Texas Instruments CY74FCT163H952CPVC, CY74FCT163H952CPAC, CY74FCT163952CPVCT, CY74FCT163952CPVC, CY74FCT163952CPACT Datasheet

...
16-Bit Registered Transceivers
CY74FCT163952
CY74FCT163H952
SCCS048 - March 1997 - Revised March 2000
Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
1CY74FCT163952
• Low power, pin-compatible replacement for LCX and LPT families
• 5V tolerant inputs and outputs
• 24 mA balanced drive outputs
• Power-off disable outputs permits live insertion
• Edge-rate control circuitry for reduced noise
• FCT-C speed at 4.4 ns
• Latch-up performance exceedsJEDEC standard no. 17
• Typical output skew < 250 ps
• Industrial temperature range of –40˚C to +85˚C
• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)
• Typical
V
olp
(groundbounce)performanceexceedsMil
Std 883D
•V
CC
= 2.7V to 3.6V
• ESD (HBM) > 2000V
CY74FCT163H952
• Bus hold on data inputs
• Eliminates the need for external pull-up or pull-down resistors
• Devices with bus hold are not recommended for trans­lating rail-to-rail CMOS signals to 3.3V logic levels
Functional Description
These 16-bit registered transceivers are high-speed, low-powerdevices. 16-bit operation is achievedby connecting the control lines of the two 8-bit registered transceivers together. For data flow from bus A-to-B,
CEAB must be LOW to allow data to be stored when CLKAB transitions from LOW-to-HIGH. The stored data will be present on the output when
OEAB is LOW.Control of data from B-to-A is similar and
is controlled by using the
CEBA, CLKBA, and OEBA inputs. The outputs are 24-mA balanced output drivers with current limiting resistors to reduce the need for external terminating resistors and provide for minimal undershoot and reduced ground bounce.
The CY74FCT163H952 has “bus hold” on the data inputs, whichretains the input’s laststate whenever the sourcedriving the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs.
The CY74FCT163952 is designed with inputs and outputs capable of being driven by 5.0V buses, allowing its use in mixed voltage systems as a translator. The outputs are also designed with a power off disable feature enabling its use in applications requiring live insertion.
Logic Block Diagrams; CY74FCT163952, CY74FCT163H952
Pin Configuration
1
OEAB
SSOP/TSSOP
Top View
1
CLKBA
1B1 1B2
GND
V
CC
GND
GND
1B1
TO7 OTHERCHANNELS
1 2
3 4
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55
54 53
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
1
CEBA
1
OEAB
1
CEAB
1
CLKAB
1
OEBA
1A1
D
C
CE
D
C CE
1
CEAB
1
CLKAB
GND
1A1 1A2
1A3 1A4
GND
2A1 2A2 2A3
2A4
V
CC
1A5
1A6 1A7 1A8
GND
2A5
2A6
2A7 2A8
2
CLKAB
GND
2
OEAB
2
CEAB
V
CC
1
OEBA
1
CEBA
1
CLKBA
GND
2
CLKBA
2
OEBA
2
CEBA
1B3
1B6 1B7 1B8
1B4 1B5
2B1
2B3
2B4
2B2
2B5 2B6
2B7 2B8
V
CC
2
CLKBA
2B1
2
OEAB
2
CEAB
2
CLKAB
2
OEBA
2A1
D
C
CE
D
C CE
2
CEBA
TO7 OTHERCHANNELS
CY74FCT163952
CY74FCT163H952
2
Maximum Ratings
[5, 6]
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperature ..................................–55°C to +125°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage Range......................................0.5V to +4.6V
DC Input Voltage............................................–0.5V to +7.0V
DC Output Voltage .........................................–0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin)........................ –60 to +120 mA
Power Dissipation..........................................................1.0W
Pin Description
Name Description
OEAB A-to-B Output Enable Input (Active LOW) OEBA B-to-A Output Enable Input (Active LOW) CEAB A-to-B Clock Enable Input (Active LOW) CEBA B-to-A Clock Enable Input (Active LOW) CLKAB A-to-B Clock Input CLKBA B-to-A Clock Input A A-to-B Data Inputs or B-to-A Three-State
Outputs
[1]
B B-to-A Data Inputs or A-to-B Three-State
Outputs
[1]
Function Table
[2, 3]
For A-to-B (Symmetric with B-to-A)
Inputs Outputs
CEAB CLKAB OEAB A B
H X L X B
[4]
X L L X B
[4]
L L L L L L H H X X H X Z
Operating Range
Range
Ambient
Temperature V
CC
Industrial –40°C to +85°C 2.7V to 3.6V
Electrical Characteristics for Non Bus Hold Devices Over the Operating Range V
CC
=2.7V to 3.6V
Parameter Description Test Conditions Min. Typ.
