Sony RG80 Schematic

HCD-DX50/RG80

SERVICE MANUAL

Ver 1.2 2002. 09

•HCD-DX50/RG80 are the tuner,
deck, CD and amplifier section in
MHC-DX50/RG80.

Photo : HCD-DX50

CD CD Mechanism Type CDM58E-30BD60

Section Base Unit Name BU-30BD60

Tape deck Model Name Using Similar Mechanism NEW

Section Tape Transport Mechanism Type TCM-230PWR41C

Canadian Model

HCD-RG80

Australian Model

E Model

HCD-DX50

Model Name Using Similar Mechanism NEW

Optical Pick-up Name A-MAX.3

SPECIFICATIONS

— Continued on next page —

9-929-589-13

2002I1600-1

© 2002.09

MINI HI-FI COMPONENT SYSTEM

Sony Corporation

Home Audio Company

Published by Sony Engineering Corporation

HCD-DX50/RG80

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C
during repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

2

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

HCD-DX50/RG80

TABLE OF CONTENTS

SAFETY CHECK-OUT

After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for A C leakage. Check leakage as
described below.

LEAKAGE

The A C leakag e from any exposed metal part to earth g round and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. F ollow the manufactur ers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated A C voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate lo w-v olta ge
scale. The Simpson 250 and Sanwa SH-63Trd ar e examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)

To Exposed Metal
Parts on Set

1. GENERAL ·········································································· 4

2. DISASSEMBLY ······························································· 7

3. TEST MODE ····································································12

4. MECHANICAL ADJUSTMENTS ····························· 14

5. ELECTRICAL ADJUSTMENTS ······························· 14

6. DIAGRAMS

6-1. Circuit Board Location ················································· 20
6-2. Block Diagrams ···························································· 21
6-3. Schematic Diagram Main Section (1/4) ···················· 23
6-4. Schematic Diagram Main Section (2/4) ···················· 24
6-5. Schematic Diagram Main Section (3/4) ···················· 25
6-6. Schematic Diagram Main Section (4/4) ···················· 26
6-7. Printed Wiring Board Main Section ·························· 27
6-8. Schematic Diagram BD Section ································ 28
6-9. Printed Wiring Board BD Section ····························· 29
6-10. Schematic Diagram AMP Section ···························30
6-11. Printed Wiring Board AMP Section························· 31
6-12. Schematic Diagram Panel Section ··························· 32
6-13. Printed Wiring Board Panel Section ························33
6-14. Schematic Diagram Panel SW Section ···················· 34
6-15. Printed Wiring Board Panel SW Section ·················35
6-16. Schematic Diagram Leaf SW Section ····················· 36
6-17. Printed Wiring Board Leaf SW Section··················· 37
6-18. Schematic Diagram Driver Section ························· 38

6-19. Printed Wiring Board Driver Section ······················· 39
6-20. Schematic Diagram Trans Section···························40
6-21. Printed Wiring Board Trans Section ························ 41
6-22. Printed Wiring Board Switch Section ······················ 42
6-23. IC Pin Function Description ·······································42
6-24. IC Block Diagrams ····················································· 45

0.15µF

Fig. A. Using an AC voltmeter to check AC leakage.

MODEL IDENTIFICATION

— BACK PANEL —

PARTS No.

1.5kΩ

Earth Ground

AC
voltmeter
(0.75V)

7. EXPLODED VIEWS

7-1. Cabinet Section····························································· 47
7-2. Front Panel Section······················································· 48
7-3. Main Board Section ······················································ 49
7-4. Tape Mechanism Section-1 (TCM-230PWR41C)········ 50
7-5. Tape Mechanism Section-2 (TCM-230PWR41C)········ 51
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 52
7-7. Base Unit Section (BU-30BD60) ·································53

8. ELECTRICAL PARTS LIST ······································· 54

MODEL

DX50 : E, SP, AR models

DX50 : KR, MX, AUS/RG80 models

• Abbreviation

AUS : Australian model
SP : Singapore model
KR : Korea model

PARTS No.

4-231-580-0s

4-231-580-2s

MX : Mexican model
AR : Argentina model

3

HCD-DX50/RG80

SECTION 1

GENERAL

This section is extracted from
instruction manual.

