Features
3
Type R
DS(on)
VNN3NV04
VNS3NV04
VND3NV04
120 mΩ 3.5 A 40 V
VND3NV04-1
■ Linear current limitation
■ Thermal shutdown
■ Short circuit protection
■ Integrated clamp
■ Low current drawn from input pin
■ Diagnostic feedback through input pin
■ ESD protection
■ Direct access to the gate of the Power
MOSFET (analog driving)
■ Compatible with standard Power MOSFET in
compliance with the 2002/95/EC European
Directive
I
lim
V
clamp
VNN3NV04, VNS3NV04
VND3NV04, VND3NV04-1
OMNIFET II
fully autoprotected Power MOSFET
2
3
2
1
SOT-223
3
1
TO252 (DPAK)
Description
The VNN3NV04, VNS3NV04, VND3NV04
VND3NV04-1, are monolithic devices designed in
STMicroelectronics™ VIPower™ M0-3
Technology, intended for replacement of standard
Power MOSFETs from DC up to 50 kHz
applications. Built in thermal shutdown, linear
current limitation and overvoltage clamp protect
the chip in harsh environments.
SO-8
TO251 (IPAK)
2
1
Fault feedback can be detected by monitoring the
voltage at the input pin.
Table 1. Device summary
Package
T ube Tube (lead-free) Tape and reel Tape and reel (lead-free)
SOT-223 VNN3NV04 - VNN3NV0413TR -
SO-8 VNS3NV04 - VNS3NV0413TR -
TO-252 VND3NV04 VND3NV04-E VND3NV0413TR VND3NV04TR-E
TO-251 VND3NV04-1 VND3NV04-1-E - -
April 2011 Doc ID 7382 Rev 3 1/26
Order codes
www.st.com
1
Contents VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2 TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.4 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.7 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.8 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.9 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 6. TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 7. SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 8. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 9. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 7382 Rev 3 3/26
List of figures VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Thermal impedance for DPAK/IPAK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Thermal impedance for SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. Static drain-source on resistance vs input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14. Static drain-source on resistance vs input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 15. Source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. Turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 20. Static drain-source on resistance vs Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 21. Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 22. Turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 23. Turn-off drain source voltage slope (part 2/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 24. Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 25. Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 26. Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 27. Switching time resistive load (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 28. Switching time resistive load (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 29. Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 30. Normalized current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 31. Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 32. TO-251 (IPAK) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 33. TO-252 (DPAK) package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 34. SOT-223 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 35. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 36. SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 37. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 38. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 39. DPAK footprint and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 40. DPAK tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 41. IPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
DRAIN
2
Overvoltage
Clamp
INPUT
1
Gate
Control
Over
Temperature
Linear
Current
Limiter
3
SOURCE
Figure 2. Configuration diagram (top view)
SO-8 Package
SOURCE
SOURCE
SOURCE
INPUT
1
4
1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1.
(1)
DRAIN
8
DRAIN
DRAIN
5
DRAIN
FC01000
Doc ID 7382 Rev 3 5/26
Electrical specifications VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
2 Electrical specifications
Figure 3. Current and voltage conventions
I
D
V
DS
R
I
IN
IN
INPUT
V
IN
2.1 Absolute maximum ratings
DRAIN
SOURCE
Table 2. Absolute maximum ratings
Symbol Parameter
V
R
IN MIN
V
V
T
V
I
ESD1
ESD2
P
T
Drain-source voltage (VIN=0 V) Internally clamped V
DS
Input voltage Internally clamped V
IN
Input current +/-20 mA
IN
Minimum input series impedance 220 Ω
Drain current Internally limited A
I
D
Reverse DC output current -5.5 A
I
R
Electrostatic discharge (R=1.5 KΩ,
C=100 pF)
Electrostatic discharge on output pin
only (R=330 Ω, C=150 pF)
Total dissipation at Tc=25 °C 7 8.3 35 W
tot
Operating junction temperature Internally limited °C
T
j
Case operating temperature Internally limited °C
c
Storage temperature -55 to 150 °C
stg
Value
Unit
SOT-223 SO-8 DPAK/IPAK
4000 V
16500 V
6/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Electrical specifications
2.2 Thermal data
Table 3. Thermal data
Value
Symbol Parameter
SOT-223 SO-8 DPAK IPAK
R
thj-case
R
thj-lead
R
thj-amb
1. When mounted on a standard single-sided FR4 board with 50 mm2 of Cu (at least 35 mm thick) connected to all DRAIN
pins.
