Sony SDX-1100V-R, SDX-1100V User Manual

SDX-1100V
SDX-1100V/R

5.25”Model

Product Specification Manual
Version 1.0

August, 2006

Copyright © 2006, Sony Corporation.
All right reserved.

NOTE:
This Product Specification Manual is applicable for AIT-5 drive.

Notice

This document contains proprietary information which is protected by copyright. All rights reserved. No part of this
document may be photocopied, reproduced or translated to another language without prior written consent of Sony.
The information contained in this document is subject to change without notice.

SONY MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS DOCUMENT. Sony shall not be liable
for errors contained herein, or indirect, special, incidental or consequential damages in connection with the
furnishing, performance, or use of this document.

© Copyright 2006, Sony Corporation

For further information, please contact the appropriate Sony location listed below;

Sony Electronics Inc., Tape Storage Solutions (USA)

URL: http://www.storagebysony.com

Sony of Canada Ltd., AV/IT Marketing Group
Computer Peripherals Product Marketing

115 Gordon Baker Road Toronto, Ontario, M2H 3R6 Canada
TEL: [phone] or (1) 800-961-7669
FAX: [phone]

Sony Business Europe

URL: http://www.sonyisstorage.com/

Electronics Devices Marketing (Singapore)
(A division company of Sony Electronics (S) Pte. Ltd.)
Enterprise Storage Solutions Dept.

2 International Business Park, #01-10 Tower One,
The Strategy, Singapore 609930
TEL: [phone] FAX: [phone]

Sony Corporation of Hong Kong Ltd.
Computer Peripheral Sales & Marketing Division
Electronic Devices Marketing Hong Kong

45/F, The Lee Gardens, 33 Hysan Avenue, Causeway Bay, Hong Kong
TEL: [phone] FAX: [phone]

Sony Corporation of Hong Kong Ltd. Beijing Rep. Office
Computer Peripheral Div.

Full Link Plaza Tower A 11/F., No.18 Chaoyangmenwai Ave., Beijing
100020 P.R.C.
TEL: [phone] FAX: [phone]
URL: http://www.sony.com.cn/ed/cp/ait/

Sony Corporation of Hong Kong Ltd.,
Electronic Devices Marketing Hong Kong
Computer Peripherals Sales & Marketing Div.

8/F, One Corporate Avenue, 222 Hu Bin Road. Luwan District,
Shanghai. P.R.C. Postcode 200021
TEL: [phone]
URL: http://www.sony.com.cn/ed/cp/ait/

Sony Brasil Ltda.

Rua InocŽncio Tobias, 125-BlocoA, CEP01144-000, Săo Paulo-SP-Brasil
TEL: [phone] to 6598 FAX: [phone]
URL: http://www.sonybrasil.com

Sony Australia Limited

33-39 Talavera Rd.
NORTH RYDE, NSW 2113
TEL: [phone] FAX: [phone]
e-mail: [e-mail]

Sony New Zealand

Akoranga Business Park
NORTH SHORE, AUCKLAND
TEL: [phone] FAX: [phone]
e-mail: [e-mail]

Sony Chile Ltda

Av. Kennedy 8017, Las Condes, Santiago, Chile
TEL: [phone] FAX: [phone]

Sony Taiwan Limited
Optical Devices Storage Dept. Data Storage Section

5F, 145 Changchun Road, Taipei 104, Taiwan
TEL: [phone] FAX: [phone]

Sony Korea Corporation EDMK CP Sales & Marketing Team

34F, ASEM Tower, World Trade Center, 159-1, Samsung-Dong,
Kangnam-Ku, Seoul, 135-798, Korea
TEL: [phone] FAX: [phone]
URL: http://www.sony.co.kr/cp/

Sony Gulf FZE Computer Display & Peripheral Div.

P.O.BOX 16871, Jebel Ali, Dubai, U.A.E.
TEL: [phone] or 8816912 FAX: [phone] or 8816259

Sony Marketing of Japan

Business Solution Dept. Server Solution Marketing Section
URL: http://www.sony.co.jp/STORAGE

Table of Contents

1. INTRODUCTION.............................................................................................1-1

1.1. About this Product Specification Manual................................................................1-1

1.2. Introducing the Sony AIT Technology.....................................................................1-1

1.3. Features of the Drive.................................................................................................1-1

1.4. Reference...................................................................................................................1-3

1.4.1. How to get ECMA-329 Standard Document ............................................................ 1-3

2. SPECIFICATIONS..........................................................................................2-1

2.1. Specifications............................................................................................................2-1

2.1.1. Dimensions.............................................................................................................. 2-1

2.1.1.1. Mounting Holes....................................................................................................... 2-2

2.1.2. Weight ..................................................................................................................... 2-4

2.1.3. Connectors .............................................................................................................. 2-4

2.1.3.1. SCSI Cables and Terminators................................................................................. 2-4

2.2. Environmental Specifications..................................................................................2-4

2.2.1. Temperature and Humidity Range ........................................................................... 2-4

2.2.2. Altitude..................................................................................................................... 2-5

2.2.3. Suspended Particulate............................................................................................. 2-5

2.2.4. Vibration .................................................................................................................. 2-5

2.2.5. Shock....................................................................................................................... 2-5

2.2.6. Acoustic Noise .........................................................................................................2-5

2.2.7. EMC......................................................................................................................... 2-5

2.2.8. Orientation............................................................................................................... 2-5

2.3. Performance Specification....................................................................................... 2-6

2.3.1. Data Capacity.......................................................................................................... 2-6

2.3.2. Data transfer Rate ................................................................................................... 2-7

2.3.2.1. Sustained Data Transfer Rate to and from the Tape............................................... 2-7

2.3.2.2. Burst Transfer Rate to and from the SCSI Bus....................................................... 2-7

2.3.3. Initialize Time........................................................................................................... 2-7

2.3.4. Load Time................................................................................................................ 2-7

2.3.5. Unload Time ............................................................................................................ 2-7

2.3.6. Search Time ............................................................................................................ 2-7

2.3.7. Rewind Time............................................................................................................ 2-7

2.3.8. Long Erase Time ..................................................................................................... 2-8

2.3.9. Error Rate................................................................................................................ 2-8

2.3.10. Definition of Failure ............................................................................................... 2-8

