Sony RCDW-50-C Service manual

RCD-W50C

SERVICE MANUAL

Ver 1.1 2003. 12

Model Name Using Similar Mechanism NEW

CD Section

CD-R/CD-RW
Section

CD Mechanism Type CDM53L-30B61B
Base Unit Type BU-30BBD61B
Optical Pick-up Type A-MAX.3
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM65-RBD1
Base Unit Type RBD1
Optical Pick-up Type KRM-220CAA

US Model

Canadian Model

E Model

DECK A (the CD player section)

System Compact disc digital audio
Laser Semiconductor laser (λ =

Frequency response 20 Hz – 20,000 Hz (±0.5

DECK B (the CD-R and CD-RW
recording section)

System Compact disc digital audio
Laser Semiconductor laser (λ =

Playable discs CD, CD-R, CD-RW
Recordable discs CD-R, CD-RW (for music

Frequency response 20 Hz - 20,000 Hz (±0.5

system
780 nm)

Emission duration:
continuous

dB)

system
780 nm)

Emission duration:
continuous

use)
dB)

SPECIFICATIONS

Inputs

ANALOG IN
(Phono jacks) Impedance: 47 kilohms

DIGITAL OPTICAL IN
(Square optical connector jack)

Outputs

ANALOG OUT
(Phono jacks) Impedance: 47 kilohms

DIGITAL OPTICAL OUT
(Square optical connector jack)

PHONES
(Phono jack) Load impedance: 32 ohms

Rated input: 500 mVrms
Minimum input
250 mVrms

Optical wavelength:
660 nm

Rated output: 2 Vrms
Load impedance: over
10 kilohms

Wavelength: 660 nm
Output level: –18 dBm

Output level: 12mW

COMPACT DISC RECORDER

General

Power requirements
North American model: 120 V AC, 60 Hz
Other models: 110-120/220-240V AC,

Power consumption 25 W
Dimensions (approx.) (w/h/d) incl. projecting parts
and control 430 × 108 × 399 mm

Mass (approx.) 6.8 kg
Supplied accessories

Design and specifications are subject to change
without notice.

50/60 Hz

3

/8 × 15 3/4 inch)

( 17 × 4
(15 lbs)

• Audio connecting cords
Phono jack × 2 (red/white) ↔
Phono jack × 2 (red/white) (2)

• Remote commander (remote) (1)

• Size AA (R6) batteries (2)

9-874-151-02

2003L16-1
© 2003.12

Sony Corporation

Home Audio Company
Published by Sony Engineering Corporation

RCD-W50C

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

The following caution label is located inside the apparatus.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

SAFETY CHECK-OUT

After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for A C leakage. Check leakage as
described below.

LEAKAGE

The A C leakage from any e xposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follo w the manufacturers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated A C voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-volta ge
scale. The Simpson 250 and Sanwa SH-63Trd are e xamples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)

To Exposed Metal

Parts on Set

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C
during repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

0.15 µF

Fig. A. Using an A C v oltmeter to check A C leakage.

MODEL IDENTIFICATION

— BACK PANEL —

PARTS No. MODEL

4-238-401-0π
4-238-401-1π
4-238-401-3π

1.5 kΩ

Earth Ground

US
Canadian
E

AC
Voltmeter
(0.75 V)

Parts No.

2

TABLE OF CONTENTS

RCD-W50C

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

1. SERVICING NOTE·····················································4

2. GENERAL ···································································5

3. DISASSEMBLY··························································6

3-1. Case (409538) ······························································· 7
3-2. Loading Panel (CDR) ··················································· 7
3-3. Front Panel Section······················································· 8
3-4. CD-SW Board, LED Board, DISPLAY Board ············· 8
3-5. CD Mechanism Deck (CDM65-RBD1) ······················· 9
3-6. Tray··············································································· 9
3-7. CDR Board ································································· 10
3-8. Holder (MG) Sub Assembly, Dust Cover ··················· 10
3-9. Optical Pick-Up (KRM-220CAA)······························ 11
3-10. Motor Assembly (Loading) (M201) ··························· 11
3-11. Cam (CH)···································································· 12
3-12. MAIN Board ······························································· 12
3-13. CD Mechanism Deck (CDM53L-30B61B) ················ 13
3-14. Fitting Base (Magnet) Assembly ································ 13
3-15. CLAMP MOTOR Board,

Motor (Clamp) Assembly (M701)······························ 14
3-16. Fitting Base (Guide) Assembly, Bracket (Chassis) ····· 14
3-17. Tray (Sub) ··································································· 15
3-18. Chassis (Mold B) ························································ 15
3-19. LOAD MOTOR Board,

