Supermicro X11SPA-T operation manual

X11SPA-TF

X11SPA-T

USER'S MANUAL

Revision 1.0a

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer

!

assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL,
INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE,
SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING,
REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

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State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0a

Release Date: June 14, 2019

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2019 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11SPA-TF/-T motherboard.

About This Motherboard

The Supermicro X11SPA-TF/-T supports a single Intel® Xeon® Scalable-SP series processor
(Socket LGA 3647) with up to 28 cores and a thermal design power (TDP) of up to 205W.
Built with the Intel PCH C621 chipset, the X11SPA-TF/-T supports 6-channel, 12-DIMM
DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2933 MHz, four M.2 PCI-E 3.0
x4 slots, three RJ45 ports (two RJ45 LAN ports and one IPMI LAN port), and a Trusted
Platform Module (TPM) header. The X11SPA-TF/-T is optimized for high-performance and
high-end computing platforms that address the needs of next generation server applications.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.

supermicro.com/products/.

Notes: 1. X11SPA-TF supports 2nd Generation Intel Xeon Scalable-SP
(82xx/62xx/52xx/42xx/32xx series) processors. X11SPA-T supports 2nd Gen Intel
Xeon Scalable-SP (82xx/62xx/52xx/42xx/32xx series) and Intel Xeon W-32xx series
processors. 2. 2933 MHz memory is supported by 2nd Gen Intel Xeon Scalable-SP
(82xx/62xx series) processors only.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for proper system setup.

3

Super X11SPA-TF/-T User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Table of Contents

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................7

1.2 Processor and Chipset Overview .......................................................................................17

1.3 Special Features ................................................................................................................18

1.4 System Health Monitoring ..................................................................................................18

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................20

1.7 Serial Port ...........................................................................................................................20

1.8 Intel Optane DC Peristent Memory Overview ....................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

2.2 Processor and Heatsink Installation ...................................................................................22

2.3 Motherboard Installation .....................................................................................................30

2.4 Memory Support and Installation .......................................................................................32

2.5 M.2 SSD Installation ...........................................................................................................39

2.6 Rear I/O Ports ....................................................................................................................42

2.7 Front Control Panel ............................................................................................................47

2.8 Connectors .........................................................................................................................52

2.9 Jumper Settings .................................................................................................................63

2.10 LED Indicators ...................................................................................................................67

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................70

3.2 Technical Support Procedures ...........................................................................................74

3.3 Frequently Asked Questions ..............................................................................................75

3.4 Battery Removal and Installation .......................................................................................76

3.5 Returning Merchandise for Service ....................................................................................77

Chapter 4 UEFI BIOS

4.1 Introduction .........................................................................................................................78

4.2 Main Setup .........................................................................................................................79

4.3 Advanced Setup Congurations .........................................................................................81

4.4 Event Logs .......................................................................................................................136

4.5 IPMI ..................................................................................................................................138

5

Super X11SPA-TF/-T User's Manual

4.6 Security .............................................................................................................................141

4.7 Boot .................................................................................................................................145

4.8 Save & Exit .......................................................................................................................148

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................152

B.2 SuperDoctor® 5 ................................................................................................................153

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................154

Product Disposal .............................................................................................................156

Appendix D UEFI BIOS Recovery

D.1 Overview ...........................................................................................................................157

D.2 Recovering the UEFI BIOS Image ...................................................................................157

D.3 Recovering the BIOS Block with a USB Device ..............................................................158

Appendix E Conguring VROC RAID Settings

E.1 All Intel® VMD Controllers Features ................................................................................162

E.2 Conguring RAID Settings ...............................................................................................169

E.3 Use of Journaling Drive ....................................................................................................182

Appendix F Secure Boot Settings

F.1 Boot mode select Feature ................................................................................................186

F.2 Secure Boot/ Secure Boot Mode/ CSM Support Features ..............................................187

F.3 Secure Boot Settings .......................................................................................................188

F.4 Key Management Settings ...............................................................................................191

Appendix G Conguring iSCSI Settings

G.1 PCIe/PCI/PnP Features ....................................................................................................208

G.2 Conguring iSCSI Settings ...............................................................................................211

Appendix H Conguring Network Interface Card (NIC) Settings

H.1 Network Interface Card (NIC) Settings ............................................................................230

6

Chapter 1: Introduction

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

In addition to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SPA-TF/-T 1

I/O Shield MCP-260-00042-0N 1

SATA Cables CBL-0044L 6

GPU to CPU Power Cable CBL-PWEX-0663 1

Quick Reference Guide MNL-2173-QRG 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: https://www.supermicro.com/wftp/driver/

