Supermicro X11SPi-TF operation manual

X11SPi-TF

USER'S MANUAL

Revision 1.1

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer
assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in industrial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.1

Release Date: March 26, 2020

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2020 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SPi-TF motherboard.

About This Motherboard

The Supermicro X11SPi-TF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
(Socket P0-LGA 3647) processor with up to 28 cores and a thermal design power (TDP) of up
to 205W. Built with the Intel PCH C622 chipset, the X11SPi-TF supports 6-channel, 8-DIMM
DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2666MHz, SATA 3.0 ports, a M.2
slot, 10G Base-T ports, and a Trusted Platform Module (TPM) header. The X11SPi-TF is
optimized for high-performance, high-end computing platforms that address the needs of next
generation server applications. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to di󰀨erentiate various models or provides infor-
mation for proper system setup.

3

Super X11SPi-TF User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................11

Quick Reference Table ......................................................................................................12

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................18

1.3 Special Features ................................................................................................................18

Recovery from AC Power Loss .........................................................................................18

1.4 System Health Monitoring ..................................................................................................19

Onboard Voltage Monitors ................................................................................................19

Fan Status Monitor with Firmware Control .......................................................................19

Environmental Temperature Control .................................................................................19

System Resource Alert......................................................................................................19

1.5 ACPI Features ....................................................................................................................19

1.7 Serial Port ...........................................................................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

Precautions .......................................................................................................................21

Unpacking .........................................................................................................................21

2.2 Processor and Heatsink Installation ...................................................................................22

The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor ...........................................22

Overview of the Processor Carrier Assembly ...................................................................23

Overview of the CPU Socket ............................................................................................23

Overview of the Processor Heatsink Module ....................................................................24

Creating the Non-F Model Processor Carrier Assembly...................................................25

Assembling the Processor Heatsink Module ....................................................................26

Preparing the CPU Socket for Installation ........................................................................27

Installing the Processor Heatsink Module .........................................................................28

Removing the Processor Heatsink Module .......................................................................29

2.3 Motherboard Installation .....................................................................................................30

Tools Needed ....................................................................................................................30

5

Super X11SPi-TF User's Manual

Location of Mounting Holes ..............................................................................................30

Installing the Motherboard.................................................................................................31

2.4 Memory Support and Installation .......................................................................................32

Memory Support ................................................................................................................32

DDR4 Memory Support for 81xx/61xx/51xx/41xx/31xx Platform ......................................32

DDR4 Memory Support for 82xx/62xx/52xx/42xx/32xx Platform ......................................33

Memory Population Table for Motherboard based on the 81xx/61xx/51xx/41xx/31xx and

82xx/62xx/52xx/42xx/32xx Platform ..................................................................................33

General Guidelines for Optimizing Memory Performance ................................................34

DIMM Installation ..............................................................................................................35

DIMM Removal .................................................................................................................35

2.5 Rear I/O Ports ....................................................................................................................36

2.6 Front Control Panel ............................................................................................................41

2.7 Connectors .........................................................................................................................46

Power Connections ...........................................................................................................46

Headers .............................................................................................................................48

2.8 Jumper Settings .................................................................................................................57

How Jumpers Work ...........................................................................................................57

2.9 LED Indicators ....................................................................................................................60

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................63

Before Power On ..............................................................................................................63

No Power ..........................................................................................................................63

No Video ...........................................................................................................................64

System Boot Failure .......................................................................................................64

Memory Errors ..................................................................................................................64

Losing the System's Setup Conguration .........................................................................65

When the System Becomes Unstable ..............................................................................65

3.2 Technical Support Procedures ...........................................................................................67

3.3 Frequently Asked Questions ..............................................................................................68

3.4 Battery Removal and Installation .......................................................................................69

Battery Removal ................................................................................................................69

6

Preface

Proper Battery Disposal ....................................................................................................69

Battery Installation .............................................................................................................69

3.5 Returning Merchandise for Service ....................................................................................70

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................71

4.2 Main Setup .........................................................................................................................72

4.3 Advanced Setup Congurations .........................................................................................74

