Support
– 64 General-Purpose Registers (32-Bit)
– Six ALU (32- and 40-Bit) Functional Units
– Supports 32-Bit Integer, SP (IEEE Single
Precision/32-Bit) and DP (IEEE Double
Precision/64-Bit) Floating Point
– Supports up to Four SP Additions Per Clock,
Four DP Additions Every Two Clocks
– Supports up to Two Floating-Point (SP or DP)
Reciprocal Approximation (RCPxP) and
Square-Root Reciprocal Approximation
(RSQRxP) Operations Per Cycle
– Two Multiply Functional Units:
– Mixed-Precision IEEE Floating-Point Multiply
Supported up to:
– 2 SP × SP → SP Per Clock
– 2 SP × SP → DP Every Two Clocks
TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
– 2 SP × DP → DP Every Three Clocks
– 2 DP × DP → DP Every Four Clocks
– Fixed-Point Multiply Supports Two 32 × 32-
Bit Multiplies, Four 16 × 16-Bit Multiplies, or
Eight 8 × 8-Bit Multiplies per Clock Cycle,
and Complex Multiples
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Hardware Support for Modulo Loop Operation
– Protected Mode Operation
– Exceptions Support for Error Detection and
Program Redirection
• Software Support
– TI DSP BIOS™
– Chip Support Library and DSP Library
• 128KB of RAM Shared Memory
• 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and
DDR2 Interfaces)
• Two External Memory Interfaces:
– EMIFA
– NOR (8- or 16-Bit-Wide Data)
– NAND (8- or 16-Bit-Wide Data)
– 16-Bit SDRAM With 128-MB Address Space
– DDR2/Mobile DDR Memory Controller With one
of the Following:
– 16-Bit DDR2 SDRAM With 256-MB Address
Space
– 16-Bit mDDR SDRAM With 256-MB Address
Space
• Three Configurable 16550-Type UART Modules:
– With Modem Control Signals
– 16-Byte FIFO
– 16x or 13x Oversampling Option
• LCD Controller
• Two Serial Peripheral Interfaces (SPIs) Each With
Multiple Chip Selects
• Two Multimedia Card (MMC)/Secure Digital (SD)
Card Interfaces With Secure Data I/O (SDIO)
Interfaces
• Two Master and Slave Inter-Integrated Circuits
(I2C Bus™)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
www.ti.com
• One Host-Port Interface (HPI) With 16-Bit-Wide
Muxed Address and Data Bus For High Bandwidth
• Programmable Real-Time Unit Subsystem
(PRUSS)
– Two Independent Programmable Real-Time Unit
(PRU) Cores
– 32-Bit Load-Store RISC Architecture
– 4KB of Instruction RAM Per Core
– 512 Bytes of Data RAM Per Core
– PRUSS can be Disabled Through Software to
Save Power
– Register 30 of Each PRU is Exported From
the Subsystem in Addition to the Normal R31
Output of the PRU Cores.
– Standard Power-Management Mechanism
– Clock Gating
– Entire Subsystem Under a Single PSC Clock
• USB 2.0 OTG Port With Integrated PHY (USB0)
– USB 2.0 High- and Full-Speed Client
– USB 2.0 High-, Full-, and Low-Speed Host
– End Point 0 (Control)
– End Points 1, 2, 3, and 4 (Control, Bulk,
Interrupt, or ISOC) RX and TX
• One Multichannel Audio Serial Port (McASP):
– Two Clock Zones and 16 Serial Data Pins
– Supports TDM, I2S, and Similar Formats
– DIT-Capable
– FIFO Buffers for Transmit and Receive
• Two Multichannel Buffered Serial Ports (McBSPs):
– Supports TDM, I2S, and Similar Formats
– AC97 Audio Codec Interface
– Telecom Interfaces (ST-Bus, H100)
– 128-Channel TDM
– FIFO Buffers for Transmit and Receive
• 10/100 Mbps Ethernet MAC (EMAC):
– IEEE 802.3 Compliant
– MII Media-Independent Interface
– RMII Reduced Media-Independent Interface
– Management Data I/O (MDIO) Module
• Video Port Interface (VPIF):
– Two 8-Bit SD (BT.656), Single 16-Bit or Single
Raw (8-, 10-, and 12-Bit) Video Capture
Channels
– Two 8-Bit SD (BT.656), Single 16-Bit Video
Display Channels
• Universal Parallel Port (uPP):
– High-Speed Parallel Interface to FPGAs and
Data Converters
– Data Width on Both Channels is 8- to 16-Bit
Inclusive
– Single-Data Rate or Dual-Data Rate Transfers
– Supports Multiple Interfaces With START,
ENABLE, and WAIT Controls
• Serial ATA (SATA) Controller:
– Supports SATA I (1.5 Gbps) and SATA II
(3.0 Gbps)
– Supports All SATA Power-Management
Features
– Hardware-Assisted Native Command Queueing
(NCQ) for up to 32 Entries
– Supports Port Multiplier and Command-Based
Switching
• Real-Time Clock (RTC) With 32-kHz Oscillator and
Separate Power Rail
• Three 64-Bit General-Purpose Timers (Each
Configurable as Two 32-Bit Timers)
• One 64-Bit General-Purpose or Watchdog Timer
(Configurable as Two 32-Bit General-Purpose
Timers)
• Two Enhanced High-Resolution Pulse Width
Modulators (eHRPWMs):
– Dedicated 16-Bit Time-Base Counter With
Period and Frequency Control
– 6 Single-Edge Outputs, 6 Dual-Edge Symmetric
Outputs, or 3 Dual-Edge Asymmetric Outputs
– Dead-Band Generation
– PWM Chopping by High-Frequency Carrier
– Trip Zone Input
• Three 32-Bit Enhanced Capture (eCAP) Modules:
– Configurable as 3 Capture Inputs or 3 Auxiliary