2.3.11. Mean Time Between Failures................................................................................ 2-8

2.3.12. Mean Time to Repair............................................................................................. 2-8

2.3.13. Component Life..................................................................................................... 2-8

2.3.14. Durability ............................................................................................................... 2-8

2.4. Safety.........................................................................................................................2-9

2.4.1. Conditions of Acceptability....................................................................................... 2-9

2.5. Installation Requirements ........................................................................................ 2-9

2.5.1. Power Requirements ............................................................................................... 2-9

2.6. Data Compression................................................................................................... 2-10

SDX-1100V series Ver.1.0 Table of Contents

3. INSTALLATION..............................................................................................3-1

3.1. Installation Guide......................................................................................................3-1

3.1.1. SCSI ID Number Jumper......................................................................................... 3-2

3.1.2. Termination Power Switch ....................................................................................... 3-2

3.1.3. Parity Disable Jumper.............................................................................................. 3-3

3.1.4. Data Compression ON Switch ................................................................................. 3-3

3.1.5. Power Connector..................................................................................................... 3-3

3.1.6. SCSI 68 pin Connector............................................................................................ 3-3

3.1.7. Attaching and Removing the Dust Cover................................................................. 3-6

3.1.7.1. Attaching the Dust Cover ........................................................................................ 3-6

3.1.7.2. Removing the Dust Cover....................................................................................... 3-7

4. OPERATION...................................................................................................4-1

4.1. Summary of LED Indications....................................................................................4-1

4.2. Operator Action......................................................................................................... 4-2

4.2.1. Powering up the Drive ............................................................................................. 4-2

4.2.2. Inserting Cassettes.................................................................................................. 4-2

4.2.3. Removing Cassettes................................................................................................ 4-2

4.2.4. Hard Reset Hole ...................................................................................................... 4-2

4.2.5. Write-Protecting Cassettes...................................................................................... 4-2

4.3. Internal Function.......................................................................................................4-3

4.3.1. The Load Sequence ................................................................................................ 4-3

4.3.2. The Unload Sequence ............................................................................................. 4-3

4.3.3. Power-Fail or SCSI Reset Handling......................................................................... 4-3

4.3.4. Diagnostic and Normal Status Displays................................................................... 4-4

4.3.4.1. Diagnostic Status Display....................................................................................... 4-4

4.3.4.2. Normal Status Display ............................................................................................ 4-4

4.4. Tape Alert................................................................................................................... 4-5

4.5. Tape Format...............................................................................................................4-5

4.6. Maintenance, Troubleshooting and Service............................................................4-6

4.6.1. Head Cleaning......................................................................................................... 4-6

4.6.1.1. Message When Cleaning Cassette is Necessary ................................................... 4-6

4.6.1.2. The condition of Cleaning Request......................................................................... 4-6

4.6.1.3. Usage of Cleaning Cassette................................................................................... 4-6

4.6.2. Troubleshooting Guide............................................................................................. 4-6

4.6.2.1. Operational Problems............................................................................................. 4-6

4.6.2.2. Read/Write Problems.............................................................................................. 4-9

4.6.2.3. Replace Tape.......................................................................................................... 4-9

4.6.2.4. Media Warning........................................................................................................ 4-9

5. SCSI INTERFACE..........................................................................................5-1

5.1. Introduction...............................................................................................................5-1

5.2. SCSI Bus Operation..................................................................................................5-3

5.3. Message Specification..............................................................................................5-4

5.3.1. COMMAND COMPLETE (00h)................................................................................ 5-5

5.3.2. EXTENDED MESSAGE (01h) ................................................................................. 5-5

5.3.2.1. PARALLEL PROTOCOL REQUEST (04h) ............................................................. 5-5

5.3.2.2. SYNCHRONOUS DATA TRANSFER REQUEST (01h).......................................... 5-6

SDX-1100V series Ver.1.0 Table of Contents

5.3.2.3. WIDE DATA TRANSFER REQUEST...................................................................... 5-8

5.4. Status Specification................................................................................................ 5-12

6. COMMAND SPECIFICATION........................................................................6-1

6.1. ERASE 19h................................................................................................................. 6-2

6.2. INQUIRY 12h.............................................................................................................. 6-3

6.3. LOAD/UNLOAD 1Bh.................................................................................................. 6-8

6.4. LOCATE 2Bh............................................................................................................6-10

6.5. LOG SELECT 4Ch.....................................................................................................6-11

6.6. LOG SENSE 4Dh...................................................................................................... 6-13

6.6.1. The Log Page Descriptor....................................................................................... 6-14

6.6.2. The Log Parameter Descriptor............................................................................... 6-15

6.6.3. Summary List of Supported Pages (00h)............................................................... 6-17

6.6.4. Write and Read Error Counters Pages (02h or 03h).............................................. 6-17

6.6.5. Last N Error Events List (07h) ............................................................................... 6-18

6.6.6. Tape Alert Log Page (2Eh)..................................................................................... 6-19

6.6.7. Tape Log Page (30h) (Sony Unique) ..................................................................... 6-24

6.6.8. Tape Capacity Log Page (31h) (Sony Unique)....................................................... 6-25

6.6.9. Drive Usage Log Page (33h) (Sony Unique) ......................................................... 6-26

6.6.10. Read and Write Frame Error Counter Page (34h & 35h) .................................... 6-27

6.6.11. Data Compression Transfer Log Page (39h) (Sony Unique) ............................... 6-30

6.6.12. AIT Log Page (3Ch) (Sony Unique)..................................................................... 6-31

6.6.13. MIC Fixed Length Information Page (3Dh) (Sony Unique).................................. 6-33

6.6.14. MIC Variable Length Information Page (3Eh) (Sony Unique) .............................. 6-38

6.7. MODE SELECT(6/10) 15h and 55h ......................................................................... 6-40

6.7.1. Disconnect-Reconnect Page (02h)........................................................................ 6-44

6.7.2. Control Mode Page (0Ah)...................................................................................... 6-45