4.4 Event Logs .......................................................................................................................102

4.5 IPMI ..................................................................................................................................104

4.6 Security .............................................................................................................................107

4.7 Boot ................................................................................................................................. 111

4.8 Save & Exit .......................................................................................................................114

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................11 8

®

B.2 SuperDoctor

5 .................................................................................................................119

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................120

Product Disposal .............................................................................................................122

Appendix D UEFI BIOS Recovery

D.1 Overview ...........................................................................................................................123

D.2 Recovering the UEFI BIOS Image ...................................................................................123

D.3 Recovering the Main BIOS Block with a USB Device .....................................................124

7

Super X11SPi-TF User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

In additon to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SPi-TF 1

I/O Shield MCP-260-00042-0N 1

SATA Cables CBL-0044L 6

Quick Reference Guide MNL-1900-QRG 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• A secure data deletion tool designed to fully erase all data from storage devices can be

found at our website: https://www.supermicro.com/wftp/utility/Lot9_Secure_Data_Dele-

tion_Utility/

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

8

Figure 1-1. X11SPi-TF Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

Super X11SPi-TF User's Manual

COM2

JWD1

PCH SLOT1 PCI-E 3.0 X4(IN X8)

JPG1

JD1

USB8/9(3.0)

+

SP1

I-SGPIO2

I-SGPIO1

S-SGPIO1

JOH1

ASpeed

AST2500

LEDBMC

CPU SLOT2 PCI-E 3.0 X8

LICENSE

Figure 1-2. X11SPi-TF Motherboard Layout

(not drawn to scale)

UID-SW

UID-LED

VGA

CPU SLOT4 PCI-E 3.0 X16

CPU SLOT3 PCI-E 3.0 X8

BIOS

Intel

X557

CPU SLOT6 PCI-E 3.0 X16

DESIGNED IN USA

REV:1.02

X11SPi-TF

MH11

MH10

JPTG1

JIPMB1

JRK1

DIMMB1

DIMMC1

LAN2

DIMMA2

DIMMA1

LAN1

CPU

USB6/7(3.0)

IPMI_LAN
USB0/1

DIMMD2

DIMMD1

DIMME1

DIMMF1

COM1

FAN5

JBT1

S-SATA0

I-SATA0
I-SATA1
I-SATA2
I-SATA3

JSD2

I-SATA4
I-SATA5
I-SATA6
I-SATA7

S-SATA1

JL1

JSD1

FANB

Intel

C622

JPME2

FANA

M.2 PCI-E 3.0 X4

LE3

BT1

USB2/3

JTPM1

USB4/5

USB10(3.0)

LEDPWR

JF1

JF1

ON

PWR UID

RST

FAIL 1

PS

LED

NIC

2

NIC

PWRHDD

LEDLED

NMIX

FAN4

C

JNVI2C1

FAN3 FAN2

SAN MAC

BAR CODE

MAC CODE

IPMI CODE

JPWR2

JSTBY1

FAN1

JPWR1

JPI2C1

Note: Components not documented are for internal testing only.

10

Quick Reference

Chapter 1: Introduction

COM2

JWD1

JPG1

JD1

USB8/9 (3.0)

SP1

I-SGPIO2

I-SGPIO1

S-SGPIO1

JOH1
I-SATA0
I-SATA1
I-SATA2
I-SATA3
I-SATA4
I-SATA5
I-SATA6

I-SATA7

JL1

LEDBMC

SLOT1

COM2

JWD1

JPG1

JD1

USB8/9(3.0)

+

I-SGPIO2

I-SGPIO1

S-SGPIO1

JL1

SLOT3

SLOT2

LEDBMC

PCH SLOT1 PCI-E 3.0 X4(IN X8)