4

HCD-DX50/RG80

5

HCD-DX50/RG80

6

SECTION 2

Driver board, Moter board and Address sensor board

Upper case (Top)

Loading panel assy

Front panel section

Panel board

Sub trans board and Main trans board Main board and Power board

Leaf SW board, Head (A) board and Head (B) board

Base unit

Set

DISASSEMBLY

• The equipment can be removed using the following procedure.

Note : Follow the disassembly procedure in the numerical order given.

2-1. UPPER CASE (TOP)

q;

Upper case (Top)

5

Two screws (Case)

qa

9

Four screws (+BVTP 3

HCD-DX50/RG80

×

12)

6

Screw (Case)

Side panel (L)

7

Two screws

(+BVTP 3

8

×

10)

q;

4

Side panel (R)

1

Two screws (Case)

2

Screw (Case)

3

Tw o

screws

(+BVTP 3

×

10)

7

HCD-DX50/RG80

)

2-2. LOADING PANEL ASSY

CD mechanism deck (CDM58E)

1

Turn the pulley to the direction of arrow.

pulley

Front panel side

2

Pull-out the disc tray.

Loading panel

3

2-3. FRONT PANEL SECTION

CD mechanism deck (CDM58E)

4

Screw (+BVTP 3

qf

×

10)

2

Connector

6

Flat type wire (17 core)

8

Screws

(+BVTP 3

qd

5

1

Flat type wire

(21 core)

×

10)

7

3

Screw

(+BVTP 3

9

Connector

×

10)

qs

Screw

(+BVTP 3

×

10)

Screws (+BVTP 3

× 10

q;

Connector

Front panel section

qa

Two screws (+BVTP 3

× 10

)

8

2-4. PANEL BOARD

)

9

Two claws

6

Four claws

7

CD Switch board

qa

Eight screws

(+BVTP 2.6

×

HCD-DX50/RG80

5

Four screws

(+BVTP 2.6

8)

qs

Pad

switch board

q;

Panel board

×

8)

8

Nine screws

(+BVTP 2.6

qd

Five

screws

(+BVTP 2.6

×

×

8)

8)

4

Ring volume

3

Bracket ring

2

Nut

1

Knob (Volume)

2-5. SUB TRANS BOARD AND MAIN TRANS BOARD

q;

Screw (+BVTP 3

qd

Switch board

qg

Sub trans board

1

Connector (CN973)

6

Main

trans board

2

Connector (CN977)

4

Two screws

(+BVTT 4

×

8)

qf

Three

(+BVTP 3

screws

3

(+BVTT 4

×

10)

Two screws

×

8)

qa

Sensor board

×

10)

qf

Tape mechanism deck

9

Back panel

qs

Screw

(+BVTP 3

8

Five screws

(+BVTP 3

7

Two screws

(+BVTP 3

×

×

×

8)

10

10)

5

Power

transformer (T910)

9

HCD-DX50/RG80

)

2-6. MAIN BOARD AND POWER BOARD

4

Three screws (+BVTP 3

5

Power

board

3

Two screws (+BVTP 3

×

16)

×

10)

7

Heat sink

6

Two screws (+BVTT 3

Main board

×

8)

2

Main board

2-7. LEAF SW BOARD, HEAD (A) BOARD AND HEAD (B) BOARD

1

Five claws

1

Two screws (+BVTP 3

2

Leaf

SW board

Remove the four solderings.

×

10

10

4

Head (A) board

3

Screw (+PTT 2

×

6

4)

5

Head (B) board

Screw (+PTT 2

×

4)

2-8. BASE UNIT

2

Holder assy

qa

HCD-DX50/RG80

1

Screw (+PTPWH M2.6)

Base unit

qs

Two insulators

8

Two stoppers

7

Two screws (+BVTP 2.6

6

BD board

5

Rivet

×

8)

2-9. DRIVER BOARD, MOTER BOARD AND ADDRESS SENSOR BOARD

q;

Screw (+PTPWH 2.6

8

×

8)

Motor board

4

Two screws (+BVTP 2.6

qs

Two insulators

q;

Screws (DIA. 12)

9

Tw o

screws (+PTPWH M2.6)

4

Flat type wire (16 core)

3

Flat type wire (21 core)

×

8)

qa

Tray

3

Flat type wire

(8 core)

2

Driver board

1

Screw (+BVTP 2.6

9

Pull-out the disc tray.

qs

Screw (+BVTP 2.6

×

8)

×

6

Flat type wire (8 core)

5

8)

Remove the two solderings of motor.

