0.1V to 5.1V)

0.1 1

160

140

120

100

−

135

−

180

Phase (

)

Frequency (Hz)

10 100 1k 10k 100k 1M 10M 100M

Voltage Gain (dB)

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

6.7 Typical Characteristics

All specifications at TA= 25°C, VS= 5 V, and RL= 1 kΩ connected to VS/2, unless otherwise noted.

www.ti.com

Figure 1. Open-Loop Gain and Phase vs Frequency

Figure 3. Input Voltage and Current Noise Spectral Density

vs Frequency

Figure 2. Power Supply and Common-Mode Rejection Ratio

vs Frequency

Figure 4. Channel Separation vs Frequency

Figure 5. Total Harmonic Distortion + Noise vs Frequency

Figure 6. Harmonic Distortion + Noise vs Frequency

Product Folder Links: OPA350 OPA2350 OPA4350

Supply Voltage (V)

Quiescent Current (mA)

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Per Amplifier

Temperature ( °C)

Quiescent Current (mA)

7.0

6.5

6.0

5.5

5.0

4.5

4.0

3.5

100

Short−Circuit Current (mA)

−75−50−

25 0 25 50 75 100 125

−

Temperature ( °C)

Slew Rate (V/

−75−50−

25 0 25 50 75 1 00 125

Negative Slew Rate

Positive Slew Rate

100

CMRR (dB)

110

100

PSRR (dB)

Temperature ( °C )

−75 −50 −25 0 25 50 75 100 125

CMRR, VS= 5.5V

(VCM=−0.1V to +5.6V)

CMRR, VS= 2.7V

=− 0.1V to +2.8V)

PSRR

0.5

0.4

0.3

0.2

0.1

Differential Gain (%)

Differential Phase (°

)

Resistive Load (Ω)

0 100 200 300 500400 600 800700 900 100

G = 2 V

= 1.4V NTSC Signal Generator See Figure 6 for test circuit.

Phase

Gain

130

125

120

115

110

Open−Loop Gain (dB)

Temperature ( °C)

−

75−50−25 0 25 5 0 75 100 125

RL= 600

Ω

RL= 1k

Ω

RL= 10k

Ω

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Typical Characteristics (continued)

All specifications at TA= 25°C, VS= 5 V, and RL= 1 kΩ connected to VS/2, unless otherwise noted.

Figure 7. Differential Gain and Phase vs Resistive Load

Figure 9. Common-Mode and Power-Supply Rejection Ratio

vs Temperature

Figure 8. Open-Loop Gain vs Temperature

Figure 10. Slew Rate vs Temperature

Figure 11. Quiescent Current and short circuit Current vs

Temperature

Product Folder Links: OPA350 OPA2350 OPA4350

Figure 12. Quiescent Current vs Supply Voltage

140

130

120

110

100

Open−Loop Gain (dB)

Output Voltage Swing from Rails (mV)

0 20 40 6 0 10080 120 160140 180 200

OUT

= 4.2mA

OUT

= 250µA

OUT

= 2.5mA

Output Current (mA)

Output Voltage (V)

V+

(V+)−1

(V+)−2

(V−)+2

(V−)+1

(V−)

+25

°C

+125

°C

−

°C

−

°C

+125

°C

+25

°C

Depending on circuit configuration (including closed−loop gain) performance may be degraded in shaded region.

100M1M 10M

Frequency (Hz)

100k

Output Voltage (V

)

Maximum output voltage without slew rate−induced distortion.

