• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
CC
= 5V,
o
C to 125oC
CC
CD74HCT02
High Speed CMOS Logic
Quad Two-Input NOR Gate
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
• Related Literature
- CD54HC02F3A and CD54HCT02F3A Military
Data Sheet, Document Number 3754
Description
The Harris CD74HC02, CH74HCT02 logic gates utilize
silicon-gate CMOS technology to achieve operating speeds
similar to LSTTL gates with the low power consumption of
standard CMOSintegrated circuits.All deviceshave theability
to drive 10 LSTTL loads. The 74HCT logic family is
≤ 1µA at VOL, V
l
OH
Pinout
CD74HC02, CD74HCT02
(PDIP, SOIC)
TOP VIEW
1Y
1
2
1A
1B
3
2Y
4
2A
5
2B
6
GND
7
V
14
CC
4Y
13
4B
12
4A
11
3Y
10
3B
9
3A
8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
Maximum Junction Temperature (Hermetic Pac kage or Die) . . .175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETERSYMBOL
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
V
IH
V
IL
V
OH
V
OL
I
I
I
CC
TEST
CONDITIONS
(V)IO(mA)MINTYPMAXMINMAXMINMAX
I
V
CC
(V)
o
C-40oC TO 85oC -55oCTO125oC
25
UNITSV
--21.5--1.5-1.5-V
4.53.15--3.15 -3.15-V
64.2--4.2-4.2-V
--2--0.5-0.5-0.5V
4.5--1.35-1.35-1.35V
6--1.8-1.8-1.8V
VIHor VIL-0.0221.9--1.9-1.9-V
-0.024.54.4--4.4 -4.4-V
-0.0265.9--5.9-5.9-V
- - ---- - - - V
-44.53.98--3.84-3.7-V
-5.265.48--5.34-5.2-V
VIHor VIL0.022--0.1-0.1-0.1V
0.024.5--0.1-0.1-0.1V
0.026--0.1-0.1-0.1V
- - ---- - - - V
44.5--0.26-0.33-0.4V
5.26--0.26-0.33-0.4V
VCC or
-6--±0.1-±1-±1µA
GND
VCC or
06--2-20-40µA
GND
3
CD74HC02, CD74HCT02
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETERSYMBOL
HCT TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
V
IH
V
IL
V
OH
CMOS Loads
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
V
OL
CMOS Loads
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
I
I
I
CC
∆I
CC
Input Pin: 1 Unit Load
NOTE: For dual-supply systems theoretical worst case (V
(V)IO(mA)MINTYPMAXMINMAXMINMAX
I
--4.5 to
--4.5 to
VIHor VIL-0.024.54.4--4.4-4.4-V
-44.53.98--3.84-3.7-V
VIHor VIL0.024.5--0.1-0.1-0.1V
44.5--0.26-0.33-0.4V
VCCand
05.5-±0.1-±1-±1µA
GND
VCC or
05.5--2-20-40µA
GND
V
CC
-4.5 to
-2.1
o
C-40oC TO 85oC -55oCTO125oC
V
CC
25
(V)
2--2- 2 - V
5.5
--0.8-0.8-0.8V
5.5
-100360-450-490µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
UNITSV
HCT Input Loading Table
INPUTUNIT LOADS
All1.5
NOTE: Unit Load is ∆ICClimit specified in DC Electrical Table,e.g.,
360µA max at 25oC.
Switching Specifications Input t
PARAMETERSYMBOL
HC TYPES
Propagation Delay,
Input to Output (Figure 1)
Propagation Delay, Data Input
to Output Y
Transition Times (Figure 1)t
Input CapacitanceC
r
t
PLH,tPHL
t
, t
PLH
PHL
, t
TLH
THL
IN
, tf = 6ns
TEST
CONDITIONS VCC(V)
CL= 50pF2--90-115-135ns
CL= 15pF5-7-----ns
CL= 50pF2--75-95-110ns
----10-10-10pF
25
o
C
-40oC TO
85oC
-55oC TO
125oC
UNITSMINTYPMAXMINMAXMINMAX
4.5--18-23-27ns
6--15-20-23ns
4.5--15-19-22ns
6--13-16-19ns
4
CD74HC02, CD74HCT02
Switching Specifications Input t
, tf = 6ns (Continued)
r
PARAMETERSYMBOL
Power Dissipation Capacitance
C
PD
(Notes 4, 5)
HCT TYPES
Propagation Delay, Input to
t
PLH
, t
PHL
Output (Figure 2)
Propagation Delay, Data Input
to Output Y
Transition Times (Figure 2)t
Input CapacitanceC
Power Dissipation Capacitance
(Notes 4, 5)
t
PLH
TLH
, t
PHL
, t
THL
IN
C
PD
NOTES:
4. C
is used to determine the dynamic power consumption, per gate.
PD
5. PD = V
2
fi(CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
CC
Test Circuits and Waveforms
TEST
CONDITIONS VCC(V)
25
o
C
-40oC TO
85oC
-55oC TO
125oC
UNITSMINTYPMAXMINMAXMINMAX
-5-26-----pF
CL= 50pF4.5--21-26-32ns
CL= 15pF5-8-----ns
CL= 50pF4.5--15-19-22ns
----10-10-10pF
-5-26-----pF
tr = 6nstf = 6ns
V
t
CC
GND
TLH
INPUT
INVERTING
OUTPUT
t
THL
t
PHL
90%
50%
10%
t
90%
50%
10%
PLH
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
TLH
3V
GND
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
2.7V
1.3V
0.3V
PHL
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.