7

Connector

qd

Address sensor board

11

HCD-DX50/RG80

SECTION 3

TEST MODE

[Cold Reset]

• The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning
the set to the customer.

Procedure:

1. Press three buttons x , ENTER , and ?/1 simultaneously.

2. The fluorescent indicator tube becomes blank instantaneously,

and the set is reset.

[Hot Reset]

• This mode resets the set with the preset data kept stored in the
memory. The hot reset mode functions same as if the power
cord is plugged in and out.

Procedure:

1. Press three buttons x , ENTER , and DISPLAY

simultaneously.

2. The fluorescent indicator tube becomes blank instantaneously,

and the set is reset.

[Tuner Step Change]

• A step of AM channels can be changed o ver between 9 kHz and
10 kHz.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “TUNER”, and press TUNER/BAND b utton

to select the BAND “AM”.

3. Press ?/1 button to turn the set OFF.

4. Press ENTER and ?/1 buttons simultaneously , and the display

of fluorescent indicator tube changes to “AM 9 k STEP” or
“AM 10 k STEP”, and thus the channel step is changed over.

[Function Change Mode]

• Select either VIDEO or MD of the external FUNCTION input.

Procedure:

1. Turn on the power.

2. Hold down MD (VIDEO) b utton then press ?/1 button , and

release ?/1 button first in order not to switch off the set
immediately.
The another function of the previous function is selected , the
input level is also changed and displayed “ MD ” or “VIDEO”.

[GC Test Mode]

• This mode is used to check the software version, FL tube, LED,
keyboard and VACS.

Procedure:

1. Press three buttons x , ENTER , and DISC 2 simultaneously.

2. LEDs and fluorescent indicator tube are all turned on.

3. When you want to enter the software version display mode,

press DISC 1 . The model number and destination are displayed.

4. Each time DISC 1 is pressed, the display changes starting

from MC version, GC version, CD version, CDDM version,
CDMA version, CDMB, version BDA version, BDB version,
ST version, TA version, TM version and TC version in this
order, and returns to the model number and destination display.

5. When DISC 3 is pressed while the version numbers are being

displayed except model number and destination, year, month
and day of the software creation appear. When DISC 3 is
pressed again, the display returns to the software version display .
When DISC 1 is pressed while year, month and day of the
software creation are being displayed, the year, month and day
of creation of the software versions are displayed in the same
order of version display.

6. Press DISC 2 button, and the key check mode is activated.

7. In the key check mode, the fluorescent indicator tube displays
“K0 V0”. Each time a button is pressed, “KEY” value increases.
However, once a button is pressed, it is no longer taken into
account.
“VOL” value increases like 1, 2, 3 ... if rotating VOLUME
knob in “+” direction, or it decreases like 0, 9, 8 ... if rotating in
“–” direction.

8. Also when DISC 3 is pressed after lighting of all LEDs and FL
tubes, value of VACS appears.

9. To exit from this mode, press three buttons in the same manner
as step 1, or disconnect the power cord.

[MC Test Mode]

• This mode is used to check operations of the respective sections

of Amplifier, Tuner , and T ape.

Procedure:

* To enter MC Test Mode

1. Press the ?/1 button to turn on the set.

2. Press the three buttons of x , ENTER and DISC 3
simultaneously.

3. The messages MUSIC, MOVIE, GAME and P FILE flash on
the FL display tube.
The input FUNCTION is Changed to VIDEO.

* Check of Amplifier

1. When f (CURSOR UP) button is pressed, GEQ increases to
its maximum and a message “GEQ MAX” appears.

2. When F (CURSOR DOWN) b utton is pressed, GEQ decreases
to its minimum and a message “GEQ MIN” appears.

3. When g (CURSOR LEFT) or G (CURSOR RIGHT) button
is pressed, GEQ is set to flat and a message “GEQ FLAT”
appears.

4. When the VOLUME control knob is turned clockwise even
slightly, the sound volume incr eases to its maximum and a
message “VOLUME MAX” appears for two seconds, then the
display returns to the original display.

5. When the VOLUME control knob is turned counter -clockwise
even slightly , the sound volume decreases to its minimum and a
message “VOLUME MIN” appears for two seconds, then the
display returns to the original display.

* Check of clock frequency

1. T o check the frequenc y of clock used to run the time in the unit,
the clock output is available at pin 39 (IC 501, MASTER
CONTROL) only during MC test mode.