6.7.3. Data Compression Control Page (0Fh).................................................................. 6-46

6.7.4. Device Configuration Page (10h)........................................................................... 6-47

6.7.5. Medium Partitions Parameter Page (11h).............................................................. 6-49

6.7.6. Informational Exceptions Control Page (1Ch)........................................................ 6-51

6.7.7. AIT Device Configuration Page (31h) .................................................................... 6-52

6.8. MODE SENSE (6/10) 1Ah and 5Ah.........................................................................6-54

6.9. PERSISTENT RESERVE IN 5Eh.............................................................................. 6-57

6.10. PERSISTENT RESERVE OUT 5Fh ....................................................................... 6-60

6.11. PREVENT ALLOW MEDIUM REMOVAL 1Eh........................................................6-62

6.12. READ 08h .............................................................................................................. 6-63

6.13. READ ATTRIBUTE 8Ch.........................................................................................6-65

6.13.1. ATTRIBUTE VALUES service action ................................................................... 6-66

6.13.2. ATTRIBUTE LIST service action ......................................................................... 6-67

6.13.3. PARTITION LIST service action .......................................................................... 6-68

6.13.4. VOLUME LIST service action.............................................................................. 6-68

6.14. READ BLOCK LIMITS 05h.................................................................................... 6-69

6.15. READ BUFFER 3Ch .............................................................................................. 6-70

6.16. READ POSITION 34h ............................................................................................ 6-73

6.17. RECEIVE DIAGNOSTIC RESULTS 1Ch................................................................ 6-75

6.18. RELEASE (6/10) 17h and 57h............................................................................... 6-77

6.19. REPORT DENSITY SUPPORT 44h....................................................................... 6-79

6.20. REPORT DEVICE IDENTIFIER A3h...................................................................... 6-82

6.21. REPORT LUNS A0h...............................................................................................6-83

SDX-1100V series Ver.1.0 Table of Contents

6.22. REQUEST SENSE 03h..........................................................................................6-84

6.23. RESERVE (6/10) 16h and 56h............................................................................... 6-93

6.24. REWIND 01h.......................................................................................................... 6-95

6.25. SEND DIAGNOSTIC 1Dh....................................................................................... 6-96

6.26. SET DEVICE IDENTIFIER A4h.............................................................................. 6-98

6.27. SPACE 11h............................................................................................................. 6-99

6.27.1. CHECK CONDITION......................................................................................... 6-101

6.28. TEST UNIT READY 00h....................................................................................... 6-102

6.29. WRITE 0Ah .......................................................................................................... 6-103

6.30. WRITE ATTRIBUTE 8Dh...................................................................................... 6-104

6.31. WRITE BUFFER 3Bh........................................................................................... 6-106

6.32. WRITE FILEMARKS 10h.....................................................................................6-108

7. DRIVE DIAGNOSTICS...................................................................................7-1

7.1. Overview....................................................................................................................7-1

7.2. Diagnostic Test.......................................................................................................... 7-1

7.2.1. Power-on Self Test................................................................................................... 7-1

7.2.2. SEND DIAGNOSTIC command - Self Test.............................................................. 7-2

7.2.3. SEND DIAGNOSTIC command - Individual Test..................................................... 7-2

7.2.4. Diagnostic Test Number Summary .......................................................................... 7-3

7.2.5. RECEIVE DIAGNOSTIC RESULT command .......................................................... 7-4

8. APPENDIX A: ASC & ASCQ ALPHABETIC ORDER....................................8-1

9. APPENDIX B: ASC & ASCQ NUMERIC ORDER..........................................9-1

10. APPENDIX C: ASC & ASCQ FOR AIT (SONY UNIQUE)..........................10-1

11. APPENDIX D: SCSI COMMANDS (OP CODE ORDER)........................... 11-1

12. APPENDIX E: MEDIUM AUXILIARY MEMORY ATTRIBUTE...................12-1

12.1. INTRODUCTION.................................................................................................... 12-1

12.2. OVERVIEW.............................................................................................................12-1

12.3. MEDIUM AUXILIALY MEMORY ATTRIBUTE TYPES AND STATES .................... 12-1

12.4. MEDIUM AUXILIARY MEMORY A TTRIBUTE DATA.............................................12-2

12.4.1. Attribute Format................................................................................................... 12-2

12.4.2. Attribute Identifier Values..................................................................................... 12-3

12.4.3. Standard Device Type Attributes......................................................................... 12-3

12.4.4. Standard Medium Type Attributes ....................................................................... 12-9

12.4.5. Standard Host Type Attributes........................................................................... 12-10

13. APPENDIX F: AIT BASED WORM SYSTEM.............................................13-1

13.1. Important Notice................................................................................................... 13-1

13.2. Write-Protected (WP) Bit in Mode Sense Data....................................................13-1

13.3. How to detect a WORM cartridge........................................................................ 13-1

13.4. How to initialize a WORM cartridge..................................................................... 13-1

13.5. How to handle the WORM cartridge in the drive................................................ 13-2

SDX-1100V series Ver.1.0 Table of Contents

14. APPENDIX G: CD-ROM DEVICE EMULATION FOR DISASTER

RECOVERY......................................................................................................14-1

14.1. Overview................................................................................................................14-1

14.2. Creating Disaster Recovery Tape........................................................................14-1

14.3. Configuring The Drive For Disaster Recovery Operation..................................14-1

14.4. Exiting DR Mode................................................................................................... 14-1

14.5. Supported CD-ROM DR Command Set............................................................... 14-1

14.5.1. Inquiry (12h)........................................................................................................ 14-1

14.5.2. Read 10 (28h) ..................................................................................................... 14-1

14.5.3. Read Capacity (0x25).......................................................................................... 14-1

14.5.4. Read TOC (0x43)................................................................................................ 14-2

14.5.5. Mode Sense/Select Page Code 0x3C................................................................. 14-2

14.6. Reset Handling...................................................................................................... 14-2

SDX-1100V series Ver.1.0 Table of Contents

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SDX-1100V series Ver.1.0 Table of Contents

1.Introduction

1. Introduction

1.1. About this Product Specification Manual

This Product Specification Manual is applicable for AIT-5 drive.
This manual provides information about the Sony SDX-1100V series Advanced Intelligent Tape Drives which is

necessary to integrate the drives into OEM products. This manual describes the specifications, SCSI Interface,
diagnostics, operation and installation of the Sony AIT-5 Tape Drives.

