256 x 72 x 4-Bit OLED Passive Matrix Controller/Driver
PRODUCT PREVIEW
Description
(Bumped Die)
ORDER CODE:
Main Features
■ Supports Monochrome OLED Passive
Matrices in different formats:
● 256×72 Black & White
● 256×72×2-bits/4 levels of gray
● 256×72×4-bits/16 levels of gray
● 256×36×6-bits/64 levels of gray
● 128×72×6-bits/64 levels of gray
■ On-chip DC/DC Step-up Converter
■ Display Power Supply up to 25V
■ Device Power Supply: 3.0 to 3.6V
■ Low-power Consumption Suitable for
Battery-operated Systems
■ Column Source Current capability: 800µA,
max.
■ Row Sink Current capability: 110mA, max.
STV8105
The STV8105 is a low-power, controller/driver
“combo” IC for OLED displays. The STV8105
supports 256 columns by 72 rows with 16 levels of
gray for monochrome and 2 x 128 columns by 72
rows with 16 lev els of gray f or “two” color displa ys. It
can control a display of 128 columns by 72 rows or
256 columns by 36 rows with 64 levels of gray in
monochrome mode.
The STV8105 provides all necessary functions in a
single chip, including on-chip supply control and
bias current generators, resulting in a minimum of
external components and in very low-power
consumption.
The STV8105 communicates with the system via
fully configurable interfaces (parallel or serial) to
FT
ease interfacing with the host microcontroller. The
STV8105 has a set of command and control
registers that can be addressed by these interfaces.
A
SERIALPARALLEL
INTERFACEINTERFACE
■ On-chip Oscillator
■ Programmable Gamma Correction
■ Programmable Display Multiplexing
■ Two Brightness Control registers of 128
steps each
■ 32 Step Dimmer Control
■ One Time Programmable (OTP) fuse ROM for
key configuration parameters
■ Dual Scan, Master/Slave Capability
■ Selectable 8-bit Parallel as well as Serial
Peripheral Interfaces
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This is target data for new product. Details are subject to change withou t notic e.
4/9605-Sep-2005Draft of Rev. 1 STMicroelectronics Confidential
STV8105General Overview
1General Overview
The STV8105 is a monochrom e , l ow-power co nt ro ll e r/ dri ver combo from STM i cr o ele ct ro ni c s’ family
of controllers for OLED displays. It has been developed to bring a flexible solution to applications
and systems based on OLED passi ve matr ic es.
STV8105 can be used with many different host micro-controllers. It supports a serial bus and a
The
parallel interface covering most of the possible application architectures. This provides easy access
to a set of command and control registers to properly program the
STV8105 includes a dual port Display RAM of 256 x 72 x 4-bits to support the full display
The
capabilities of 256 column and 72 row drivers with several display functions.
The on-chip DC/DC step-up converter generates the necessary supply voltage (18V, typically) for
all row and column drivers from the battery supply.
STV8105.
Processed in BCD technology, the
can source up to 800µA for columns and sink up to 110mA for rows with a display supply of up to
25V. Thanks to the high level of integration, the number of required external components is
drastically reduced.