2. The frequency is 32.768 kHz or so.

* Tuner function

1. In the test mode, the default-preset channel is called ev en when
the TUNER is selected and an attempt is made to call the preset
channel that has been stored in memory. (It means that the
memory is cleared.)

2. The minimum, center and maximum frequency of each band is
set then.

12

HCD-DX50/RG80

* T ape function

1. When a tape is inserted in Deck B and recording is started, the
input source function selects VIDEO automatically.
When CD SYNC/HI-DUB button is pressed during Rec in
function, ALC is turned on.

2. When x button is pressed to stop recording, the Tape (Deck)

B is selected and tape is rewound, tape is rewound using m
button, tape is stops at around the record-starting position and
playback of the recorded portion of the tape is started. If P A USE
is inserted even once during recording, tape is rewound to the
position around the PAUSE position and is played back.

3. When CD SYNC / HI-DUB button is pressed during playback

of Deck B, either normal speed or high speed can be selected
by this button.

* AMS Test Mode

1. Set T APE function

2. Select the desired loop by pressing the PLAY MODE button.

Insert a test tape AMS-110A or AMS-120 to Deck A.

3. Press the SPECTRUM button to enter the AMS test mode.

4. After a tape is rewound first, the FF AMS is checked, and the

mechanism is shut off after detecting the AMS signal twice.

5. Then the REW AMS is checked and the mechanism is shut of f

after detecting the AMS signal twice.

6. When the check is complete, a message of either OK or NG

appears.

[CD Ship Mode (Memory Clear) ]

• This mode moves the pickup to the position durable to vibra­tion. Use this mode when returning the set to the customer after
repair.

Procedure:

1. Press 1/u button to turn the set ON.

2. Press three buttons x , ENTER and GAME simultaneously.

3. After the "STANDBY" display blinks six times, a message

“LOCK” is displayed on the fluorescent indicator tube, and the
CD ship mode is set.

[CD Ship Mode (No Memory Clear) ]

• This mode moves the pickup to the position durable to vibra­tion. Use this mode when returning the set to the customer after
repair.

Procedure:

1. Press 1/u button to turn the set ON.

2. Press CD button and 1/u button simultaneously.

3. After the "STANDBY" display blinks six times, a message

“LOCK” is displayed on the fluorescent indicator tube, and the
CD ship mode is set.

* To return to normal mode again.

1. When you want to exit this mode, press the ?/1 button.

2. The cold reset is enforced at the same time.

[VACS ON/OFF Mode]

• This mode is used to switch ON and OFF the VACS (Variable
Attenuation Control System).

Procedure:

Press the ENTER and SPECTRUM buttons simultaneously. The
message “VACS OFF” or “VACS ON” appears.

[CD Service Mode]

• This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the pickup.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. Press three buttons x , ENTER , and OPEN/CLOSE simul-

taneously.

4. The CD service mode is selected.

M

5. With the CD in stop status, press

to outside track, or press m button to inside track.

6. To exit from this mode, perform as follows:

–

b utton to move the pickup

+

1) Move the pickup to the most inside track.

2) Press ?/1 button to turn the set OFF.

Note: • Always move the pickup to most inside track when exiting from

this mode. Otherwise, a disc will not be unloaded.

• Do not run the sled motor excessively , otherwise the gear can be
chipped.

13

HCD-DX50/RG80

r

SECTION 4

MECHANICAL ADJUSTMENTS

SECTION 5

ELECTRICAL ADJUSTMENTS

Precaution

1. Clean the following parts with a denatured alcohol-moistened
swab:

record/playback heads pinch rollers
erase head rubber belts
capstan idlers

2. Demagnetize the record/playback head with a head
demagnetizer.

3. Do not use a magnetized screwdriver for the adjustments.

4. After the adjustments, apply suitable locking compound to the
parts adjusted.

5. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.