VS= 2.7V

VS= 5.5V

Frequency (Hz)

Output Impedance (

Ω

)

100

0.1

0.01

0.001

0.0001 1 10 100 1k 10k 100k 1M 10M 100

G = 100

G = 10

G = 1

Common−Mode Voltage (V)

Input Bias Current (pA)

1.5

1.0

0.5

0.0

−

0.5

−0.5 0.0 0.5 1.0 2.01.5 2.5 3.0 3.5 4.0 5.04.5 5.5

Input Bias Current (pA)

Temperature (

°C)

−75−50−

25 0 25 50 75 100 125

100

0.1

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Typical Characteristics (continued)

All specifications at TA= 25°C, VS= 5 V, and RL= 1 kΩ connected to VS/2, unless otherwise noted.

www.ti.com

Figure 13. Input Bias Current vs Temperature

Figure 15. Closed-Loop Output Impedance vs Frequency

Figure 14. Input Bias Current vs Input Common-Mode

Voltage

Figure 16. Maximum Output Voltage vs Frequency

Figure 17. Output Voltage Swing vs Output Current

Figure 18. Open-Loop Gain vs Output Voltage Swing

Product Folder Links: OPA350 OPA2350 OPA4350

100ns/div

50mV/div

200ns/div

1V/div

0.1

Settling Time (

Closed−Loop Gain (V/V)

−

100

0.1%

0.01%

1M100 1k 10k 100k

Load Capacitance (pF)

Overshoot (%)

G = 1

G=−1

G =±10

Offset Voltage Drift (µV/

°C)

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Percent of Amplifiers (%)

Typical production distribution of packaged units.

Offset Voltage (µV)

Percent of Amplifiers (%)

−

500

−

450

−

400

−

350

−

300

−

250

−

200

−

150

−

100

−

100

150

200

250

300

350

400

450

500

Typical distribution of

packaged units.

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Typical Characteristics (continued)

All specifications at TA= 25°C, VS= 5 V, and RL= 1 kΩ connected to VS/2, unless otherwise noted.

Figure 19. Offset Voltage Production Distribution

Figure 21. Small-Signal Overshoot vs Load Capacitance

Figure 20. Offset Voltage Drift Production Distribution

Figure 22. Settling Time vs Closed-Loop Gain

Figure 23. Small-Signal Step Response Figure 24. Large-Signal Step Response

CL= 100 pF CL= 100 pF

Product Folder Links: OPA350 OPA2350 OPA4350

Reference

Current

V+

IN-

IN+

(Ground)

BIAS2

BIAS1

Class AB

Control

Circuitry

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

7 Detailed Description

7.1 Overview

The OPA350 series rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analog-to-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility.

7.2 Functional Block Diagram

7.3 Feature Description

The OPA350 series of operational amplifiers (op amps) are fabricated on a state-of-the-art 0.6 micron CMOS process. They are unity-gain stable and suitable for a wide range of general purpose applications. Rail-to-rail input and output make them ideal for driving sampling A/D converters. They are also suited for controlling the output power in cell phones. These applications often require high speed and low noise. In addition, the OPA350 series offers a low-cost solution for general-purpose and consumer video applications (75-Ω drive capability).

Excellent AC performance makes the OPA350 series suited for audio applications. Their bandwidth, slew rate, low noise (5 nV/√Hz), low THD (0.0006%), and small package options are ideal for these applications. The class AB output stage is capable of driving 600-Ω loads connected to any point between V+ and ground.

Rail-to-rail input and output swing significantly increases dynamic range, especially in low voltage supply applications. Figure 25 shows the input and output waveforms for the OPA350 in unity-gain configuration. Operation is from a single 5-V supply with a 1-kΩ load connected to VS/2. The input is a 5 VPPsinusoid. Output voltage swing is approximately 4.95 VPP.

Power supply pins should be bypassed with 0.01-μF ceramic capacitors.

Product Folder Links: OPA350 OPA2350 OPA4350

VS= +5, G = +1, RL= 1k

Ω

OUT

1.25V/div

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Feature Description (continued)

Figure 25. Rail-to-Rail Input and Output

7.3.1 Operating Voltage

OPA350 series operational amplifiers are fully specified from 2.7 V to 5.5 V. Supply voltage may range from 2.5 V to 5.5 V. Parameters are tested over the specified supply range: a feature of the OPA350 series. In addition, many specifications apply from −40°C to 85°C. Most behavior remains virtually unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltage or temperature are shown in

Typical Characteristics.