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

7

Super X11SPA-TF/-T User's Manual

Figure 1-1. X11SPA-TF/-T Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

8

Chapter 1: Introduction

X11SPA-TF

DESIGNED IN USA

REV:1.01

BIOS

LICENSE

MAC CODE

MAC CODE

IPMI CODE

ASPEED
AST2500

LEDBMC

A C

CPU SLOT1 PCI-E 3.0 x16

M.2-C04
PCI-E 3.0 x4

CPU SLOT2 PCI-E 3.0 x8

CPU SLOT3 PCI-E 3.0 x16

Figure 1-2. X11SPA-TF Motherboard Layout

(not drawn to scale)

C

Universal ID

A

UID-SWUID-LED

JPAC1

JSPDIF_OUT

CPU SLOT4 PCI-E 3.0 x8

CPU SLOT5 PCI-E 3.0 x16

AUDIO FP

CPU SLOT6 PCI-E 3.0 x8

CPU SLOT7 PCI-E 3.0 x16

JPWR4

DIMMC1
DIMMC2
DIMMB1
DIMMB2
DIMMA1
DIMMA2

HD AUDIO

FAN D

FAN C

JPL2

USB4/5(3.0)
USB3.1 Gen.1
LAN2

USB6/7 (3.0)
USB3.1 Gen.1
IPMI_LAN

VGA
COM1

USB3.1 Gen.2
LAN1

JPL1

FAN6

FAN5

JPUSB1

(3.1)USB8/9

JPWR3

JVRM1

JP5

FAN4

12V_PUMP_PWR1

BAR CODE

J9702

J9701

JOH1-OH

JWD1

RAID Key Header

JL1

JPG1

JPME2

COM2

JD1

JTPM1

C

LE5

C

PCI-E 3.0 x4

LE4

A

C

PCI-E 3.0 x4

JSD2

I-SATA1 I-SATA3
I-SATA0

JRK1

1

LE6

A

M.2-C03

M.2-C02

A

Intel C621

I-SATA5

I-SATA2 I-SATA4

I-SATA7
I-SATA6

JSD1

I-SGPIO2

PEX8747

I-SGPIO1

FAN B FAN A

PLX

(3.0)USB2/3

USB3.1 Gen.1

DIMMD2
DIMMD1
DIMME2
DIMME1
DIMMF2
DIMMF1

M.2-C01
PCI-E 3.0 x4

USB0/1

LE3

A

C

USB3.1 Gen.2

FAN3

JPI2C1

JP4

USB10 (3.1)
USB3.1 Gen.2

(3.1)USB11

FAN2

FAN1

JSTBY1

JF1

LEDPWR

A

C

IPMI

JPWR2

JIPMB1

BATTERY

JPWR1

+

Note: Components not documented are for internal testing only.

9

Super X11SPA-TF/-T User's Manual

JWD1

JOH1-OH

Quick Reference

SLOT3

SLOT2

LEDBMC

SLOT1

JSPDIF_OUT

JPAC1

SLOT4

AUDIO FP

SLOT6

SLOT5

UID-LED

SLOT7

JPWR4

Universal ID

UID-SW

C

A

UID-SWUID-LED

HD AUDIO

FAN C

FAN D

JPL2

USB4/5
(3.1 Gen1)
LAN2

USB6/7
(3.1 Gen1)

IPMI_LAN

VGA
COM1

USB8/9
(3.1 Gen2)
LAN1

M.2-C04
PCI-E 3.0 x4

J9701/J9702

JL1

JOH1-OH

JPG1
JPME2

M.2-C03
PCI-E 3.0 x4

M.2-C02
PCI-E 3.0 x4

JSD1

Notes:

