Supermicro X11SAE-M operation manual

X11SAE-M

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: November 13, 2015

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2015 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SAE-M motherboard.

About This Motherboard

The Supermicro X11SAE-M motherboard supports an Intel® Xeon E3-1200 v5, 6th Generation
Core i3/i5/i7, Celeron, or Pentium processor in an LGA 1151 (H4) socket. With support of
the Intel C236 chipset, DDR4 memory, SATA 3.0, a combination of USB 2.0 and USB 3.0
ports, Thunderbolt, this motherboard offers exceptional performance and storage capability
for workstation platforms. It also provides security-enhancing technologies like Intel vPro, Intel
Trusted Execution Technology (TXT), and a Trusted Platform Module (TPM). Please note that
this motherboard is intended to be installed and serviced by professional technicians only.
For processor/memory updates, please refer to our website at http://www.supermicro.com/
products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for correct system setup.

3

X11SAE-M User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................11

Quick Reference Table ......................................................................................................12

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................18

1.3 Special Features ................................................................................................................18

Recovery from AC Power Loss .........................................................................................18

1.4 System Health Monitoring ..................................................................................................19

Fan Status Monitor with Firmware Control .......................................................................19

Environmental Temperature Control .................................................................................19

System Resource Alert......................................................................................................19

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................20

1.7 Super I/O ............................................................................................................................20

1.8 Advanced Power Management ..........................................................................................20

Management Engine (ME) ................................................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

Precautions .......................................................................................................................21

Unpacking .........................................................................................................................21

2.2 Motherboard Installation .....................................................................................................22

Tools Needed ....................................................................................................................22

Location of Mounting Holes ..............................................................................................22

Installing the Motherboard.................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................24

Installing the LGA1151 Processor .....................................................................................24

Installing an Active CPU Heatsink with Fan .....................................................................27

Removing the Heatsink .....................................................................................................29

2.4 Memory Support and Installation .......................................................................................30

Memory Support ................................................................................................................30

5

X11SAE-M User's Manual

DIMM Module Population Conguration ...........................................................................30

DIMM Module Population Sequence ................................................................................30

DIMM Installation ..............................................................................................................31

DIMM Removal .................................................................................................................31

2.5 Rear I/O Ports ....................................................................................................................32

2.6 Front Control Panel ............................................................................................................36

2.7 Connectors .........................................................................................................................39

Power Connections ...........................................................................................................39

Headers .............................................................................................................................41

2.8 Jumper Settings .................................................................................................................49

How Jumpers Work ...........................................................................................................49

2.9 LED Indicators ....................................................................................................................53

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................55

Before Power On ..............................................................................................................55

No Power ..........................................................................................................................55

No Video ...........................................................................................................................56

System Boot Failure .......................................................................................................56

Memory Errors ..................................................................................................................56

Losing the System's Setup Conguration .........................................................................57

When the System Becomes Unstable ..............................................................................57

3.2 Technical Support Procedures ...........................................................................................59

3.3 Frequently Asked Questions ..............................................................................................60

3.4 Battery Removal and Installation .......................................................................................61

Battery Removal ................................................................................................................61

Proper Battery Disposal ....................................................................................................61

Battery Installation .............................................................................................................61

3.5 Returning Merchandise for Service ....................................................................................62

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................63

Starting the Setup Utility ...................................................................................................63

4.2 Main Setup .........................................................................................................................64

4-3 Advanced Setup Congurations .........................................................................................66

6

Preface

4.4 Event Logs .........................................................................................................................89

4-5 Security ...............................................................................................................................91

4-6 Boot ....................................................................................................................................94

4-7 Save & Exit .........................................................................................................................96

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................100

B.2 SuperDoctor® 5 .................................................................................................................101

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................102

Product Disposal .............................................................................................................104

Appendix D UEFI BIOS Recovery

7

X11SAE-M User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard and chassis, several important parts that are included with the
system are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SAE-M 1