Torque Measurement

Mode Torque meter

FWD

FWD
back tension

REV

REV
back tension

FF/REW

FWD tension

REV tension

CQ-102C

CQ-102C

CQ-102RC

CQ-102RC

CQ-201B

CQ-403A

CQ-403R

Meter reading

3.06 N • m to 6.96 N • m
31 to 71 g • cm

(0.43 – 0.98 oz • inch)

0.19 N • m to 0.58 N • m

2 to 6 g • cm

(0.02 – 0.08 oz • inch)

3.06 N • m to 6.96 N • m
31 to 71 g • cm

(0.43 – 0.98 oz • inch)

0.19 N • m to 0.58 N • m

2 to 6 g • cm

(0.02 – 0.08 oz • inch)

6.96 N • m to 14.02 N • m
71 to 143 g • cm

(0.98 – 1.99 oz • inch)

9.80 N • m

100 g or more

(3.53 oz or more)

9.80 N • m

100 g or more

(3.53 oz or more)

DECK SECTION

1. Demagnetize the record/playback head with a head
demagnetizer.

2. Do not use a magnetized screwdriver for the adjustments.

3. After the adjustments, apply suitable locking compound to the
parts adjust.

4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.

5. The adjustments should be performed in the order giv en in this
service manual. (As a general rule, playback circuit adjustment
should be completed before performing recording circuit
adjustment.)

6. The adjustments should be performed for both L-CH and R­CH.

7. Switches and controls should be set as follows unless otherwise
specified.

• T est Tape

Tape Signal Used for

P-4-A100 10 kHz, –10 dB Azimuth Adjustment

WS-48B 3 kHz, 0 dB Tape Speed Adjustment

P-4-L300J 315 Hz, 0 dB Level Adjustment

Record/Playback Head Azimuth Adjustment

0 dB=0.775 V

DECK A DECK B

Note: Perform this adjustments for both decks

Procedure:

1. Mode: Playback

test tape
P-4-A100
(10 kHz, –10 dB)

set

main board
CN301
Pin 2 (GND)

main board
CN301
Pin 3 (L-CH)
Pin 1 (R-CH)

level mete

+
–

14

HCD-DX50/RG80

e

r

+

–

set

test tape
P-4-L300J
(315 Hz, 0 dB)

main board
CN301 (Pin 3 : L-CH)

(Pin 1 : R-CH)

level meter

2. T urn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1dB of peak.

Output
level

within
1dB

L-CH
peak

R-CH
peak

within
1dB

Screw
position

L-CH
peak

Screw
position

R-CH
peak

3. Mode: Playback

test tape
P-4-A100
(10 kHz, –10 dB)

L-CH

MAIN
board
CN301
set

R-CH

waveform of oscilloscope

in phase 45° 90° 135° 180°

pin 3

pin 2

L

R

pin 1

good

oscilloscop

V

wrong

H

4. After the adjustments, apply suitable locking compound to the
pats adjusted.

Tape Speed Adjustment

Note: Start the Tape Speed adjustment as below after setting to the test

mode.
In the test mode, the tape speed is high during pressing the

DECK B

CD SYNC/HI-DUB button.

Procedure:

1. Turn the power switch on.

2. Press the x button, ENTER button and DISC 3 button
simultaneously.
(The “TEST MODE” on the fluorescent indicator tube display
while in the test mode.)
To exit from the test mode, press the ?/1 button.

Mode: Playback

test tape
WS-48B
(3 kHz, 0 dB)

set

main board
CN301 (Pin 3 : L-CH)

frequency counte

+

–

(Pin 1 : R-CH)

1. Insert the WS-48B into the deck B.

2. Press the gG button on the deck B.

3. Press the CD SYNC/HI-DUB button in playback mode.
Then at HIGH speed mode.

4. Adjust RV1001 on the LEAF SW board so that frequency
counter reads 6,000 ± 30 Hz.

5. Press the CD SYNC/HI-DUB button.
Then back to NORMAL speed mode.

6. Adjust RV1002 on the LEAF SW board so that frequency
counter reads 3,000 ± 15 Hz.

Adjustment Location: LEAF SW board

Playback level Adjustment

DECK A DECK B

Procedure:

Mode: Playback

Adjustment Location: Playback Head (Deck A).

Record/Playback/Erase Head (Deck B).

forward

reverse

1. Confirm that level difference between the channels is with ±

0.5 dB.

2. After check, adjust the following RVs.
Deck A is RV302 (L-CH), Deck B is RV303 (L-CH) so that
adjustment within adjustment level as follows.