STV8105 f eatures a low-power digital core and output drivers that
FT
A
R
D
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General OverviewSTV8105
Figure 1: STV8105 Input/Output Diagram
RST
CLKIN
ROSC
COSC
SELCLK
MSEL[1]
MSEL[0]
P/S
DIN[7] (SIN)
DIN[6] (SCLI)
DIN[5:0]
CS1, CS2
SD/C
WR
HSYNCIN
VSYNCIN
VDD
STV8105
A
VPRG
VPP1, VPP2
VROW1, VROW2
VCOL1, VCOL2
COLUMNS
C1…C256
ROWS
R1…R72
DOUT[7] (SOUT)
DOUT[6] (SCLOUT)
DOUT[5:0]
CSOUT1, CSOUT2
SD/COUT
FT
WROUT
HSYNCOUT
VSYNCOUT
RCTRLA
RCTRLB
ROWDATA
SCLKOUT
R
D
TEST[3]
TEST[2:1]
GND
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GNDL
GNDSENSE
VDC
VHSENSE
VDRIVE
ISENSE
VSENSE
VCOMP
VF
TON/F
CMODE
VREF1, VREF2
STV8105General Overview
1.1Bumped Die Pad Description
Figure 2: Die Mechanical Data (Bump-side View)
TOP SIDE
C1
-TBDµm
C256
C255
TBDµm
C2
+TBDµm
R72
LEFT SIDE
R38R37
R36
-TBDµm
-TBDµm
-TBDµm
-TBDµm
R34
+TBDµm
STV8105
(X=0.0, Y=0.0)
-TBDµm
R2
R4
Figure 3: Alignment Mark Positions (Bump-side View)
Interface
BOTTOM SIDE
-TBDµm
R3
R1
FT
+TBDµm
-TBDµm
+TBDµm
-TBD
R33
+TBDµm
A
-TBDµm
TOP SIDE
+TBDµm
R71
RIGHT SIDE
R35
-TBDµm
+TBDµm
LEFT SIDE
-TBDµm
R
Columns
(X=0.0, Y=0.0)
Rows
Rows
-TBDµm
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D
Interface
BOTTOM SIDE
Rows
+TBDµm
+TBDµm
Rows
RIGHT SIDE
-TBDµm
General OverviewSTV8105
Figure 4: Alignment Mark Mechanical Data
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
METAL X
TBDµm
COF Alignment Mark
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
TBDµm
METAL X
TBDµm
TBDµm
TBDµm
TBDµm
Die Positioning Mark
FT
R
D
A
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STV8105General Overview
Figure 5: Pad Position (Bump-Side View)
Left
ROW OUTPUTS
INPUTS
- - - -
R34
R32
R30
R4
R2
VROW2
VROW2
DUMMY
DUMMY
ROWDATA
RCTRLB
RCTRLA
SCLKOUT
VSYNCOUT
HSYNCOUT
CSOUT2
CSOUT1
OUT
WR
SD/COUT
DOUT[0]
DOUT[1]
DOUT[2]
DOUT[3]
DOUT[4]
DOUT[5]
DOUT[6]
DOUT[7]
VSENSE
VCOMP
ISENSE
VDC
VDC
VDRIVE
R36
= = =
BOTTOM SIDE
D
R38
= = =
LEFT HALF SIDE
R72
R70
C256
C255
C254
C253
COLUMN OUTPUT SIDE
TOP SIDE
STV8105
FT
A
R
C167
C168
C167
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General OverviewSTV8105
INPUTS
VDRIVE
VDRIVE
GNDSENSE
GNDSENSE
GNDL
GNDL
GNDL
GNDL
GND
GND
GND
GND
VPRG
VPRG
VPRG
VPRG
VPP2
VPP2
VHSENSE
VHSENSE
VPP1
VPP1
VCOL2
VCOL2
VCOL1
VCOL1
VF
BOTTOM SIDE
STV8105
0,0
+Y
FT
+X
A
C167
C166
C165
COLUMN OUTPUT SIDE
TOP SIDE
VREF2
VREF1
R
VDD
VDD
VDD
VDD
DUMMY
GND
P/S
TON/F
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D
C92
C91
C90
STV8105General Overview
INPUTS
(95 I/O Pads)
ROW OUTPUTS
- - - -
TON/F
CMODE
SELCLK
MSEL[1]
MSEL[0]
VDD
TEST[3]
TEST[2]
TEST[1]
RST
DIN[7] (SIN)
DIN[6] (SCLI)
DIN[5]
DIN[4]
DIN[3]
DIN[2]
DIN[1]
DIN[0]
SD/C
WR
CS1
CS2
GND
VSYNCIN
HSYNCIN
CLKIN
ROSC
COSC
DUMMY
DUMMY
VROW1
VROW1
R1
R3
R31
R33R33
C90
C89
C88
STV8105
BOTTOM SIDE
COLUMN OUTPUT SIDE
FT
TOP SIDE
A
R
D
C3
= = =
R35
R37
R71
R69
C2
C1
= = =
RIGHT HALF SIDE
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Pad RCTRLB is pulled “High” if a voltage fault is detected on the output of the
DC/DC converter.