SATA Cables 4

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

8

Figure 1-1. X11SAE-M Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

X11SAE-M User's Manual

AUDIO FP

JPAC1

JSTBY1

JPME2

JI2C1

JI2C2

PCH SLOT4 PCI-E 3.0 X4

COM1

JWD1

SIO

Figure 1-2. X11SAE-M Motherboard Layout

(not drawn to scale)

JPL2

SLOT5 PCI 33MHz

JTBT1

CPU SLOT7 PCI-E 3.0 X16

MAC CODE

HD AUDIO

MH12

MH11

MH10

MH9

JPL1

BIOS
LICENSE

LAN2

USB0/1

LAN1

USB6/7(3.0)

X11SAE-M

REV: 1.01
DESIGNED IN USA

CPU Socket LGA 1151

HDMI/DP

DVI-D

JVR1

USB12/13(3.1)

FAN5

JPW2

FAN4

JTPM1

USB2/3 USB4/5

I-SATA7

I-SATA3

I-SATA2

JBT1

PCH
C236

BIOS

DIMMA1

DIMMA2

DIMMB1

DIMMB2

I-SGPIO2

I-SGPIO1

I-SATA6

I-SATA5

JL1

B3

I-SATA4

JSD1

BAR CODE

FAN3

I-SATA0

I-SATA1

J23

M.2 PCI-E 3.0 X4

ALWAYS POPULATE BLUE SOCKET FIRST
UNB ECC/NON-ECC DDR4 DIMM REQUIRED

USB8/9(3.0)

USB10/11(3.0)

JPW1

S1
BIOS RESTORE

JLED1

JF1

LED3

LED1

FAN2

JD1

FAN1

CPU FAN

SP1

Note: Components not documented are for internal testing only.

10

Quick Reference

Chapter 1: Introduction

AUDIO FP

JPAC1
SLOT4

COM1

JPME1

JWD1

JSTBY1

J23

JBT1

JTPM1

B3

I-SGPIO2
I-SGPIO1

USB2/3

JL1

USB4/5

I-SATA4
I-SATA5
I-SATA6
I-SATA7

JI2C1

AUDIO FP

JPAC1

JSTBY1

JTPM1

USB2/3 USB4/5

I-SATA7

I-SATA3

I-SATA2

JI2C2

COM1

JPME2

JWD1

JL1

SLOT5

JI2C1

JI2C2

PCH SLOT4 PCI-E 3.0 X4

SIO

JBT1

I-SGPIO1

I-SATA6

I-SATA5

SLOT5 PCI 33MHz

PCH
C236

I-SGPIO2

I-SATA4

JSD1

I-SATA0

I-SATA1

JTBT1

JPL2

B3

BAR CODE

FAN3

JPL2

JTBT1

BIOS

SLOT7

CPU SLOT7 PCI-E 3.0 X16

MAC CODE

DIMMA1

DIMMA2

DIMMB1

DIMMB2

JPL1

LAN2

USB0/1

HD AUDIO

HD AUDIO

MH12

MH11

MH10

MH9

M.2 PCI-E 3.0 X4

ALWAYS POPULATE BLUE SOCKET FIRST
UNB ECC/NON-ECC DDR4 DIMM REQUIRED

USB8/9(3.0)

USB10/11(3.0)

J23

BIOS
LICENSE

LAN2

USB0/1

JPL1

X11SAE-M

REV: 1.01
DESIGNED IN USA

LAN1

USB6/7

LAN1

USB6/7(3.0)

CPU Socket LGA 1151

JPW1

HDMI/DP

HDMI/DP

DVI-D

DVI-D

JVR1

S1
BIOS RESTORE

JF1

USB12/13 (3.1)

USB12/13(3.1)

JPW2

LED3

LED1

FAN2

JLED1

FAN5

FAN5

JPW2

FAN4

FAN4

FAN1

CPU FAN

FAN1

DIMMA1

DIMMA2

DIMMB1

DIMMB2

LED3
SP1

SP1

JD1

JD1

I-SATA3

I-SATA2

I-SATA1

I-SATA0

JSD1

FAN3

USB8/9 (3.0)

USB10/11 (3.0)