LE6

JWD1

LE5

COM2

LE4

JD1

JTPM1

JSD2

JRK1

X11SPA-TF

DESIGNED IN USA

REV:1.01

BIOS

LICENSE

MAC CODE

MAC CODE

IPMI CODE

BAR CODE

J9702

J9701

JL1

JPG1

JPME2

COM2

JD1

JTPM1

JSD2

JRK1

RAID Key Header

I-SATA1
I-SATA0

LEDBMC

A C

CPU SLOT1 PCI-E 3.0 x16

M.2-C04
PCI-E 3.0 x4

A

C

LE6

LE5

C

A

PCI-E 3.0 x4

M.2-C03

LE4

A

C

M.2-C02

PCI-E 3.0 x4

I-SATA1 I-SATA3
I-SATA0

1

ASPEED
AST2500

CPU SLOT2 PCI-E 3.0 x8

Intel C621

I-SATA2 I-SATA4

I-SATA3
I-SATA2

I-SATA5
I-SATA4

CPU SLOT3 PCI-E 3.0 x16

I-SATA5

I-SATA7
I-SATA6

I-SGPIO2

JPAC1

JSPDIF_OUT

CPU SLOT4 PCI-E 3.0 x8

JSD1

I-SATA7
I-SATA6

I-SGPIO2

FAN B FAN A

FAN B

CPU SLOT6 PCI-E 3.0 x8

CPU SLOT5 PCI-E 3.0 x16

PLX

PEX8747

I-SGPIO1

USB3.1 Gen.1

FAN A

I-SGPIO1

USB2/3
(3.1 Gen1)

M.2-C01
PCI-E 3.0 x4

(3.0)USB2/3

USB0/1

AUDIO FP

HD AUDIO

JPWR4

CPU SLOT7 PCI-E 3.0 x16

DIMMC1

FAN D

DIMMC2
DIMMB1
DIMMB2
DIMMA1
DIMMA2

DIMMD2
DIMMD1
DIMME2
DIMME1
DIMMF2
DIMMF1

LE3

A

C

(3.1)USB11

USB3.1 Gen.2

USB0/1

USB10

(3.1 Gen2)
USB11
(3.1 Gen2)

M.2-C01
PCI-E 3.0 x4

JPL2

FAN C

USB10 (3.1)
USB3.1 Gen.2

USB4/5(3.0)
USB3.1 Gen.1
LAN2

JP4

FAN2

USB6/7(3.0)
USB3.1 Gen.1
IPMI_LAN

JSTBY1

FAN2

FAN1

FAN1

JSTBY1

LE3

LEDPWR

C

JF1

JF1

VGA
COM1

A

JPWR2

LEDPWR

JPWR2

USB3.1 Gen.2
LAN1

FAN6

JIPMB1

IPMI

JIPMB1

JPUSB1

(3.1)USB8/9

JPWR3

JPL1

FAN5

JPUSB1

JPWR3
JPL1
FAN6

JVRM1

FAN5

JP5

JP5

DIMMC1
DIMMC2
DIMMB1
DIMMB2
DIMMA1
DIMMA2

FAN4

FAN4
12V_PUMP_PWR1

12V_PUMP_PWR1

CPU

FAN3

FAN3
DIMMD2
DIMMD1
DIMME2

DIMME1
DIMMF2

JPI2C1

DIMMF1

BATTERY

JPWR1

+

JPI2C1
JP4

BATTERY
JPWR1

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-

nections.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

10

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

J9701, J9702 Manufacturing Mode Pins 1-2 (Normal)

JPAC1 Audio Enable/Disable Pins 1-2 (Enabled)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPL1, JPL2 LAN1/LAN2 Enable/Disable Pins 1-2 (Enabled)

JPME2 Intel Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Function Enable Pins 1-2 (Reset)

LED Description Status

LE3, LE4, LE5, LE6 M.2 LED Blinking Green: Device Working

LEDBMC BMC Heartbeat LED Blinking Green: BMC Normal

LEDPWR Onboard Power LED Solid Green: Power On

UID-LED Unit Identier (UID) LED Blue on: Unit Identied

Connector Description

12V_PUMP_PWR1 12V 4-pin power connector for CPU liquid cooling pump

AUDIO FP Front Panel Audio Header

BATTERY Onboard Battery

COM1, COM2 COM1: COM Port (Back Panel), COM2: COM Header

PCI-Express x16 Slots

CPU SLOT1/3/5/7 PCI-E 3.0 x16

CPU SLOT2/4/6 PCI-E 3.0 x8 (in x16) PCI-Express x16 Slots (PCI-Express x8 link)

FAN1 ~ FAN6 CPU Fan Headers

FAN A ~ FAN D

HD AUDIO Back Panel High Denition Audio Ports

IPMI_LAN

I-SATA0 ~ 7 Intel Serial ATA (SATA 3.0) Ports 0~7 (6Gb/sec)

I-SGPIO1, I-SGPIO2 Serial General Purpose I/O Headers

JD1 Speaker/Power LED Indicator

JF1 Front Control Panel Header

JIPMB1 4-pin External I2C Header (for an IPMI card)