7.3.2 Rail-to-Rail Input

The tested input common-mode voltage range of the OPA350 series extends 100 mV beyond the supply rails. This is achieved with a complementary input stage: an N-channel input-differential pair in parallel with a Pchannel differential pair, as shown in Figure 26. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 1.8 V to 100 mV above the positive supply, while the P-channel pair is on for inputs from 100 mV below the negative supply to approximately (V+) – 1.8 V. There is a small transition region, typically (V+) – 2 V to (V+) – 1.6 V, in which both pairs are on. This 400-mV transition region can vary ±400 mV with process variation. Thus, the transition region (both input stages on) can range from (V+) – 2.4 V to (V+) – 2 V on the low end, up to (V+) – 1.6 V to (V+) – 1.2 V on the high end.

Product Folder Links: OPA350 OPA2350 OPA4350

Ω

OPA x350

10mA max

V+

OUT

OVERLOAD

BIAS1

BIAS2

VIN+

−

Class AB

Control

Circuitry

−

(Ground)

V+

Reference

Current

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Feature Description (continued)

www.ti.com

Figure 26. Simplified Schematic

OPA350 series operational amplifiers are laser-trimmed to reduce offset voltage difference between the Nchannel and P-channel input stages, resulting in improved common-mode rejection and a smooth transition between the N-channel pair and the P-channel pair. However, within the 400-mV transition region PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region.

A double-folded cascode adds the signal from the two input pairs and presents a differential signal to the class AB output stage. Normally, input bias current is approximately 500 fA. However, large inputs (greater than 300 mV beyond the supply rails) can turn on the input protection diodes, causing excessive current to flow in or out of the input pins. Momentary voltages greater than 300 mV beyond the power supply can be tolerated if the current on the input pins is limited to 10 mA. This is easily accomplished with an input resistor, as shown in Figure 27. Many input signals are inherently current-limited to less than 10 mA; therefore, a limiting resistor is not required.

Figure 27. Input Current Protection for Voltages Exceeding the Supply Voltage

7.3.3 Rail-to-Rail Output

A class AB output stage with common-source transistors achieves rail-to-rail output. For light resistive loads (>10 kΩ), the output voltage swing is typically ten millivolts from the supply rails. With heavier resistive loads (600 Ω to 10 kΩ), the output can swing to within a few tens of millivolts from the supply rails and maintain high open-loop gain. See Figure 17 and Figure 18 for more information.

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Feature Description (continued)

7.3.4 Capacitive Load and Stability

OPA350 series operational amplifiers can drive a wide range of capacitive loads. However, all operational amplifiers under certain conditions may become unstable. operational amplifier configuration, gain, and load value are just a few of the factors to consider when determining stability. An operational amplifier in unity-gain configuration is the most susceptible to the effects of capacitive load. The capacitive load reacts with the output impedance of the operational amplifier, along with any additional load resistance, to create a pole in the smallsignal response that degrades the phase margin.

In unity gain, OPA350 series operational amplifiers perform well with large capacitive loads. Increasing gain enhances the ability of the amplifier to drive more capacitance. Figure 21 shows performance with a 1-kΩ resistive load. Increasing load resistance improves capacitive load drive capability.

7.3.5 Driving A/D Converters

OPA350 series operational amplifiers are optimized for driving medium speed (up to 500 kHz) sampling A/D converters, and also offer excellent performance for higher speed converters. The OPA350 series provides an effective means of buffering the input capacitance of the A/D and resulting charge injection while providing signal gain.

Figure 28 shows the OPA350 driving an ADS7861. The ADS7861 is a dual, 500 kHz, 12-bit sampling converter

in the tiny SSOP-24 package. When used with the miniature package options of the OPA350 series, the combination is ideal for space-limited applications. For further information, consult the ADS7861 data sheet,

Dual, 500kSPS, 12-Bit, 2 + 2 Channel, Simultaneous Sampling ANALOG-TO-DIGITAL CONVERTER

(SBAS110).