JPW1

JF1

FAN2

JLED1

S1 BIOS Restore

LED1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-

nections.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

11

X11SAE-M User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JI2C1/JI2C2 SMB to PCIE & PCI Slots Enable/Disable Pins 2-3 (Disabled)

JPAC1 Audio Enable Pins 1-2 (Enabled)

JPL1/JPL2 LAN1/LAN2 Enable/Disable Pins 1-2 (Enabled)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Pins 1-2 (Reset)

LED Description Status

LED1 Power LED Green: Power On

LED3 Standby Power LED On: Power On

Connector Description

AUDIO FP Front Panel Audio Header

B3 Onboard Battery

COM1 COM Header

FAN1 ~ FAN5 System/CPU Fan Headers (FAN1: CPU Fan)

HD Audio High-Dention Audio Connector

HDMI/DP High-Denition Multimedia Interface/DispalyPort

I-SATA0 ~ I-SATA7 Intel® PCH SATA 3.0 Ports

I-SGPIO1/I-SGPIO2 Serial Link General Purpose I/O Headers

J23 M.2 PCI-E 3.0 X4 Slot

JD1 Speaker/Buzzer (Pins 1-4: Speaker, Pins 3-4: Buzzer)

JF1 Control Panel Header

JL1 Chassis Intrusion Header

JLED1 3-Pin Power LED

JPW1 24-pin ATX Power Connector

JPW2 8-pin 12V Processor Power Connector

JSD1 SATA DOM Power Connector

JSTBY1 Standby Power Header

JTBT1 General Purpose I/O Header for a Thunderbolt add-on card

JTPM1 Trusted Platform Module/Port 80 Connector

LAN1/LAN2 Gb LAN (RJ45) Ports

MH9 ~ MH12 M.2 Mounting Holes

S1 BIOS Restore

SLOT4 PCH PCI-E 3.0 X4 Slot

SLOT5 PCI 33MHz Slot

SLOT7 CPU PCI-E 3.0 X16 Slot

SP1 Internal Speaker/Buzzer

Note: Table is continued on the next page.

12

Chapter 1: Introduction

Connector Description

USB0/1, 6/7, 12/13

USB2/3, 4/5, 8/9, 10/11 Front Accessible USB Headers (USB2/3, USB4/5: USB 2.0, USB8/9 and USB10/11: USB 3.0)

Back panel Universal Serial Bus (USB) Ports (USB 0/1: USB 2.0, USB6/7: USB 3.0, USB12/13:

USB 3.1)

13

X11SAE-M User's Manual

Motherboard Features

Motherboard Features

CPU

• Intel® E3-1200 v5 series, 6th Gen. Core i3/i5/i7, Celeron, and Pentium processors

Memory

• Integrated memory controller supports up to 64 GB of DDR4 ECC/Non-ECC UDIMM memory up to 2133MHz

DIMM Size

• Up to 16GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel® PCH C236

Expansion Slots

• One (1) PCI Express 3.0 X4 (PCH SLOT4)

• One (1) PCI Express 3.0 X16 (CPU SLOT7)

• One (1) PCI 33MHz (SLOT5)

• One (1) M.2 PCI Express 3.0 X4 (M.2 SLOT)

Network

• Intel I219LM Gigabit Network Controller

• Intel I210AT Gigabit Network Controller

Graphics

• Intel IGD

I/O Devices

• Serial (COM) Port • One (1) COM header

• SATA 3.0 • Eight (8) SATA 3.0 ports supported by Intel PCH (I-SATA 0-7)

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

Peripheral Devices

• One (1) USB 2.0 port on the rear I/O panel (USB0/1)

• Two (2) internal USB 2.0 header with two (2) USB connections on the motherboard for front access (USB2/3, USB4/5)

• One (1) USB 3.0 port on the rear I/O panel (USB6/7)

• One (1) USB 3.1 port on the rear I/O panel (USB12/13)

• Two (2) internal USB 3.0 header with two (2) USB connections on the motherboard for front access (USB8/9, USB 10/11)