The Sony SDX-1100V drive uses data compression to achieve high capacity and high transfer rates. Actual
capacity and transfer rate depends on the source file type. The capacity ratings listed in the next subsection are
based on a 246 meter tape AIT-5 cassette. The Sony SDX-1100V drive is a high capacity data storage device
using Advanced intelligent tape (AIT) technology. The Sony SDX-1100V drive achieves high data integrity through
read-after-write, an additional level of Error Correction Code, and other features.

The Sony SDX-1100V drives provide MIC technology that automatically enhance reliability and performance. The
Sony SDX-1100V drives provide read and write capability for MIC user data area.

1.2. Introducing the Sony AIT Technology

While magnetic storage technologies continue to push the envelope of recording density and provide higher
capacities and transfer rates every 18 to 24 months, improvements in time to access this data have become very
limited. Since 1990, tape recording densities have increased up to ten fold, while the time to access this data
has increased less than two fold, creating a large mismatch between the amount of stored data and the ability to
access it.

This large “gap” between data access latency and area density has created a dilemma in application development
and limited the potential to implement truly cost-effective tertiary storage solutions. Many applications
compensated for this deficiency by incorporating multiple redundant tape drives, at higher cost, to achieve an
acceptable level of service for their users. Sony’s new Advanced Intelligent Tape design has recognized this need
and provided an innovative approach to solving the data latency problem while increasing capacity and data
transfer rates.

Traditional, older tape technologies relied mostly on conventional mechanical means, such as faster search
speeds or an on-tape index to improve access to stored data. While improvements in electronics and magnetics
have been the main enablers of increased capacity and transfer rates, rarely have these same technologies been
employed to significantly improve access to data.

Sony’s Advanced Intelligent Tape (AIT) architecture has deviated from conventional designs and employed
electronic enhancements to significantly improve access to stored data, using a captive, non-volatile memory
chip contained within the magnetic data cartridge. Known as Memory-In-Cassette, or MIC, this memory chip
provides a direct and immediate connection to the tape drive’s on-board processors to enable quick media
load, fast access to user files and provide a wealth of data about the history and current state of the data
cartridge.

1.3. Features of the Drive

Major features of the Sony SDX-1100V include:

• Capacity
100 Gbyte typical when using 230 meter tape AIT-3 cassette (SDX3-100C)

260 Gbyte with 2.6:1 Data Compression

150 Gbyte typical when using 246 meter tape AIT-3Ex cassette (SDX3X-150C)

390 Gbyte with 2.6:1 Data Compression

200 Gbyte typical when using 246 meter tape AIT-4 cassette (SDX4-200C)

520 Gbyte with 2.6:1 Data Compression

400 Gbyte typical when using 246 meter tape AIT-5 cassette (SDX5-400C)

SONY AIT-5 drive SDX-1100V series Ver.1.0 1-1

1.Introduction

1040 Gbyte with 2.6:1 Data Compression

• Sustained transfer rate

16 Mbyte/sec when using AIT-3 cassette
18 Mbyte/sec when using AIT-3Ex cassette
24 Mbyte/sec when using AIT-4 cassette and AIT-5 cassette

• Supported Format

AIT-3 (Read/Write)
AIT-3Ex (Read/Write)
AIT-4 (Read/Write)
AIT-5 (Read/Write)

• Not compatible with the DDS and EXABYTE format tapes

• Burst transfer rate

12 Mbyte/sec Asynchronous
160 Mbyte/sec Synchronous

• Large 96 MB Buffer Memory

• 3.5” Standard Height, 5.25” Half Height

• Embedded SCSI interface (Ultra 160 LVD, Single-ended or Low Voltage differential)

• Supports Variable or Fixed record length

• Supports SCSI Disconnection/Arbitration

• Read After Write (RAW) On and Off capability

• Read Retry On and Off capability

• Frame rewrite function –AIT-3

• Fragment rewrite function – AIT-3Ex, AIT-4 and AIT-5

• Three levels of Error Correction Code (ECC) – AIT-3

• Two levels of Error Correction Code (ECC) – AIT-3Ex, AIT-4 and AIT-5

• High Speed search

• Random read, Append write

• MIC Support (Automatic reliability and performance enhancement.)

• MIC Support (Read and write capability for MIC user data area.)

• Remote-MIC Support

• Tape Alert

1-2 SONY AIT-5 drive SDX-1100V series Ver. 1.0

1.4. Reference

Please refer to the following documents for additional information:

•SCSI-2

• SCSI Parallel Interface-2 (SPI-2) ANSI X3T10-1142D rev 20b.

ANSI X3T9.2/86-109 (Revision 10H, or above), available through ANSI.

• SCSI Parallel Interface-3 (SPI-3) ANSI INCITS 336-2000

• SCSI Architecture Model-2 (SAM-2) ANSI INCITS 366-2003

1

ANSI X3.131.-1996 Small Computer Systems Interface-2 (SCSI-2).

1.Introduction

• ALDC - Adaptive Lossless Data Compression (ALDC) Algorithm;

ECMA-222, available through

2

ECMA.

•

1.4.1. How to get ECMA-329 Standard Document

You can get the ECMA-329 Standard Document file from the following URL.

http://www.ecma-international.org/publications/standards/standard.html

1

ANSI (American National Standard for Industry)

2

ECMA (European Computer Manufacturers Association)

SONY AIT-5 drive SDX-1100V series Ver.1.0 1-3

1.Introduction

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1-4 SONY AIT-5 drive SDX-1100V series Ver. 1.0

2.Specification

2. Specifications

Physical, environmental and performance specifications for the SDX-1100V and SDX-1100V/R.

2.1. Specifications

2.1.1. Dimensions

The SDX-1100V

Height 41.2 mm (1.62 in) ± 0.5 mm (0.02 in)

Width 101.6 mm (4.00 in) ± 0.5 mm (0.02 in)
Depth 155.0 mm (6.10 in) ± 0.5 mm (0.02 in)

The SDX-1100V/R

Height 41.2 mm (1.62 in) ± 0.5 mm (0.02 in)

Width 146.0 mm (5.75 in) ± 0.5 mm (0.02 in)
Depth 155.0 mm (6.10 in) ± 0.5 mm (0.02 in)

Note: The above dimensions do not include the front panel thickness, eject button and SCSI connector.