JL1 Chassis Intrusion Header

JOH1-OH Overheat LED Indicator

JP4, JP5 JP4: Enable/Disable USB10/11, JP5: Enable/Disable USB8/9

JPI2C1 Power Supply SMBus I2C Header

JPUSB1 Enable/Disable USB6/7 WakeUp

JPWR1/3/4 +12V 8-pin CPU Power Connectors (Required)

JPWR2 24-pin ATX Main Power Connector (Required)

*PCI-E SLOT1 will change to PCI-Express x8 link when either M.2-C03 or M.2-C04 is populated with an
SSD. PCI-E SLOT1 will be completely disabled when either M.2-C01 or M.2-C02 is populated with an SSD.

System Fan Headers

*The initial system fan speed must not be lower than 600 RPM.

Dedicated IPMI LAN Port

*For IPMI support, X11SPA-TF is via SPS, whereas X11SPA-T is via ME.

Note: The table above is continued on the next page.

11

Super X11SPA-TF/-T User's Manual

Connector Description

JRK1

JSD1, JSD2 SATA DOM (Disk-On-Module) Power Connectors

JSPDIF_OUT Sony/Philips Digital Interface (S/PDIF) Out Header

JSTBY1 Standby Power Header (5V)

JTPM1 Trusted Platform Module (TPM) Header

LAN1, LAN2 RJ45 1GbE/10GbE LAN Ports

PCI-E M.2-C01/C02/C03/C04 PCI-E 3.0 x4

UID-SW Unit Identier (UID) Switch

USB0/1 Front Access USB 2.0 Header

USB2/3 Front Access USB 3.1 Gen1 Header

USB4/5, USB6/7

USB8/9 Back Panel USB 3.1 Gen2 Ports

USB10/11 Front Access USB 3.1 Gen2 Headers (USB10: Type A, USB11: Type C)

VGA VGA Port

Intel RAID Key Header

*A VROC hardware key is required to enable an M.2 RAID card.

PCI-E M.2 Connectors (Small form factor devices and other portable devices for
high speed NVMe SSDs)

Back Panel USB 3.1 Gen1 Ports

*X11SPA-TF/-T does not support S3 or S4.
*Either U SB4/5 or US B6/7 will su pport sta ndby power.

12

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

•

Supports a single Intel Xeon Scalable-SP series processor with up to 28 cores and a thermal design power (TDP) of up

to 205W

Notes: 1. The X11SPA-TF/-T does not support FPGA or Fabric processors. 2. X11SPA-TF supports 2nd Gen Intel

Xeon Scalable-SP (82xx/62xx/52xx/42xx/32xx series) processors. X11SPA-T supports 2nd Gen Intel Xeon Scalable-

SP (82xx/62xx/52xx/42xx/32xx series) and Intel Xeon W-32xx series processors.

Memory

•

Up to 768GB of RDIMM, 3TB of 3DS RDIMM, 1.5TB of LRDIMM, and 3TB of 3DS LRDIMM DDR4 (288-pin) ECC memory

with speeds of up to 2933 MHz (2DPC) in twelve memory slots. (1DPC and 2DPC are recommended for memory

installation. Only selected 2nd Gen Intel Xeon Scalable-SP processors support Intel DC Persistent memory.)

Note: Memory speed support depends on the processors used in the system. 2933 MHz memory is supported by

the 2nd Gen Intel Xeon Scalable-SP (82xx/62xx series) processors only.

DIMM Size

• Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

•

Intel PCH C621

Expansion Slots

Four (4) PCI-Express 3.0 x16 Slots (CPU SLOT1, 3, 5, 7)

•

• Three (3) PCI-Express 3.0 x8 Slots (IN x16) (CPU SLOT2, 4, 6)

• Four (4) M.2 PCI-Express 3.0 x4 Slots (Supports M-Key 2280 and 22110)

Network

•

Intel X557 10G PHY

• Intel Ethernet Controller X722 for 10G BASE-T Ports

• One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

•

ASPEED AST2500 BMC

Graphics

•

Graphics controller via ASPEED AST2500 BMC

Note: The table above is continued on the next page.