Product Folder Links: OPA350 OPA2350 OPA4350

1/ 4

O PA 435 0

VINB1

Ω

CH B1+

CH B1

−

CH B0+

CH B0

−

CH A1+

CH A1

−

CH A0+

CH A0

−

REF

OUT

SERIAL DATA A

SERIAL DATA B

BUSY

CLOCK

CONVST

1/ 4

O PA 435 0

VINB0

+5V

Ω

1/ 4

O PA 435 0

VINA1

Ω

1/ 4

O PA 435 0

VINA0

1 12

Ω

0.1µF 0.1µF

24 13

Serial

Interface

DGND AGND

ADS7861

VIN= 0V to 2.45V for 0V to 4.9V output. Choose C

, CB0, CA1, CA0to filter high frequency noise.

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Feature Description (continued)

www.ti.com

Figure 28. OPA4350 Driving Sampling A/D Converter

7.3.6 Output Impedance

The low-frequency open-loop output impedance of the common-source output stage of the OPA350 is approximately 1 kΩ. When the operational amplifier is connected with feedback, this value is reduced significantly by the loop gain of the operational amplifier. For example, with 122 dB of open-loop gain, the output impedance is reduced in unity-gain to less than 0.001 Ω. For each decade rise in the closed-loop gain, the loop gain is reduced by the same amount which results in a ten-fold increase in effective output impedance (see

Figure 15).

At higher frequencies, the output impedance rises as the open-loop gain of the operational amplifier drops. However, at these frequencies the output also becomes capacitive due to parasitic capacitance. This prevents the output impedance from becoming too high, which can cause stability problems when driving capacitive loads. The OPA350 has excellent capacitive load drive capability for an operational amplifier with its bandwidth.

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

7.4 Device Functional Modes

The OPAx350 has a single functional mode and is operational when the power-supply voltage is greater than

2.7 V (±1.35 V). The maximum power supply voltage for the OPAx350 is 5.5V (±2.75 V).

Product Folder Links: OPA350 OPA2350 OPA4350

 

4 1

C 3 4 2 5

Gain

f 1 R R C C

 

1 3 2 5

2 1 3 4 3 4 2 5

1R R C C

Output

Input

s s C 1 R 1R 1 R 1R R C C



   

OPAx350

Output

Input

590 

2.94 k

499 

39 nF

1 nF

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

Low pass filters are commonly employed in signal processing applications to reduce noise and prevent aliasing. The OPAx350 are ideally suited to construct high speed, high precision active filters. Figure 29 illustrates a second order low pass filter commonly encountered in signal processing applications.

8.2 Typical Applications

8.2.1 Second Order Low Pass Filter

8.2.1.1 Design Requirements

Use the following parameters for this design example:

• Gain = 5 V/V (inverting gain).

• Low pass cutoff frequency = 25 kHz.

• Second order Chebyshev filter response with 3-dB gain peaking in the passband.

8.2.1.2 Detailed Design Procedure

The infinite-gain multiple-feedback circuit for a low-pass network function is shown in Equation 1. Use Equation 2 to calculate the voltage transfer function.

This circuit produces a signal inversion. For this circuit the gain at DC and the low pass cutoff frequency can be calculated using Equation 2.

Software tools are readily available to simplify filter design. WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive components from TI's vendor partners. Available as a web based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to design, optimize, and simulate complete multi-stage active filter solutions within minutes.