Motor (Loading) Assembly (M702) ···························16
3-20. Stocker Section ··························································· 16
3-21. Slider (Selection), Tension Spring (Shutter),

Slider (Shutter)···························································· 17
3-22. Gear (Gear A), Gear (Gear B), Gear (U/D Slider)······ 17

Precaution During Gear (Gear U/D Slider),

Gear (Gear B), Gear (Gear A) Installation·················· 18
3-23. Gear (Chucking) ························································· 18
3-24. BD Board ···································································· 19
3-25. Optical Block Section ················································· 19

4. TEST MODE ···································································· 21

5. ELECTRICAL ADJUSTMENTS ······························· 24

CD SECTION ····························································· 24

CD-R/RW SECTION·················································· 25

6. DIAGRAMS······································································ 55

6-1. Block Diagrams – CD-R Section – ··························· 56

6-2. Printed Wiring Board – BD Section – ························ 59
6-3. Schematic Diagram – BD Section – ··························· 60
6-4. Printed Wiring Board

6-5. Schematic Diagram
6-6. Printed Wiring Board – CD-R Section (Side A) – ······ 63

6-7. Printed Wiring Board – CD-R Section (Side B) – ······ 64
6-8. Schematic Diagram – CD-R Section (1/4) – ·············· 65
6-9. Schematic Diagram – CD-R Section (2/4) – ·············· 66
6-10. Schematic Diagram – CD-R Section (3/4) – ·············· 67
6-11. Schematic Diagram – CD-R Section (4/4) – ·············· 68
6-12. Printed Wiring Board – MAIN Section (Side A) – ····· 69
6-13. Printed Wiring Board – MAIN Section (Side B) –····· 70
6-14. Schematic Diagram – MAIN Section (1/2) – ············· 71
6-15. Schematic Diagram – MAIN Section (2/2) – ············· 72
6-16. Printed Wiring Board – LED Section – ······················ 73
6-17. Schematic Diagram – LED Section – ························· 74
6-18. Printed Wiring Board – DISPLAY Section – ············· 75
6-19. Schematic Diagram – DISPLAY Section – ················ 76
6-20. IC Block Diagrams ····················································· 77
6-21. IC Pin Functions Description······································80

– CD Section – ······························· 57
– POWER/DISPLAY Section –······ 58

– SENSER/MOTOR/SW Section – ·····61
– SENSER/MOTOR/SW Section – ·····62

7. EXPLODED VIEWS ······················································ 54

7-1. Case Section··································································90
7-2. Front Panel Section ······················································· 91
7-3. Chassis Section ····························································· 92
7-4. Overall Section (CDM53L-30B61B)···························· 93
7-5.

Chassis (Mold) Assembly Section (CDM53L-30B61B) ··
7-6. Chassis Section (CDM53L-30B61B) ··························· 95
7-7. Optical Block Section ··················································· 96
7-8. CDM65-RBD1 ······························································ 97

94

8. ELECTRICAL PARTS LIST······································· 98

3

RCD-W50C

SECTION 1

SERVICING NOTE

Self-diagnosis Function

When the self-diagnosis function is activated to
prevent the player from malfunctioning, three
character service numbers in a combination
with a message appears in the display. In this
case, check the following table.

Message

C12/
Cannot Copy

C13/
Rec Error

C14/
TOC Error

C41/
Cannot Copy

C71/
Din Unlock

Explanation

You are trying to record a disc that
cannot be played back in DECK-A
or with an external device, such as
CD-ROM or VIDEO CD.

• Remove the disc, and then insert a
music CD for playback.

Recording has not been completed
successfully because of vibration.

• Relocate the unit in a place free of
vibration and restart the recording
again.

The disc you try to record is
excessively dirty (such as oil­stained or finger marked) or
scratched. Or the disc is not
normal.

• Replace the disc with another one
and restart the recording again.

The unit did not read the TOC
information.

• Insert other discs.

The sound source you are trying to
record is a copy of a commercial
music software. Or you are trying
to record on a CD-R/CD-RW
digitally.

• Because of the restriction of the
Serial Copy Management System,
you cannot record a copy of a
commercial music software.
Neither can you record a CD-R/
CD-RW digitally.

If this message is displayed
momentarily, this is not an error. It
is caused by the digital signal
during recording.

During recording of a digital sound
source, the connecting cable has
been disconnected or the player of
the sound source has turned off.

• Connect the cable or turn on the
digital player.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.

LASER DIODE AND FOCUS SEARCH OPERATION
CHECK

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.