BIOS

• 128 Mb SPI AMI BIOS

• ACPI3.0, SMBIOS 2.7, Plug-and-Play (PnP), BIOS Rescue Hot-key, PCI F/W 3.0, RTC wakeup,

Power Management

• Power button override mechanism

• Power-on mode for AC power recovery

• ACPI Management

• Wake-On-Ring

• Wake-On-LAN

• Keyboard wakeup from S5

• Management Engine (ME)

®

SM Flash UEFI BIOS

System Health Monitoring

• Onboard voltage monitoring for +3.3V, 3.3V standby, +5V, +12V, VBAT, CPU, Memory, PCH Temp., PCH Core, System

Temp.

• CPU Thermal Design Power (TDP) support of up to 145W (See Note 1 on next page.)

Fan Control

• Fan status monitoring via SIO

• Single cooling zone

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 2.0 support

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog, NMI

• Chassis intrusion header and detection

Note: The table above is continued on the next page.

15

X11SAE-M User's Manual

LED Indicators

• CPU/Overheating

• Fan Failure

• Power/Suspend state indicator.

• HDD activity. LAN activity.

Dimensions

• 9.6" (L) x 9.6" (W) (243.84 mm x 243.84 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Motherboard Features

16

Figure 1-3.

System Block Diagram

Chapter 1: Introduction

2 USB3.1 PORTS
TYPE A

PCI SLOT #1

USB3.1_x2

5V PCI

33MHz

PCIe x16 SLOT #7

Display Port

HDMI

DVI-D

ASMedia Host

10Gb/s

ASM1142

PCIe x4 SLOT #4

IDT 89HMPEB383
PCIE to PCI Bridge

M.2 MKEY SSD

Realtek ALC888S-VD2

PCIe3.0_x16

128Gb/s

Digital port D

Digital port C

Digital port B

PCIe3.0_x1

8Gb/s

PCIe3.0_x4

32Gb/s

PCIe2.0_x1

2.5Gb/s

PCIe3.0_x4

32Gb/s

AZALIA

INTEL LGA1151

(Socket-H4)

x4 DMI 3
8GT/s

Intel

PCH-H C236

SPI

FLASH

SPI 128Mb

IMVP8

SVID

DDR4 (CHA)

2133/1866MHz

DDR4 (CHB)

2133/1866MHz

PCIe1.1_x1

2.5Gb/s

PCIe1.1_x1

2.5Gb/s

SATA-III

6Gb/s
USB2.0
480Mb/s
USB3.0

5Gb/s

LPC

DIMMA1 (Black)
DIMMA2 (Blue)

DIMMB1 (Black)

DIMMB2 (Blue)

GLAN1
I219LM

GLAN2
I210-AT

8 SATA-III PORTS

6 USB 2.0 PORTS

6 USB 3.0 PORTS

TPM2.0 Header

NCT6776D
LPC I/O

1Gb/s

1Gb/s

RJ45

RJ45

* 4+2 Front/Rear

* 4+2 Front/Rear

HEALTH
INFO

COM1

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

17

X11SAE-M User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel E3-1200 v5 series processors (Socket
LGA 1151) and the Intel C236 PCH, the X11SAE-M motherboard offers maximum I/O

expendability, energy efciency, and data reliability in a 14-nm process architecture, and

is optimized for embedded storage solutions, networking applications, or cloud-computing
platforms.

The Intel E3-1200 v5 and PCH C236 platform supports the following features:

• ACPI Power Management Logic Support, Rev. 4.0a

• Intel® Turbo Boost Technology 2.0 Power Monitoring/Power Control, Turbo Time Parameter

(TAU), and Platform Power Control

• Congurable TDP (cTDP) and Lower-Power Mode

• Adaptive Thermal Management/Monitoring

• PCI-E 3.0, SATA 3.0 w/transfer rates of up to 6 Gb/s, xHCI USB w/SuperSpeed 3.0

• System Management Bus (SMBus) Specication, Version 2.0

• Intel Trusted Execution Technology (Intel TXT)

• Intel Rapid Storage Technology

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

1.3 Special Features

This section describes the health monitoring features of the X11SAE-M motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

18

Chapter 1: Introduction

1.4 System Health Monitoring

This section describes the health monitoring features of the X11SAE-M motherboard. The
motherboard has an onboard Super I/O (SIO) chip that supports system health monitoring.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the SIO chip can check the RPM status of the cooling
fans. The CPU and chassis fans are controlled via SlO chip.