CPU SLOT2 PCI-E 3.0 X8

SP1

JOH1

JBT1

S-SATA0

I-SATA0
I-SATA1
I-SATA2
I-SATA3

JSD2

I-SATA4
I-SATA5
I-SATA6
I-SATA7

S-SATA1

FANB

JSD1

SLOT4

ASpeed

AST2500

LICENSE

Intel

C622

JPME2

SLOT6

MH11

MH10

CPU SLOT4 PCI-E 3.0 X16

CPU SLOT3 PCI-E 3.0 X8

BIOS

LE3

FANA

JIPMB1

JRK1

Intel

X557

CPU SLOT6 PCI-E 3.0 X16

DESIGNED IN USA

REV:1.02

X11SPi-TF

MH11

MH10

M.2 PCI-E 3.0 X4

UID SW

UID LED
JPTG1

JPTG1

JIPMB1

JRK1

BT1

USB2/3

USB4/5

JTPM1

LEDPWR

UID-SW

UID-LED

USB10(3.0)

C

JF1

ON

FAIL 1

LED

2

LEDLED

PWR UID

RST

PS

NIC

NIC

PWRHDD

NMIX

JF1

VGA

FAN4

VGA

JNVI2C1

FAN3 FAN2

DIMMC1

DIMMB1

LAN2

DIMMA2

DIMMA1

SAN MAC

BAR CODE

MAC CODE

IPMI CODE

LAN2

LAN1

LAN1

CPU

USB6/7 (3.0)

IPMI_LAN

USB0/1

USB6/7(3.0)

IPMI_LAN
USB0/1

DIMMD1

DIMMD2

DIMME1

DIMMF1

JPWR2

COM1

JSTBY1

FAN1

FAN5

JPWR1

JPI2C1

COM1

FAN5

DIMMD2
DIMMD1

DIMME1
DIMMF1

DIMMC1
DIMMB1

DIMMA1
DIMMA2

CPU

JPWR2
JPWR1

JSTBY1
JPI2C1

FAN1

S-SATA0

S-SATA1

JSD1

FANB

JSD2

JBT1

JPME2

FANA

LE3

M.2

BT1

LEDPWR

USB10 (3.0)

JF1

FAN3

FAN4

FAN2

JNVI2C1

USB4/5

USB2/3

JTPM1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-

nections.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

11

Super X11SPi-TF User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPTG1 LAN Enable/Disable Pins 1-2 (Enabled)

JWD1 Watchdog Timer Pins 1-2 (Reset)

LED Description Status

LE3 M.2 LED Blinking Green: Device Working

LEDBMC BMC Heartbeat LED Blinking Green: BMC Normal

LEDPWR Onboard Power LED Solid Green: Power On

UID-LED Unit Identier (UID) LED Solid Blue: Unit Identied

Connector Description

BT1 Onboard Battery

COM1, COM2 COM Port, COM Header

FAN1 ~ FAN5, FANA, FANB CPU/System Fan Headers

IPMI_LAN Dedicated IPMI LAN Port

I-SATA0 ~ I-SATA7 Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)

I-SGPIO1, I-SGPIO2,

S-SGPIO1

JD1 Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)

JF1 Front Control Panel Header

JIPMB1 4-pin BMC External I

JL1 Chassis Intrusion Header

JNVI2C1 NVMe I2C Header

JOH1 Overheat LED Indicator

JPI2C1 Power System Management Bus (SMB) I2C Header

JPWR1 8-pin Power Connector

JPWR2 24-pin ATX Power Connector

JRK1 Intel RAID Key Header

JSD1, JSD2 SATA DOM Power Connectors

JSTBY1 Standby Power Header

JTPM1 Trusted Platform Module/Port 80 Connector

LAN1, LAN2 LAN (RJ45) Ports

M.2 M.2 PCI-E 3.0 x4 Slot (Supports M-Key 2280 and 22110)

MH10, MH11 M.2 Mounting Holes

SLOT1 PCH PCI-E 3.0 x4 (in x8) Slot

Serial Link General Purpose I/O Connection Headers (I-SGPIO: SATA use; S-SGPIO: sSATA

use)

2

C Header (for an IPMI card)

Note: Table is continued on the next page.

