Supermicro X11SPG-TF operation manual
X11SPG-TF
USER'S MANUAL
Revision 1.1
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
!
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
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State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class B digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
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proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.1
Release Date: March 28, 2019
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2019 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SPG-TF motherboard.
About This Motherboard
The Supermicro X11SPG-TF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx and
82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA 3647) processor with a thermal design
power (TDP) of up to 205W. Built with the Intel C621 chipset, the X11SPG-TF includes three
PCI-E slots for GPU and AOC support and oers such features as SATA 3.0, dual 10GbE
LAN, USB ports, and a built-in PCIe storage solution enhancement via Intel VROC. This
motherboard supports 6-channel, 6-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds
of up to 2933MHz. The X11SPG-TF is the ideal solution for GPU server platforms that address
the needs of next generation computing. Please note that this motherboard is intended to
be installed and serviced by professional technicians only. For processor/memory updates,
please refer to our website at http://www.supermicro.com/products/.
Note 1: 2933MHz memory is supported by the 82xx/62xx series processors.
Note 2: Intel VROC requires a separate hardware key to enable.
Conventions Used in the Manual
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered while performing a procedure.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to dierentiate various models or provides infor-
mation for proper system setup.
3
Super X11SPG-TF User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
4
Preface
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................8
Quick Reference ...............................................................................................................11
Quick Reference Table ......................................................................................................12
Motherboard Features .......................................................................................................14
1.2 Processor and Chipset Overview .......................................................................................18
1.3 Special Features ................................................................................................................19
Recovery from AC Power Loss .........................................................................................19
1.4 System Health Monitoring ..................................................................................................19
Onboard Voltage Monitors ................................................................................................19
Fan Status Monitor with Firmware Control .......................................................................19
Environmental Temperature Control .................................................................................19
System Resource Alert......................................................................................................19
1.5 ACPI Features ....................................................................................................................20
1.6 Power Supply .....................................................................................................................20
1.7 Serial Port ...........................................................................................................................20
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................21
Precautions .......................................................................................................................21
Unpacking .........................................................................................................................21
2.2 Processor and Heatsink Installation ...................................................................................22
The Intel Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx Series
Processor ..........................................................................................................................22
Overview of the Processor Carrier Assembly ...................................................................23
Overview of the CPU Socket ............................................................................................23
Overview of the Processor Heatsink Module ....................................................................24
Creating the Non-F Model Processor Carrier Assembly...................................................25
Assembling the Processor Heatsink Module ....................................................................26
Preparing the CPU Socket for Installation ........................................................................27
Installing the Processor Heatsink Module .........................................................................28
Removing the Processor Heatsink Module .......................................................................29
2.3 Motherboard Installation .....................................................................................................30
5
Super X11SPG-TF User's Manual
Tools Needed ....................................................................................................................30
Location of Mounting Holes ..............................................................................................30
Installing the Motherboard.................................................................................................31
2.4 Memory Support and Installation .......................................................................................32
Memory Support ................................................................................................................32
DDR4 Memory Support for 81xx/61xx/51xx/41xx/31xx Platform ......................................32
DDR4 Memory Support for 82xx/62xx/52xx/42xx/32xx Platform ......................................33
General Guidelines for Optimizing Memory Performance .............................................. 34
DIMM Installation ..............................................................................................................35
DIMM Removal .................................................................................................................35
2.5 Rear I/O Ports ....................................................................................................................36
2.6 Front Control Panel ............................................................................................................40
2.7 Connectors .........................................................................................................................45
Power Connections ...........................................................................................................45
Headers .............................................................................................................................46
2.8 Jumper Settings .................................................................................................................55
How Jumpers Work ...........................................................................................................55
2.9 LED Indicators ....................................................................................................................58
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................61
Before Power On ..............................................................................................................61
No Power ..........................................................................................................................61
No Video ...........................................................................................................................62
System Boot Failure .......................................................................................................62
Memory Errors ..................................................................................................................62
Losing the System's Setup Conguration .........................................................................63
When the System Becomes Unstable ..............................................................................63
3.2 Technical Support Procedures ...........................................................................................65
3.3 Frequently Asked Questions ..............................................................................................66
3.4 Battery Removal and Installation .......................................................................................67
Battery Removal ................................................................................................................67
Proper Battery Disposal ....................................................................................................67
6
Preface
Battery Installation .............................................................................................................67
3.5 Returning Merchandise for Service ....................................................................................68
Chapter 4 UEFI BIOS
4.1 Introduction .........................................................................................................................69
4.2 Main Setup .........................................................................................................................70
4.3 Advanced Setup Congurations .........................................................................................72
4.4 Event Logs .........................................................................................................................99
4.5 IPMI ..................................................................................................................................101
4.6 Security .............................................................................................................................104
4.7 Boot .................................................................................................................................108
4.8 Save & Exit .......................................................................................................................111
Appendix A UEFI BIOS Codes
Appendix B Software Installation
B.1 Installing Software Programs ...........................................................................................11 5
B.2 SuperDoctor® 5 .................................................................................................................116
Appendix C Standardized Warning Statements
Battery Handling ..............................................................................................................117
Product Disposal .............................................................................................................119
Appendix D UEFI BIOS Recovery
7
Super X11SPG-TF User's Manual
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.