4

SECTION 2

GENERAL

RCD-W50C

2 5 978 q;

e;
wl

wgwh ws

1 POWER button
2 H button
3 DISC 1 to DISC 5 A button and indicators
4 CD SYNCHRO NORMAL button

3

41

qh PLAY MODE button
qj TIME button
qk DISPLAY button
ql YES button

6

qa
qs
qd

qgqhqjqkqlw;wd wawfwjwk

qf

5 CD SYNCHRO HIGH button
6 OPEN/CLOSE A button
7 H button
8 INPUT button
9 FINALIZE button
q; ERASE button
qa SBM button and indicator
qs REC z button
qd X button
qf REC LEVEL knob
qg x button

w; l AMS L knob
wa CLEAR button
ws MENU/NO button
wd l AMS L knob
wf CLEAR button
wg PLAY MODE button
wh TIME button
wj x button
wk PHONES jack
wl X button
e; PHONE LEVEL knob

5

RCD-W50C

Note : Disassemble the unit in the order as shown below.

SECTION 3

DISASSEMBLY

SET

CASE (409538)

LOADING PANEL (CDR)

TRAY

CDR BOARD

HOLDER (MG) SUB ASSEMBLY, DUST COVER

MAIN BOARD

CD MECHANISM DECK (CDM53L-30B61B)

FITTING BASE (MAGNET) ASSEMBLY

MOTOR ASSEMBLY (LOADING) (M201)

FRONT PANEL SECTION

CD MECHANISM DECK (CDM65-RBD1)

CD-SW board, LED board, DISPLAY board

OPTICAL PICK-UP (KRM-220CAA)

CLAMP MOTOR BOARD, MOTOR (CLAMP) ASSEMBLY

CAM (CH)

FITTING BASE (GUIDE) ASSEMBLY,
BRACKET (CHASSIS)

BD BOARD

OPTICAL BLOCK SECTION

TRAY (SUB)

CHASSIS (MOLD B)

SLIDER (SELECTION), TENSION SPRING (SHUTTER),
SLIDER (SHUTTER)

GEAR (GEAR A), GEAR (GEAR B), GEAR(U/D SLIDER)

GEAR (CHUCKING)

LOAD MOTOR BOARD,
MOTOR (LOADING) ASSEMBLY

STOCKER SECTION

6

Note : Follow the disassembly procedure in the numerical order given.

3-1. Case (409538)

4

case (409538)

2

two

screws

(case 3 TP2 3

× 8

)

3

two

screws

(case 3 TP2 3

1

two

screws

(case 3 TP2 3

RCD-W50C

× 8

)

× 8

)

3-2. Loading Panel (CDR)

4

loading panel

two hooks

(CDR)

3

2

CD mechanism deck (CDM65-RBD1)

1

Slide the lever (cam (CH)) to the direction of arrow.

Front panel side

lever (cam (CH))

7

RCD-W50C

3-3. Front Panel Section

4

connector (2core)(CN920)

5

three

screws

(+BVTP 3

×

8)

1

connector (2core)(CN900)

2

connector (3core)(CN690)

7

t

wo claws

6

four screws

(+BVTP 3

×

8)

3-4. CD-SW Board, LED Board, DISPLAY Board

7

four

claws

2

two knobs (AMS)

3

flexible flat cable

(21core) (CN671)

8

front panel section

HARNESS PROCESSING

CD-SW board

5

three

screws

(+BVTP 2.6

×

4

CD-SW board

8)

1

8

knob (AMS)

9

LED board

6

twelve

(+BVTP 2.6

screws

qa

DISPLAY board

×

8)

8

Remove the soldering.

q;

flexible flat cable

(21core) (CN700)

3

four

screws

(+BVTP 2.6

×

8)

3-5. CD Mechanism Deck (CDM65-RBD1)

1

Slide the lever (cam (CH)) to the direction of arrow.

4

t

ray

2

Pull the tray while pressing the claw of

the chassis in the direction of the arrow.

3

Pull the tray while pressing the claw of the chassis and the claw

of the tray in the direction of the arrow.

front panel side

lever (cam (CH))

claw

claw

chassis

chassis

3

4

CD mechanism deck

(CDM65-RBD1)

four

screws (+BVTP 3

×

RCD-W50C

8)

2

flexible flat cable

(11core) (CN630)

1

connector

(CN631)

3-6. T ray

9

RCD-W50C

r

3-7. CDR Board

2

bottom plate

9

CDR board

5

(11core) (CN103)

flexible flat cable

1

four

screws

(+BVTP 2.6

3

flexible flat cable

(32core) (CN101)

×

8)

6

c

law

8

c

onnector

(2 core) (CN104)

3-8. Holder (MG) Sub Assembly, Dust Cover

3

holder (MG)

sub assembly

1

two claws

4

flexible flat cable

(11core) (CN102)

7

c

law

4

three s

(+BVTP 2.6

crews

5

dust cove

×

8)

10

2

two claws

3-9. Optical Pick-Up (KRM-220CAA)

)

2

1

two step screws

two screws

((2X9) (G with), +p tappin)

6

optical pick-up

(KRM-220CAA)

RCD-W50C

3

two insulators (main)

3-10. Motor Assembly (Loading) (M201)

2

Remove the belt (loading) from the

pulley of the motor assembly.