STV8105General Overview
Table 1: STV8105 Pad Description (Sheet 2 of 2)
Ball NameInput/OutputDescription
ROSCOExternal RC oscillator, resistor connection or Crystal connection
ROW DATAORow Driver Data
RST
SCLKOUTOSystem Clock Output
SD/C
OUTOSD/C Output
SD/C
SELCLKI
TEST[2:1]I
TEST[3] I Reserved (internal pull-up)
TON/F
VCOL1SupplyOdd column supply
VCOL2SupplyEven column supply
VCOMPI/OCompensation pad for DC/DC converter, constant frequency PWM mode
VDCSupplySupply for gate drive output buffer
ISystem Reset Input
Display Data or Command:
I
I
SD/C=”H”: Display Data
SD/C
=”L”: Command
“H”: An internal oscillator (if MSEL[0]=”1”)
“L”: External clock used
Test Mode Select:
“H”: Test Mode OFF (internal pull-up)
“L”: Reserved modes
DC/DC Converter Mode Select
“H”: PFM constant t
“L”: PWM constant switching frequency mode
ON
mode
FT
VDDSupplyAnalog/Digital low-voltage controller supply
VDRIVEOGate drive for external switchin g MOS transistor
VFI/O
VHSENSEIVH sense input
VPP1SupplyOdd column driver power supply
VPP2SupplyEven column dr iver power supply
VPRGSupplyNon-volatile OTP memory program power supply
VREF1I/OReferen ce Voltag e 1
VREF2I/OReferen ce Voltag e 2
VROW1SupplyOdd row driver supply
VROW2SupplyEven row driver supply
VSENSEIFeedback signal
VSYNCINIVertical SYNC Input
VSYNCOUTOVertical SYNC Output
WR
OUTOWrite Pulse Output
WR
IDisplay Data and Command Write Pulse
Pad for storing the re sult of VF dete ction, i.e. the average of the voltage on column
outputs C1 and C256 measured during constant current drive
R
D
A
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General OverviewSTV8105
1.3Lead Pad Reference Chart
The reference for the following tables is the center of the die (X = 0.0, Y = 0.0)
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STV8105General Overview
Table 5: Left Side (from bottom to top)
Pad PlacementsPad Dimensions
Lead Pad Name
XYXY
R36TBDTBD
R38TBDTBD
----------------------------------R72TBDTBD
1.4Mechanical Dimensions
Table 6: Mechanical Dimensions
DescriptionDimension
Die Size (mm)TBD
Pad Pitch (µm)TBD
Pad Size (µm)TBD
Pad Heigh t (µm )TBD
Wafer Thickness (µm)TBDµm
Bump Size (µm)TBDµm x TBDµm
Bump Characteristicsgold, electrolytic
TBDTBD
TBDTBD
TBDTBD
FT
Bump Hardness30-80Hv
A
R
D
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General OverviewSTV8105
1.5Functional Description
The architecture of the STV8105 provides all of the functions required to drive OLED displays. The
block diagram below gives an overview of the different on-chip components, embedded functions
and their links.
Figure 6: STV8105 Block Diagram
SERIALPARALLEL
INTERFACEINTERFACE
STATUS
REGISTERS
ROW
DRIVERS
INSTRUCTION DECODER
DISPLAY RAM
256×72 4-bit
CONTROL
REGISTERS
CLOCK
GENERATOR
FT
DC/DC
CONVERTER
SCANNING CONTROL
COLUMN DRIVERS
A
CURRENT
REFERENCES
R
The following rules are used in this datasheet to describe bit, bit-fields and registers:
- ROWDRVSEL is the name of a register,
- RDIR.ROWDRVSEL is the RDIR bit of register ROWDRVSEL,
- RMODE.ROWDRVSEL is the RMODE bit-field of register ROWDRVSEL.
