ST STGIPS10K60A User Manual

SLLIMM™ (small low-loss intelligent molded module)

IPM, 3-phase inverter - 10 A, 600 V short-circuit rugged IGBT

Features

■ IPM 10 A, 600 V, 3-phase IGBT inverter bridge

including control ICs for gate driving and free­wheeling diodes

■ Short-circuit rugged IGBT

■ V

■ 3.3 V, 5 V, 15 V CMOS/TTL inputs

comparators with hysteresis and pull down
resistor

■ Under-voltage lockout

■ Internal bootstrap diode

■ Interlocking function

■ DBC substrate leading to low thermal

resistance

■ Isolation rating of 2500 Vrms/min.

■ 5 kΩ NTC thermistor for temperature control

negative temperature coefficient

CE(sat)

STGIPS10K60A

SDIP-25L

Applications

■ 3-phase inverters for motor drives

■ Home appliances, such as washing machines,

refrigerators, air conditioners

Description

This intelligent power module provides a
compact, high performance AC motor drive in a
simple, rugged design. Combining ST proprietary
control ICs with the most advanced short-circuit­rugged IGBT system technology, this device is
ideal for 3-phase inverters in applications such as
home appliances and air conditioners. SLLIMM™
is a trademark of STMicroelectronics.

Table 1. Device summary

Order code Marking Package Packaging

STGIPS10K60A GIPS10K60A SDIP-25L Tube

November 2011 Doc ID 15587 Rev 8 1/18

www.st.com

18

Contents STGIPS10K60A

Contents

1 Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3

2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1.1 NTC thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2/18 Doc ID 15587 Rev 8

STGIPS10K60A Internal block diagram and pin configuration

LIN

HIN HVG

OUT

LVG

GND

LIN

HIN HVG

OUT

LVG

GND

LIN

HIN
V

CC

V

boot

HVG

OUT

LVG

GND

L IN

W

OU T

U

V

boot W

V

HIN

W

L IN

U

GN D

N

W

L IN

V

V

boot U

HIN

U

V

boot V

OU T

W

HIN

V

P

U

OU T

V

W

V

CC

T

1

N

V

N

U

T

2

NTC

P

P

Pinin 16

P

in 1

Pin 17

Pinin 25

V

boot

V

CC

V

CC

V

boot

AM09364v1

1 Internal block diagram and pin configuration

Figure 1. Internal block diagram

in

boot

boot

boot

boot

boot

boot

AM09364v1

Doc ID 15587 Rev 8 3/18

Internal block diagram and pin configuration STGIPS10K60A

Table 2. Pin description

Pin Symbol Description

1OUT

2V

3LIN

4HIN

5V

6OUT

7V

U

boot U

U

U

CC

V

boot V

High side reference output for U phase

Bootstrap voltage for U phase

Low side logic input for U phase

High side logic input for U phase

Low voltage power supply

High side reference output for V phase

Bootstrap voltage for V phase

8 GND Ground

9LIN

10 HIN

11 OUT

12 V

13 LIN

14 HIN

15 T

16 T

17 N

V

V

W

boot W

W

W

1

2

W

Low side logic input for V phase

High side logic input for V phase

High side reference output for W phase

Bootstrap voltage for W phase

Low side logic input for W phase

High side logic input for W phase

NTC thermistor terminal 1

NTC thermistor terminal 2

Negative DC input for W phase

18 W W phase output

19 P Positive DC input

20 N

V

Negative DC input for V phase

21 V V phase output

22 P Positive DC input

23 N

U

Negative DC input for U phase

24 U U phase output

25 P Positive DC input

Figure 2. Pin layout (bottom view)

4/18 Doc ID 15587 Rev 8

STGIPS10K60A Electrical ratings

2 Electrical ratings

2.1 Absolute maximum ratings

Table 3. Inverter part

Symbol Parameter Value Unit

V

V

PN(surge)

V

CES

± I

± I

CP

P

TOT

t

scw

1. Applied between HIN

Supply voltage applied between P - NU, NV, N

PN

W

Supply voltage (surge) applied between P - NU,

, N

N

V

W

Each IGBT collector emitter voltage (V

Each IGBT continuous collector current at

(2)

C

(3)

= 25°C

T

C

Each IGBT pulsed collector current 20 A

(1)

= 0)

IN

450 V

500 V

600 V

10 A

Each IGBT total dissipation at TC = 25°C 33 W

Short-circuit withstand time, VCE = 0.5 V

= 125 °C, VCC = V

T

j

, LINi and GND for i = U, V, W.

i

= 15 V, V

boot

IN

(1)

= 5 V

(BR)CES

5µs

2. Calculated according to the iterative formula:

ICTC()

-------------------------------------------------------------------------------------------------------=

R

thj c–

T

V

CE sat()max()Tjmax()ICTC

–

jmax()TC

(),()×

3. Pulse width limited by max junction temperature.

Table 4. Control part

Symbol Parameter Value Unit

V

OUT

V

V

boot

V

dV

out

Output voltage applied between OUT
OUTW - GND (VCC = 15 V)

Low voltage power supply -0.3 to +18 V

CC

Bootstrap voltage applied between V
for i = U, V, W

Logic input voltage applied between HINi, LIN

IN

and GND for i = U, V, W

/dt Allowed output slew rate 50 V/ns

U,

boot i

OUT

- OUTi

V,

-3 to V

-18 V

boot

-1 to 618 V

i

-0.3 to V

+0.3 V

CC

Doc ID 15587 Rev 8 5/18

Electrical ratings STGIPS10K60A

Table 5. Total system

Symbol Parameter Value Unit

V

ISO

T

J

T

C

Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60sec.)

(1)

Operating junction temperature -40 to 150 °C

Module case operating temperature -40 to 125 °C

1. The maximum junction temperature rating of the power chips integrated within the SDIP module is 150 °C
(@T

≤ 100 °C). To ensure safe operation of the SDIP module, the average junction temperature should

C

be limited to Tj(avg) ≤ 125 °C (@TC ≤ 100 °C).

2.2 Thermal data

Table 6. Thermal data

Symbol Parameter Value Unit

R

thJC

Thermal resistance junction-case single IGBT max. 3.8 °C/W

Thermal resistance junction-case single diode max. 5.5 °C/W

2500 V

6/18 Doc ID 15587 Rev 8