The TMS320C6748 fixed- and floating-point DSP is a low-power applications processor based on a C674x
DSP core. This DSP provides significantly lower power than other members of the TMS320C6000™
platform of DSPs.
The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs)
to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor
performance through the maximum flexibility of a fully integrated, mixed processor solution.
The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache.
The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program
and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.
Although the DSP L2 is accessible by other hosts in the system, an additional 128KB of RAM shared
memory is available for use by other hosts without affecting DSP performance.
For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property
and prevents external entities from modifying user-developed algorithms. By starting from a hardwarebased “root-of-trust," the secure boot flow ensures a known good starting point for code execution. By
default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port
can be enabled during the secure boot process during application development. The boot modules are
encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and
authenticated when loaded during secure boot. Encryption and decryption protects customers’ IP and lets
them securely set up the system and begin device operation with known, trusted code.
TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
•Machine Vision (Low-End)
Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure
Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption
scheme which not only protects the boot process but also offers the ability to securely upgrade boot and
application software code. A 128-bit device-specific cipher key, known only to the device and generated
using a NIST-800-22 certified random number generator, is used to protect customer encryption keys.
When an update is needed, the customer uses the encryption keys to create a new encrypted image.
Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the
existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the
The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management
data input/output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two I2C Bus
interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two
multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with
multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as a
watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output
(GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes,
multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced highresolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module
peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory
interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or
peripherals; and a higher speed DDR2/Mobile DDR controller.
The EMAC provides an efficient interface between the device and a network. The EMAC supports both
10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an
MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.
The Serial ATA (SATA) controller provides a high-speed interface to mass data storage devices. The
SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).
The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters,
FPGAs, or other parallel devices. The uPP supports programmable data widths between 8- to 16-bits on
both channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE,
and WAIT signals to provide control for a variety of data converters.
A video port interface (VPIF) provides a flexible video I/O port.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each peripheral, see the related sections in this document and the
associated peripheral reference guides.
The device has a complete set of development tools for the DSP. These tools include C compilers, a DSP
assembly optimizer to simplify programming and scheduling, and a Windows®debugger interface for
visibility into source code execution.
www.ti.com
Device Information
PART NUMBERPACKAGEBODY SIZE
TMS320C6748ZCENFBGA (361)13,00 mm x 13,00 mm
TMS320C6748ZWTNFBGA (361)16,00 mm x 16,00 mm
(1) For more information on these devices, see Section 8.
Table 3-1 provides an overview of the device. The table shows significant features of the device, including
the capacity of on-chip RAM, peripherals, and the package type with pin count.
HARDWARE FEATURESC6748
DDR2/mDDR Memory Controller
EMIFA
Flash Card Interface2 MMC and SD cards supported
EDMA3
Timers
UART3 (each with RTS and CTS flow control)
SPI2 (Each with one hardware chip select)
Peripherals
Not all peripherals pins
are available at the
same time (for more
detail, see the Device
Configurations section).