Thermal resistance junction-case max 18 3.5 3.5 °C/W
Thermal resistance junction-lead max 15 °C/W
Thermal resistance junction-ambient max 70
(1)
65
(1)
54
(1)
100 °C/W
2.3 Electrical characteristics
-40 °C < Tj < 150 °C, unless otherwise specified.
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min Typ Max Unit
Off
V
CLAMP
V
CLTH
V
INTH
I
ISS
V
INCL
I
DSS
On
Drain-source clamp
voltage
Drain-source clamp
threshold voltage
V
=0 V; ID=1.5 A 40 45 55 V
IN
=0 V; ID=2 mA 36 V
V
IN
Input threshold voltage VDS=VIN; ID=1 mA 0.5 2.5 V
Supply current from input
pin
Input-source clamp
voltage
Zero input voltage drain
current (VIN=0 V)
=0 V; VIN=5 V 100 150 µA
V
DS
=1 mA
I
IN
=-1 mA
I
IN
=13 V; VIN=0 V; Tj=25 °C
V
DS
=25 V; VIN=0 V
V
DS
6
-1.0
6.8 8
-0.3
30
75
Unit
V
µA
R
DS(on)
Dynamic (T
(1)
g
fs
C
OSS
Switching
=5 V; ID=1.5 A; Tj=25 °C
Static drain-source on
resistance
=25 °C, unless otherwise specified)
j
Forward
transconductance
V
IN
=5 V; ID=1.5 A
V
IN
=13 V; ID=1.5 A 5.0 S
V
DD
120
240
Output capacitance VDS=13V; f=1MHz; VIN=0 V 150 pF
(T
=25 °C, unless otherwise spe ci fied)
j
Doc ID 7382 Rev 3 7/26
mΩ
Electrical specifications VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Table 4. Electrical characteristics (continued)
Symbol Parameter Test conditions Min Typ Max Unit
t
d(on)
t
t
d(off)
t
t
d(on)
t
t
d(off)
t
(dI/dt)
Q
Source drain diode (T
V
SD
t
Q
I
RRM
Protections (-40 °C < T
I
lim
t
dlim
Turn-on delay time
V
=15 V; ID=1.5 A
Rise time 250 750 ns
r
Turn-off delay time 450 1350 ns
Fall time 250 750 ns
f
DD
V
=5 V; R
gen
gen=RIN MIN
(see figure Figure 4.)
=220 Ω
Turn-on delay time
=15 V; ID=1.5 A
V
Rise time 2.5 7.5 µs
r
Turn-off delay time 3.3 10.0 µs
Fall time 2.0 6.0 µs
f
Turn-on current slope
on
Total input charge
i
=25 °C, unless otherwise specified)
j
(1)
Forward on voltage ISD=1.5 A; VIN=0 V 0.8 V
Reverse recovery time
rr
Reverse recovery charge 37 µC
rr
Reverse recovery current 0.7 A
< 150 °C, unless otherwise specified)
j
DD
V
gen
=5 V; R
=2.2 KΩ
gen
(see figure Figure 4.)
VDD=15 V; ID=1.5 A
V
gen
=5 V; R
gen=RIN MIN
=220 Ω
VDD=12 V; ID=1.5 A; VIN=5 V
=2.13 mA (see figure Figure 7.)
I
gen
ISD=1.5 A; dI/dt=12 A/µs
=30 V; L=200 µH
V
DD
(see test circuit, figure Figure 5.)
90 300 ns
0.45 1.35 µs
4.7 A/µs
8.5 nC
107 ns
Drain current limit VIN=5 V; VDS=13V 3.55 7A
Step response current
limit
VIN=5 V; VDS=13 V 10 µs
jsh
T
I
E
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
shutdown
Over temperature reset 135 °C
jrs
Fault sink current VIN=5 V; VDS=13 V; Tj=T
gf
Single pulse avalanche
as
energy
starting T
V
IN
(see figures Figure 6. & Figure 8.)