Environmental Temperature Control

System Health sensors in the SIO chip monitor the temperatures and voltage settings of
onboard processors and the system in real time via the SIO chip. Whenever the temperature

of the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will

be turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows 8/R2, and Windows 2012/R2 operating systems.

19

X11SAE-M User's Manual

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

1.7 Super I/O

The Super I/O NUVOTON NCT6776D chip provides one high-speed, 16550 compatible
serial communication port (UART), which supports serial infrared communication. The UART
includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete modem
control capability and a processor interrupt system. The UART provide legacy speed with a
baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500
K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

1.8 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
support for VPRO with ME11.

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

X11SAE-M User's Manual

I-SATA3

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Philips
Screwdriver
(1)

Tools Needed

AUDIO FP

JI2C1

JI2C2

JPAC1

COM1

JPME2

JWD1

JSTBY1

SIO

JTPM1

JBT1

USB2/3 USB4/5

I-SGPIO1

I-SATA6

JL1

I-SATA7

I-SATA2

PCH SLOT4 PCI-E 3.0 X4

SLOT5 PCI 33MHz

PCH
C236

I-SGPIO2

I-SATA4

I-SATA5

JSD1

I-SATA0

I-SATA1

B3

BAR CODE

FAN3

JPL2

JTBT1

BIOS

Philips Screws
(8)

HD AUDIO

MH12

CPU SLOT7 PCI-E 3.0 X16

MH11

BIOS
LICENSE

MAC CODE

MH10

MH9

J23

M.2 PCI-E 3.0 X4

ALWAYS POPULATE BLUE SOCKET FIRST
UNB ECC/NON-ECC DDR4 DIMM REQUIRED

DIMMA1

DIMMA2

DIMMB1

DIMMB2

USB8/9(3.0)

USB10/11(3.0)

USB0/1

JPL1

LAN2

LAN1

USB6/7(3.0)

X11SAE-M

REV: 1.01
DESIGNED IN USA

CPU Socket LGA 1151

JPW1

HDMI/DP

Standoffs (8)
Only if Needed

DVI-D

USB12/13(3.1)

FAN5

JPW2

JVR1

S1
BIOS RESTORE

JF1

LED3

JLED1

LED1

FAN2

FAN4

FAN1

CPU FAN

SP1

JD1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

22

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might
look different from those shown in this manual.

23

X11SAE-M User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the fan.

Important:

• Always connect the power cord last, and always remove it before adding, removing or

changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.

• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional

heatsink only.

• Make sure to install the motherboard into the chassis before you install the CPU heatsink.

• When receiving a motherboard without a processor pre-installed, make sure that the plastic

CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

Installing the LGA1151 Processor

1. Press the load lever to release the load plate, which covers the CPU socket, from its
locking position.

Load Plate

Load Lever

24

Chapter 2: Installation

2. Gently lift the load lever to open the load plate. Remove the plastic cap.

3. Use your thumb and your index nger to hold the CPU at the north center edge and the
South center edge of the CPU.

North Center Edge

South Center Edge

4. Align the CPU key that is the semi-circle cutouts against the socket keys. Once it is
aligned, carefully lower the CPU straight down into the socket. (Do not drop the CPU on
the socket. Do not move the CPU horizontally or vertically.

25

X11SAE-M User's Manual

5. Do not rub the CPU against the surface or against any pins of the socket to avoid
damaging the CPU or the socket.

6. With the CPU inside the socket, inspect the four corners of the CPU to make sure that
the CPU is properly installed.

7. Use your thumb to gently push the load lever down to the lever lock.

CPU properly

installed

Load lever locked into

place

Note: You can only install the CPU inside the socket in one direction. Make sure that

it is properly inserted into the CPU socket before closing the load plate. If it doesn't
close properly, do not force it as it may damage your CPU. Instead, open the load
plate again and double-check that the CPU is aligned properly.