_

Height 41.2 0.5mm
[1.62" 0.02"]

+

_

+

Width 101.6 0.5mm

_

+

[4.00" 0.02"]

_

+

_

+

7.4 0.6mm

_

+

[0.29" 0.02"]

Figure 2-1: Dimensions (SDX-1100V)

7.6
[0.30" 0.02"]

_

Depth 155.0 0.5mm
[6.10" 0.02"]

+

_

+

_

+

0.5mm

_

+

SONY AIT-5 drive SDX-1100V series Ver.1.0 2-1

2.Specification

2.1.1.1. Mounting Holes

Figure 2-2a gives details of the mounting holes for the Sony SDX-1100V and figure 2-2b for the Sony
SDX-1100V/R.

4.8 0.5mm

[0.19" 0.02"]

41.2 0.5mm

[1.62" 0.02"]

+

+

_

+

_

_

+

_

_

+

21.0 0.3mm

_

+

[0.83" 0.01"]

_

+

60.0 0.3mm

_

+

[2.36" 0.01"]

_

+

90.0 0.3mm [3.54" 0.01"]

_

+

6-M3 (depth 2.5mm [0.10"] max.)

6-M3 (depth 2.5mm [0.10"] max.)

_

+

7.4 0.6mm

_

+

[0.29" 0.02"]

_

+

9.8 0.6mm [0.39" 0.02"]

_

+

101.6 0.5mm [4.00" 0.02"]

94.0 0.5mm [3.70" 0.02"]

+

_

+

_

+

_

+

_

_

+

31.0 0.3mm

_

+

[1.22" 0.01"]

_

+

155.0 0.5mm [6.10" 0.02"]

_

+

42.0 0.3mm

_

+

[1.65" 0.01"]

_

+

70.0 0.3mm [2.76" 0.01"]

_

+

_

+

Figure 2-2a: SDX-1100V Mounting Holes

2-2 SONY AIT-5 drive SDX-1100V series Ver. 1.0

2.Specification

21.8 0.5mm

[0.86" 0.02"]

[0.39" 0.02"]

+

_

+

_

+

_

41.2 0.5mm

[1.62" 0.02"]

+

_

+

_

_

+

7.4 0.6mm

_

+

_

+

9.8 0.6mm
[0.39" 0.02"]

149.0 0.5mm [5.87" 0.02"]

+

_

[0.29" 0.02"]

_

+

_

+

31.0 0.3mm

_

+

[1.22" 0.01"]

139.6 0.5mm [5.50" 0.02"]

146.0 0.5mm [5.75" 0.02"]

+

_

94.0 0.5mm [3.70" 0.02"]

+

_

+

_

9.9 0.5mm

+

_

47.5 0.3mm
[1.87" 0.01"]

79.2 0.3mm [3.12" 0.01"]

_

+

_

+

155.0 0.5mm [6.10" 0.02"]

_

+

70.0 0.3mm [2.76" 0.01"]

_

42.0 0.3mm

+

_

[1.65" 0.01"]

+

_

+

_

+

79.2 0.3mm [3.12" 0.01"]

_

+

_

+

_

+

_

+

_

+

_

+

7.0 0.5mm

_

+

[0.28" 0.02"]

6-M3

_

+

8.4 0.5mm

_

+

[0.33" 0.02"]

_

+

7.6 0.5mm

_

+

[0.30" 0.02"]

+

+

_

+

_

_

+

_

_

+

47.5 0.3mm

_

+

[1.87" 0.01"]

_

+

79.2 0.3mm [3.12" 0.01"]

_

+

4-M3

Figure 2-2b: SDX-1100V/R Mounting Holes

SONY AIT-5 drive SDX-1100V series Ver.1.0 2-3

2.Specification

2.1.2. Weight

SDX-1100V 0.8 kg, without a cassette and a front bezel.
SDX-1100V/R 1.1 kg, without a cassette and a front bezel.

2.1.3. Connectors

The SDX-1100V has a SCSI connector with a power connector and Jumpers at the positions shown in Figure 2-3.
All other connectors are for use by Sony’s manufacturing and service facilities only.

Figure 2-3: Connector Positions

SCSI 68 pin Connector

2.1.3.1. SCSI Cables and Terminators

Jumpers

Power Connector

The Single-Ended SCSI configuration and Low-Voltage-differential SCSI configuration are supported by
SDX-1100V, and SDX-1100V/R The hardware specification of this interface can be found in Clause 3. Physical
Characteristics, of the X3T10/1142D (SCSI Parallel Interface2) standard. Only unshielded connectors are
supported. Possible cable and connector sources are listed below. This does not imply that these are the only
sources for SCSI accessories.

Note: When using high speed data transfer with the SDX-1100V it is recommended that total length of the SCSI
data cable not exceeded 1.5m for Single Ended SCSI configuration. As for Low-Voltage-differential SCSI
configuration, less than 12m is recommended.

Cable 30 AWG Ribbon

Hitachi UL 20848 (or equivalent)

Connector AMP 1-786090-7 (or equivalent)

2.2. Environmental Specifications

The specifications which apply when media is present may be different than these.

2.2.1. Temperature and Humidity Range

Temperature

Operating 5 ºC to 40 ºC (ΔT < 10 ºC/h)
Non-Operating(mech.) -40 ºC to 70 ºC (ΔT < 20 ºC/h)
Non-Operating(tape) -40 ºC to 45 ºC (ΔT < 20 ºC/h)

Humidity

Operating 20 to 80% RH, non-condensing

Maximum wet bulb temperature = 26 ºC

Non-operating (mech.) 5 to 95%RH(ΔRH<30%/h)

Maximum wet bulb temperature = 45 ºC

Non-operating (tape) 20 to 80%RH(ΔRH<30%/h)

.

2-4 SONY AIT-5 drive SDX-1100V series Ver. 1.0

2.2.2. Altitude

Operating 0 to 10,000 feet

2.2.3. Suspended Particulate

2.Specification

Operating

Less than 150 microgram/m
Based Sampling period 24 hours

3

2.2.4. Vibration

Operating Swept Sine 5 to 500Hz, @0.25G Peak 1 Octave/min.