On-Chip Memory
I2C2 (both Master/Slave)
Multichannel Audio Serial Port [McASP]1 (each with transmit/receive, FIFO buffer, 16 serializers)
Multichannel Buffered Serial Port [McBSP]2 (each with transmit/receive, FIFO buffer, 16)
10/100 Ethernet MAC with Management Data I/O1 (MII or RMII Interface)
UHPI1 (16-bit multiplexed address/data)
USB 2.0 (USB0)High-Speed OTG Controller with on-chip OTG PHY
USB 1.1 (USB1)Full-Speed OHCI (as host) with on-chip PHY
General-Purpose Input/Output Port9 banks of 16-bit
LCD Controller1
SATA Controller1 (Supports both SATA I and SATAII)
Universal Parallel Port (uPP)1
Video Port Interface (VPIF)1 (video in and video out)
PRU Subsystem (PRUSS)2 Programmable PRU Cores
Size (Bytes)448KB RAM
Organization
www.ti.com
Table 3-1. Characteristics of C6748
DDR2, 16-bit bus width, up to 156 MHz
Mobile DDR, 16-bit bus width, up to 150 MHz
Asynchronous (8/16-bit bus width) RAM, Flash,
16-bit SDRAM, NOR, NAND
64 independent channels, 16 QDMA channels,
2 channel controllers, 3 transfer controllers
4 64-Bit General Purpose (each configurable as 2 separate
32-bit timers, one configurable as Watch Dog)
4 Single Edge, 4 Dual Edge Symmetric, or
2 Dual Edge Asymmetric Outputs
DSP
32KB L1 Program (L1P)/Cache (up to 32KB)
32KB L1 Data (L1D)/Cache (up to 32KB)
256KB Unified Mapped RAM/Cache (L2)
DSP Memories can be made accessible to EDMA3 and
other peripherals.
SecuritySecure BootTI Basic Secure Boot
C674x CPU ID + CPU
Rev ID
C674x Megamodule
Revision
JTAG BSDL_IDDEVIDR0 Registersee Section 6.34.4.1, JTAG Peripheral Register Description
CPU FrequencyMHz674x DSP 375 MHz (1.2V) or 456 MHz (1.3V)
(1) ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice. PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include
testing of all parameters.
(1)
Core (V)
I/O (V)1.8V or 3.3 V
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Variable (1.2V-1.0V) for 375 MHz version
Variable (1.3V-1.0V) for 456 MHz version
13 mm x 13 mm, 361-Ball 0.65 mm pitch, PBGA (ZCE)
16 mm x 16 mm, 361-Ball 0.80 mm pitch, PBGA (ZWT)
375 MHz versions - PD
456 MHz versions - PD
3.2Device Compatibility
The C674x DSP core is code-compatible with the C6000™ DSP platform and supports features of both
the C64x+ and C67x+ DSP families.
3.3DSP Subsystem
The DSP Subsystem includes the following features:
The C674x Central Processing Unit (CPU) consists of eight functional units, two register files, and two
data paths as shown in Figure 3-2. The two general-purpose register files (A and B) each contain 32 32bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be data
address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored in
register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the
next upper register (which is always an odd-numbered register).
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
The C674x CPU combines the performance of the C64x+ core with the floating-point capabilities of the
C67x+ core.
Each C674x .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, one 16 x
32 bit multiply, two 16 x 16 bit multiplies, two 16 x 32 bit multiplies, two 16 x 16 bit multiplies with
add/subtract capabilities, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add operations, and four
16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There is also support for
Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and
modems require complex multiplication. The complex multiply (CMPY) instruction takes for 16-bit inputs
and produces a 32-bit real and a 32-bit imaginary output. There are also complex multiplies with rounding
capability that produces one 32-bit packed output that contain 16-bit real and 16-bit imaginary values. The
32 x 32 bit multiply instructions provide the extended precision necessary for high-precision algorithms on
a variety of signed and unsigned 32-bit data types.
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.
The C674x core enhances the .S unit in several ways. On the previous cores, dual 16-bit MIN2 and MAX2
comparisons were only available on the .L units. On the C674x core they are also available on the .S unit
which increases the performance of algorithms that do searching and sorting. Finally, to increase data
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack
instructions return parallel results to output precision including saturation support.
