Texas Instruments BQ4017YMC-70, BQ4017MC-70 Datasheet

bq4017/bq4017Y
2048Kx8 Nonvolatile SRAM
Features
Data retention in the absence of
power
Automatic write-protection dur
ing power-up/power-down cycles
Conventional SRAM operation;
5-year minimum data retention
in absence of power
Battery internally isolated until
power is applied
Pin Connections
36
V
CC
A
35
19
NC
34
A
33
15
A
32
17
31
WE A
30
13
A
29
8
A
28
9
A
27
11
26
OE A
25
10
24
CE DQ
23 22
DQ DQ
21 20
DQ
19
DQ
DQ DQ DQ V
NC
1
A
2
20
A
3
18
A
4
16
A
5
14
A
6
12
A
7
7
A
8
6
9
A
5
A
10
4
11
A
3
A
12
2
A
13
1
A
14
0
15
0
16
1
17
2
18
SS
General Description
The CMOS bq4017 is a nonvolatile 16,777,216-bit static RAM organized as 2,097,152 words by 8 bits. The
­integral control circuitry and lith
ium energy source provide reliable nonvolatility coupled with the un limited write cycles of standard SRAM.
The control circuitry constantly monitors the single 5V supply for an out-of-tolerance condition. When V falls out of tolerance, the SRAM is
At this time the integral energy source is switched on to sustain the memory until after V
returns valid.
CC
The bq4017 uses extremely low standby current CMOS SRAMs, cou
­pled with small lithium coin cells to
provide nonvolatility without long
­write-cycle times and the write-cycle
limitations associated with EE PROM.
The bq4017 has the same interface as industry-standard SRAMs and
CC
requires no external circuitry.
-
-
unconditionally write-protected to prevent an inadvertent write opera
-
tion.
Pin Names
A0–A
DQ
0
CE
OE
WE
V
CC
7 6 5 4 3
V
SS
NC No connect
Address inputs
20
–DQ7Data input/output
Chip enable input
Output enable input
Write enable input
Supply voltage input
Ground
Block Diagram
36-Pin DIP Module
PN401701.eps
Selection Guide
Part
Number
Maximum
Access
Time (ns)
Negative
Supply
Tolerance
Part
Number
Maximum
Access
Time (ns)
bq4017MC -70 70 -5% bq4017YMC -70 70 -10%
5/95
1
Negative
Supply
Tolerance
bq4017/bq4017Y
Functional Description
When power is valid, the bq4017 operates as a standard CMOS SRAM. During power-down and power-up cycles, the bq4017 acts as a nonvolatile memory, automatically protecting and preserving the memory contents.
Power-down/power-up control circuitry constantly moni tors the V V
. The bq4017 monitors for V
PFD
use in systems with 5% supply tolerance. The bq4017Y monitors for V with 10% supply tolerance.
When V automatically write-protects the data. All outputs be come high impedance, and all inputs are treated as “don’t care.” If a valid access is in process at the time of power-fail detection, the memory cycle continues to com pletion. If the memory cycle fails to terminate within time t
WPT
supply for a power-fail-detect threshold
CC
= 4.37V typical for use in systems
PFD
falls below the V
CC
= 4.62V typical for
PFD
threshold, the SRAM
PFD
, write-protection takes place.
As V
falls past V
CC
circuitry switches to the internal lithium backup supply, which provides data retention until valid V
When V
returns to a level above the internal backup
CC
cell voltage, the supply is switched back to V V
ramps above the V
CC
continues for a time t
­processor stabilization. Normal memory operation may resume after this time.
The internal coin cells used by the bq4017 have an ex tremely long shelf life. The bq4017 provides data reten tion for more than 5 years in the absence of system power.
­As shipped from Unitrode, the integral lithium cells are
electrically isolated from the memory. (Self-discharge in this condition is approximately 0.5% per year.) Follow
­ing the first application of V
and the lithium backup provides data retention on sub sequent power-downs.
and approaches 3V, the control
PFD
is applied.