3 axis, 3 directions

Non-operating Swept Sine 5 to 500Hz, @ 0.5G Peak 1 Octave/min.

3 axis, 3 directions

2.2.5. Shock

Operating No Data Loss

Half Sine
Performance
5 G Peak 3 ms
3 axes, 3 directions
*Interval 10 seconds

Non-operating No Device Damage

Half Sine
90 G Peak 3 ms
(30 G Peak 11 ms)
3 axes, 3 directions
*

Interval 10 seconds

2.2.6. Acoustic Noise

The ambient noise level is no greater than 25 dB (A). The sound-meter on (A) scale is located 1m in front of the
center of the drive front panel. (A): A curve weight

Streaming Write/Read 35dB(A)
Insert/Eject 60dB(A)

2.2.7. EMC

EMI/EMS Radiated Emissions /

Conducted noise
Emissions

EMS ESD

(Front Panel Only,
integrated product)

EN 55022 / 94 + EN 55022 A1 / 95 class B

Discharge Voltage
Less than 15kV: No operation failure
Less than 20kV: No drive damage

2.2.8. Orientation

The SDX-1100V can be installed in three different mounting positions as shown in the figure below. Each position
has a maximum tolerance of ± 10 degrees.

SONY AIT-5 drive SDX-1100V series Ver.1.0 2-5

2.Specification

10

10

10

10

10

10

10

10

Figure 2-4: Mounting Attitude and Tolerance

2.3. Performance Specification

The data capacity, data transfer rate and data reliability specifications this chapter require the media to conform to
the AIT-3, AIT-3Ex, AIT-4 and AIT-5 Media Specification and also require the drive and media to remain within their
respective operating and non-operating environmental specifications. The specifications below also assume that
the C3 ECC frame (AIT-3) or C3 ECC fragment (AIT-3Ex, AIT-4 and AIT-5) is generated on writing and used as
necessary on reading, and further assumes that read-after-write rewrites are used as necessary on writing.

2.3.1. Data Capacity

The SDX-1100V includes a data compression capability. When data compression is enabled the drive capacity can
increase from 2 times to 3 times. The efficiency of the data compression depends on the actual data that is being
compressed and cannot be predicted precisely prior to compression.

Format AIT-3 Standard Format
Native
Capacity

Format AIT-3Ex Standard Format
Native
Capacity

Format AIT-4 Standard Format
Native
Capacity

Format AIT-5 Standard Format
Native
Capacity

100.0 Gbyte typical When using 230 meter tape AIT-3 cassette (SDX3-100C)

150.0 Gbyte typical When using 246 meter tape AIT-3Ex cassette (SDX3X-150C)

200.0 Gbyte typical When using 246 meter tape AIT-4 cassette (SDX4-200C)

400.0 Gbyte typical When using 246 meter tape AIT-5 cassette (SDX5-400C)

2-6 SONY AIT-5 drive SDX-1100V series Ver. 1.0

2.Specification

2.3.2. Data transfer Rate

2.3.2.1. Sustained Data Transfer Rate to and from the Tape

The sustained transfer rate to and from the tape is 24Mbyte per second with AIT-4 and AIT-5 cassette, 18Mbyte
per second with AIT-3Ex cassette, 16Mbyte per second with AIT-3 cassette. For this sustained rate to be achieved,
the drive must be streaming.

2.3.2.2. Burst Transfer Rate to and from the SCSI Bus

The SDX-1100V will transmit and receive data bursts to and from the SCSI bus at a maximum burst rate of
12Mbyte per second, using Ultra 160 asynchronous transfers and maximum of 160Mbyte per second, using
Ultra160 synchronous transfers.

2.3.3. Initialize Time

Initialize Time means the period from the time the drive is powered on to the time when the drive is ready and
waiting for a SCSI command such as INQUIRY or TEST UNIT READY. Initialize Time is less than 7 seconds.

The drive will respond with BUSY status until the completion of the Initialize Time. The Initialize Time does not
include the time necessary for drive diagnostics to complete and the drive to become ready for tape insertion.

2.3.4. Load Time

Load Time means the period from the time when the operator inserts a cassette into the drive to the time
when the drive is ready. The data in the below table represents the average time for SDX-1100V. The time it
may take for retrying is not reflected here.

SDX3-100C (230 m) SDX3X-150C (246 m) SDX4-200C (246 m) SDX5-400C (246 m)

Load Time 40 sec 14 sec 14 sec 14 sec

2.3.5. Unload Time

Unload Time means the period from the beginning of the unload sequence caused by Unload Command or Eject
button to the time when a cassette is ejected from the slot. Unload Time does not include Rewind time. The data in
the below table represents the average time for SDX-1100V. The time it may take for retrying is not reflected here.

SDX3-100C (230 m) SDX3X-150C (246 m) SDX4-200C (246 m) SDX5-400C (246 m)

Unload Time 24 sec 24 sec 24 sec 24 sec

2.3.6. Search Time

Search Time means the period for the drive to find the position that is required by a command. This time also
depends on the tape length and the position of the head along the tape. The data in the below table represents the
average time for SDX-1100V. The time it may take for retrying is not reflected here.

SDX3-100C (230 m) SDX3X-150C (246 m) SDX4-200C (246 m) SDX5-400C (246 m)

Search Time 130 sec 130 sec 130 sec 130 sec

2.3.7. Rewind Time

Rewind Time means the period from the beginning to the end of rewinding sequence. This value depends on the
tape length and the position of the head along the tape.

time for SDX-1100V. The time it may take for retrying is not reflected here.

SDX3-100C (230 m) SDX3X-150C (246 m) SDX4-200C (246 m) SDX5-400C (246 m)

Rewind Time 105 sec 115 sec 115 sec 115 sec

The data in the below table represents the average

SONY AIT-5 drive SDX-1100V series Ver.1.0 2-7

2.Specification

2.3.8. Long Erase Time

Long Erase Time means the period from the beginning of the Erase (long) sequence caused by Erase Command
at BOT. The data in the below table represents the average time for SDX-1100V. The time it may take for retrying
is not reflected here.

SDX3-100C (230 m) SDX3X-150C (246 m) SDX4-200C (246 m) SDX5-400C (246 m)

Long Erase Time 2 hrs 2.5 hrs 2.5 hrs 5 hrs

2.3.9. Error Rate

The un-correctable bit error rate is expected to be less than 1 in 10 to the 17th.

