Texas Instruments CY74FCT2827CTQCT, CY74FCT2827CTQC, CY74FCT2827ATQCT, CY74FCT2827ATQC Datasheet

10-Bit Buffe
r
CY74FCT2827T
SCCS045 - May 1994 - Revised March 2000
Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
Features
• Function and pinout compatible with FCT, F, and AM29827 logic
• FCT-C speed at 5.0 ns max. (Com’l), FCT-A speed at 8.0 ns max. (Com’l)
25outputseriesresistorstoreducetransmissionline reflection noise
• Reduced V
OH
(typically = 3.3V) versions of equivalent
FCT functions
• Edge-rate control circuitry for significantly improved noise characteristics
• Power-off disable feature
• ESD > 2000V
• Matched rise and fall times
• Fully compatible with TTL input and output logic levels
• Extended commercial temp. range of –40˚C to +85˚C
• Sink current 12 mA Source current 15 mA
Functional Description
The FCT2827T 10-bit bus driver provides high-performance bus interface buffering for wide data/address paths or buses carrying parity. This 10-bit buffer has NAND-ed output enables for maximum control flexibility. The FCT2827T is designed for high-capacitance load drive capability, while providing low-capaci­tance bus loading at both inputs and outputs. All inputs have clamp diodesandalloutputsaredesignedf orlow-capacitancebusloading in the high impedance state. On-chip termination resistors have been added to the outputs to reduce system noise caused by re­flections. The FCT2827T can be used to replace the FCT827T to reduce noise in an existing design.
The outputs are designed with a power-off disable feature to allow for live insertion of boards.
Logic Block Diagram
Pin Configurations
FCT2827T–3
Y
0
OE
1
Y1Y2Y3Y4Y
5
Y8Y
9
Y6Y
7
D0D1D2D3D4D
5
D8D
9
D6D
7
OE
2
1 2 3 4 5 6 7 8 9 10 11 12
16
17
18
19
20
24 23 22 21
13
14
V
CC
FCT2827T–2
15
SOIC/QSOP
Top View
OE
1
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
Y
8
GND
D
0
D
9
Y
0
Y
9
OE
2
Function Table
[1]
Inputs Outputs
FunctionOE
1
OE
2
D Y
L L
L L
L H
L
H
Transparent
H X
X H
X X
Z Z
Three-State
Note:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.
CY74FCT2827T
2
Maximum Ratings
[2, 3]
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–65°C to +135°C
Supply Voltage to Ground Potential............... –0.5V to +7.0V
DC Input Voltage............................................–0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin) ......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Operating Range
Range
Ambient
Temperature V
CC
Commercial –40°C to +85°C 5V ± 5%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[4]
Max. Unit
V
OH
Output HIGH Voltage VCC= Min., IOH= –15 mA 2.4 3.3 V
V
OL
Output LOW Voltage VCC= Min., IOL= 12 mA 0.3 0.55 V
R
OUT
Output Resistance VCC= Min., IOL= 12 mA 20 25 40
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Hysteresis
[5]
All inputs 0.2 V
V
IK
Input Clamp Diode Voltage VCC= Min., IIN= –18 mA –0.7 –1.2 V
I
I
Input HIGH Current VCC= Max., VIN= V
CC
5 µA
I
IH
Input HIGH Current VCC= Max., VIN= 2.7V ±1 µA
I
IL
Input LOW Current VCC= Max., VIN= 0.5V ±1 µA
I
OZH
Off State HIGH-Level Output Current
VCC= Max., V
OUT
= 2.7V 10 µA
I
OZL
Off State LOW-Level Output Current
VCC = Max., V
OUT
= 0.5V –10 µA
I
OS
Output Short Circuit Current
[6]
VCC= Max., V
OUT
= 0.0V –60 –120 –225 mA
I
OFF
Power-Off Disable VCC= 0V, V
OUT
= 4.5V ±1 µA
Capacitance
[5]
Parameter Description Typ.
[4]
Max. Unit
C
IN
Input Capacitance 5 10 pF
C
OUT
Output Capacitance 9 12 pF
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
4. Typical values are at V
CC
=5.0V, TA=+25˚C ambient.
5. This parameter is specified but not tested.
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I
OS
tests should be performed last.
Loading...
+ 4 hidden pages