Figure 29. Second Order Low Pass Filter

Product Folder Links: OPA350 OPA2350 OPA4350

(1)

(2)

OPA350

+5V

OUT

+5V (pin 7)

Video

OUT

Cable

Ω

10µF

0.1µF 10µF

0.1µF

1000µF

47µF

Ω

220µF

Frequency (Hz)

Gain (db)

-60

-40

-20

100 1k 10k 100k 1M

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Typical Applications (continued)

8.2.1.3 Application Curve

Figure 30. OPAx350 2nd Order 25-kHz, Chebyshev, Low-Pass Filter

8.2.2 Single-Supply Video Line Driver

Figure 31 shows a circuit for a single supply, G = 2 composite video line driver. The synchronized outputs of a

composite video line driver extend below ground. As shown, the input to the operational amplifier should be ACcoupled and shifted positively to provide adequate signal swing to account for these negative signals in a singlesupply configuration.

The input is terminated with a 75-Ω resistor and AC-coupled with a 47-μF capacitor to a voltage divider that provides the DC bias point to the input. In Figure 31, this point is approximately (V−) + 1.7 V. Setting the optimal bias point requires some understanding of the nature of composite video signals. For best performance, avoid the distortion caused by the transition region of the complementary input stage of the OPA350. See the discussion of rail-to-rail input in Rail-to-Rail Input.

Figure 31. Single-Supply Video Line Driver

Product Folder Links: OPA350 OPA2350 OPA4350

O PA 35 0

V+

OUT

•

= R

•

Where CINis equal to the OPA350’s input capacitance (approximately 9pF) plus any parasitic layout capacitance.

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

Typical Applications (continued)

8.2.3 Adding a Feedback Capacitor to Improve Response

For optimum settling time and stability with high-impedance feedback networks, it may be necessary to add a feedback capacitor across the feedback resistor, RF, as shown in Figure 32. This capacitor compensates for the zero created by the feedback network impedance and the input capacitance of the OPA350 (and any parasitic layout capacitance). The effect becomes more significant with higher impedance networks.

Figure 32. Feedback Capacitor Improves Dynamic Performance

A variable capacitor can be used for the feedback capacitor, because input capacitance may vary between operational amplifiers and layout capacitance is difficult to determine. For the circuit shown in Figure 32, the value of the variable feedback capacitor should be chosen so that the input resistance times the input capacitance of the OPA350 (typically 9 pF) plus the estimated parasitic layout capacitance equals the feedback capacitor times the feedback resistor:

RIN× CIN= RF× C

where

• CINis equal to the input capacitance of the OPA350 (sum of differential and common-mode) plus the layout capacitance. (3)

The capacitor can be varied until optimum performance is obtained.

8.2.4 Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection

The OPAx350 is well suited for high input impedance applications such as an instrumentation amplifier. The two amplifier configuration shown in Figure 33 rejects any common mode signals and senses the small differential input voltage developed by the resistive bridge. The voltage reference sets the output to 2.5 V when the differential signal developed by the bridge is zero. The high common mode rejection versus frequency response of the OPAx350, rejects and common mode noise that may be coupled into the bridge circuit from the bridge excitation source. The gain of the circuit is determined by RGaccording to the equation shown in Figure 33.

Product Folder Links: OPA350 OPA2350 OPA4350

+2.5V

270pF

1830pF

−2.5V

49.9k

Ω

20kΩ

OPA350

OUT

10.5k

Ω

1/ 2

O PA 235 0

1/ 2

O PA 235 0

25k

Ω

25k

Ω

100k

Ω

100k

Ω

10k

Ω

50k

Ω

G = 5 +

200k

Ω

+5V

REF1004−2.5

(2.5V)

www.ti.com

Typical Applications (continued)

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

8.2.5 10-kHz High-Pass Filter

High-pass filters are used to reject DC signals and low-frequency time varying signals such as drift versus temperature. Figure 34 illustrates a high-pass filter with a 10 kHz low-frequency cutoff frequency.

Figure 33. Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode

Rejection Schematic

Figure 34. 10-kHz High-Pass Filter

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

9 Power Supply Recommendations

The OPAx350 are specified for operation from 2.7 V to 5.5 V (±1.35 V to ±2.75 V); many specifications apply from –40°C to 85°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in the Typical Characteristics.