2.3.10. Definition of Failure

A failure is defined as any permanent manufacture of the drive that prevents the user from retrieving data from
tape. This includes failure to power up, failure to unload or eject a cassette, or failure to write and read data to and
from the tape, providing that both the drive and tape are being used within specification.

Faults are not considered failures when they are related to operator error mishandling and abuse, system-related
faults (cabling problems unsupported systems, operating software and so on) no trouble found, and transportation
damage.

2.3.11. Mean Time Between Failures

The Mean Time Between Failures (MTBF) for the SDX-1100V is 400,000 power-on hours, assuming a duty cycle
of 100%, where:

DutyCycle =

TapeMotion Time

PowerOn Time

× 100

2.3.12. Mean Time to Repair

The Mean Time To Repair (MTTR) of the SDX-1100V is 30 minutes. Since at the field level the entire drive is
considered a Field Replaceable Unit (FRU) the time to replace the drive with a new one is less that 30 minutes.

2.3.13. Component Life

The specified life of the SDX-1100V is 5 years average.

2.3.14. Durability

The durability of the components in the SDX-1100V will exceed the number of operations listed on the following
table:

Start/Stop 400,000 times
Reposition 3,000,000 times
Thread/Unthread 100,000 times
Load/Eject 100,000 times

2-8 SONY AIT-5 drive SDX-1100V series Ver. 1.0

2.Specification

2.4. Safety

The SDX-1100V conforms to the following safety standards:
UL/cUL UL60950

CE (LVD) EN60950-1
CE (EMC) EN55024 + EN55022: Class B
C-Tick (EMC) EN55022: Class B

AS/NZS CISPR22: Class B
MIC CISPR22 + CISPR24
RPC/DoC CISPR22

IEC60950-1
CB report IEC60950-1

2.4.1. Conditions of Acceptability

The SDX-1100V is for use only in equipment where the suitability of the combination has been determined by an
appropriate certification organization (for example, Underwriters Laboratories, Inc. or the Canadian Standards
Association in North America, and the British Standards Institution or Verband Deutscher Elektrotechniker in
Europe). Other considerations include the following:

1. An enclosure must be supplied to limit the operator’s access to live parts, to provide system stability, and to

furnish the drive with the necessary grounding integrity.

2. The necessary voltage supplies must be provided. These supplies are Extra Low Voltage SEC for UL and

CSA, or Safety Extra Low Voltage for BSI, VDE, and so on, of +5V and +12V DC.

2.5. Installation Requirements

Note: Do not move the drive while it is operating. It may cause malfunction.

2.5.1. Power Requirements

Voltage Max Ripple Current

Typical Maximum

5V ± 5% 100 mV p-p 1.7A 2.5A

12V ± 10% 150 mV p-p 0.87A 3.0A

4.75V

T

0V

10.8V

0V

-300 ms <

T < 300 ms

5V

* exclude SCSI terminator power

12V

Figure 2-5: Power-up Sequence

Note: Voltage has to increase constantly during Power-up until Maximum is reached.

Do not turn off the drive while the tape is in the drive.

SONY AIT-5 drive SDX-1100V series Ver.1.0 2-9

2.Specification

2.6. Data Compression

The tape capacity is increased by compressing data prior to writing it to the tape. Data compression is a well
established technology for reducing the number of bits used to represent data in order to improve data transfer
rate as well as reduce the amount of storage space consumed by the data. The compression ratio depends on the
source file type. The SDX-1100V uses the ALDC Data Compression algorithm. ALDC is ECMA standard data
compression algorithm. (ECMA-222) The Data Compression control page allows the host computer to enable data
compression and decompression and also configure the way in which the drive responds to
compressed/uncompressed data boundaries on the tape. The AIT-3, AIT-3Ex, AIT-4 and AIT-5 Format allows both
compressed and uncompressed data to reside on the same tape.

The Sony SDX-1100V has a DIP switch to disable the Data Compression/ Decompression. After power-on reset
with this DIP switch set, both data compression and data decompression are disabled However, a MODE SELECT
command can override the setting of this DIP switch. After power-on reset without this DIP switch set, both data
compression and data decompression are enabled. (See clause 3.1.4)

2-10 SONY AIT-5 drive SDX-1100V series Ver. 1.0

3. Installation

3.1. Installation Guide

This Product Specification Manual is applicable for AIT-5 drive.

3.Installation

Dip switch

Jumpers

SCSI 68 pin Connector

Figure 3-1: DIP switch & Connector

Power Connector

SONY AIT-5 drive SDX-1100V series Ver.1.0 3-1

3.Installation

ON

|

ON

OFF

1 2 3 4 5 6 7 8

1 DR (Desaster Recovery) Mode
2 Emulation Mode
3 AIT Library Interface Mode
4 Reserved
5 Terminator Power (ON)
6 Periodic Cleaning Req (ON)
7 DC Control-1
8 DC Control-2

Figure 3-2: DIP Switch Positions

Table 3-1: Drive Mode

DIP SW 1 2 3 4 MODE

OFF OFF ON OFF

ON OFF OFF OFF
OFF ON OFF OFF
OFF OFF

Table 3-2: Periodic Cleaning Request (Refer to 4.6.1.2)

DIP SW 6 Definition

OFF Disable Periodic Cleaning Request

ON Enable Periodic Cleaning Request

OFF

SDX-900V Emulation Mode

Normal

DR Mode

Library Mode

3.1.1. SCSI ID Number Jumper

The SCSI ID number of the SDX-1100V is selected by the SCSI ID number jumpers. The figure below shows the
jumper configuration for each of the possible SCSI IDs.

: = OPEN Jumper not installed

SCSI ID3 ID2 ID1 ID0
0 : : : :
1 : : : |
2 : : | :
3 : : | |
4 : | : :
5 : | : |
6 : | | :
7 : | | |
8 | : : :
9 | : : |
10 | : | :
11 | : | |
12 | | : :
13 | | : |
14 | | | :
15 | | | |

= CLOSED Jumper installed

Parity D isable

N o C o n n e c tio n
ID3
ID2
ID1
ID0

Figure 3-3: Jumper positions

3.1.2. Termination Power Switch

Position 5 of DIP switch is used to set whether SDX-1100V provides the termination power to pin 17,18,51,52 on
SCSI bus, or not.