Refer to Chapter 13: Command and Control Registers on page 65 for details of the various
registers.
The various functions of the STV8105 are described in the following sections, starting with the bus
interfaces.
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D
STV8105Bus Interfaces
2Bus Interfaces
The parallel interface and serial interface are selected using a P/S pad.
The parallel interface is active when P/S
The serial input pads SIN and SCLI are shared with DIN7 and DIN6, respectively.
Buffered versions of the serial signals, for cascading purposes, are output on pads SOUT and
SCLOUT and shared with DOUT7 and DOUT6, respectively.
The parallel interface pads DIN[7:0], CS1
CSOUT1
CS1
CS2
, CSOUT2, and WROUT.
and CSOUT1 are chip select signals for the Primary-Master and Secondary-Master devices.
and CSOUT2 are chip select signals for the Primary-Slave and Secondary-Slave devices.
Figure 7: Buffering of Bus Interface Signals
Internal Circuits
DIN[7] (SIN)DOUT[7] (SOUT)
DIN[6] (SCLI)DOUT[6] (SCLOUT)
DIN[5:0] DOUT[5:0]
=”H”; the serial interface when P/S =”L”.
, CS2 and WR are buff ered and sent out on DOUT[7:0],
FT
CS1
CS2
WR
SD/C
D
2.1Interface Sequen ce
After Reset or Power ON, an interface is in the state of waiting for a Command Address and Display
RAM Data.
After receiving the Command Address, the interface is in the state of waiting for Command Data.
When Command Data is received while in the receive Command Data state, the interface returns to
the receive Command Address state.
When Display RAM Data is received while in the receive Command Data state, the interface also
returns to the receive Command Address state.
A
R
CSOUT1
CSOUT2
WROUT
SD/COUT
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Bus InterfacesSTV8105
When the Serial Interface is selected, the output buffer for the interface signals is cleared when CS1
and CS2
2.2Parallel Interface
The parallel interface is active when pad P/S is "High".
are both "High".
When writing parallel data, the WR
Data is interpreted as a command if SD/C
"High".
When transmitting a command, the command address is sent first followed by command data.
A command is decided by a 2-byte access: a command code followed by a data byte.
When there is a Display RAM access with SD/C
of a command, the STV8105 enters the state where it is waiting for a Command Address.
CS1, CS2
WR
pad is asserted while CS1 and CS2 are both "Low".
is "Low"; it is interpreted as Display RAM data if SD/C is
set “High” but without respecting the “2-byte nature”
Figure 8: Parallel Interface
FT
SD/C
DIN[7:0]
A
P/S = HighCommand Data
Command Address
(1 byte)
(1 byte)
Display RAM Data
(1 byte)
Command
(2 bytes)
R
Don’t care
D
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STV8105Bus Interfaces
Figure 9: 8-bit Parallel Interface Timing Diagram
SD/C
CS1
CS2
WR
WR
DIN[7:0]
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
Taw
Valid
Tcclw
Tcyc
Tds
Tah
Tcchw
Tdh
FT
Valid
SD/COUT
CSOUT1
CSOUT2
WROUT
DOUT[7:0]
VIH
VIL
Tdsdc
VIH
VIL
VIH
VIH
VIL
VIL
VIH
VIL
A
Valid
R
Tdcs
Tdwr
D
Tdd
Valid
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Bus InterfacesSTV8105
Table 7: 8-bit Parallel Interface Timing
SymbolParameterTest ConditionsMin.Typ.Max.Units
TahAddress Hold TimeWR10ns
TawAddress Setup TimeWR
TcycSystem Cycle TimeCS1
TcclwWrite Pulse WidthWR
TdsData Setup TimeDIN[7:0]60ns
TdhData Hold TimeDIN7:0]10ns
TdsdcSD/C Output DelaySD/C
TdcsCS Output DelayCSOUT1
TdwrWR Output DelayWR
TddDATA OutputDOUT[7:0]30ns
2.3Serial Interface
The serial interface is active when P/S is "Low".