Adjustment Level:

CN301 PB level: 334.4 to 748.7 mV (–7.3 to –0.3 dB)

Adjustment Location: MAIN board

Sample Volue of Wow and Flutter: 0.3% or less W. RMS

(WS-48B)

15

HCD-DX50/RG80

e

r

r

REC Bias Adjustment DECK B

Procedure:

In the MC test mode, the “REC memory mode” is convenient for
this adjustment. In the “REC memory mode” , when the REC starts
the input signal FUNCTION is switched to VIDEO automatically.
When the REC stops, the tape returns near to the recording start
position.

1. Press MD (VIDEO) button to select VIDEO. (This step is not
necessary if the above test mode has already been set.)

2. Insert a tape into deck B.

3. After press REC PAUSE/START button, press REC PAUSE/
START button, then recording start.

4. Mode: Record

MD/VIDEO (AUDIO) IN (J101)

1) 315 Hz

2) 10 kHz

AF OSC

attenuator



50 mV (–23.8 dB)




600 Ω

blank tap
CN-123

set

5. Mode: Playback

recorded
portion

set

level mete

+

–

4. Mode: Record

MD/VIDEO (AUDIO) IN (J101)

AF OSC

315 Hz, 50 mV (–23.8 dB)

600 Ω

attenuator

blank tape
CS-123

set

5. Mode: Playback

recorded
portion

set

CN301 (Pin 3 : L-CH)

(Pin 1 : R-CH)

level mete

+

–

6. Confirm the play back signal recorded in step 3 becomes
adjustable level as follows.
If these levels are not adjustable level, adjust the RV301 (L­CH) and RV351 (R-CH) on the MAIN board to repeat steps 4
and 5.

Adjustable level:

CN301 PB level: 47.2 to 53.0 mV (–24.3 to –23.3 dB)
Adjustment Location: MAIN board

[MAIN BOARD] (Component Side)

CN301 (Pin 3 : L-CH)

(Pin 1 : R-CH)

6. Confirm the playback signal recorded in step 3 becomes
adjustable level as follows.
If these levels are not adjustable level, adjust the RV304 (L­CH) and R V354 (R-CH) on the MAIN board to repeat steps 4
and 5.

Adjustable level: Playback output of 315 Hz to playback output

of 10 kHz: ±1.0 dB

Adjustment Location: MAIN board

REC Level Adjustment DECK B

Procedure:

In the MC test mode, the “REC memory mode” is convenient for
this adjustment. In the “REC memory mode” , when the REC starts
the input signal FUNCTION is switched to VIDEO automatically.
When the REC stops, the tape returns near to the recording start
position.

1. Press MD (VIDEO) button to select VIDEO. (This step is not
necessary if the above test mode has already been set.)

2. Insert a tape into deck B.

3. After press REC PAUSE/START button, press REC PAUSE/
START button, then recording start.

T11

RV11

PB LEVEL (L)

(B)

REC LEVEL (R)

(B)

[LEAF SW BOARD] (Component Side)

TAPE SPEED





REC LEVEL (L)

CN301

RV351

REC BIAS (L)

(B)

(NORMAL) (HIGH)

RV1002

RV1001

(B)

13

RV301

REC BIAS (R)

CN1001

RV302

(B)

PB LEVEL (L)

(A)

CN304

CN302

RV303

CN303

RV304

RV354

16

HCD-DX50/RG80

TUNER SECTION

FM Tuned Level Adjustment

FM RF SIGNAL GENERATOR

75 Ω coaxial

set

Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 28 dB (at 75 Ω open)

Procedure:

1. Supply a 98 MHz signal at 28 dB from the ANTENN A terminal.

2. Tune the set to 98 MHz.

3. Adjust R V11 to the point (moment) when the TUNED indicator
will change from going off to going on.

Adjustment Location: MAIN board

Null Adjustment

FM RF SIGNAL GENERATOR

75 Ω coaxial

Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 60 dB (at 75 Ω open)

Procedure:

1. Supply a 98 MHz signal at 60 dB from the ANTENN A terminal.

2. Tune the set to 98 MHz.

3. Measure voltage between pin 22 and pin 3 of IC11. Adjust
T11 until the voltage becomes 0 V.

Adjustment Location: MAIN board

Adjustment Location

[MAIN BOARD] (Component Side)

FM ANTENNA terminal
(TM1)

set

FM ANTENNA terminal
(TM1)

CD SECTION

Note :

1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.