In additon to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
Description Part Number Quantity
Supermicro Motherboard X11SPG-TF 1
SATA Cables CBL-0044L 6
Quick Reference Guide MNL-1965-QRG 1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wftp/driver/
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. X11SPG-TF Motherboard Image
Chapter 1: Introduction
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
9
Super X11SPG-TF User's Manual
Figure 1-2. X11SPG-TF Motherboard Layout
(not drawn to scale)
USB1
SXB1A
SXB1B PCI-E 3.0 X16
I-SATA4
I-SATA5
I-SATA6
I-SATA7
S-SGPIO1
I-SGPIO2
FANA
FANB
JUIDB1
LE1
COM2
VGA
CPU SLOT3 PCI-E 3.0 X16
LEDM1
JSTBY1
DESIGNED IN USA
+
BT1
JSD2
JSD1
S-SATA0
S-SATA1
Aspeed
AST2500
JPG1
REV: 1.01
X11SPG-TF
C621
Intel
JPTG1
JWD1
JBT1
USB0
JPCK1
JD1
JP2
JPME2
M.2-H_1 PCI-E 3.0 X4
JP1
CPU
LAN2
LAN1
Intel
X550
MH12
MH10
M.2-H_2 PCI-E 3.0 X4
IPMI_LAN
USB4/5(3.0)
JIPMB1
USB6/7(3.0)
JP4
USB2/3
+
SP1
USB8(3.0)
LE3
LE4
SXB2A
SXB2B PCI-E 3.0 X16
JP3
JTPM1
JNVI2C1
FANC
FAND
ON
JPWR5
JPI2C1
DIMMF1
FAN4
DIMME1
DIMMD1
FAN3
SAN MAC
IPMI CODE
MAC CODE
BIOS LICENSE
DIMMA1
FAN2
BAR CODE
DIMMC1
DIMMB1
FAN1
JL1
JF1
LE2
LEDLED12LEDFAIL
NMIXPWRHDDNICNICUIDPSRSTPWR
Note: Components not documented are for internal testing only.
