Sony Ericsson W960 Working Instruction

Working Instruction, Electrical

Applicable for W960

CONTENTS

1 Read this first!........................................................................................3

2 Lead-free soldering................................................................................4

3 Hot air gun temperature requirements.................................................6

4 Soldering tip temperature requirements..............................................6

5 Bottom heat requirements.....................................................................6

6 BGA equipment reflow profiles.............................................................6

6.1 General..................................................................................................6

6.2 Temperature Measurements................................................................. 6

7 PoP Components Repair instruction....................................................8

8 Shield fence instruction.......................................................................12

9 Replacement of components ..............................................................13

9.1 B2000 Quartz/Crystal 32768Hz..........................................................14

9.2 B2500 Quartz/Crystal 32768MZ.........................................................14

9.3 B2510 Crystal 13 MHz .......................................................................15

9.4 B2680 12.000 MHz Crystal osc..........................................................15

9.5 B6000 Crystal 44 MHz .......................................................................16

9.6 D1100 Marlin...................................................................................... 16

9.7 D2005 Asic Wanda 10X10.................................................................17

9.8 D2500 Suzi PoP................................................................................. 17

9.9 D2501 2 - ind and gate.......................................................................18

9.10 D2663 USB OTG Transceiver............................................................ 18

9.11 D2665 Asic Elin (Knatte 3)................................................................. 19

9.12 D5001 Microphone.............................................................................19

9.13 D6000 Level Shifter............................................................................20

9.14 N2000 Asic Vincenne2.......................................................................20

9.15 N2662 ESD Protection for USB..........................................................21

9.16 N3001 Bluetooth module....................................................................21

9.17 N4021, N4040 Step-down DC/DC......................................................22

9.18 N4030 2,8V 150mA Line regulator.....................................................22

9.19 N4050 LDO 120mA Line regulator.....................................................23

9.20 N4070 LED Driver.............................................................................. 23

9.21 N4071 Single Gate.............................................................................24

9.22 N5010 Asic Tjatte3.............................................................................24

9.23 N5500 Stereo Headphone Ampl........................................................25

9.24 N5505 Audio Amplifier........................................................................25

9.25 N5508 FM-radio w RDS..................................................................... 26

9.26 N6000 W-Lan Module 802.11b..........................................................26

9.27 S2125, S2821, S2822 Side Push Switch........................................... 27

9.28 S2820 Jog Dial...................................................................................27

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Working Instruction, Electrical

9.29 V2125, V4001, V5000, V5001 Diode, SSM Series ............................28

9.30 V2181, V2191 Dual Red/Green SMD.................................................28

9.31 V2663 ESD Protector 5,6V.................................................................29

9.32 V4004 Diode, Shottky.........................................................................29

9.33 X1001 External RF Connector...........................................................30

9.34 X1010, X1011, X1012, X6001 Internal antenna connector................ 30

9.35 X1021 Connector...............................................................................31

9.36 X2741 Connector 22pin BtB...............................................................31

9.37 X2743 Camera Socket....................................................................... 32

9.38 X2820 Display Connector...................................................................32

9.39 X2821 Keyboard Connector...............................................................33

9.40 X2825 Spring Connector, 5 Pins........................................................33

9.41 X3001, X6000 Antenna Switch........................................................... 34

9.42 X4000 Battery Connector...................................................................34

10 Revision history ...................................................................................35

1206-4806 Rev1 2(35)

Working Instruction, Electrical

1 Read this first!

CAUTION



Before you start replacing any components, make sure you have read and fully understood

the contents of section 2 and 3!

• Also make sure you have acces listed on the first page of section 4!

• Use Electrostatic Discharge (ESD) equipment to avoid damaging the PBA.

• Use gloves or finger cots to avoid contaminating the PBA with skin oil.

s to the mechanical Working Instruction and the equipment

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Working Instruction, Electrical

2 Lead-free soldering

KEEP ALL CONTACT SURFACES CLEAN OF DIRT AND HAND

GREASE

THIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER

AND LEAD

-FREE COMPONENTS!

During electrical repair, it is critical to make sure that no lead is in

troduced.

This symbol indicates that the product is lead- free.

All lead-free PBA will be marked with this symbol.

A lead-free work area must be set up completely separated from work areas that are used to make lead repairs.

The lead-free work area must also be clearly labeled with the lead free

symbol as shown in the adjacent picture. The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free

status clearly and easily recognized.

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Working Instruction, Electrical

Lead-free soldering continued

LFS (lead-free solder paste) characteristics:

• High melting point (typically 220°C)

• Low wettability

• High surface tension

• Difficult to spread

• Recommended tip temperature = 360°C

WHEN SERVICING PBA’S THAT HAVE BEEN MANUFACTURED

LFS (LEAD-FREE SOLDER PASTE), LFS MUST BE USED.

WITH

F NOT, THERE IS A HIGH RISK FOR UNRELIABLE SOLDERING

JOINTS

Lead-free solder joints are more difficult to inspect because they do not have shiny surfaces like leaded solde

Also, lead-free solder does not flow as well as leaded solder, so exposed.

r joints.

some of the solder pad areas may remain

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Working Instruction, Electrical

3 Hot air gun temperature requirements

The air temperature shall not exceed 360°C. The temperature shall be measured 5 mm from the nozzle outlet. If it’s not possible to remove and/ or solder with 360°C a BGA Rework Station or another repair process shall be considered to ensure high process control.

Too high temperature can cause damage and cracks due to therm components, e.g. ceramic components like capacitors.

4 Soldering tip temperature requirements

The soldering tip temperature shall be minimum 310°C and maximum 360°C.