, CS2200ns
OUT30ns
, CSOUT230ns
OUT30ns
0ns
60ns
FT
Serial data is written in using DIN[7] (SIN) and DIN[6] (SCLI) while CS1
Data is interpreted as a command if SD/C
"High".
is "Low"; it is interpreted as Display RAM data if SD/C is
and CS2 are both "Low".
DIN[5:0] are not used; they should be tied either “High” or “Low”.
A
R
D
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STV8105Bus Interfaces
Figure 10: Serial Interface
CS1, CS2
SD/C
D7D0D7D0D7D0
DIN[7](SIN)
DIN[6](SCLI)
DIN[5:0]
Fixed High or Low
P/S = Low
Command Address
(1 byte)
R
D
Command
(2 bytes)
A
Command Data
(1 byte)
FT
Display RAM Data
(1 byte)
Don’t care
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Bus InterfacesSTV8105
Figure 11: 4-wire Serial Interface Timing Diagram
TcssTcsh
CS1
CS2
SD/C
SCLI
SIN
VIH
VIL
VIH
VIL
VIH
VIL
Tslw
Tsas
TrTf
Tsds
Tsah
Valid
Tscyc
Tshw
Tsdh
Valid
FT
A
Table 8: 4-wire Serial Interface Timing
SymbolParameterTest ConditionsMin.Typ.Max.Units
TscysSerial Clock Cycle200ns
TshwPulse Width (High)90ns
TslwPulse Width (Low)90ns
TsasAddress Setup Time20ns
TsahAddress Hold Time20ns
TsdsData Setup Time20ns
TsdhData Hold Time20ns
TcssCS-SCL Time20ns
TcshCS-SCL Time20ns
D
R
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STV8105Bus Interfaces
2.4Master/Slave Connection
Figure 12 below shows an example connection between two ICs for Master/Slave mode.
Figure 12: Master/Slave Mode
OLED Panel
From MPU
SCLKOUT
DIN[7:0]
CS1
CS2
WR
SD/C
STV8105 MasterSTV8105 Slave
DOUT[7:0]
CSOUT2
WROUT
SD/COUT
SCLKOUT
VSYNCOUT, HSYNCOUT
Figure 13: External IC Interface Timing Diagram
FT
VIH
VIL
A
VSYNCIN,
HSYNCIN
VSYNCOUT
HSYNCOUT
RCTRLA
RCTRLB
KDATA
VIH
VIL
R
Tdvso
Tdhso
Tdrca
Tdrcb
Tdrowdata
D
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Bus InterfacesSTV8105
Table 9: External IC Interface Timing
SymbolParameterTest ConditionsMin.Typ.Max.Units
TdvsoVSYNCOUT Delay20ns
TdhsoHSYNCOUT Delay20ns
TdrcaRCTRLA Delay20ns
TdrcbRCTRLB Delay20ns
TdrowdataROWDATA Delay20ns
R
D
FT
A
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STV8105Display RAM
3Display RAM
The STV8105 contains a Dual Port, 256 × 72 x 4-bit Display RAM. As shown in Figure 14 below,
Port A is for write only; Port B, read only.
It is possible to access any location thanks to X and Y, programmable pointers with ranges
corresponding to the selected display mode.
The X address is specified with the command RAMXSTART, the Y address with RAMYSTART.
The X and Y addresses can be automatically incremented with bits YINC and XINC of the
GSADDINC command. The GSMODE bit-field of this command is also used to select the display
mode and gray scale. See Section 13.2 for details.