12

Connector Description

SLOT2 CPU PCI-E 3.0 x8 Slot

SLOT3, SLOT4 CPU PCI-E 3.0 x8/x16 Slot (Supports Auto Switch)

SLOT6 CPU PCI-E 3.0 x16 Slot

SP1 Internal Speaker/Buzzer

S-SATA0, S-SATA1 SATA 3.0 Ports with SATA DOM Power

UID-SW Unit Identier (UID) Switch

USB0/1 Back Panel Universal Serial Bus (USB) 2.0 Ports

USB2/3, USB4/5 Front Accessible USB 2.0 Headers

USB6/7 Back Panel USB 3.0 Ports

USB8/9 Front Accessible USB 3.0 Header

USB10 USB 3.0 Type-A Header

VGA VGA Port

Chapter 1: Introduction

13

Super X11SPi-TF User's Manual

Motherboard Features

CPU

•

Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA3647) processor with up to 28 cores and a

thermal design power (TDP) of up to 205W

Note: The X11SPi-TF motherboard does not support FPGA or Fabric processors.

Memory

•

Up to 256GB of RDIMM, 512GB of LRDIMM, and 1TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up

to 2666MHz in eight memory slots

Note: Memory speed support depends on the processors used in the system.

DIMM Size

Motherboard Features

• Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

•

Intel PCH C622

Expansion Slots

•

One (1) PCI-Express 3.0 x4 Slot (in x8) (PCH SLOT1)

• One (1) PCI-Express 3.0 x8 Slots (CPU SLOT2)

• Two (2) PCI-Express 3.0 x8/x16 Slots (CPU SLOT3, CPU SLOT4: Supports Auto Switch)

• One (1) PCI-Express 3.0 x16 Slot (CPU Slot 6)

• One (1) M.2 PCI-Express 3.0 x4 Slot (Supports M-Key 2280 and 22110)

Network

•

Intel X557 10G PHY

• Intel Ethernet Controller X722 for 10G BASE-T Ports

• One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

•

ASpeed AST2500 BMC

Graphics

•

Graphics controller via ASpeed AST2500 BMC

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

I/O Devices

•

Serial (COM) Port

• SATA 3.0

• Video (VGA) Port • One (1) VGA connection on the rear I/O panel

Peripheral Devices

•

Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)

• Two (2) USB 3.0 ports on the rear I/O panel (USB6/7)

• Two (2) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5)

• One (1) front accessible USB 3.0 header with two (2) USB connections (USB8/9)

• One (1) USB 3.0 Type-A header (USB10)

BIOS

•

256Mb AMI BIOS® SPI Flash BIOS

• ACPI 6.0, Plug and Play (PnP), BIOS rescue hot-key, riser card auto detection support, and SMBIOS 3.0 or later

• One (1) serial port on the rear I/O panel (COM1)

• One (1) front accessible serial port header (COM2)

• Eight (8) SATA 3.0 ports at 6 Gb/s (I-SATA0~7 with RAID 0, 1, 5, 10)

• Two (2) SATA 3.0 ports with SATA DOM power (S-SATA0, S-SATA1)

Power Management

•

ACPI power management

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-on-LAN

• Power supply monitoring

System Health Monitoring

•

Onboard voltage monitoring for +12V, +5V, +3.3V, CPU, Memory, VBAT, +5V stdby, +3.3V stdby, +1.8V PCH, +1.05V

PCH, +1.0V PCH, CPU temperature, VRM temperature, LAN temperature, PCH temperature, system temperature, and

memory temperature

• 5 CPU switch phase voltage regulator

• CPU thermal trip support

• Platform Environment Control Interface (PECI)/TSI

Fan Control

•

Fan status monitoring via IPMI connections

• Single cooling zone

• Low-noise fan speed control

• Seven (7) 4-pin fan headers

System Management

•

Trusted Platform Module (TPM) support

• SuperDoctor® 5

• Chassis intrusion header and detection

• Server Platform Service

Note: The table above is continued on the next page.