4

two insulators (main)

5

flexible flat cable

(32core) (from optical device

1

Slide the cam (CH) to the direction of arrow.

3

t

wo claws

4

m

otor assembly

(loading) (M201)

11

RCD-W50C

)

3-11. Cam (CH)

5

holder (BU) sub assembly

1

1

1

2

Slide the cam (CH) to the

q;

direction of arrow
pressing the claw.

A

A

while

6

(+PTPWH 2.6

qs

cam (CH)

screw

7

×

8)

g

ear (C)

3-12. MAIN Board

1

4

qd

two

screws

(+BVTT 3

1

3

qs

(+BVTT 3

×

6)

cam (CH)

four

screws

× 6

claw

qa

)

qg

power transformer

8

claw

9

g

ear (B)

8

connector

(4core) (CN631)

6

connector

(2core) (CN900)

1

flexible flat cable

(21core) (CN671)

2

connector

(3core) (CN690)

7

flexible flat cable

(23core) (CN660)

5

flexible flat cable

(17core) (CN640)

4

connector

(5core) (CN641)

qf

Remove the soldering.

qh

MAIN board

9

screw

(+BVTP 3

3

flexible flat cable

(11core) (CN630)

×

8)

q;

bracket

qa

three

(+BVTP 3

(TR)

screws

×

8

12

3-13. CD Mechanism Deck (CDM53L-30B61B)

2

four

screws (+BVTP 3

5

CD mechanism deck

(CDM53L-30B61B)

4

flexible flat cable

(17core) (CN701)

×

RCD-W50C

8)

1

connector

(CN641)

3

flexible flat cable

(23core) (CN101)

3-14. Fitting Base (Magnet) Assembly

3

fitting base (magnet)

assembly

2

four screws

(+BTTP M2.6 )

1

connector
(CN710)

13

RCD-W50C

)

3-15. CLAMP MOTOR Board, Motor (Clamp) Assembly (M701)

1

belt (mode)

5

motor (clamp)

assembly (M701)

4

CLAMP MOTOR

board

2

two screws

(+BTTP M2.6)

3-16. Fitting Base (Guide) Assembly, Bracket (Chassis)

2

four screws

3

fitting base
(guide) assembly

1

two connectors
(CN709, 715)

(+BVTP 2.6

×

8)

4

two screws

(+BVTP 2.6

3

Remove the two solderings.

×

8)

6

bracket
(chassis)

5

three screws

(+BVTP 2.6

×

8

14

3-17. T ray (Sub)

)

1

three screws

(+BTTP M2.6 )

2

Insert the gear (eject)
under the gear (LD
deceleration).

1

Insert the portion A of
chassis (mold B)
into the portion B of
slider (selection).

gear (eject)

portion A

portion B of
slider (selection)

3

g

ear (eject)

2

c

hassis (mold B)

chassis (mold B)

PRECAUTION DURING CHASSIS (MOLD B) INSTALLATION

1

Rotating the pulley (LD), shift the slider (selection) in the arrow A direction.

2

Rotating the pulley (mode) in the arrow direction, adjust the tray (sub) to be removed.

3

Rotating the pulley (LD), shift the slider (selection) in the arrow B direction.

4

Rotating the pulley (mode) in the arrow direction, remove the tray (sub) to be removed.

slider (selection)

pulley (LD)

RCD-W50C

stocker section

tray (sub)

3-18. Chassis (Mold B)

A

B

pulley (mode

15

RCD-W50C

3-19. LOAD MOTOR Board, Motor (Loading) Assembly (M702)

1

belt (communication)

2

3

belt (loading1)

belt (loading1)

7

motor (loading)

assembly (M702)

6

LOAD MOTOR

board

3-20. Stocker Section

2

two step screws

4

two screws

(+BTTP M2.6)

4

stocker section

5

Remove the two solderings.