13

Super X11SPA-TF/-T User's Manual

Motherboard Features

I/O Devices

•

Serial (COM) Port

• SATA 3.0 • Eight (8) SATA 3.0 ports at 6 Gb/s (I-SATA0~7 with RAID 0, 1, 5, 10)

• Video (VGA) Port • One (1) VGA connection on the rear I/O panel

Peripheral Devices

•

Two (2) front accessible USB 2.0 connections via one header (USB0/1)

• Two (2) front accessible USB 3.1 Gen1 connections via one header (USB2/3)

• Four (4) USB 3.1 Gen1 ports on the rear I/O panel (USB4/5, USB6/7)

• Two (2) USB 3.1 Gen2 ports on the rear I/O panel (USB8/9)

• Two (2) front accessible USB 3.1 Gen2 headers (USB10: Type A, USB11: Type C)

BIOS

•

256Mb AMI BIOS® SPI Flash BIOS

• ACPI 6.0, Plug and Play (PnP), BIOS rescue hot-key, riser card auto detection support, and SMBIOS 3.0 or later

• One (1) serial port on the rear I/O panel (COM1)

• One (1) front accessible serial port header (COM2)

Power Management

•

ACPI power management

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-on-LAN

• Power supply monitoring

System Health Monitoring

•

Onboard voltage monitoring for +12V, +5V, +3.3V, CPU, Memory, VBAT, +5V stdby, +3.3V stdby, +1.8V PCH, +1.05V

PCH, +1.0V PCH, CPU temperature, VRM temperature, LAN temperature, PCH temperature, system temperature, and

memory temperature

• 6 CPU switch phase voltage regulator

• CPU thermal trip support

• Platform Environment Control Interface (PECI)/TSI

Fan Control

•

Fan status monitoring via IPMI connections

• Single cooling zone

• Multi-speed fan control via onboard BMC

• Ten (10) 4-pin fan headers and one (1) 12V pump connector

System Management

•

Trusted Platform Module (TPM) support

• SuperDoctor® 5

• Chassis Intrusion header and detection

• Server Platform Service

Note: The table above is continued on the next page.

14

LED Indicators

Onboard Power LED

•

• UID LED

• BMC Heartbeat LED

• M.2 LED

Dimensions

•

13" (W) x 12" (L) EATX

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

Chapter 1: Introduction

Motherboard Features

Note 3: If you purchase a Supermicro Out of Band (OOB) software license key

(Supermicro P/N: SFT-OOB-LIC), please DO NOT change the IPMI MAC address.

Note 4: X11SPA-T does not support Out of Band (OOB) ash BIOS.

Note 5: It is strongly recommended that you change BMC login information upon the

initial system power-on. The manufacture default username is ADMIN and the password

is ADMIN. For proper BMC conguration, please refer to https://www.supermicro.com/

products/nfo/les/IPMI/Best_Practices_BMC_Security.pdf.

15

Super X11SPA-TF/-T User's Manual

VPP (2.625) 5v
VDDQ (1.2) 12v

4 x M.2 SOCKET SSD

SLOT 6

PCI-E x8

IT8898*4

PCI-E x16

SLOT 7

RJ45(+U30*2)

RJ45(+U31*2)

LAN3
RTL8211FD-CG

DDR4

BMC Boot Flash

Temp Sensor
W83773G local and remote at SMBUS

RGRMI I

SPI

VGA CONN

VTT_M (0.6)

SLOT 2 SLOT 3 SLOT 4 SLOT 5

x8

x8

LAN2

LAN1 Springville i210AT

BMC
AST2500

COM1
Connector

SYSTEM POWER

FAN SPEED CTRL

Front Panel

PEX8747

IT8898*8

x8x8x8

AQC107(10Gb)

COM2
Header

x4 x4 x4 x4

IT8898*8

PCI-E x16

SLOT 1

x16

x8 x8

PCI-E x8 PCI-E x16 PCI-E x8

x8

x8

Figure 1-3.

System Block Diagram

VR13

VCCP0 12V

6+1+1 PHASE
205W

PCI-E x16 G3

x16

PCI-E x16 G3

x8

PCI-E x16 G3

PCI

-E

x16

PCI-E x4 G2

PCI-E x1 G2

-E

x1 G2

PCI

USB 2.0

ESPI

ESPI

Header

SPI (Reserved)

INTEL LGA3647

(Socket-P0)

DMI3

#8-11

#6

PCH

#5

C621

#14

SPI

Switch

SPI

TPM Header
Debug Card

BIOS

2133/2666 (2933) MHz

2133/2666 (2933) MHz

2133/2666 (2933) MHz

2133/2666 (2933) MHz

2133/2666 (2933) MHz

2133/2666 (2933) MHz

6.0 Gb/s

AZALIA

USB 2.0

PCI

-E

#0-3

-E

PCI

ASM2142/3142 USB3.1

DDR4 (CHA)