15

Super X11SPi-TF User's Manual

LED Indicators

•

CPU/system overheat LED

• Power/suspend-state indicator LED

• Fan failed LED

• UID/remote UID

• HDD activity LED

• LAN activity LED

Dimensions

•

12" (W) x 9.6" (L) ATX (304.8mm x 243.84mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Motherboard Features

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con-

guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: Starting in 2020, Supermicro ships standard products with a unique password
that can be found on a label on the motherboard. For products shipped before 2020,
the manufacturer default username is ADMIN and the password is ADMIN. For gen­eral documentation and information on IPMI, please visit our website at: https://www.

supermicro.com/en/solutions/management-software/bmc-resources

16

RJ45

DDR4

BMC Boot Flash

Temp Sensor
EMC1402-1 *2 at diff SMBUS

SLOT 2

PCI-E X8

SLOT 3

PCI-E X8

SLOT 1

PCI-E X8

LAN3

RTL8211E-VB-CG

SPI

VGA CONN

#A-2

#A-1

DDRIV

PCI-E X8 G3

PCI-E X8 G3

PCI-E X4 G3

M.2 SSD

LAN

X557 (10G)

RGRMII

BMC

AST2500

COM1
Connector

Figure 1-3.

System Block Diagram

VCCP0 12v

VR13

#C-1

#B-1

2666/2933

UP TO

(Also supports

RMII/NCSI

COM2
Header

PCI-E X4 G3

SATA X1)

KR

PCI-E X1 G2

USB 2.0

5+1 PHASE
145W

VCCP0

SOCKET ID:0

SNB CORE
DDR-IV

#3B #3A #1B

#1A

SWITCH

#8~11

KR

C622 X8 UPLINK
NO QAT 2*10G+2*1G(~17W)

#5

#6 USB2.0

#0~3
PCIe

Switch

BIOS

PECI:30

DMI3

PCI-E X8

Uplink

Intel

C622

SPI

#2

PCI-E X16 G3(X8 option)

PCI-E X16 G3

DMI3

6.0 Gb/S

6.0 Gb/S

USB2.0 #2,3
USB2.0 #4,5

USB2.0 #0,1

USB 2.0

USB 2.0

USB 3.0

SPI

TPM HEADER

Debug Card

FRONT PANEL

Chapter 1: Introduction

#F-1

#E-1

#D-2

#D-1

2666/2933

UP TO

DDRIV

#7

#6

#5

#4

#3

#2

#1

#0

SATA

#1

SATA-DOM

#0

sSATA

Front USB2.0 x 4

USB

Front USB3.0 x 2

USB

USB

SYSTEM POWER

FAN SPEED

CTRL

PCI-E X16

SLOT 6

Rear USB2.0 x 2

USB

Type A USB3.0

Rear USB3.0 x 2

USB

PCI-E X16

SLOT 4

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

17

Super X11SPi-TF User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
(Socket P0-LGA3647) processor and the Intel PCH C622 chipset, the X11SPi-TF motherboard

provides system performance, power e󰀩ciency, and feature sets to address the needs of

next-generation computer users.

With the support of the new Intel Microarchitecture 14nm Process Technology, the X11SPi-TF
dramatically increases system performance for a multitude of server applications.

The Intel PCH C622 chipset provides Enterprise SMbus support, including the following
features:

• DDR4 288-pin memory support

• Support for Management Engine (ME)

• Support of SMBus speeds of up to 400KHz for BMC connectivity

• Improved I/O capabilities to high-storage-capacity congurations

• SPI Enhancements

• Intel Node Manager 3.0 for advanced power monitoring, capping and management for BMC

enhancement (see note below).

• BMC supports remote management, virtualization, and the security package for enterprise

platforms

Note: Note Manager support depends on the power supply used in your system.

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to

remain powered o󰀨 (in which case you must press the power switch to turn it back on), or

for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

18

Chapter 1: Introduction

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU,
and battery continuously. Once a voltage becomes unstable, a warning is given, or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or

the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to

prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux
environment. SuperDoctor is used to notify the user of certain system events. For example,

you can congure SuperDoctor to provide you with warnings when the system temperature,
CPU temperatures, voltages and fan speeds go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system, including its hardware, operating

system and application software. This enables the system to automatically turn on and o󰀨

peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/2012R and 2016 operating systems.