10
JRK1
JOH1
JPWR6
Quick Reference
JPI2C1
Chapter 1: Introduction
COM2
SXB1A
SLOT3
LEDM1
JPG1
JSTBY1
JD1
JWD1
JPME2
SXB1B
BT1
JSD2
JSD1
I-SATA4
I-SATA5
S-SATA0
S-SATA1
I-SATA6
I-SATA7
JBT1
S-SGPIO1
I-SGPIO2
FANA
FANB
DIMMD1
DIMME1
DIMMF1
DIMMC1
DIMMB1
DIMMA1
JPWR5
JPI2C1
JUIDB1
SXB1A
SXB1B PCI-E 3.0 X16
I-SATA4
I-SATA5
I-SATA6
I-SATA7
S-SGPIO1
I-SGPIO2
FANA
FANB
VGA
LE1
JUIDB1
LE1
COM2
CPU SLOT3 PCI-E 3.0 X16
LEDM1
JSTBY1
DESIGNED IN USA
+
BT1
JSD2
JSD1
S-SATA0
S-SATA1
JPWR5
DIMMF1
DIMME1
FAN4
FAN3
JPTG1
VGA
Aspeed
AST2500
JPG1
REV: 1.01
X11SPG-TF
DIMMD1
SAN MAC
USB1
USB1
JPTG1
JWD1
Intel
C621
JBT1
USB0
USB0
JPCK1
JD1
JPME2
JP1
CPU
IPMI CODE
MAC CODE
JP2
LAN2
LAN1
LAN2
LAN1
Intel
X550
MH12
MH10
M.2-H_1 PCI-E 3.0 X4
M.2-H_2 PCI-E 3.0 X4
BAR CODE
IPMI_LAN
USB4/5 (3.0)
SXB2A
IPMI_LAN
USB4/5(3.0)
USB2/3
+
JIPMB1
SP1
USB6/7(3.0)
JP4
USB8(3.0)
LE3
LE4
BIOS LICENSE
DIMMC1
DIMMB1
DIMMA1
FAN2
FAN1
SXB2B PCI-E 3.0 X16
JP3
JTPM1
JNVI2C1
JRK1
FANC
FAND
JOH1
ON
JF1
LE2
LEDLED12LEDFAIL
NMIXPWRHDDNICNICUIDPSRSTPWR
JPWR6
JL1
SXB2A
USB2/3
MH10
MH12
JIPMB1
SP1
USB6/7 (3.0)
SXB2B
USB8 (3.0)
LE3
LE4
M.2-H_2 PCI-E 3.0 x4
M.2-H_1 PCI-E 3.0 x4
JTPM1
JNVI2C1
CPU
JRK1
FANC
FAND
JOH1
JF1
LE2
JPWR6
JL1
FAN4 FAN3
FAN2 FAN1
Notes:
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-
nections.
• " " indicates the location of Pin 1.
• Jumpers/LED indicators not indicated are used for testing only.
• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
11
Super X11SPG-TF User's Manual
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPG1 VGA Enable/Disable Pins 1-2 (Enabled)
JPME2 ME Manufacturing Mode Pins 1-2 (Normal)
JPTG1 LAN Enable/Disable Pins 1-2 (Enabled)
JWD1 Watchdog Timer Pins 1-2 (Reset)
LED Description Status
LE1 Unit Identier (UID) LED Solid Blue: Unit Identied
LE2 Onboard Power LED Solid Green: Power On
LE3, LE4 M.2 LED Blinking Green: Device Working
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal
Connector Description
BT1 Onboard Battery
COM2 COM Header
FAN1 ~ FAN4 CPU/System Fan Headers
FANA ~ FAND GPU Fan Headers
IPMI_LAN Dedicated IPMI LAN Port
I-SATA4 ~ I-SATA7 Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)
I-SGPIO2, S-SGPIO1
JD1 Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)
JF1 Front Control Panel Header
JIPMB1 4-pin BMC External I2C Header (for an IPMI card)
JL1 Chassis Intrusion Header
JNVI2C1 NVMe I2C Header
JOH1 Overheat LED Indicator
JPI2C1 Power I2C System Management Bus (SMB) Header
JPWR5 20-pin Main Power Connector
JPWR6 8-pin Power Connector for GPU
JRK1 Intel RAID Key Header
JSD1, JSD2 SATA DOM Power Connectors
JSTBY1 Standby Power Header
JTPM1 Trusted Platform Module/Port 80 Connector
JUIDB1 Unit Identier (UID) Switch
LAN1, LAN2
M.2-H_1, M.2-H_2 Dual M.2 PCI-E 3.0 x4 or SATA 3.0 Slots (Supports M-Key 2280)
Serial Link General Purpose I/O Connection Headers (I-SGPIO: SATA use; S-SGPIO: sSATA
use)
10GbE LAN Ports
Note: Table is continued on the next page.