PRECAUTION DURING STOCKER
SECTION INSTALLATION

Hook the portion A of tray (SUB)
to the slider (selection).

portion A
of tray (SUB)

sticking of
slider (selection)

16

1

gear (gear A)

3

two step screws

3-21. Slider (Selection), Tension Spring (Shutter), Slider (Shutter)

)

1

two floating screws

(+PTPWHM 2.6 x 6)

2

4

slider (selection),
tension spring (shutter),
slider (shutter)

washer

3

compression

spring (gear)

RCD-W50C

PRECAUTION DURING SLIDER
(SELECTION) INSTALLATION (2)

Insert the slider (selection)
into the portion A.

portion A

3-22. Gear (Gear A), Gear (Gear B), Gear (U/D Slider)

6

gear (gear B)

7

screw

(+BTTP M2.6)

8

gear (U/D slider)

PRECAUTION DURING SLIDER
(SELECTION) INSTALLATION (1)

gear (chuking)

Insert a convex portion into
the groove of gear (chucking).

slider (selection)

5

gear (gear A)

3

2

washer

compression spring

4

gear (selection

1

gear (relay)

17

RCD-W50C

Precaution During Gear (Gear U/D Slider), Gear (Gear B), Gear (Gear A) Installation

3

gear (gear B)

portion A

Adjust the gear (gear B) with the
portion A as shown.

slider (U/D)

1

Slide the slider (U/D)
fully in the arrow
direction.

4

2

gear (U/D slider)

slider (U/D) gear

gear (gear A)

gear
(gear B)

linearly

Adjust the gear so that it meshes with
the bottom tooth of slider (U/D) gear,
as shown.

3-23. Gear (Chucking)

PRECAUTION DURING
GEAR (CHUCKING) (2)

rotary encoder
(S707)

NG

OK

Align with the slot of
rotary encoder.

PRECAUTION DURING
GEAR (CHUCKING) (1)

rotary encoder (S707)

gear
(chucking)

2

1

Adjust so as to be aligned with
gear B linearly, as shown.

3

gear (chucking)

rotary encoder (S707)

18

Align marking.

3-24. BD Board

2

Remove soldering from the four points.

4

BD board

1

flexible flat cable

(16core) (CN102)

3

hook

RCD-W50C

3-25. Optical Block Section

4

3

shaft (BU holder)

gear (chucking)

optical block section

2

1

two floating screws

(+PTPWHM 2.6)

Rotate the pulley (LD) in the direction of 2 to move
the shaft (BU holder) upper.

gear (chucking)

19

RCD-W50C

MEMO

20

SECTION 4

TEST MODE

RCD-W50C

Setting the Test Mode

Procedure:

1. Press the POWER button to POWER on.

2. Pr ess the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.

3. Turn the l AMS L (DECK B) knob to select the men u.

4. Pr ess the l AMS L (DECK B) knob to execute the test
mode.

Releasing the Test Mode

Procedure 1:

1. Turn the l AMS L (DECK B) knob to select the Ship
Mode.

2. Pr ess the l AMS L (DECK B) knob to execute the Ship
Mode.

3. Press the POWER button to POWER off.

Procedure 2:

1. Pr ess the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.

2. Press the POWER button to POWER off.

Contents of test mode

No. Display Function

1 SYS Version System version display
2 CDR Version CDR version display
3BU Test Deck A BU test mode
4 SERVICE Deck A Service mode
5 Ship Mode CD Shipment mode
6 FL ALL ON Fluorescent indicator tube test
7 FL ALL OFF Fluorescent indicator tube test
8 FL ITIMATSU Fluorescent indicator tube test

9 LED CHECK LED check
10 KEY CHECK Keyboard check
11 RM CHECK Remote commander check
12 CDR History CDR error history display
13 Play Speed Deck A x4 speed

System Version Display

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SYS Version”, and press the l AMS L
(DECK B) knob.

2. The system version is displayed.

3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

4. Press the POWER button to POWER off.

CDR Version Display

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR Version”, and press the l AMS L
(DECK B) knob.

2. The CDR version is displayed.

3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

4. Press the POWER button to POWER off.

BU Test Mode (Deck A)

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “BU Test”, and press the l AMS L
(DECK B) knob.

2. “bdt S CURVE” is displayed. This test mode is used in the Elec­trical Adjustment section.

3. T urn the l AMS L (DECK B) knob. “bdt RAM READ”,
“bdt RAM WRITE”, “bdt COMOUT”, “bdt FB TUNE” and “bdt
ERR RATE” are displayed.

4. To exit from this mode, press the MENU/NO button and turn
the l AMS L (DECK B) knob to display “bdt ERR
RATE”.

5. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.