3-2 SONY AIT-5 drive SDX-1100V series Ver.1.0

3.Installation

5

4

3.1.3. Parity Disable Jumper

Parity check function can be disabled by Jumper. Parity check is disabled while left end jumper is installed. Parity
generate function is always enabled.

Parity Setting
Disable |

Enable :

: = OPEN Jumper not installed
| = CLOSED Jumper installed

3.1.4. Data Compression ON Switch

Data compression can be selected by DIP switch.

Table 3-3: Data Compression Switches

DC Control-1 DC Control-2 Definition

OFF OFF Compression disabled at power-on. The host is allowed to control

compression.

OFF ON Compression disabled at power-on. The host is not allowed to

control compression.

ON OFF Compression enabled at power-on. The host is allowed to control

compression.

ON ON Compression enabled at power-on. The host is not allowed to

control compression.

3.1.5. Power Connector

The power connector is illustrated as Figure 3-4.

3 2 1

V GND GND 12V

Figure 3-4: Power Connector

3.1.6. SCSI 68 pin Connector

Figure 3-5 illustrates SCSI 68 pin connector, and table 3-4 shows the assignments for the pins of the connector.

Pin 34 1

Pin 68 35

Figure 3-5: Non-shielded SCSI Device Connector

SDX-1100V supports both Low-Voltage-Differential SCSI configuration as shown table 3-4 and Single-Ended SCSI
configuration as shown table 3-5. SDX-1100V detects and switches SCSI configuration between
Low-Voltage-Differential and single-ended modes by monitoring DIFFSENS signal assigned pin 16 in SCSI bus.
(Refer to table 3-4)

SONY AIT-5 drive SDX-1100V series Ver.1.0 3-3

3.Installation

Table 3-4: SDX-1100V SCSI Signals

(Low-Voltage-Differential Type BUS P Cable Signal Assignment)

Signal Name Cable Conductor Number Signal Name

-DB(12) 35 1 +DB(12)

-DB(13) 36 2 +DB(13)

-DB(14) 37 3 +DB(14)

-DB(15) 38 4 +DB(15)

-DB(P1) 39 5 +DB(P1)

-DB(0) 40 6 +DB(0)

-DB(1) 41 7 +DB(1)

-DB(2) 42 8 +DB(2)

-DB(3) 43 9 +DB(3)

-DB(4) 44 10 +DB(4)

-DB(5) 45 11 +DB(5)

-DB(6) 46 12 +DB(6)

-DB(7) 47 13 +DB(7)

-DB(P) 48 14 +DB(P)
GROUND 49 15 GROUND
GROUND 50 16 DIFFSENS

TERMPWR 51 17 TERMPWR
TERMPWR 52 18 TERMPWR

RESERVED 53 19 RESERVED

GROUND 54 20 GROUND

-ATN 55 21 +ATN

GROUND 56 22 GROUND

-BSY 57 23 +BSY

-ACK 58 24 +ACK

-RST 59 25 +RST

-MSG 60 26 +MSG

-SEL 61 27 +SEL

-C/D 62 28 +C/D

-REQ 63 29 +REQ

-I/O 64 30 +I/O

-DB(8) 65 31 +DB(8)

-DB(9) 66 32 +DB(9)

-DB(10) 67 33 +DB(10)

-DB(11) 68 34 +DB(11)

3-4 SONY AIT-5 drive SDX-1100V series Ver.1.0

3.Installation

Table 3-5: SDX-1100V SCSI Signals (Single-Ended Type BUS P Cable Signal Assignment)

Signal Name Cable Conductor Number Signal Name

-DB(12) 35 1 GROUND

-DB(13) 36 2 GROUND

-DB(14) 37 3 GROUND

-DB(15) 38 4 GROUND

-DB(P1) 39 5 GROUND

-DB(0) 40 6 GROUND

-DB(1) 41 7 GROUND

-DB(2) 42 8 GROUND

-DB(3) 43 9 GROUND

-DB(4) 44 10 GROUND

-DB(5) 45 11 GROUND

-DB(6) 46 12 GROUND

-DB(7) 47 13 GROUND

-DB(P) 48 14 GROUND
GROUND 49 15 GROUND
GROUND 50 16 GROUND

TERMPWR 51 17 TERMPWR
TERMPWR 52 18 TERMPWR

RESERVED 53 19 RESERVED

GROUND 54 20 GROUND

-ATN 55 21 GROUND

GROUND 56 22 GROUND

-BSY 57 23 GROUND

-ACK 58 24 GROUND

-RST 59 25 GROUND

-MSG 60 26 GROUND

-SEL 61 27 GROUND

-C/D 62 28 GROUND

-REQ 63 29 GROUND

-I/O 64 30 GROUND

-DB(8) 65 31 GROUND

-DB(9) 66 32 GROUND

-DB(10) 67 33 GROUND

-DB(11) 68 34 GROUND

SONY AIT-5 drive SDX-1100V series Ver.1.0 3-5

3.Installation

3.1.7. Attaching and Removing the Dust Cover

3.1.7.1. Attaching the Dust Cover

(1) Align the dust cover’s hinge clips (one on each side) with the pins of the drive bezel.

• The dust cover should be positioned so that the six magnets on the cover’s back face the drive bezel.

• Holding the dust cover at an angle as shown in the figure below, set the hinge clips on top of the bezel
pins, positioning them so that they bracket the pins.

(2) Press down at an angle on each side in turn until you hear the hinge clips click into place.

(3) Close the dust cover.

Caution:

Do not press the dust cover in horizontally from the side. Doing so could cause the dust cover to break.

This completes attachment of the dust cover.

3-6 SONY AIT-5 drive SDX-1100V series Ver.1.0

3.1.7.2. Removing the Dust Cover

(1) Open the dust cover.
(2) Holding the dust cover at both corners, carefully raise the dust cover.

The dust cover hinge clips and drive bezel pins uncouple.

3.Installation

SONY AIT-5 drive SDX-1100V series Ver.1.0 3-7

3.Installation

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3-8 SONY AIT-5 drive SDX-1100V series Ver.1.0