Depending on the selected display mode, one, two or four pictures can be stored in the Display
RAM, and one or two colors can be controlled:
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Display RAMSTV8105
3.116 Level Gray Scale Mode Memory Map
In this mode, the picture has 256 x 72 pixels, and the gray scale of each pixel is defined by the
corresponding 4-bit value stored in Display RAM. This mode is selected using field GSMODE of the
GSADDINC command. Only one picture can be stored in the Display RAM. The range of the
address pointers is 00h to 7Fh for X and 00h to 47h for Y. One byte loaded in Display RAM contains
data for two pixels.See Section 13.2 for details. The “two” color mode can be used; see Section
Y 00h, X 00hY 00h, X 01hY 00h, X 7DhY 00h, X 7EhY 00h, X 7Fh
Pxl 0, Pxl 1
Y 01h, X 00h
Col1Col2Col254 Col255 Col256
Pxl 0
Pxl 2, Pxl 3
Pxl 1Pxl 255
Display Screen
Pxl 250, Pxl 251
Pxl 254Pxl 253
Pxl 252, Pxl 253
FT
Display RAM
Y 46h, X 00h
Y 47h, X 00h
A
Pxl 254, Pxl 255
Y 47h, X 7Fh
Col 1*Col 2*Col 3*
Row 1
3.24 Level Gray Scale Mode Memory Map
In this mode, the picture has 256 x 72 pixels. The gray scale of each pixel is defined by the
corresponding 2-bit value stored in Display RAM. This mode is selected using field GSMODE of the
GSADDINC command. Two pictures can be stored in the Display RAM. The range of the address
pointers is 00h to 3Fh for X and 00h to 8Fh for Y. One byte loaded in Display RAM contains data for
4 pixels. See Figure 16 for details. The “two” color mode can be used, see Section 9.1: Colo r
Selection Modes for details.
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b3---b2, Byte 00h
Column to Pixel Mapping
b5---b4, Byte 00h
Col 4*
Pixel 3
b7---b6, Byte 00h
Col 255*
Pixel 254
b5---b4, Byte 7Fh
* Default column mapping
Col 256*
Pixel 255
b7---b6, Byte 7Fh
Display RAMSTV8105
3.364 Level Gray Scale Mode 1 Memory Map
In this mode, the picture has 128 x 72 pixels. The gray scale of each pixel is defined by the
corresponding 6-bit value stored in Display RAM. This mode is selected using field GSMODE of the
GSADDINC command. Only one picture can be stored in the Display RAM. The range of the
address pointers is 00h to 7Fh for X and 00h to 47h for Y. One byte loaded in the Display RAM
contains data for one pixel.
In this mode, column outputs C
“two” color mode, see Section 9.1: Color Selection Modes for details. For more information on using
this mode, refer to the description of command GSADDINC in Section 13.2.
and Cn, must be connected together. It is not possible to use the
n+1
Col1Col2Col126 Col127 Col128
Pxl 0
Pxl 1Pxl 127
Display Screen
Pxl 126Pxl 125
FT
Y 00h, X 00hY 00h, X 01hY 00h, X 7DhY 00h, X 7EhY 00h, X 7Fh
Pxl 0
Y 00h, X 00h
Pxl 1
Pxl 125
Pxl 126
Pxl 127
A
Display RAM
Y 46h, X 00h
Y 47h, X 00h
Col 1*Col 2*Col 3*
Row 1
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Pixel 0Pixel 1Pixel 2
b5---b0, Byte 00h
Column to Pixel Mapping
D
b5---b0, Byte 01h
128 columns, 72 rows
R
b5---b0, Byte 02h
Y 47h, X 7Fh
Col 127*
Pixel 126
b5---b0, Byte 7Eh
* Default column mapping
Col 128*
Pixel 127
b5---b0, Byte 7Fh
STV8105Display RAM
3.464 Level Gray Scale Mode 2 Memory Map
In this mode, the picture has 256 x 36pixels, the gray scale of each pixel is defined by the
corresponding 6-bit value stored in Display RAM. This mode is selected using field GSMODE of the
GSADDINC command. Only one picture can be stored in the Display RAM. The range of the
address pointers is 00h to FFh for X, 00h to 23h for Y. One byte loaded in the Display RAM contains
data for one pixel.
The “two” color mode cannot be used, see Section 9.1: Color Selection Modes for detail. For more
information on using this mode, refer to the description of command GSADDINC in Section 13.2.