=25µ°C; VDD=24 V
j
=5 V R
gen=RIN MIN
Over temperature
T
8/26 Doc ID 7382 Rev 3
jsh
=220 Ω; L=24 mH
150 175 200 °C
10 15 20 mA
100 mJ
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
3 Protection features
During normal operation, the input pin is electrically connected to the gate of the internal
Power MOSFET through a low impedance path.
The device then behaves like a standard Power MOSFET and can be used as a switch from
DC up to 50 kHz. The only difference from the user’s standpoint is that a small DC current
I
(typ. 100µA) flows into the input pin in order to supply the internal circuitry.
ISS
The device integrates:
● Overvoltage clamp protection: internally set at 45 V, along with the rugged avalanche
characteristics of the Power MOSFET stage give this device unrivalled ruggedness and
energy handling capability. This feature is mainly important when driving inductive
loads.
● Linear current limiter circuit: limits the drain current I
voltages. When the current limiter is active, the device operates in the linear region, so
power dissipation may exceed the capability of the heatsink. Both case and junction
temperatures increase, and if this phase lasts long enough, junction temperature may
reach the over temperature threshold T
● Over temperature and short circuit protection: these are based on sensing the chip
jsh
.
temperature and are not dependent on the input voltage. The location of the sensing
element on the chip in the power stage area ensures fast, accurate detection of the
junction temperature. Over temperature cutout occurs in the range 150 to 190 °C, a
typical value being 170 °C. The device is automatically restarted when the chip
temperature falls of about 15 °C below shutdown temperature.
● Status feedback: in the case of an over temperature fault condition (T
device tries to sink a diagnostic current I
through the input pin in order to indicate fault
gf
condition. If driven from a low impedance source, this current may be used in order to
warn the control circuit of a device shutdown. If the drive impedance is high enough so
that the input pin driver is not able to supply the current I
This will not however affect the device operation: no requirement is put on the current
capability of the input pin driver except to be able to supply the normal operation drive
current I
ISS
.
Additional features of this device are ESD protection according to the Human Body model
and the ability to be driven from a TTL logic circuit.
to I
D
whatever the input pin
lim
> T
j
, the input pin will fall to 0 V.
gf
jsh
), the
Doc ID 7382 Rev 3 9/26
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Figure 4. Switching time test circuit for resistive load
V
D
R
I
D
V
gen
90%
gen
t
r
t
V
gen
d(on)
10%
Figure 5. Test circuit for diode recovery times
A
FAST
DIODE
B
R
gen
I
V
gen
220
I
OMNIFET
Ω
D
S
t
d(off)
A
B
OMNIFET
t
f
D
S
L=100uH
8.5
Ω
t
t
V
DD
10/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Figure 6. Unclamped inductive load test
Figure 7. Input charge test circuit
circuits
Figure 8. Unclamped inductive waveforms
V
IN
GEN
ND8003
Doc ID 7382 Rev 3 11/26
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
3.1 Electrical characteristics curves
Figure 9. Thermal impedance for DPAK/IPAK Figure 10. Thermal impedance for SOT-223
Figure 11. Derating curve Figure 12. Transconductance
Gfs (S)
11
10
Vds=13V
9
8
7
6
5
4
3
2
1
0
00.511.522.5 33.544.555.5
Tj=-40ºC
Tj=25ºC
Tj=150ºC
Id (A)
Figure 13. Static drain-source on resistance
vs input voltage (part 1/2)
Rds(on) (mohms)
300
275
250
Tj=150ºC
225
200
175
150
Tj=25ºC
125
100
Tj=-40ºC
75
50
25
0
3 3.5 4 4.5 5 5.5 6 6.5