19

Super X11SPi-TF User's Manual

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates where
noisy power transmission is present.

The X11SPi-TF motherboard accommodates a 24-pin ATX power supply. Although most power

supplies generally meet the specications required by the CPU, some are inadequate. In

addition, one 12V 8-pin power connection is also required to ensure adequate power supply
to the system.

Warning: To avoid damaging the power supply or the motherboard, be sure to use a
power supply that contains a 24-pin and an 8-pin power connector. Be sure to connect
the power supplies to the 24-pin power connector (JPWR2), and the 8-pin power con­nector (JPWR1) on the motherboard. Failure in doing so may void the manufacturer
warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power

supply Specication 2.02 or above. It must also be SSI compliant. (For more information,

please refer to the website at http://www.ssiforum.org/).

1.7 Serial Port

The X11SPi-TF motherboard supports two serial communication connections. COM Ports 1
and 2 can be used for input/output. The UART provides legacy speeds with a baud rate of
up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s,
which support high-speed serial communication devices.

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
system board, it is important to handle it very carefully. The following measures are generally

su󰀩cient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the motherboard by its edges only; do not touch its components, peripheral chips,

memory modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your computer chassis provides excellent conduc-

tivity between the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of onboard CMOS battery. Do not install the onboard battery

upside down to avoid possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

Super X11SPi-TF User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together rst to form

the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.

Notes:

• Use ESD protection.

• Unplug the AC power cord from all power supplies after shutting down the system.

• Check that the plastic protective cover is on the CPU socket and none of the socket pins

are bent. If they are, contact your retailer.

• When handling the processor, avoid touching or placing direct pressure on the LGA lands

(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.

• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.

• Refer to the Supermicro website for updates on processor support.

• All graphics in this manual are for illustrations only. Your components may look di󰀨erent.

The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor

Non-Fabric Model

22

Chapter 2: Installation

Overview of the Processor Carrier Assembly

The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and
a processor carrier.

1. Non-F Processor

2. Processor Carrier

Overview of the CPU Socket

The CPU socket is protected by a plastic protective cover.

1. Plastic Protective Cover

2. CPU Socket

23

Super X11SPi-TF User's Manual

Overview of the Processor Heatsink Module

The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the
Intel Xeon Non-Fabric (Non-F) processor.

1. Heatsink with Thermal Grease

2. Processor Carrier

3. Non-F Processor

Processor Heatsink Module

Bottom View

24

Chapter 2: Installation

Creating the Non-F Model Processor Carrier Assembly

To install a Non-F model processor into the processor carrier, follow the steps below:

1. Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold
triangle in the corner of the processor and the corresponding hollowed triangle on the
processor carrier. These triangles indicate pin 1. See the images below.

2. Using the triangles as a guide, carefully align and place Point A of the processor into

Point A of the carrier. Then gently ex the other side of the carrier for the processor to t

into Point B.

3. Examine all corners to ensure that the processor is rmly attached to the carrier.

CPU (Upside Down)
with CPU LGA Lands up

Align Point A of the CPU and
Point A of the Processor Carrier

Align CPU Pin 1

B

Align Point B of the CPU and
Point B of the Processor Carrier

A

Pin 1

B

A

Processor Carrier
(Upside Down)

Allow carrier to
latch onto CPU

B

A

Allow carrier to
latch onto CPU

Processor Carrier Assembly (Non-F Model)

Pin 1

25

Super X11SPi-TF User's Manual

Assembling the Processor Heatsink Module

After creating the processor carrier assembly for the Non-F model processor, mount it onto
the heatsink to create the processor heatsink module (PHM):

1. Note the label on top of the heatsink, which marks the heatsink mounting holes as 1,
2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the
underside. Otherwise, apply the proper amount of thermal grease.

2. Turn the heatsink over with the thermal grease facing up. Hold the processor carrier
assembly so the processor's gold contacts are facing up, then align the triangle on the
assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The
plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips
will snap into their corresponding holes.

3. Examine all corners to ensure that the plastic clips on the processor carrier assembly

are rmly attached to the heatsink.