DDR4 (CHB)

DDR4 (CHC)

DDR4 (CHD)

DDR4 (CHE)

DDR4 (CHF)

#6

#5

#4

#3

#2

#1

#0

SATA

eSPI

x2 G2

x2 G2

NCT6796D
LPC I/O

Realtek ALC888S

Front USB 2.0 x2

#6

Rear USB 3.0 *2 (RTL)

#5

#4

Front USB 3.0 *2

#3

ASM2142/3142 USB 3.1

DIMMA1

DIMMA2

DIMMB1

DIMMB2

DIMMC1

DIMMC2

DIMMD1

DIMMD2

DIMME1

DIMME2

DIMMF1

DIMMF2

#7

#2

Rear USB 3.0 *2 (AQC)

#1

USB 3.1 Type A (Rear)

ASM1543

1 X USB Type A (Front)

ASM1543

USB 3.1 Type C
(Rear)

USB 3.1 Type C
(Front)

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel Xeon SP series (Socket P0-LGA3647)

processor and the Intel PCH C621 chipset, the X11SPA-TF/-T motherboard provides system

performance, power efciency, and feature sets to address the needs of next-generation

computer users.

With the support of the new Intel Microarchitecture 14nm Process Technology, the
X11SPA-TF/-T dramatically increases system performance for a multitude of server
applications.

The Intel PCH C621 chipset provides Enterprise SMBus support, including the following
features:

• DDR4 288-pin memory support

• Support for Management Engine (ME)

• Support of SMBus speeds of up to 400KHz for BMC connectivity

• Improved I/O capabilities to high-storage-capacity congurations

• SPI Enhancements

• Intel Node Manager 3.0 for advanced power monitoring, capping, and management for

BMC enhancement (see note below).

• BMC supports remote management, virtualization, and the security package for enterprise

platforms

Note: Node Manager support depends on the power supply used in your system.

Features Supported by Intel Xeon Scalable-SP Processors

Intel Xeon Scalable-SP processors support the following features:

• Intel AVX-512 instriction support to handle complex workloads

• 1.5x memory bandwidth increased to 6 channels

• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)

• Rich set of available IOs with increased PCI-E lanes (48 lanes)

• Integrated Intel Ethernet Connection X722 with iWARP RDMA

17

Super X11SPA-TF/-T User's Manual

New Features Supported by the 2nd Gen Intel Xeon Scalable-SP Processors

The 2nd Gen Intel Xeon Scalable-SP processors support the following features:

• Higher performance for a wider range of workloads with per-core performance increase

• Support of Optane

large capacity

TM

DC Persistnet Memory (DCPMM) with affordable, persistnet, and

• Up to 2933 MHz memory supported (Refer to Section 1.8 for more details.)

• Vector Neutral Network Instruction (VNNI) support for Accelerate Deep Learning & Articial

Intelligence (AI) workloads

• Speed Select Technology provides multiple CPU proles that can be set in the BIOS (This

feature is available on selected CPU SKUs).

• Seamless hardware security mitigations & performance/frequency exibility

Note: DCPMM memory and 2933 MHz memory are supported by 2nd Gen Intel Xeon
Scalable-SP processsors only.

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU,
and battery continuously. If a voltage becomes unstable, a warning will be given, or an error

message will be sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

18

Chapter 1: Introduction

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or

the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to

prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, be sure to provide adequate airow to

your system.

System Resource Alert

This feature is available when used with SuperDoctor 5 in the Windows® OS or in the Linux®
environment. SuperDoctor is used to notify the user of certain system events. For example,

you can congure SuperDoctor to provide you with warnings when system temperatures,
CPU temperatures, voltages, or fan speeds go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system, including its hardware, operating
system, and application software. This enables the system to automatically turn on and off
peripherals such as CD-ROMs, network cards, hard disk drives, and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/R2 and Windows 2016 operating systems.

19

Super X11SPA-TF/-T User's Manual

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates where
noisy power transmission is present.

The X11SPA-TF/-T motherboard accommodates a 24-pin ATX power supply. Although most

power supplies generally meet the specications required by the CPU, some are inadequate.

In addition, two 12V 8-pin power connections (JPWR1/ JPWR3) are also required to ensure
adequate power supply to the system.