6. Press the POWER button to POWER off.

Service Mode (Deck A)

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SERVICE”, and press the l AMS L
(DECK B) knob.

2. “SERVICE MODE” is displayed.

3. Press the ERASE button, the “SLED OUT” is displayed and
the sled moves to the outermost position.

4. Press the FINALIZE button, the “SLED IN” is displayed and
the sled moves to the innermost position.

5. Press the l AMS L (DECK B) knob, then “SERVICE
MODE” is displayed again.

6. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.

7. Press the POWER button to POWER off.

Note: Always move the pick-up to the most inside position when

exiting from this mode.

Ship Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob.

2. “Push POWER!” is displayed.

3. Press the POWER button to POWER off.

FL ALL ON Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL ON”, and press the l AMS L
(DECK B) knob.

2. All segments of fluorescent indicator tube and all LEDs turn on.

3. Press the MENU/NO button, then “FL ALL ON” is displayed
again.

4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

5. Press the POWER button to POWER off.

21

RCD-W50C

FL ALL OFF Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL OFF”, and press the l AMS L
(DECK B) knob.

2. All segments of fluorescent indicator tube and all LEDs turn off.

3. Press the MENU/NO button, then “FL ALL OFF” is displayed
again.

4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

5. Press the POWER button to POWER off.

FL ITIMATSU Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ITIMATSU”, and press the l AMS
L (DECK B) knob.

2. Checkered patterns of segments are displayed.

3. Press the MENU/NO button, then “FL ITIMATSU” is displayed
again.

4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

5. Press the POWER button to POWER off.

LED Check Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “LED CHECK”, and press the l AMS L
(DECK B) knob.

2. Turn the l AMS L (DECK A) or (DECK B) knob clock-
wise. The green LED (DISC 1) turns on, then the orange LED
(DISC 1) turns on. The each orange LED turns on after the green
LED from DISC 1 to DISC 5. The LED (SBM) turns on at last.
Counterclockwise rotation gives a performance in re verse order .

3. Press the MENU/NO button, then “LED CHECK” is displayed
again.

4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

5. Press the POWER button to POWER off.

KEY Check Mode

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “KEY CHECK”, and press the l AMS L
(DECK B) knob.

2. “Got l keys” is displayed.

3. Press the buttons, and when all the buttons are pressed (without
the POWER button), “Got 36 keys” will be displayed.

4. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.

5. Press the POWER button to POWER off.

Remote Commander Check

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “RM CHECK”, and press the l AMS L
(DECK B) knob.

2. Press the H key on the remote commander, then “Got
PlayCom” is displayed.
Press the MENU/NO button, then “RM CHECK” is displayed again.

3.

4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

5. Press the POWER button to POWER off.

CDR History Display

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR History”, and press the l AMS L
(DECK B) knob.

2. “00 ######## ########” is displayed as the first error hitory.

3. Turn the l AMS L (DECK B) knob to select the error
history. The number of error histories is ten in all.
(Refer to “Contents of CDR error history”.)

4. Press the MENU/NO button, then “CDR History” is displayed
again.

5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

6. Press the POWER button to POWER off.

Play Speed Selection Mode (Deck A)

Procedure:

1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Play Speed”, and press the l AMS L
(DECK B) knob.

2. “x4 Play” is displayed. If a CD is in the deck A, pressing the
H button executes the 4 times speed playback.

3. Press the x button to stop the playback.

4. Press the MENU/NO button, then “Play Speed” is displayed
again.

5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.

6. Press the POWER button to POWER off.

Contents of CDR error history

display(example)

1 2

3 4

00 05070D80
000E2E0D

5 6

(hexadecimal)

1 Order of the error history

00 to 09: ten error histories in all

2 Error contents

01: unable to focus on
02: Q code/ATIP discontinuous (several frames preceding)
03: Q code/ATIP unreadable
04: search taking more than sixteen seconds
05: focus failure
06: sled over run
07: not passing by start time to write
08: audio buffer over
09: sync failure
OA: Spindle lock taking more than 8 secouds

example : 05 is focus failure

22

RCD-W50C

3 Operation mode

bit 7: Speed

0: normal speed
1: x4 speed

bit 6 to bit 0: Number of inner condition

01: POWER off condition/during shift to POWER on
02: POWER off and shipment setting/during shift to POWER

off and shipment setting
03: stop condition/during stop
04: during start up of servo
05: during TOC reading and others
06: during CD TEXT reading
07: during standby(waiting for command from the CD sys-

tem)/during search
08: during playback
09: during manual search(playback)

0A:during pause
0B:during manual search(pause)
0C:during OPC
0D:recording standby/during recording pause