12
Connector Description
MH10, MH12 M.2 Mounting Holes
SLOT3 Middle CPU PCI-E 3.0 x16 Slot
SP1 Internal Speaker/Buzzer
S-SATA0, S-SATA1 SATA 3.0 Ports with SATA DOM Power
SXB1A, SXB1B Left PCI-E 3.0 x16 GPU Slot
SXB2A, SXB2B Right PCI-E 3.0 x16 GPU Slot
USB0, USB1 Back Panel Universal Serial Bus (USB) 2.0 Ports
USB2/3 Front Accessible USB 2.0 Header
USB4/5 Back Panel USB 3.0 Ports
USB6/7 Front Accessible USB 3.0 Header
USB8 USB 3.0 Type-A Header
VGA VGA Port
Chapter 1: Introduction
13
Super X11SPG-TF User's Manual
Motherboard Features
Motherboard Features
CPU
• Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA3647)
processor with a thermal design power (TDP) of up to 205W and 28 cores
Note: The X11SPG-TF motherboard does not support FPGA or Fabric processors.
Memory
• Up to 384GB of RDIMM, 768GB of LRDIMM, and 1.5TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of
up to 2933MHz in six memory slots
Note 1: Memory speed support depends on the processors used in the system.
Note 2: 2933MHz memory is supported by the 82xx/62xx series processors only.
DIMM Size
• Up to 256GB at 1.2V
Note 1: Memory capacity and frequency is CPU dependent.
Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/
motherboard.
Chipset
• Intel C621
Expansion Slots
• Three (3) PCI-Express 3.0 x16 Slots (CPU Slot 3, SXB1A/SXB1B Slot, SXB2A/SXB2B Slot)
• Two (2) M.2 for PCI-Express 3.0 x4 or SATA 3.0 Slot (Supports M-Key 2280)
Network
• Intel Ethernet Controller X550 for 10G BASE-T Ports
• One (1) Dedicated IPMI LAN located on the rear I/O panel
Baseboard Management Controller (BMC)
• ASpeed AST2500 BMC
Graphics
• Graphics controller via ASpeed AST2500 BMC
Note: The table above is continued on the next page.
14
Chapter 1: Introduction
Motherboard Features
I/O Devices
• Serial (COM) Port • One (1) front accessible serial port header (COM2)
• SATA 3.0
• Video (VGA) Port • One (1) VGA connection on the rear I/O panel
Peripheral Devices
• Two (2) USB 2.0 ports on the rear I/O panel (USB0, USB1)
• Two (2) USB 3.0 ports on the rear I/O panel (USB4/5)
• One (1) front accessible USB 2.0 header with two (2) USB connections (USB2/3)
• One (1) front accessible USB 3.0 header with two (2) USB connections (USB6/7)
• One (1) USB 3.0 Type-A header (USB8)
BIOS
• 256Mb AMI BIOS
®
SPI Flash UEFI BIOS
• ACPI 6.0, Plug and Play (PnP), PCI F/W 3.0, BIOS rescue hot-key, SPI dual/quad speed support, riser Card auto detection
support, SMBIOS 3.0 or later, real time clock (RTC) wakeup
• Four (4) SATA 3.0 ports with RAID 0, 1, 5, 10 (I-SATA4~7)
• Two (2) S-SATA 3.0 ports with RAID 0, 1, 5, 10 (S-SATA0~1)
Power Management
• ACPI power management
• Power button override mechanism
• Wake-on-LAN
• Power-on mode for AC power recovery
• Power supply monitoring
System Health Monitoring
• Onboard voltage monitoring for +1.8V, +3.3V, +5V, +12V, +3.3V stdby, +5V stdby, VBAT, PCH temperature, system
temperature, and memory temperature
• 5 CPU switch phase voltage regulator
• CPU thermal trip support
• Platform Environment Control Interface (PECI)/TSI
Fan Control
• Fan status monitoring via IPMI connections
• Three cooling zones
• Multi-fan speed control support through onboard BMC
• Eight (8) 4-pin fan headers
System Management
• Trusted Platform Module (TPM) support
• SuperDoctor® 5
• Watchdog, Non-maskable Interrupt (NMI), RoHs
• Chassis intrusion header and detection (Note: Please connect a cable from the Chassis Intrusion header at JD1 to the
chassis to receive an alert via IPMI)
• Server Platform Service
Note: The table above is continued on the next page.