Warning: To prevent damage to the power supply and the motherboard, please use
power supplies that contain 24-pin and 8-pin power connectors. Be sure to connect the
power supplies to the 24-pin power connector (JPWR2) and the 8-pin power connec­tor (JPWR1/ JPWR3/ JPWR4) when more than four of the PCI-E slots are populated.
Failure in doing so may void the manufacturer warranty on your power supply and
motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power

supply Specication 2.02 or above. It must also be SSI compliant. For more information,

please refer to the website at http://www.ssiforum.org/.

1.7 Serial Port

The X11SPA-TF/-T motherboard supports two serial communication connections. COM port
(COM1) and header (COM2) can be used for input/output. The UART provides legacy speeds
with a baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250
K, 500 K, or 1 Mb/s, which support high-speed serial communication devices.

1.8 Intel Optane DC Peristent Memory Overview

Intel 2nd Generation Xeon Scalabale SP processors support new DCPMM (OptaneTM DC
Persistnet Memory Modules) technology that offers data persistence with higher capacity
than existing memory modules and lower latency than NVMe SSDs. DCPMM memory

provides hyper-speed storage capacity for high performance computing platform with exible
conguration options.

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
system board, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the motherboard by its edges only; do not touch its components, peripheral chips,

memory modules, or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your computer chassis provides excellent conduc-

tivity between the power supply, the case, the mounting fasteners, and the motherboard.

• Use only the correct type of onboard CMOS battery. Do not install the onboard battery

upside down to avoid possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

Super X11SPA-TF/-T User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together rst to form

the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.

Notes:

• Use ESD protection.

• Unplug the AC power cord from all power supplies after shutting down the system.

• Check that the plastic protective cover is on the CPU socket and none of the socket pins

are bent. If they are, contact your retailer.

• When handling the processor, avoid touching or placing direct pressure on the LGA lands

(gold contacts). Improper installation or socket misalignment can cause serious damage

to the processor or CPU socket, which may require manufacturer repairs.

• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.

• Refer to the Supermicro website for updates on processor support.

• All graphics in this manual are for illustrations only. Your components may look different.

The Intel Xeon SP Series Processor

Non-Fabric Model

22

Chapter 2: Installation

Overview of the Processor Carrier Assembly

The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and
a processor carrier.

1. Non-F Processor

2. Processor Carrier

Overview of the CPU Socket

The CPU socket is protected by a plastic protective cover.

1. Plastic Protective Cover

2. CPU Socket

23

Super X11SPA-TF/-T User's Manual

Overview of the Processor Heatsink Module

The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the
Intel Xeon Non-Fabric (Non-F) processor.

1. Heatsink with Thermal Grease

2. Processor Carrier

3. Non-F Processor

Processor Heatsink Module

Bottom View

24

Chapter 2: Installation

Creating the Non-F Model Processor Carrier Assembly

To install a Non-F model processor into the processor carrier, follow the steps below:

1. Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold
triangle in the corner of the processor and the corresponding hollowed triangle on the
processor carrier. These triangles indicate pin 1. See the images below.

2. Using the triangles as a guide, carefully align and place Point A of the processor into

Point A of the carrier. Then gently ex the other side of the carrier for the processor to t

into Point B.

3. Examine all corners to ensure that the processor is rmly attached to the carrier.

CPU (Upside Down)
with CPU LGA Lands up

Align Point A of the CPU and
Point A of the Processor Carrier

Align CPU Pin 1

B

Align Point B of the CPU and
Point B of the Processor Carrier

A

Pin 1

B

A

Processor Carrier
(Upside Down)

Allow carrier to
latch onto CPU

B

A

Allow carrier to
latch onto CPU

Processor Carrier Assembly (Non-F Model)

Pin 1

25

Super X11SPA-TF/-T User's Manual

Assembling the Processor Heatsink Module

After creating the processor carrier assembly for the Non-F model processor, mount it onto
the heatsink to create the processor heatsink module (PHM):

1. Note the label on top of the heatsink, which marks the heatsink mounting holes as 1,
2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the
underside. Otherwise, apply the proper amount of thermal grease.

2. Turn the heatsink over with the thermal grease facing up. Hold the processor carrier
assembly so the processor's gold contacts are facing up, then align the triangle on the
assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The
plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips
will snap into their corresponding holes.

3. Examine all corners to ensure that the plastic clips on the processor carrier assembly

are rmly attached to the heatsink.