Other new features include:
•SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where
•Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common
•Instruction Set Enhancement - As noted above, there are new instructions such as 32-bit
•Exceptions Handling - Intended to aid the programmer in isolating bugs. The C674x CPU is able to
•Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a
•Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a free-
TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C674x
compiler can restrict the code to use certain registers in the register file. This compression is
performed by the code generation tools.
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field
multiplication.
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and
from system events (such as a watchdog time expiration).
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with
read, write, and execute permissions.
running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.
For more details on the C674x CPU and its enhancements over the C64x architecture, see the following
documents:
•TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRUFE8)
•TMS320C64x Technical Overview (literature number SPRU395)
A. On .M unit, dst2 is 32 MSB.
B. On .M unit, dst1 is 32 LSB.
C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.
D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.
The DSP memory map is shown in Section 3.4.
By default the DSP also has access to most on and off chip memory areas.
Additionally, the DSP megamodule includes the capability to limit access to its internal memories through
its SDMA port; without needing an external MPU unit.
3.3.2.1External Memories
The DSP has access to the following External memories:
•Asynchronous EMIF / SDRAM / NAND / NOR Flash (EMIFA)
•SDRAM (DDR2)
3.3.2.2DSP Internal Memories
The DSP has access to the following DSP memories:
•L2 RAM
•L1P RAM
•L1D RAM
3.3.2.3C674x CPU
TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
The C674x core uses a two-level cache-based architecture. The Level 1 Program cache (L1P) is 32 KB
direct mapped cache and the Level 1 Data cache (L1D) is 32 KB 2-way set associated cache. The Level 2
memory/cache (L2) consists of a 256 KB memory space that is shared between program and data space.
L2 memory can be configured as mapped memory, cache, or a combination of both.
Table 3-2 shows a memory map of the C674x CPU cache registers for the device.
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings.
3.5.1Pin Map (Bottom View)
The following graphics show the bottom view of the ZCE and ZWT packages pin assignments in four
quadrants (A, B, C, and D). The pin assignments for both packages are identical.
Device level pin multiplexing is controlled by registers PINMUX0 - PINMUX19 in the SYSCFG module.
For the device family, pin multiplexing can be controlled on a pin-by-pin basis. Each pin that is multiplexed
with several different functions has a corresponding 4-bit field in one of the PINMUX registers.
Pin multiplexing selects which of several peripheral pin functions controls the pin's IO buffer output data
and output enable values only. The default pin multiplexing control for almost every pin is to select 'none'
of the peripheral functions in which case the pin's IO buffer is held tri-stated.
Note that the input from each pin is always routed to all of the peripherals that share the pin; the PINMUX
registers have no effect on input from a pin.
Table 3-5 to Table 3-31 identify the external signal names, the associated pin/ball numbers along with the
mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any internal
pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a functional pin
description.
TMSL16IIPUBJTAG test mode select
TDIM16IIPUBJTAG test data input
TDOJ18OIPUBJTAG test data output
TCKJ15IIPUBJTAG test clock
TRSTL17IIPDBJTAG test reset
EMU0J16I/OIPUBEmulation pin
EMU1K16I/OIPUBEmulation pin
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor. CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. For more detailed information on pullup/pulldown resistors and situations
where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and
internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
PLL0_VDDAL15PWR——PLL analog VDD(1.2-V filtered supply)
PLL0_VSSAM17GND——PLL analog VSS(for filter)
1.2-V PLL1
PLL1_VDDAN15PWR——PLL analog VDD(1.2-V filtered supply)
PLL1_VSSAM15GND——PLL analog VSS(for filter)
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. For more detailed information on pullup/pulldown resistors and situations
where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and
internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(4) Note: The CLKOUT clock output is provided as PLL observation clock, and is provided for debug purposes only. It may be routed to a
test point, but should never be connected to a load.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up,
an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown
circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
3.7.4DEEPSLEEP Power Control
Table 3-8. DEEPSLEEP Power Control Terminal Functions
SIGNAL
NAMENO.
TYPE
(1)
PULL
RTC_ALARM / UART2_CTS / GP0[8] / DEEPSLEEPF4ICP[0]ADEEPSLEEP power control output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up,
an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown
circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using
the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the
device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up,
an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown
circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can
be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of
power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power
supply DVDD3318_C.