Triangle on the CPU

Triangle on the
Processor Carrier

Plastic clips 1 and 2 lock
outside the heatsink’s
mounting holes

Non-Fabric Processor Carrier Assembly

(Upside Down)

Heatsink

(Upside Down)

2

2

1

1

Remaining plastic clips snap

into the other corner holes

2

of the heatsink

1

26

Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with a plastic protective cover installed on the CPU socket. Remove
it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner
of the plastic protective cover to remove it.

CPU Socket with Plastic Protective Cover

Remove the plastic protective

cover from the CPU socket.

Do not touch or bend

the socket pins.

Socket Pins

27

Super X11SPi-TF User's Manual

Installing the Processor Heatsink Module

After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:

1. Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left
image below.

2. Make sure all four holes of the heatsink are aligned with the socket before gently placing
the heatsink on top.

3. With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even
pressure. The order of the screws is shown on the label on top of the heatsink. To
avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when
tightening the screws.

4. Examine all corners to ensure that the PHM is rmly attached to the socket.

Oval C

Oval D

Small Guide Post

Large Guide Post

Printed Triangle

Mounting the Processor Heatsink Module
onto the CPU socket (on the motherboard)

#1

Use a torque
of 12 lbf-in

T30 Torx Screwdriver

#4

#2

#3

Tighten the screws in
the sequence of 1, 2, 3, 4

28

Chapter 2: Installation

Removing the Processor Heatsink Module

Before removing the processor heatsink module (PHM) from the motherboard, unplug the
AC power cord from all power supplies after shutting down the system. Then follow the steps
below:

1. Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of
#4, #3, #2, and #1.

2. Gently lift the PHM upwards to remove it from the socket.

#1

Remove the screws in

the sequence of 4, 3, 2, 1

#4

#2

#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws,

lift the Processor Heatsink
Module off the CPU socket.

29

Super X11SPi-TF User's Manual

2.3 Motherboard Installation

All motherboards have standard mounting holes to t di󰀨erent types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that

the metal stando󰀨s click in or are screwed in tightly.

Tools Needed

Phillips

Screwdriver

(1)

COM2

JL1

JWD1

JPG1

USB8/9(3.0)

I-SGPIO2

I-SGPIO1

S-SGPIO1

JD1

LEDBMC

PCH SLOT1 PCI-E 3.0 X4(IN X8)

CPU SLOT2 PCI-E 3.0 X8

+

SP1

JOH1

JBT1

S-SATA0

I-SATA0
I-SATA1
I-SATA2
I-SATA3

JSD2

I-SATA4
I-SATA5
I-SATA6
I-SATA7

S-SATA1

JSD1

FANB

ASpeed

AST2500

LICENSE

Intel
C622

JPME2

CPU SLOT4 PCI-E 3.0 X16

CPU SLOT3 PCI-E 3.0 X8

BIOS

LE3

FANA

Intel

X557

CPU SLOT6 PCI-E 3.0 X16

DESIGNED IN USA

REV:1.02

X11SPi-TF

MH11

MH10

M.2 PCI-E 3.0 X4

Phillips Screws

(9)

UID-SW

UID-LED

VGA

BT1

USB2/3

JTPM1

JIPMB1

JRK1

USB4/5

JPTG1

USB10(3.0)

LEDPWR

JF1

ON

PWR UID

RST

FAIL 1

PS

LED

NIC

2

NIC

PWRHDD

LEDLED

NMIX

C

JF1

FAN4

JNVI2C1

FAN3 FAN2

DIMMC1

DIMMB1

DIMMA2

DIMMA1

SAN MAC

BAR CODE

MAC CODE

IPMI CODE

LAN2

LAN1

CPU

Stando󰀨s (9)

Only if Needed

USB6/7(3.0)

IPMI_LAN
USB0/1

DIMMD1

DIMMD2

DIMMF1

DIMME1

JPWR2

COM1

JSTBY1

FAN5

JPWR1

JPI2C1

FAN1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lbf-in on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precaution­ary measures to avoid damaging these components when installing the motherboard
to the chassis.

30