(enable to shift to recording)
0E: during recording
0F: unable to record (waiting for shift to being recordable)
10: PMA updating
11: during operation of unfinalize
12: during operation of finalize
13: PMA erasing
14: emergency
15: recording preparation
16: recording end

5 Write POWER (integer of mW x 10, availab le during write

processing)

examples: 00 means unavailable

(when 3 operation mode is not recording)
: A3 means 163(decimal), i.e. 16.3 mW

6 ATIME (min)/(sec)/(frame)

example: 0E, 2E, 0D means 14 : 46 : 13

Abbreviations:

ATIP : Absolute Time In Pre-groove
OPC : Optimum POWER Control
PMA : Program Memory Area

examples :

bit

HEX

77654 321

0000 0111

07

00

1001 0001

91

11 1

4 Start time of read in(compression method)

bit 15 to bit 13 : (min)

0: 97 min
1: 96 min
2: 95 min
7: others

bit 12 to bit 7: (sec)
bit 6 to bit 0: (frame)

examples :

HEX

bit

0 Operation mode

normal speed, during

standby(waiting for
command from the CD
system)/during search

during operation of

0000 1101 1000 0000

0D,80

97(min) 27(sec)

x4 speed,

unfinalize

7

654 321

0(frame)

015 14 13 12 11 10 9 8 Start time of read in

97 : 27 : 00

11,16

0001 0001 0001 0110

34(sec)97(min) 22(frame)

97 : 34 : 22

23

RCD-W50C

)

e

p

e

+
–

BD board

TP (TE)

TP (DVC)

oscilloscope

(DC range)

SECTION 5

ELECTRICAL ADJUSTMENTS

CD SECTION (DECK A)

Note :

1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.

2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.

S Curve Check

Connection :

oscilloscop

(DC range)

BD board

TP (FE)

TP (DVC)

Procedure :

1. Connect an oscilloscope to test point TP (FE) and TP (DVC) on
the BD board.

2. Turn the power on.

3. Load the disc (YEDS-18).

4. Enter the test mode, select the BU Test asd press the l
AMS L (DECK B) knob to display “bdt S CURVE”.

5. Press the l AMS L (DECK B) knob. “LD AL” is
displayed and playback starts automatically.

6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 3.6 ±

0.5 Vp-p.

7. Press the MENU/NO button to stop playback.

8. Exit from the test mode.
(Refer to the TEST MODE Section)

+
–

Note: A clear RF signal waveform means that the shape “◊” can be

clearly distinguished at the center of the waveform.

VOLT/DIV : 200mV
TIME/DIV : 500ns

level : 1.1 ± 0.3Vp-p

E-F Balance (1 Track jump) Check

Connection :

Procedure:

1. Connect an oscilloscope to TP (TE) and TP (DVC).

2. Turn the power on.

3. Load the disc (YEDS-18) and playback the number five track.

4. Press the X (DECK A) button.
(Becomes the 1 track jump mode.)

5. Confirm the level B and A (DC voltage) on the oscilloscope
waveform.

Center of
waveform

B

0V

A (DC voltage

symmetry

A

within 3.6

B

VOLT/DIV : 1V
TIME/DIV : 2ms

±

0.5 Vp-

Note: Try to measure several times to make sure than the ratio of A

: B or B : A is more than 10 : 7.

RF Level Check

Connection :

oscilloscop

(AC range)

BD board

TP (RFAC)

TP (DVC)

+
–

Procedure :

1. Connect an oscilloscope to TP (RFAC) and TP (DVC).

2. Turn the power on.

3. Load the disc (YEDS-18) and playback the number five track.

4. Confirm that oscilloscope waveform is clear and check RF signal
level is correct or not.

24

level=1.1 ±0.6Vp-p

Specification level: x 100=less than ±22%

A
B

Symmetry

[BD BOARD] — SIDE A —

TP (DVC)

TP (TE)

TP (FE)

IC104

IC101

IC103

TP (RFAC)

CD-R/RW SECTION

*The following is the method of locating the faulty point and

electrical adjustment.