26

Installing an Active CPU
Heatsink with Fan

1. Locate the CPU fan power connector on
the motherboard. (Refer to the layout on
the right for the CPU Fan location.)

2. Position the heatsink so that the heatsink
fan wires are closest to the CPU fan
power connector and are not interfered
with other components.

Chapter 2: Installation

Thermal Grease

3. Inspect the CPU fan wires to make sure
that the wires are routed through the
bottom of the heatsink.

4. Remove the thin layer of the protective

lm from the heatsink.

Important: CPU overheating may oc-

cur if the protective lm is not removed

from the heatsink.

5. Apply the proper amount of thermal
grease on the CPU.

Note: If your heatsink came with a ther­mal pad, please ignore this step.

6. If necessary, rearrange the wires to
make sure that the wires are not pinched
between the heatsink and the CPU. Also
make sure to keep clearance between the

fan wires and the ns of the heatsink.

Heatsink

Fins

27

X11SAE-M User's Manual

7. Align the four heatsink fasteners with
the mounting holes on the motherboard.
Gently push the pairs of diagonal
fasteners (#1 & #2, and #3 & #4) into
the mounting holes until you hear a click.
Also, make sure to orient each fastener
so that the narrow end of the groove is
pointing outward.

8. Repeat step 7 to insert all four heatsink
fasteners into the mounting holes.

9. Once all four fasteners are securely
inserted into the mounting holes, and
the heatsink is properly installed on the
motherboard, connect the heatsink fan
wires to the CPU fan connector.

28

Removing the Heatsink

Note: We do not recommend that

the CPU or the heatsink be removed.
However, if you do need to remove the
heatsink, please follow the instructions
below to remove the heatsink and to
prevent damage done to the CPU or
other components.

Active Heatsink Removal

1. Unplug the power cord from the power
supply.

Chapter 2: Installation

Unplug the

PWR cord

2. Disconnect the heatsink fan wires from
the CPU fan header.

3. Use your nger tips to gently press on the
fastener cap and turn it counterclockwise
to make a 1/4 (900) turn, and pull the
fastener upward to loosen it.

4. Repeat step 3 to loosen all fasteners from
the mounting holes.

5. With all fasteners loosened, remove the
heatsink from the CPU.

Pull Up

29

X11SAE-M User's Manual

2.4 Memory Support and Installation

Note: Check the Supermicro website for recommended memory modules.

Important: Exercise extreme care when installing or removing DIMM modules to pre-

vent any possible damage.

Memory Support

The X11SAE-M supports up to 64 GB of DDR4 ECC/Non-ECC UDIMM memory up to
2133MHz in four memory slots. Populating these DIMM slots with a pair of memory modules
of the same type and size will result in interleaved memory, which will improve memory
performance.

DIMM Module Population Conguration

For optimal memory performance, follow the table below when populating memory.

Recommended Population (Balanced)

DIMMA1 DIMMB1 DIMMA2 DIMMB2 Total System Memory

2GB 2GB 4GB

2GB 2GB 2GB 2GB 8GB

4GB 4GB 8GB

4GB 4GB 4GB 4GB 16GB

8GB 8GB 16GB

8GB 8GB 8GB 8GB 32GB

16GB 16GB 32GB

16GB 16GB 16GB 16GB 64GB

DIMM Module Population Sequence

When installing memory modules, the DIMM slots must be populated in the following order:

DIMMB2, DIMMA2, then DIMMB1, DIMMA1. The blue slots must be populated rst.

Towards the CPU

DIMMA1

DIMMA2 (Blue Slot)

DIMMB1

DIMMB2 (Blue Slot)

Towards the edge of the motherboard

Note: Be sure to use memory modules of the same type and speed on the motherboard.
Mixing of memory modules of different types and speeds is not allowed.

30