CC
threshold, write-protection
PFD
(120ms maximum) to allow for
CER
, this isolation is broken,
CC
CC
Truth Table
Mode CE WE OE I/O Operation Power
Not selected H X X High Z Standby
Output disable L H H High Z Active
Read L H L D
Write L L X D
OUT
IN
Active
Active
. After
-
-
-
-
Absolute Maximum Ratings
Symbol Parameter Value Unit Conditions
V
CC
V
T
T
OPR
T
STG
T
BIAS
T
SOLDER
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation
DC voltage applied on VCCrelative to V
SS
DC voltage applied on any pin excluding V relative to V
SS
CC
-0.3 to 7.0 V
-0.3 to 7.0 V
V
+ 0.3
V
T
CC
Operating temperature 0 to +70 °C
Storage temperature -40 to +70 °C
Temperature under bias -10 to +70 °C
Soldering temperature +260 °C For 10 seconds
should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to con ditions beyond the operational limits for extended periods of time may affect device reliability.
2
-
bq4017/bq4017Y
Recommended DC Operating Conditions (T
= 0 to 70°C)
A
Symbol Parameter Minimum Typical Maximum Unit Notes
V
CC
V
SS
V
IL
V
IH
Supply voltage
Supply voltage 0 0 0 V
Input low voltage -0.3 - 0.8 V
Input high voltage 2.2 - VCC+ 0.3 V
4.5 5.0 5.5 V bq4017Y
4.75 5.0 5.5 V bq4017
Note: Typical values indicate operation at TA= 25°C.
DC Electrical Characteristics (T
= 0 to 70°C, V
A
CCmin
V
CC
V
CCmax
)
Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes
I
I
V
V
I
I
LI
LO
OH
OL
SB1
SB2
Input leakage current - -
Output leakage current - -
Output high voltage 2.4 - - V IOH= -1.0 mA
Output low voltage - - 0.4 V IOL= 2.1 mA
Standby supply current - 7 17 mA CE = V
Standby supply current - 2.5 5 mA
4
±
4
±
AVIN= VSSto V
µ
= VIHor OE = VIHor
CE
A
µ
WE
= V
IL
IH
0V≤V
IN
CE
V
CC
or V
V
IN
0.2V,
- 0.2V,
CC
CC
- 0.2
Min. cycle, duty = 100%,
= VIL,I
I
CC
Operating supply current - 75 115 mA
CE A19 < V A20 < V
V
PFD
V
SO
Power-fail-detect voltage
Supply switch-over voltage - 3 - V
4.55 4.62 4.75 V bq4017
4.30 4.37 4.50 V bq4017Y
= 0mA,
I/O
or A19 > VIH,
IL
or A20 > V
IL
IH
Note: Typical values indicate operation at TA= 25°C, VCC= 5V.
3
bq4017/bq4017Y
Capacitance (T
= 25°C, F = 1MHz, VCC= 5.0V)
A
Symbol Parameter Minimum Typical Maximum Unit Conditions
C
I/O
C
IN
Input/output capacitance - - 40 pF Output voltage = 0V
Input capacitance - - 40 pF Input voltage = 0V
Note: These parameters are sampled and not 100% tested.
AC Test Conditions
Parameter Test Conditions
Input pulse levels 0V to 3.0V
Input rise and fall times 5 ns
Input and output timing reference levels 1.5 V (unless otherwise specified)
Output load (including scope and jig) See Figures 1 and 2
Figure 1. Output Load A
Read Cycle
Symbol Parameter
t
RC
t
AA
t
ACE
t
OE
t
CLZ
t
OLZ
t
CHZ
t
OHZ
t
OH
(TA= 0 to 70°C, V
CCmin
Read cycle time 70 - ns
Address access time - 70 ns Output load A
Chip enable access time - 70 ns Output load A
Output enable to output valid - 35 ns Output load A
Chip enable to output in low Z 5 - ns Output load B
Output enable to output in low Z 5 - ns Output load B
Chip disable to output in high Z 0 25 ns Output load B
Output disable to output in high Z 0 25 ns Output load B
Output hold from address change 10 - ns Output load A
Figure 2. Output Load B
V
CC
V
CCmax
)
-70
Min. Max.
4
Unit Conditions
Loading...
+ 7 hidden pages