[7]
Max. Unit
V
IH
Input HIGH Voltage All Inputs 2.0 5.5 V
V
IL
Input LOW Voltage 0.8 V
V
H
Input Hysteresis
[8]
100 mV
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
I
IH
Input HIGH Current VCC=Max., VI=5.5 ±1 µA
I
IL
Input LOW Current VCC=Max., VI=GND ±1 µA
I
OZH
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT
=5.5V ±1 µA
I
OZL
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT
=GND ±1 µA
I
OS
Short Circuit Current
[9]
VCC=Max., V
OUT
=GND –60 –135 –240 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
4.5V ±100 µA
I
CC
Quiescent Power Supply Current VIN≤0.2V,
V
IN>VCC
–0.2V
VCC=Max. 0.1 10 µA
I
CC
Quiescent Power Supply Current (TTL inputs HIGH)
VIN=VCC–0.6V
[10]
VCC=Max. 2.0 30 µA
Notes:
1. On the CY74FCT163H952, these pins have bus hold.
2. A-to-B data flow is shown: B-to-A data flow is similar but uses,
CEBA, CLKBA, and OEBA.
3. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. = LOW-to-HIGH Transition. Z = HIGH Impedance.
4. Level of B before the indicated steady-state input conditions were established.
5. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature.
6. With the exception of inputs with bus hold, unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground,
7. Typical values are at VCC=3.3V, TA = +25˚C ambient.
8. This parameter is specified but not tested.
9. Not more than one output should be shortedat a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internalchip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last.
10. Per TTL driven input; all other inputs at VCC or GND.
CY74FCT163952
CY74FCT163H952
3
Electrical Characteristics For Bus Hold Devices Over the Operating Range V
CC
=2.7V to 3.6V
Parameter Description Test Conditions Min. Typ.
[7]
Max. Unit
V
IH
Input HIGH Voltage All Inputs 2.0 V
CC
V
V
IL
Input LOW Voltage 0.8 V
V
H
Input Hysteresis
[8]
100 mV
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 – 1.2 V
I
IH
Input HIGH Current VCC=Max., VI=V
CC
±100 µA
I
IL
Input LOW Current ±100 µA
I
BBH
I
BBL
Bus Hold Sustain Current on Bus Hold Input
[11]
VCC=Min. VI=2.0V –50 µA
VI=0.8V +50 µA
I
BHHO
I
BHLO
Bus Hold Overdrive Current on Bus Hold Input
[11]
VCC=Max., VI=1.5V ±500 µA
I
OZH
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT=VCC
±1 µA
I
OZL
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT
=GND ±1 µA
I
OS
Short Circuit Current
[9]
VCC=Max., V
OUT
=GND –60 –135 –240 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
4.5V ±100 µA
I
CC
Quiescent Power Supply Current VIN≤0.2V V
CC
VIN>VCC–0.2V
VCC=Max. +40 µA
ICC
Quiescent Power supply Current (TTL inputs HIGH)
VIN=VCC–0.6V
[10]
VCC=Max. +350 µA
Electrical Characteristics For Balanced Drive Devices Over the Operating Range V
CC
=2.7V to 3.6V
Parameter Description Test Conditions Min. Typ.