15
Super X11SPG-TF User's Manual
LED Indicators
• CPU/system overheat LED
• Powe state indicator LED
• Fan failed LED
• UID/remote UID
• HDD activity LED
• LAN activity LED
Dimensions
• 7.71" (W) x 16.64" (L) (195.8mm x 422.7mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Motherboard Features
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con-
guration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacture default username is ADMIN and the password is
ADMIN. For proper BMC conguration, please refer to https://www.supermicro.com/
products/nfo/les/IPMI/Best_Practices_BMC_Security.pdf.
16
Figure 1-3.
System Block Diagram
#C-1
#B-1
#A-1
VCCP0
VCCP0 12v
VR13
5+1 PHASE
205W
Chapter 1: Introduction
#F-1
#E-1
#D-1
LAN1
RJ45
LAN2
RJ45
IPMI
RJ45
DDR4
BMC Boot Flash
PCI-E X16
Right GPU
PCI-E X16
LEFT GPU
PCI-E X16
LAN3
RTL8211E-VB-CG
SPI
DDRIV
PCI-E X16 G3
PCI-E X16 G3
PCI-E X16 G3
M.2 SSD
M.2 SSD
Intel
X550 (10G)
RGRMII
BMC
AST2500
UP TO
2666/2933
RMII/NCSI
PCI-E X4 G3
PCI-E X4 G3
PCIE X4 G3
PCI-E X1 G2
USB 2.0
ESPI
ESPI
Header
SPI
SNB CORE
DDR-IV
#3
#2
#8~11
#12~15
#0~3
#5
#7 USB2.0
PECI:30
SOCKET ID:0
#1
PCH
(C621)
Switch
DMI3
DMI3
USB2.0 #3,4
USB2.0 #0,1
USB3.0 #3,4
USB2.0 #8,9 &
USB3.0 #6
USB2.0 #10 &
USB3.0 #1,2
USB2.0 #13,14 &
SPI
SPI
6.0 Gb/S
6.0 Gb/S
USB 2.0
USB 2.0
USB 3.0
UP TO
DDRIV
2666/2933
#7
#6
#5
#4
SATA
SATA-DOM
#1
#0
sSATA
Front USB2.0 x 2
USB
Front USB3.0 x 2
Type A USB3.0
Rear USB3.0 x 2
Rear USB2.0 x 2
USB
USB
USBUSB
VGA CONN
COM2
Header
Temp Sensor
EMC1402-1 *2 at diff SMBUS
TPM HEADER
Debug Card
BIOS
FRONT PANEL
SYSTEM POWER
FAN SPEED
CTRL
Note 1: This is a general block diagram and may not exactly represent the features
on your motherboard. See the previous pages for the actual specications of your
motherboard.
Note 2: 2933 MHz Memory is only supported by the 82xx/62xx series processors.
17
Super X11SPG-TF User's Manual
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx and
82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA3647) processor and the Intel C621 chipset,
the X11SPG-TF motherboard provides system performance, power eciency, and feature
sets to address the needs of next-generation computer users.
With the support of the new Intel Microarchitecture 14nm Process Technology, the X11SPG-TF
dramatically increases system performance for a multitude of server applications.
The Intel C621 chipset provides Enterprise SMbus support, including the following features:
• DDR4 288-pin memory support
• Support for Management Engine (ME)
• Support of SMBus speeds of up to 400KHz for BMC connectivity
• Improved I/O capabilities to high-storage-capacity congurations
• SPI Enhancements
• Intel Node Manager 3.0 for advanced power monitoring, capping and management for BMC
enhancement (see note below).
• BMC supports remote management, virtualization, and the security package for enterprise
platforms
Note: Note Manager support depends on the power supply used in your system.