Vin(V)
12/26 Doc ID 7382 Rev 3
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Figure 14. Static drain-so urce on resistance
vs input voltage (part 2/2)
Rds(on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
3 3.5 4 4.5 5 5.5 6 6.5
Vin(V)
Id=1.5A
Tj=150ºC
Tj=25ºC
Tj=-40ºC
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Figure 15. Source-drain diode forward
Figure 16. Static drain sourc e on resistance
characteristics
Vsd (mV)
1100
1050
1000
Vin=0V
950
900
850
800
750
700
650
600
0123456789101112
Id (A)
Rds(on) (ohms)
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
Vin=2.5V
0 0.05 0.1 0.15 0.2 0.25 0.3
Tj=-40ºC
Id(A)
Tj=25ºC
Tj=150ºC
Figure 17. Turn-on current slope (part 1/2) Figure 18. Turn-on current slope (part 2/2)
di/dt(A/us)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
500
750
1000
1250
250
1500
1750
Vin=5V
Vdd=15V
Id=1.5A
2000
2250
2500
Rg(ohm)
di/dt(A/usec)
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0
250
500
750
1000
1250
Rg(ohm)
1500
Vin=3.5V
Vdd=15V
1750
Id=1.5A
2000
2250
2500
Figure 19. Transfer characteristics Figure 20. Static drain-source on resistance
vs Id
Idon(A)
2.25
2
Vds=13.5V
1.75
1.5
1.25
1
0
1.5
Tj=150ºC
1.7522.25
0.75
0.5
0.25
2.5
2.7533.25
Tj=-40ºC
3.5
3.7544.25
Tj=25ºC
4.5
4.75
5
Vin(V)
Doc ID 7382 Rev 3 13/26
Rds(on) (mohms)
250
225
200
Vin=5V
Tj=150ºC
175
150
125
100
Tj=25ºC
75
50
Tj= - 40ºC
25
0
0 0.5 1 1.5 2 2.5 3 3.5 4
Id (A)
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Figure 21. Input voltage vs input charge Figure 22. Turn-off drain source voltage slope
(part 1/2)
Vin (V)
6
5
4
3
2
1
0
Vds=12V
Id=0.5A
0123456
Qg (nC)
Figure 23. Turn-off drain source voltage slope
(part 2/2)
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
500
750
1000
1250
250
Rg(ohm)
1500
1750
Vin=3.5V
Vdd=15V
Id=1.5A
2000
2250
2500
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
500
250
1000
750
1250
1500
1750
Vin=5V
Vdd=15V
Id=1.5A
2000
Rg(ohm)
Figure 24. Capacitanc e variations
C(pF)
350
300
250
200
150
100
50
0 5 10 15 20 25 30 35
Vds(V)
f=1MHz
Vin=0V
2250
2500
Figure 25. Output characteristics Figure 26. Normalized on resistance vs
temperature
v
Id (A)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
012345678910
Vin=5V
Vin=4V
Vin=3V
Vds (V)
14/26 Doc ID 7382 Rev 3
Rds(on) (mOhm)
4
3.5
3
Vin=5V
Id=1.5A
2.5
2
1.5
1
0.5
-50 -25 0 25 50 75 100 125 150 175
Tc )ºC)
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Figure 27. Switching time resistive load (part
1/2)
t(usec)
4
3.5
Vdd=15V
3
Id=1.5A
Vin=5V
2.5
2
1.5
1
0.5
0
0
500
250
1000
750
1250
1500
1750
td(off)
2000
tr
tf
td(on)
2250
2500
Rg(ohm)
Figure 29. Normalized input threshold voltage
vs temperature
Vinth (V)
2
1.8
1.6
1.4
1.2
0.8
0.6
0.4
0.2
Vds=Vin
Id=1mA
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
Figure 31. Step response current limit
Figure 28. Switching time resistive load (part
2/2)
t(nsec)
900
800
700
600
500
400
300
200
100
0
3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25
td(off)
tf
td(on)
tr
Vdd=15V
Id=1.5A
Rg=220ohm
Vin(V)
Figure 30. Normalized current limit vs junction
temperature
Ilim (A)
10
9
8
7
6
5
4
3
2
1
0
Vin=5V
Vds=13V
-50 -25 0 25 50 75 100 125 150 175
Tc ( º C)
Tdlim(usec)
13
12.5
12
11.5
11
10.5
10
9.5
9
8.5
8
7.5
5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vin=5V
Rg=220ohm
Vdd(V)
Doc ID 7382 Rev 3 15/26
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4 Package and packing information
4.1 ECOPACK
®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com
ECOPACK® is an ST trademark.
4.2 TO-251 (IPAK) mechanical data
Table 5. TO-251 (IPAK) mechanical data
Symbol
Min. Typ. Max.