2. Use LUV-P01 (4-999-032-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.

S-Curve Check

Oscilloscope

BD board

TP(FEO)
TP(DVC)

Procedure :

1. Connect an oscilloscope to TP (FEO).

2. Connect between TP (FEI) and TP (DVC) ( 1.65 V) by lead
wire.

3. Turn Power switch on.

4. Load a disc (LUV-P01) and actuate the focus search. (In
consequence of open and close the disc tray, actuate the focus
search)

5. Confirm that the oscilloscope waveform (S-curve) is
symmetrical between A and B. And confirm peak to peak level
within 2 ± 0.5 Vp-p.

S-curve waveform

symmetry

A

within 2 ±0.5Vp-p

B

6. After check, remove the lead wire connected in step 2.

Note : • Try to measure several times to make sure than the ratio

RF Level Check

of A : B or B : A is more than 10 : 7.

• Take sweep time as long as possible and light up the
brightness to obtain best waveform.

BD board

oscilloscope

NULL

T11

RV11

FM TUNED LEVEL

CN301

RV351

TP(RFDC)
TP(RFAC)

TP(DVC)

Procedure :

1. Connect an oscilloscope CH1 to TP (RFDC) and CH2 to TP
(RFAC).

CN304

13

RV301

RV304

CN302

CN303

RV354

RV302

RV303

2. Turn Power switch on.

3. Load a disc (LUV-P01) and playback.

4. Confirm that oscilloscope waveform is clear and check if RF
signal level is correct or not.

17

HCD-DX50/RG80

e

)

Note : Clear RF signal waveform means that the shape “ ◊ ” can be clearly

distinguished at the center of the waveform.

RF signal waveform

VOLT/DIV : 200mV
TIME/DIV : 500ns

level : 0.65 ±0.15Vp-p (RFDC)

1.1 ±0.4Vp-p (RFAC)

E-F Balance (1 Track jump) Check

oscilloscop

BD board

TP(TEO)
TP(DVC)

Procedure :

1. Connect an oscilloscope to TP (TEO) and TP (DVC).

2. Turn Power switch on.

3. Load a disc (LUV-P01) and playback the number nine track.

4. Press the gG button. (Becomes the 1 track jump mode.)

5. Confirm that the level B and A (DC v oltage) on the oscilloscope
waveform.

Adjustment Location:

[BD BOARD] (Conductor Side)

TP (DVC)

TP

15

IC103

16

1

30

(RFDC)

TP

40
41

IC101

60

2021

61

(RFAC)

TP

(FEI)

RV101

TP (FEO)
TP (TEO)

1

80

1 track jump waveform

DVC

level=1.0 ±0.5Vp-p

B

symmetry

center of
waveform

A (DC voltage

6. Adjust RV101 on the BD board so that the center of wav eform
becomes the same voltage of DVC. (i.e. A=0V)

18

SECTION 6

C

B

These are omitted.

E

Q

DIAGRAMS

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)

HCD-DX50/RG80

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/

specified.

¢

•

• C : panel designation.

Note:

The components identi­fied by mark 0 or dotted
line with mark 0 are criti­cal for safety.
Replace only with part
number specified.

• A : B+ Line.

• B : B– Line.

• H : adjustment for repair.

• Voltages and waveforms are dc with respect to ground

• Voltages are taken with a VOM (Input impedance 10 MΩ).

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

• Abbreviation

: internal component.

under no-signal (detuned) conditions.

Voltage variations may be noted due to normal produc­tion tolerances.

Voltage variations may be noted due to normal produc­tion tolerances.

F : FM
f : AM
E : PB (DECK A)
d : PB (DECK B)
G : REC (DECK B)
J : CD
c : digital out

AR : Argentina model
AUS : Australian model
E51 : Chilean and Peruvian model
KR : Korea model
MX : Mexican model
SP : Singapore model

4

W or less unless otherwise

Note:

Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.

Note on Printed Wiring Boards:

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

• Indication of transistor.

Q

B

CE

These are omitted.

