Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX, TEK, and TekSecure are registered trademarks of Tektronix, Inc.
Contacting Tektronix
Tektronix, Inc.
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
For product information, sales, service, and techni cal support:
HIn North America, call 1-800-833-9200.
HWorldwide, visit www.tektronix.com to find contacts in your area.
Memory Erasure and Memory Parts List
The standard TDS3000 and TDS3000B Series instruments contain a proprietary
architecture based on a PowerPC and the VxWorks operating system. Instrument
code and calibration settings reside in FLASH memory.
Instrument setups and reference waveforms can be stored internally in FLASH or
on the internal floppy disk drive.
Instrument code can be updated by the user from floppy disks. The latest
firmware is available on www.tektronix.com. Loading firmware does not
overwrite instrument calibration settings. Loading new firmware does not
guarantee overwriting the instrument setups and reference waveforms. To
guarantee FLASH memory erasure, use the TekSecure function.
If you have any questions, contact the Tektronix Technical Support Center at
http://www.tektronix.com/support.
Memory Erasure
Floppy disk drives are standard on TDS3000 and TDS3000B models. Removed
floppy disks can be stored or destroyed.
To erase confidential data in the FLASH memory on your oscilloscopes, use the
TekSecure function. The TekSecure function does the following:
HReplaces all waveforms in all reference memories with null sample values
HReplaces the current front-panel setup and all stored setups with the default
factory setup values
HCalculates the checksums of all reference waveform memory and setup
memory locations to verify successful completion of waveform and setup
erasure
HDisplays a dialog indicating whether the secure erase was successful or
unsuccessful
NOTE. TekSecure does not erase or change factory calibration constants or
Ethernet settings.
TDS3000 & TDS3000B Series Memory Erasure and Nonvolatile Memory Parts List
1
Memory Erasure and Memory Parts List
To use the TekSecure function to erase FLASH memory:
1. Push the front-panel UTIL ITY button.
2. Push the System bottom bezel button until Config is selected.
3. Push the TekSecure Erase Memory bottom bezel button.
4. Push the OK Erase Setup & Ref Memory side bezel button.
5. Power off the oscilloscope; then power on the oscilloscope to complete the
process.
Disable LAN Ethernet Connectivity
(TDS3000 Series with TDS3EM Module, and All TDS3000B Models)
To disable LAN Ethernet connectivity:
1. Push the front-panel UTIL ITY button.
2. Push the System bottom bezel button until I/O is selected.
3. Push the Ethernet Network Settings bottom bezel button.
4. Push the Change Instrument Settings side bezel button.
5. Clear all settings. If you need to restore network connectivity at a later date,
make sure to write down all setting values before clearing them.
6. Push the OK Accept side bezel button.
The LAN system is disabled and no longer allows data traffic in or out.
2
TDS3000 & TDS3000B Series Memory Erasure and Nonvolatile Memory Parts List
Memory Erasure and Memory Parts List
Memory Parts Lists
The memory parts used in the TDS3000 and the TDS3000B series oscilloscopes
are shown in the following tables.
Table 1: TDS3000 Series Memory Parts (Board Numbers 679-4077-XX and 679- 4078- XX)
Reference
Part number
designator
DescriptionUse
156--7633--XXU540IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7633--XXU550IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7633--XXU560IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7951--00U610IC, Memory: CMOS, Flash; 2M X 8 /1M X 16, 3.0
ONLY, Bottom Sectored
156--7951--XXU620IC, Memory: CMOS, Flash; 2M X 8 /1M X 16, 3.0
ONLY, Bottom Sectored
156--4751--XXU640IC, MEMORY; CMOS, NVRAM;2K X 8, 150NS,
INTERNAL BATTERY, W/CLOCK, Y2K, 3.3V
156--7137--XXU650IC, MEMORY; CMOS;SDRAM;2MEG X 8, SYNC
DRAM, 3.3V, 100MHZ
156--7137--XXU660IC, MEMORY; CMOS;SDRAM;2MEG X 8, SYNC
DRAM, 3.3V, 100MHZ
156--7137--XXU670IC, MEMORY; CMOS;SDRAM;2MEG X 8, SYNC
DRAM, 3.3V, 100MHZ
156--7137--XXU680IC, MEMORY; CMOS;SDRAM;2MEG X 8, SYNC
DRAM, 3.3V, 100MHZ
Synchronous SRAM: holds the display image.
Synchronous SRAM: holds the live acquisition
waveforms.
Synchronous SRAM: holds the live acquisition
waveforms.
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
NVRAM: stores date format, RS--232 settings,
and language choice.
Synchronous DRAM: holds the instrument code
and data during operation.
Synchronous DRAM: holds the instrument code
and data during operation.
Synchronous DRAM: holds the instrument code
and data during operation.
Synchronous DRAM: holds the instrument code
and data during operation.
TDS3000 & TDS3000B Series Memory Erasure and Nonvolatile Memory Parts List
3
Memory Erasure and Memory Parts List
Table 2: TDS3000B Series Memory Parts (Board Numbers 679-6006- XX and 679- 6009- XX)
Reference
Part number
designator
DescriptionUse
156--7633--XXU540IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7633--XXU550IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7633--XXU560IC, MEMORY; CMOS, SRAM;128K X 18,
SYNCHRONOUS, 10NS
156--7951--00U610IC, Memory: CMOS, Flash; 2M X 8 /1M X 16, 3.0
ONLY, Bottom Sectored
156--7951--XXU620IC, Memory: CMOS, Flash; 2M X 8 /1M X 16, 3.0
ONLY, Bottom Sectored
156--4751--XXU640IC, MEMORY; CMOS, NVRAM;2K X 8, 150NS,
INTERNAL BATTERY, W/CLOCK, Y2K, 3.3V
156--8158--XXU670IC, MEMORY; CMOS, SDRAM;512K X 32 X 4
BANKS, 64M, SYNCHRONOUS, 3.3V, 125 MHZ
Application Module Memory Part List
Synchronous SRAM: holds the display image.
Synchronous SRAM: holds the live acquisition
waveforms.
Synchronous SRAM: holds the live acquisition
waveforms.
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
NVRAM: stores date format, RS--232 settings,
and language choice.
Synchronous DRAM: holds the instrument code
and data during operation.
The memory part used in the TDS3AAM, TDS3FFT, TDS3LIM, TDS3TMT,
TDS3TRG, and TDS3VID application modules is shown in the following table.
Table 3: Application Module Memory Part (Board Number 679- 4489- XX)
Reference
Part number
156--6272--XXU1IC, MEMORY; CMOS, EEPROM; 256 X 8, SERIAL EEPROM: holds the application module code.
4
designator
DescriptionUse
TDS3000 & TDS3000B Series Memory Erasure and Nonvolatile Memory Parts List
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