A2.2 2.4
A1 0.9 1.1
A3 0.7 1.3
B 0.64 0.9
B2 5.2 5.4
B3 0.85
B5 0.3
.
millimeters
B6 0.95
C 0.45 0.6
C2 0.48 0.6
D6 6.2
E6.4 6.6
G4.4 4.6
H 15.9 16.3
L9 9.4
L1 0.8 1.2
L2 0.8 1
16/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Figure 32. TO-251 (IPAK) package dimensions
4.3 TO-252 (DPAK) mechanical data
Table 6. TO-252 (DPAK) mechanical data
Symbol
Min. Typ. Max.
A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B 0.64 0.90
B2 5.20 5.40
C 0.45 0.60
C2 0.48 0.60
D 6.00 6.20
D1 5.1
E 6.40 6.60
E1 4.7
e2.28
G 4.40 4.60
H 9.35 10.10
millimeters
Doc ID 7382 Rev 3 17/26
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Table 6. TO-252 (DPAK) mechanical data (continued)
millimeters
Symbol
Min. Typ. Max.
L2 0.8
L4 0.60 1.00
R0.2
V2 0° 8°
Package Weight Gr. 0.29
Figure 33. TO-252 (DPAK) package dimensions
4.4 SOT-223 mechanical data
Table 7. SOT-223 mechanical data
Symbol
Min. Typ. Max.
A 1.8
B0.60.70.85
18/26 Doc ID 7382 Rev 3
B1 2.9 3 3.15
c 0.24 0.26 0.35
D6.36.56.7
e2.3
P032P
millimeters
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Table 7. SOT-223 mechanical data (continued)
millimeters
Symbol
Min. Typ. Max.
e1 4.6
E3.33.53.7
H6.7 7 7.3
V 10 (max)
A1 0.02 0.1
Figure 34. SOT-223 package dimensions
4.5 SO-8 mechanical data
Table 8. SO-8 mechanical data
Symbol
A 1.75
a1 0.1 0.25
a2 1.65
a3 0.65 0.85
b 0.35 0.48
A 1.75
A1 0.10 0.25
0046067
millimeters
Min Typ Max
Doc ID 7382 Rev 3 19/26
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Table 8. SO-8 mechanical data (continued)
millimeters
Symbol
Min Typ Max
A2 1.25
b 0.28 0.48
c 0.17 0.23
(1)
4.80 4.90 5.00
D
E 5.80 6.00 6.20
(2)
E1
3.80 3.90 4.00
e 1.27
h 0.25 0.50
L 0.40 1.27
L1 1.04
k 0° 8°
ccc 0.10
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm in total (both side).
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
Figure 35. SO-8 package dimensions
20/26 Doc ID 7382 Rev 3
0016023 D
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
4.6 SOT-223 packing information
Figure 36. SOT-223 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Start
Top
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
No componentsNo components Components
500mm min
Doc ID 7382 Rev 3 21/26
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4.7 SO-8 packing information
Figure 37. SO-8 tube shipment (no suffix)
B
C
Base Q.ty 100
Bulk Q.ty 2000
A
Tube length (± 0.5) 532
A 3.2
B 6
C (± 0.1) 0.6
Figure 38. SO-8 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
All dimensions are in mm.
22/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
4.8 DPAK packing information
Figure 39. DPAK footprint and tube shipment (no suffix)
A
B
6.7
6.7 3.01.8 1.6
2.3
2.3
Figure 40. DPAK tape and reel shipment (suffix “TR”)
C
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A 6
B 21.3
C (± 0.1) 0.6
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Start
Top
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
No componentsNo components Components
500mm min
Doc ID 7382 Rev 3 23/26
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4.9 IPAK packing information
Figure 41. IPAK tube shipment (no suffix)
A
C
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
B
A 6
B 21.3
C (± 0.1) 0.6
All dimensions are in mm.
24/26 Doc ID 7382 Rev 3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Revision history
5 Revision history
Table 9. Document revision history
Date Revision Changes
01-Feb-2003 1 Initial Release
27-Apr-2009 2
05-Apr-2011 3
Added Table 1: Device summary on page 1
Updated Table 4: Package and packing information on page 16
Table 2: Absolute maximum ratings:
–R
Inserted Section 4.1: ECOPACK
: changed unit from W to Ω
IN MIN
®
Doc ID 7382 Rev 3 25/26
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICUL AR PURPOS E (AND THEIR E QUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJ URY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
26/26 Doc ID 7382 Rev 3
Loading...