10 Layout

10.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

• Noise can propagate into analog circuitry through the power pins of the circuit as a whole and operational amplifier itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.

– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as

close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications.

• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds paying attention to the flow of the ground current. For more detailed information, see Circuit Board Layout Techniques (SLOA089).

• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace.

• Place the external components as close to the device as possible. As illustrated in Figure 35, keeping RF and RG close to the inverting input minimizes parasitic capacitance.

• Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.

• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.

• Cleaning the PCB following board assembly is recommended for best performance.

• Any precision integrated circuit may experience performance shifts due to moisture ingress into the plastic package. Following any aqueous PCB cleaning process, baking the PCB assembly is recommended to remove moisture introduced into the device packaging during the cleaning process. A low temperature, post cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.

Product Folder Links: OPA350 OPA2350 OPA4350

N/C

±IN

+IN

V±

V+

OUTPUT

N/C

VS+

GND

VS±

GND

Ground (GND) plane on another layer

VOUT

VIN

GND

Run the input traces

as far away from

the supply lines

as possible

Use low-ESR, ceramic

bypass capacitor

Place components

close to device and to

each other to reduce

parasitic errors

VIN

VOUT

(Schematic Representation)

Use low-ESR,

ceramic bypass

capacitor

www.ti.com

10.2 Layout Example

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

Figure 35. Operational Amplifier Board Layout for Noninverting Configuration

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

www.ti.com

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 TINA-TI™ (Free Software Download)

TINA™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI™ is a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a range of both passive and active models. TINA-TI provides all the conventional DC, transient, and frequency domain analysis of SPICE, as well as additional design capabilities.

Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool.

WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH

Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive components from TI's vendor partners. Available as a web based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to design, optimize, and simulate complete multi-stage active filter solutions within minutes.

NOTE

These files require that either the TINA software (from DesignSoft™) or TINA-TI software be installed. Download the free TINA-TI software from the TINA-TI folder.

11.1.1.2 TI Precision Designs

The OPA350 is featured in several TI Precision Designs, available online at

http://www.ti.com/ww/en/analog/precision-designs/. TI Precision Designs are analog solutions created by TI’s

precision analog applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

• Circuit Board Layout Techniques, SLOA089

• Op Amps for Everyone, SLOD006

• Compensate Transimpedance Amplifiers Intuitively, SBOS055

• Noise Analysis for High Speed op Amps, SBOA066

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY

OPA350 Click here Click here Click here Click here Click here OPA2350 Click here Click here Click here Click here Click here OPA4350 Click here Click here Click here Click here Click here

TECHNICAL TOOLS & SUPPORT &

DOCUMENTS SOFTWARE COMMUNITY

Product Folder Links: OPA350 OPA2350 OPA4350

OPA350,OPA2350,OPA4350

www.ti.com

SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

TINA-TI, E2E are trademarks of Texas Instruments. TINA, DesignSoft are trademarks of DesignSoft, Inc. All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: OPA350 OPA2350 OPA4350

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

OPA2350EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS

OPA2350EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS

OPA2350EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS

OPA2350EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

OPA2350PA LIFEBUY PDIP P 8 50 Green (RoHS

OPA2350PAG4 LIFEBUY PDIP P 8 50 Green (RoHS

OPA2350UA ACTIVE SOIC D 8 75 Green (RoHS

OPA2350UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

OPA2350UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

OPA2350UAG4 ACTIVE SOIC D 8 75 Green (RoHS

OPA350EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS

OPA350EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS

OPA350EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS

OPA350EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

OPA350PA ACTIVE PDIP P 8 50 Green (RoHS

OPA350PAG4 ACTIVE PDIP P 8 50 Green (RoHS

OPA350UA ACTIVE SOIC D 8 75 Green (RoHS

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 D50

CU NIPDAU N / A for Pkg Type -40 to 85 OPA2350PA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

2350UA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

2350UA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

2350UA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

2350UA

CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 C50

CU NIPDAU N / A for Pkg Type -40 to 85 OPA350PA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