[7]
Max. Unit
I
ODL
Output LOW Dynamic Current
[9]
VCC=3.3V, VIN=V
IH
or VIL, V
OUT
=1.5V
50 90 200 mA
I
ODH
Output HIGH Dynamic Current
[9]
VCC=3.3V, VIN=V
IH
or VIL, V
OUT
=1.5V
–36 –60 –110 mA
V
OH
Output HIGH Voltage VCC=Min., IOH= –0.1 mA VCC–0.2 V
VCC=Min., IOH= –8 mA 2.4
[12]
3.0 V
VCC=3.0V, IOH= –24 mA 2.0 3.0 V
V
OL
Output LOW Voltage VCC=Min., IOL= 0.1mA 0.2 V
VCC=Min., IOL= 24 mA 0.3 0.55
Notes:
11. Pins with bus hold are described in Pin Description.
12. V
OH=VCC
–0.6 V at rated current
Capacitance
[8]
(TA = +25˚C, f = 1.0 MHz)
Parameter Description Test Conditions Typ.
[7]
Max. Unit
C
IN
Input Capacitance VIN = 0V 4.5 6.0 pF
C
OUT
Output Capacitance V
OUT
= 0V 5.5 8.0 pF
CY74FCT163952
CY74FCT163H952
4
Power Supply Characteristics
Parameter Description Test Conditions Typ.
[7]
Max. Unit
I
CCD
Dynamic Power Supply Current
[13]
VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open,
OE=GND
VIN=VCCor V
IN
=GND
50 75 µA/MHz
I
C
Total Power Supply Current
[14]
VCC=Max., f1=10 MHz, 50% DutyCycle, Outputs Open, One Bit Toggling,
OE=GND
VIN=VCC or V
IN
=GND
0.5 0.8 mA
VIN=VCC–0.6V or V
IN
=GND
0.5 0.8 mA
VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Six­teen Bits Toggling,
OE=GND
VIN=VCC or V
IN
=GND
2.0 3.0
[15]
mA
VIN=VCC–0.6V or V
IN
=GND
2.0 3.3
[15]
mA
Switching Characteristics Over the Operating Range V
CC
=3.0V to 3.6V
[16,17]
Parameter Description
CY74FCT163952A
CY74FCT163952C
CY74FCT163H952C
Min. Max. Min. Max. Unit Fig. No.
[18]
t
PLH
t
PHL
Propagation Delay Data to Output
1.5 4.8 1.5 4.4 ns 1, 3
t
PZH
t
PZL
Output Enable Time 1.5 6.2 1.5 5.8 ns 1, 7, 8
t
PHZ
t
PLZ
Output Disable Time 1.5 5.6 1.5 5.2 ns 1, 7, 8
t
SK(O)
Output Skew
[19]
0.5 0.5 ns
Notes:
13. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
14. I
C
=I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
IC=ICC+ICCDHNT+I
CCD(f0
/2 + f1N1)
I
CC
= Quiescent Current with CMOS input levels
I
CC
= Power Supply Current for a TTL HIGH input (VIN=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
f
1
= Input signal frequency
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
15. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
16. Minimum limits are specified but not tested on Propagation Delays.
17. For V
CC
=2.7, propagation delay, output enable and output disable times should be degraded by 20%.
18. See “Parameter Measurement Information” in the General Information section.
19. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT163952
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
4.1 CY74FCT163952CPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT163952CPVC/PVCT O48 48-Lead (300-Mil) SSOP
4.8 CY74FCT163952APVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial
Ordering Information CY74FCT163H952
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
4.1 74FCT163H952CPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT163H952CPVC O48 48-Lead (300-Mil) SSOP 74FCT163H952CPVCT O48 48-Lead (300-Mil) SSOP
CY74FCT163952
CY74FCT163H952
5
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...