19

HCD-DX50/RG80

1

IC501 qa

STOP MODE

3.1Vp-p

32.768kHz

3.8Vp-p

2

IC501 qd

STOP MODE

4

T301 4

TAPE B REC MODE

16MHz

120Vp-p

4.6Vp-p

3

IC51 ws

TUNER (FM)

4.5MHz

80.8kHz

6-1. CIRCUIT BOARD LOCATION

ADDRESS SENSOR board

MOTOR board

DRIVER board

MAIN TRANS board

CD SWITCH board

PANEL board

PAD SWITCH board

LEAF

SW board

HEAD (A) board

HEAD (B) board

• WAVEFORMS

– BD BOARD –– PANEL BOARD –

BD board

SENSOR board

SWITCH board

SUB TRANS board

MAIN board

POWER board

– MAIN BOARD –

1

IC101 ta

(RFAC)(CD Play mode)

2

IC101 ra

(TE)(CD Play mode)

1.1 Vp-p

0.4 Vp-p

3

IC101 el

(FE)(CD Play mode)

4

IC101 wh (MDP)

7.5

µ

s

0.3 Vp-p

2.5 Vp-p

1

IC601 is

STOP MODE

4MHz

3.0Vp-p

20

6-2. BLOCK DIAGRAMS

TUNER/CD SECTION

TM1

1

FM 75Ω

G

AM

ANT IN

FE1

IF OUT

OSC OUT

HCD-DX50/RG80

AM/FM IF MPX

FM IF

1

AM/IF
AM OSC
VCO STOP
IF REQ MUTING

IC11

L OUT

R OUT

AM IF IN

AM MIX OUT

13

14

4

2

BUFFER

R-CH

Q11

IFT11

7
8

VT

5

CF1 CF2

+B A+12V

X51

4.5MHz

Q1

RF IF
AMP

Q2

PLL

IC51

10

1

22

16
19
20
18

FM

XIN

XOUT

FM OSC
A IN
A OUT
PD

FM

AM OSC

VCO STOP

IF REQ

IF IN

DO

+B

RV11

7

15

9
8

12

DO

6

DI

DI
CL
CE

DI

4

CL

5

CE

3

11
24
12
10

LPF11

LPF

L-CH

A

MAIN

SECTION

• R-CH is omitted due to same as L-CH.

• Signal Path

: FM

: CD

: DIGITAL OUT

OPTICAL
PICK-UP

BLOCK

(A-MAX.3)

+5V

2

11

Q101

LD

DRIVE

RB41

M102

SLED

MOTOR

M101

SPINDLE

MOTOR

AM RF IN

1

10

RF AMP

IC103

VC

27

RFAC

A

6

RFDCO

B

7

RFDCI

C

8

D

9

E

10

F

11

LD

1

PD

2

IC102

MOTOR/COIL DRIVE

CH1RO

13

CH1FO

14

CH2RO

11

CH2FO

12

CH3RO

18

9

FE

FEI

TE

CH1RI

CH1FI

CH2RI

CH2FI

CH3RI

8

7
3

6

DIGITAL SERVO

DIGITAL SIGNAL PROCESSOR

D/A CONVERTER

IC101

D OUT

60

15
28
29
16
17
18

3

2

6

5

23

RFAC

51

RFDC

43

39

41
40

33

32

31

30

29

FE

TE
SE

FFDR

FRDR

TFDR

TRDR

SRDR

L OUT

R OUT

DATA
CLOK

XLAT
SQCK
SCLK
SCOR
SQSO

SENS

SSTP

XTAI

XTAO

72

75

20

27

66

67

R-CH

5
7
6
2
9

1
8

X101

16.9344MHz

21

AM OSC

23

VCC

23

AFC

22

IC201

OPTICAL

DIGITAL

OUT

13 12 12

STEREO

OPTICAL

11 10 34

TUNED

6
7

L OUT

IC202

B

MAIN

SECTION

9856

Q102
+3.3V

REG

DVDD+3.3V

DO

DI
CL
CE

MASTER CONTROL

IC501(1/2)

TUNED

3

STEREO

2

ST MUTING

21

ST DIN

25

ST DOUT

23

ST CLK

27

ST CE

22

BU PWM2

26

BU PWM3

24

BU PWM1

28

35

CD DATA

37

CD CLK

42

XLT

33

SQ CLK

19

SCOR

32

SQ DATA

34

SENS

OPEN SW

CLOSE SW

BU UP/DOWN SW

LOAD IN

T SENS

IC701

44

45LOAD OUT

49

46
47

48

9

MOTOR

DRIVE

7

TBL ADDRESS

4

2

IC711

SENSOR

M

S701

OPEN/CLOSE

S711

BU UP/

DOWN

M721
TURN

MOTOR

M

17

16

CH3FO

CH4RO

CH3FI

SFDR

24

25CH4INS

28

MDP

26

XRST

XRST

3

43

M

CH4FO

15

MUTING

20

2121