Sony XM-502-X Service manual
XM-502X
SERVICE MANUAL
Ver 1.1 2001. 08
SPECIFICATIONS
Circuit system OTL (output transformerless) circuit
Inputs RCA pin jacks
Outputs Speaker terminals
Speaker impedance 2 - 8 ohms (stereo)
Maximum outputs 100 watts per channel (at 4 ohms)
Rated outputs (supply voltage at 14.4 V)
Frequency response 5 Hz - 100 kHz ( dB)
Harmonic distortion 0.005 % or less
Input level adjustment range
Pulse power supply
High level input connector
Through out pin jacks
4 - 8 ohms (when used as a bridging
amplifier)
260 watts (monaural) at 4 ohms
50 watts per channel (20 Hz 20 kHz, 0.04 % THD, at 4 ohms)
65 watts per channel (20 Hz 20 kHz, 0.1 % THD, at 2 ohms)
130 watts (monaural) (20 Hz 20 kHz, 0.1 % THD, at 4 ohms)
(at 1 kHz, 4 ohms)
0.2 - 4.0 V (RCA pin jacks)
0.4 - 8.0 V (High level input)
+0
–3
US Model
Canadian Model
AEP Model
UK Model
E Model
High-pass filter 50 - 200 Hz, –12 dB/oct
Low-pass filter 50 - 200 Hz, –12 dB/oct
Low boost 0 - 10 dB (40 Hz)
Power requirements 12 V DC car battery
(negative ground)
Power supply voltage 10.5 - 16 V
Current drain at rated output: 15 A
Remote input: 2 mA
Dimensions Approx. 258 × 55 × 182 mm
(10 1/4 × 2 3/8 × 7 1/4 in.)
(l/h/p) not incl. projecting parts and
controls
Mass Approx. 1.9 kg (4 lb. 3 oz.)
not incl. accessories
Supplied accessories Mounting screws (4)
High level input cord (1)
Protect cover (1)
Design and specifications are subject to change without
notice.
9-925-591-12
2001H0400-1
© 2001. 8
STEREO POWER AMPLIFIER
Sony Corporation
e Vehicle Company
Shinagawa Tec Service Manual Production Group
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls......................................... 3
Connections ............................................................................ 4
2. DISASSEMBLY
2-1. Bottom Plate....................................................................... 6
2-2. Panel (Front)....................................................................... 6
2-3. Amplifier Board ................................................................. 7
2-4. Filter Board ........................................................................ 7
3. DIAGRAMS
3-1. Block Diagram ................................................................... 8
3-2. Printed Wiring Boards ...................................................... 10
3-3. Schematic Diagram .......................................................... 13
4. EXPLODED VIEWS
4-1. Amplifier Board Section .................................................. 17
4-2. Filter Board Section ......................................................... 18
5. ELECTRICAL PARTS LIST ................................... 19
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
– 2 –
SECTION 1
GENERAL
This section extracted from
instruction manual.
– 3 –
– 4 –
– 5 –
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
3
bottom plate
1
BTP 3x6
2
BTP 3x6
2-2. PANEL (FRONT)
1
fuse (25 A)
2
BTP 3x8
4
panel (front)
– 6 –
3
BTP 3x8
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