Triangle on the CPU

Triangle on the
Processor Carrier

Plastic clips 1 and 2 lock
outside the heatsink’s
mounting holes

Non-Fabric Processor Carrier Assembly

(Upside Down)

Heatsink

(Upside Down)

2

2

1

1

Remaining plastic clips snap

into the other corner holes

2

1

of the heatsink

26

Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with a plastic protective cover installed on the CPU socket. Remove
it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner
of the plastic protective cover to remove it.

CPU Socket with Plastic Protective Cover

Remove the plastic protective

cover from the CPU socket.

Do not touch or bend

the socket pins.

Socket Pins

27

Super X11SPA-TF/-T User's Manual

Installing the Processor Heatsink Module

After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:

1. Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left
image below.

2. Make sure all four holes of the heatsink are aligned with the socket before gently placing
the heatsink on top.

3. With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even
pressure. The order of the screws is shown on the label on top of the heatsink. To
avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when
tightening the screws.

4. Examine all corners to ensure that the PHM is rmly attached to the socket.

Oval C

Oval D

Small Guide Post

Large Guide Post

Printed Triangle

Mounting the Processor Heatsink Module
onto the CPU socket (on the motherboard)

#1

Use a torque
of 12 lbf-in

T30 Torx Screwdriver

#4

#2

#3

Tighten the screws in
the sequence of 1, 2, 3, 4

28

Chapter 2: Installation

Removing the Processor Heatsink Module

Before removing the processor heatsink module (PHM) from the motherboard, unplug the AC
power cord from all power supplies after shutting down the system. Follow the steps below
to remove the processor heatsink module:

1. Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of
#4, #3, #2, and #1.

2. Gently lift the PHM upwards to remove it from the socket.

#1

Remove the screws in

the sequence of 4, 3, 2, 1

#4

#2

#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws,

lift the Processor Heatsink
Module off the CPU socket.

29

Super X11SPA-TF/-T User's Manual

2.3 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Tools Needed

Phillips

Screwdriver

(1)

ASPEED
AST2500

LEDBMC

A C

CPU SLOT1 PCI-E 3.0 x16

CPU SLOT2 PCI-E 3.0 x8

X11SPA-TF

DESIGNED IN USA

REV:1.01

BIOS

LICENSE

MAC CODE

MAC CODE

IPMI CODE

M.2-C04
PCI-E 3.0 x4

BAR CODE

A

C

LE6

J9702

J9701

LE5

C

A

PCI-E 3.0 x4

M.2-C03

LE4

A

C

M.2-C02

PCI-E 3.0 x4

I-SATA1 I-SATA3
I-SATA0

1

Intel C621

I-SATA2 I-SATA4

JOH1-OH

JWD1

RAID Key Header

JTPM1

JL1

JD1

JPG1

JPME2

COM2

JSD2

JRK1

CPU SLOT3 PCI-E 3.0 x16

I-SATA5

I-SATA7
I-SATA6

JPAC1

JSPDIF_OUT

JSD1

CPU SLOT4 PCI-E 3.0 x8

CPU SLOT5 PCI-E 3.0 x16

I-SGPIO2

I-SGPIO1

FAN B FAN A

Phillips Screws

(10)

C

Universal ID

A

UID-SWUID-LED

AUDIO FP

JPWR4

CPU SLOT6 PCI-E 3.0 x8

CPU SLOT7 PCI-E 3.0 x16

DIMMC1
DIMMC2
DIMMB1
DIMMB2
DIMMA1
DIMMA2

PLX

PEX8747

USB3.1 Gen.1

DIMMD2
DIMMD1
DIMME2
DIMME1
DIMMF2
DIMMF1

LE3

A

C

M.2-C01
PCI-E 3.0 x4

(3.0)USB2/3

USB0/1

USB3.1 Gen.2

HD AUDIO

FAN D

(3.1)USB11

JPL2

FAN C

USB10 (3.1)
USB3.1 Gen.2

USB4/5(3.0)
USB3.1 Gen.1
LAN2

JP4

Standoffs (10)

Only if Needed

VGA

LEDPWR

C

COM1

A

JPWR2

USB6/7(3.0)
USB3.1 Gen.1
IPMI_LAN

JSTBY1

FAN2

JF1

FAN1

JPUSB1

(3.1)USB8/9

USB3.1 Gen.2

LAN1

JPWR3

JPL1

JVRM1

FAN6

FAN5

JP5

FAN4

12V_PUMP_PWR1

FAN3

JPI2C1

+

JIPMB1

BATTERY

IPMI

JPWR1

Location of Mounting Holes

Notes: 1. To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lbf-in on each mounting screw during motherboard installation.

2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

30