New features supported by the 82xx/62xx/52xx/42xx/32xx series processors include
the following:
• Higher performance for a variety of workloads per-core performance increase
• Vector Neural Network Instructions (VNNI) support to accelerate AI/Deep Learning work-
loads
• Intel Speed Select Technology with support by boosting performance on critical cores in
CPU based on on workload needs **
** - support on select SKUs
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Chapter 1: Introduction
1.3 Special Features
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered o (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
1.4 System Health Monitoring
Onboard Voltage Monitors
An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU,
and battery continuously. Once a voltage becomes unstable, a warning is given, or an error
message is sent to the screen. The user can adjust the voltage thresholds to dene the
sensitivity of the voltage monitor.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or
the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to
prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux
environment. SuperDoctor is used to notify the user of certain system events. For example,
you can congure SuperDoctor to provide you with warnings when the system temperature,
CPU temperatures, voltages and fan speeds go beyond a predened range.
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Super X11SPG-TF User's Manual
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system, including its hardware, operating
system and application software. This enables the system to automatically turn on and o
peripherals such as CD-ROMs, network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,
while providing a processor architecture-independent implementation that is compatible with
the appropriate operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates where
noisy power transmission is present.
The X11SPG-TF motherboard accommodates a 20-pin main power supply. In addition, one
12V 8-pin power connector is supported to provide the required power to the GPU add-on card.
It is strongly recommended that you use a high quality power supply that meets ATX power
supply Specication 2.02 or above. It must also be SSI compliant. (For more information,
please refer to the website at http://www.ssiforum.org/).
1.7 Serial Port
The X11SPG-TF motherboard supports one serial communication connection. COM Port 2
can be used for input/output. The UART provides legacy speeds with a baud rate of up to
115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support high-speed serial communication devices.
20
Chapter 2: Installation
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
system board, it is important to handle it very carefully. The following measures are generally
sucient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the motherboard by its edges only; do not touch its components, peripheral chips,
memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your computer chassis provides excellent conduc-
tivity between the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of onboard CMOS battery. Do not install the onboard battery
upside down to avoid possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
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Super X11SPG-TF User's Manual
2.2 Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.
Notes:
• Use ESD protection.
• Unplug the AC power cord from all power supplies after shutting down the system.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
• Refer to the Supermicro website for updates on processor support.
• All graphics in this manual are for illustrations only. Your components may look dierent.
The Intel Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx Series Processor
Non-Fabric Model
22
Chapter 2: Installation
Overview of the Processor Carrier Assembly
The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and
a processor carrier.
1. Non-F Processor
2. Processor Carrier
Overview of the CPU Socket
The CPU socket is protected by a plastic protective cover.
1. Plastic Protective Cover
2. CPU Socket
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Super X11SPG-TF User's Manual
Overview of the Processor Heatsink Module
The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the
Intel Xeon Non-Fabric (Non-F) processor.
1. Heatsink with Thermal Grease
2. Processor Carrier
3. Non-F Processor
Processor Heatsink Module
Bottom View
24
Chapter 2: Installation
Creating the Non-F Model Processor Carrier Assembly
To install a Non-F model processor into the processor carrier, follow the steps below:
1. Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold
triangle in the corner of the processor and the corresponding hollowed triangle on the
processor carrier. These triangles indicate pin 1. See the images below.
2. Using the triangles as a guide, carefully align and place Point A of the processor into
Point A of the carrier. Then gently ex the other side of the carrier for the processor to t
into Point B.
3. Examine all corners to ensure that the processor is rmly attached to the carrier.
CPU (Upside Down)
with CPU LGA Lands up
Align Point A of the CPU and
Point A of the Processor Carrier
Align CPU Pin 1
B
Align Point B of the CPU and
Point B of the Processor Carrier
A
Pin 1
B
A
Processor Carrier
(Upside Down)
Allow carrier to
latch onto CPU
B
A
Allow carrier to
latch onto CPU
Processor Carrier Assembly (Non-F Model)
Pin 1
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Super X11SPG-TF User's Manual
Assembling the Processor Heatsink Module
After creating the processor carrier assembly for the Non-F model processor, mount it onto
the heatsink to create the processor heatsink module (PHM):
1. Note the label on top of the heatsink, which marks the heatsink mounting holes as 1,
2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the
underside. Otherwise, apply the proper amount of thermal grease.
2. Turn the heatsink over with the thermal grease facing up. Hold the processor carrier
assembly so the processor's gold contacts are facing up, then align the triangle on the
assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The
plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips
will snap into their corresponding holes.