Too high temperature can cause damage and cracks due to therm components, e.g. ceramic components like capacitors.

5 Bottom heat requirements

In the chapter 8 “Replacement of components” there are components which require to us a bottom heater during repair to pre-heat the board and to level out the ∆T on the PBA. It will also minimize thermal stress.

The temperature on the PBA surface shall not exceed growth and thermal stress on PWB.

150°C to minimize inter-metallic

al stress on sensitive

6 BGA equipment reflow profiles

6.1 General

BGA Rework Station shall be able to control time, airflow and temperature to achieve controlled and stable reflow profile. It shall also have a temperature controlled bottom heater.

The profile shall be according to SEMC profiling specification below. Profile parameters are illustrated in table 6.1.1.

Reflow profile in this document always refers to the reflow profile which is with thermocouples and do not refer to the BGA Rework Stations setting which can vary depending on the machine type and individual machine. Verification of reflow profile shall be done on each set of equipment. Reference profile is showed in table 6.2

6.2 Temperature Measurements

One thermocouple shall be located in the middle of the component (Thermocouple # 1). It shall be drilled from bottom side and located at the ball. The hole shall be filled with glue. A slot could also be milled in the PWB to locate the thermocouple under the component. See picture 6.1. The other thermocouple (Thermocouple # 2) should be attached in the center and on the top of the component body; it shall be attached with thin heat resistant tape or a thin layer of glue. Too thick layer of glue will isolate too much heat which could give uncertain measurements.

measured on the board/component

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Working Instruction, Electrical

It’s also recommended to place thermocouples on adjacent components to make sure that they are not over exposed to the heat.

Picture 6.1

# 2

# 3 (Recommended)

# 1

Table 6.1.1

Ramp rate < 3°C/sec Ramp rate cooling < 6°C/sec Time above liquidus 40-70 sec Minimum temperature 235°C Maximum component temperature 260 °C Time above 235°C 10-40 sec Recommended Total time Approx. 3-5min

* The higher temperature in case the board has extremely high ΔT.

Table 6.2

290

250

Reflow zone

260°C 245°C 235°C

200

150

Temperature [ºC]

100

150°C

125°C

40 80 120 160

Time [Seconds]

200

240 280

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Working Instruction, Electrical

7 PoP Components Repair instruction

1. Scope of the work instruction

2. Description

3. Preparation

4. Process instruction

4.1 Needed equipment and tools

4.2 Process description

5. Work instruction

5.1 Removing

5.2 Soldering removal

5.3 Inspection

5.4 Assembly and re soldering

5.5 Inspection after repair

6. Revision History

1. Scope of the work instruction

This document was created to help and guide the repair operators to replace the PoP components and to avoid mistakes and misunderstandings during the repair process and to avoid any damage to the final product.

2. Description

PoP component is a new type of BGA component which is made by two components, CPU on bottom and Memory soldered directly on the top of CPU, see picture below.

PoP component (Package-on-Package).

Fig 1: Cross-sectional view of the PoP stack.

Bottom package: CPU( Suzi/ Anja). Top package: Memory NAND/SDRAM

Example of PoP components used in P1i is D2500, the PDA processor with memory.

3. Preparation

Before starting the repair action, be sure that:

• You have trained to use BGA rework station

• You have the necessary tools

• You have correct components (type and revision)

• You are ESD protected

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Working Instruction, Electrical

4. Process instruction

4.1 Needed equipment and tools

• BGA rework station

• Adequate Reflow profile for component

• Adequate Nozzle

• Soldering iron

• Hot air station

• Tweezers

• De-soldering wick

• Flux

4.2 Process description

BGA rework station is using to solder and de solder PoP component. Be sure that correct soldering head (Nozzle) and correct temperature profile is used.

Soldering iron, hot air station, flux and de-soldering wick are used to remove the soldering rest of the PCB after the old component has been removed.

5. Work instruction

5.1 Removing

This instruction is showing how to remove the PoP component in one heating cycle. Equipment used A: Finetech CRS 10, Fine placer.

B: OKI, BGA station Other similar BGA station can be use.

5.1A

Put the board in the fixture, chose the right nozzle and temperature profile. Align the nozzle to the component and start the de-soldering program. When the temperature is coming to the melting point activate the vacuum, the memory will be removed from the CPU (picture A1), lift the nozzle for a few centimeters and remove the memory from the nozzle using tweezers (picture A2). Put the nozzle down again, readjust the distance to the CPU, and wait for a couple of seconds and remove the CPU component too (picture A3). Wait for the cooling down time, and remove the PCB from the fixture and go to next step.

Picture A1 Picture A2

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Working Instruction, Electrical

Picture A3

5.1B

Using a special designed nozzle with mechanical grips (picture B1) will be possible to remove only the top component (memory), ort both components in the same time (picture B2 and B3)

Picture B1 Picture B2

Picture B3

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Working Instruction, Electrical

5.2 Soldering removal

The landing area has to be cleaned from old soldering and flux.

5.3 Inspection

Check under the microscope that are no damage happened to mask, pads or the surrounding components. Go to next step.

5.4 Assembly and re soldering

Put the board in the stations fixture, chose the adequate nozzle and reflow profile. Check the component revision and mounting direction. Add flux on the board and on the CPU top pads.

Pick up the CPU and align it to the board and put it down. Pick up the memory and align it to the CPU, and put the component on the top of the other component. Start the reflow profile.

5.5 Inspection after repair

After soldering check the board to be sure that no other components are damaged or

removed. Inspect component by X-ray and send the board to trouble shoot station for

test. Each time PCB assemblies have been repaired it shall be marked with an indication on the

PCB .

1206-4806 Rev1 11(35)

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