350UA

12-Feb-2016

Samples

(4/5)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

Package Type Package

(1)

Drawing

Pins Package

Qty

OPA350UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

OPA350UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

OPA350UAG4 ACTIVE SOIC D 8 75 Green (RoHS

OPA4350EA/250 ACTIVE SSOP DBQ 16 250 Green (RoHS

OPA4350EA/250G4 ACTIVE SSOP DBQ 16 250 Green (RoHS

OPA4350EA/2K5 ACTIVE SSOP DBQ 16 2500 Green (RoHS

OPA4350UA ACTIVE SOIC D 14 50 Green (RoHS

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

350UA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

350UA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

350UA

CU NIPDAU Level-2-260C-1 YEAR OPA

4350EA

CU NIPDAU Level-2-260C-1 YEAR OPA

4350EA

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA

4350EA

CU NIPDAU Level-2-260C-1 YEAR OPA4350UA

12-Feb-2016

(4/5)

& no Sb/Br)

OPA4350UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS

CU NIPDAU Level-2-260C-1 YEAR OPA4350UA

& no Sb/Br)

OPA4350UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS

CU NIPDAU Level-2-260C-1 YEAR OPA4350UA

& no Sb/Br)

OPA4350UAG4 ACTIVE SOIC D 14 50 Green (RoHS

CU NIPDAU Level-2-260C-1 YEAR OPA4350UA

& no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Samples

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

12-Feb-2016

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Apr-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

OPA2350EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2350EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA350EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA350UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA4350EA/250 SSOP DBQ 16 250 180.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA4350EA/2K5 SSOP DBQ 16 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4350UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Apr-2015

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA2350EA/250 VSSOP DGK 8 250 210.0 185.0 35.0

OPA2350EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0

OPA350EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA350UA/2K5 SOIC D 8 2500 367.0 367.0 35.0

OPA4350EA/250 SSOP DBQ 16 250 210.0 185.0 35.0 OPA4350EA/2K5 SSOP DBQ 16 2500 367.0 367.0 35.0 OPA4350UA/2K5 SOIC D 14 2500 367.0 367.0 38.0

Pack Materials-Page 2

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Texas Instruments OPA2350EA, OPA350EA, OPA2350PA, OPA2350UA, OPA350PA Schematics

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Features 3 Description

2 Applications

Table of Contents

4 Revision History

5 Pin Configuration and Functions

6 Specifications

6.1 Absolute Maximum Ratings

6.2 ESD Ratings

6.3 Recommended Operating Conditions

6.4 Thermal Information: OPA350 and OPA2350

6.5 Thermal Information: OPA4350

6.6 Electrical Characteristics

6.7 Typical Characteristics

7 Detailed Description

7.1 Overview

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Operating Voltage

7.3.2 Rail-to-Rail Input

7.3.3 Rail-to-Rail Output

7.3.4 Capacitive Load and Stability

7.3.5 Driving A/D Converters

7.3.6 Output Impedance

7.4 Device Functional Modes

8 Application and Implementation

8.1 Application Information

8.2 Typical Applications

8.2.1 Second Order Low Pass Filter

8.2.1.1 Design Requirements

8.2.1.2 Detailed Design Procedure

8.2.1.3 Application Curve

8.2.2 Single-Supply Video Line Driver

8.2.3 Adding a Feedback Capacitor to Improve Response

8.2.4 Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection

8.2.5 10-kHz High-Pass Filter

9 Power Supply Recommendations

10 Layout

10.1 Layout Guidelines

10.2 Layout Example

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 TINA-TI™ (Free Software Download)

11.1.1.2 TI Precision Designs

11.2 Documentation Support

11.2.1 Related Documentation

11.3 Related Links

11.4 Community Resources

11.5 Trademarks

11.6 Electrostatic Discharge Caution

11.7 Glossary

12 Mechanical, Packaging, and Orderable Information