3. Examine all corners to ensure that the plastic clips on the processor carrier assembly
are rmly attached to the heatsink.
Triangle on the CPU
Triangle on the
Processor Carrier
Plastic clips 1 and 2 lock
outside the heatsink’s
mounting holes
Non-Fabric Processor Carrier Assembly
(Upside Down)
Heatsink
(Upside Down)
2
2
1
1
Remaining plastic clips snap
into the other corner holes
2
of the heatsink
1
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Chapter 2: Installation
Preparing the CPU Socket for Installation
This motherboard comes with a plastic protective cover installed on the CPU socket. Remove
it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner
of the plastic protective cover to remove it.
CPU Socket with Plastic Protective Cover
Remove the plastic protective
cover from the CPU socket.
Do not touch or bend
the socket pins.
Socket Pins
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Super X11SPG-TF User's Manual
Installing the Processor Heatsink Module
After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:
1. Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left
image below.
2. Make sure all four holes of the heatsink are aligned with the socket before gently placing
the heatsink on top.
3. With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even
pressure. The order of the screws is shown on the label on top of the heatsink. To
avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when
tightening the screws.
4. Examine all corners to ensure that the PHM is rmly attached to the socket.
Oval C
Oval D
Small Guide Post
Large Guide Post
Printed Triangle
Mounting the Processor Heatsink Module
onto the CPU socket (on the motherboard)
#1
Use a torque
of 12 lbf-in
T30 Torx Screwdriver
#4
#2
#3
Tighten the screws in
the sequence of 1, 2, 3, 4
28
Chapter 2: Installation
Removing the Processor Heatsink Module
Before removing the processor heatsink module (PHM) from the motherboard, unplug the
AC power cord from all power supplies after shutting down the system. Then follow the steps
below:
1. Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of
#4, #3, #2, and #1.
2. Gently lift the PHM upwards to remove it from the socket.
#1
Remove the screws in
the sequence of 4, 3, 2, 1
#4
#2
#3
Printed Triangle on Motherboard
CPU Socket
After removing the screws,
lift the Processor Heatsink
Module off the CPU socket.
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Super X11SPG-TF User's Manual
2.3 Motherboard Installation
All motherboards have standard mounting holes to t dierent types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standos click in or are screwed in tightly.
Tools Needed
Phillips
Screwdriver
(1)
SXB1A
SXB1B PCI-E 3.0 X16
I-SATA4
I-SATA5
I-SATA6
I-SATA7
S-SGPIO1
I-SGPIO2
FANA
FANB
JUIDB1
LE1
COM2
CPU SLOT3 PCI-E 3.0 X16
LEDM1
+
JSD2
JSD1
S-SATA0
S-SATA1
JPWR5
DIMMF1
DIMME1
FAN4
JPI2C1
Phillips Screws
(7)
USB1
Aspeed
AST2500
X11SPG-TF
Intel
C621
SAN MAC
JPTG1
JWD1
JBT1
JPCK1
JD1
JP1
IPMI CODE
MAC CODE
USB0
JPME2
CPU
LAN2
Intel
X550
MH10
JP2
M.2-H_1 PCI-E 3.0 X4
M.2-H_2 PCI-E 3.0 X4
BAR CODE
VGA
JPG1
JSTBY1
REV: 1.01
DESIGNED IN USA
BT1
DIMMD1
FAN3
LAN1
MH12
BIOS LICENSE
IPMI_LAN
USB4/5(3.0)
USB2/3
JIPMB1
USB6/7(3.0)
JP4
LE3
LE4
DIMMA1
FAN2
+
SP1
USB8(3.0)
DIMMB1
DIMMC1
FAN1
SXB2A
SXB2B PCI-E 3.0 X16
JP3
JTPM1
JNVI2C1
FANC
FAND
JOH1
ON
JF1
LE2
LEDLED12LEDFAIL
NMIXPWRHDDNICNICUIDPSRSTPWR
JPWR6
JL1
Standos (7)
Only if Needed
JRK1
Location of Mounting Holes
Note: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lbf-in on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard
to the chassis.
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