1. Connection and Setting of Programs

PC

3

(w/ SerialI/F)

RCD-W50C

1-1. Connection

5

Oscilloscope

(A)

MPXOUT

To
RCD-W50C

(B) (C) (D)

0-756-358-11
CDM65-RBD1 SERVICE

RESET

Jig

CONTROL FIRM

(B) (C) (D)

COM1

8

RS-232C

Jig

2

9

Cables for Jig connecting

Cable

6

Laser Power
Meter

7

Test Disc

CDM65-RBD1

jig

1

CDM65-RBD1

4 Fig. Position of Jig (Set the jig after removing the cover of CDM65-RBD1)

25

RCD-W50C

1-2. Equipments to prepare

1 Test Object Both RBD1 and CDM65-RBD1 shall be tested.

RBD1 : Flash Memory Writing of of

Circuit Test by Self-diagnostics

CDM65-RBD1 : Electrical Adjustment

Performance Test

2 Jig (With 9 Cables, Parts No.J-2501-223-A)
3 PC Windows95/98/2000/Me with COMport (RS-232C)
4 Programs TeraTerm Pro + Service macro
5 Oscilloscope More than 150MHz
6 Laser Power Meter LEADER LPM-8001 (Parts No.J-2501-046-A)
7 Test Disc

PATD-012 : (Parts No.4-225-203-1) Adjustment for Playback (CD,CD-R)
TCD-W091W : (Parts No.J-2501-226-A) Adjustment for Playback (CD-RW)
CRM74 (Blank CD-R) : Adjustment and Check for Recording (CD-R)
CWM74 (Blank CD-RW) : Check for Recording (CD-RW)
TCD-W032W : (Parts No.J-2501-227-A) Defocus tolerance (CD-RW)

8 RS-232C Cable

L=2000mm

(E)

D-sub 9pin Female cross cable

54321

9876

1
2
3
4
5
6
7
8
9

54321

9876

1
2
3
4
5
6
7
8
9

9 Cables for Jig connecting

:mandatory
: not use

L=300mm

(A)

PH 5p

(B)

PH 4p

(C)

FFC 11p 1.0mm pitch (J-2501-200-A)

(D)

FFC 5p 1.0mm pitch (J-2501-212-A)

26

1-3. Setting of Programs (Tera Term Pro and Service macro)

* Confirmation of System (Windows 98 is used in this explanation) Preparation for Terminal software

1) Set up the serial port from OS.
a) Select Start → Settings → Control Panel and select System →

Device manager → Communication Port (COMn)

(see Fig. 1-1)

* Specify the COM port that connected with JIG of CDM65.

RCD-W50C

b) Double click COMn (as you connect to the Jig-CDM65)

Set the parameters as below.

Bits per second : 38400
Data bits : 8
Parity : non
Stop bits : 1
Flow control : hardware

(see Fig.1-2)

4 Fig. 1-1

4 Fig. 1-2

27

RCD-W50C

Ver 1.1 2003.12

c) Press “Advanced...” button (see Fig.1-2)

Remove the check “Use FIFO buffers ...”

(see Fig.1-3)

4 Fig. 1-3

2) Unzip the file “ttermp23.zip” by PC.

(The file “ttermp23.zip” is distributed together with the service manual.)

3) After unzip the files, you can find setup.exe.

Double click the setup.exe.
Please install as the installer is.
Do not change the directory that files are installed. (use default)

4) Unzip the file “files-0208.zip” by PC.

Copy all “ttl” file and “FUNC” folder which are contained in “files-0208” and paste them in the “Ttermpro” file as below.
(The file “files-0208.zip” is distributed together with the service manual.)

Ttermpro

01ldp_S.ttl

...

10vwdcC_S.ttl

FUNC

AMS.ttl

...

VERCHK.ttl

4 Fig. 1-4

Note : Do not change the directory path.

5) Start-up the TeraTermPro

Double click the ttermpro.exe.

6) Set up the TeraTermPro (IMPORTANT!!)

a) Select Setup → Serial Port... and set the parameters as below.

Port : (As you connect to the Jig-CDM65)
Baud rate : 38400
Data : 8 bit
Parity : none
Stop : 1 bit
Flow control : hardware
Transmit delay : 0 msec/char 10 msec/line

After settings, press “OK” button. (see Fig.1-5)

28

4 Fig. 1-5

b) Terminal setup

Set the parameters as below.

New-line receive : CR

transmit : CR

After settings, press “OK” button. (see Fig.1-6)

c) General setup

Select the language and press “OK” button. (see Fig.1-7)

RCD-W50C

4 Fig. 1-6

4 Fig. 1-7

d) Saving the setup

Select Setup → Save setup... and save as teraterm.ini in the
Ttermpro directory. (see Fig.1-8)

7) Connect the JIG and CDM65.

8) Confirm the S510 on JIG is ‘CONTROL’.

9) Power on the CDM65 and press SW101(RESET) on JIG.

“CDM65-RBD1 has connected with this PC (^^)” is displayed.

(see Fig.1-9)

If above message is not displayed, you may hav e some mistakes.
Please confirm previous setting procedures again.

4 Fig. 1-8

4 Fig. 1-9

29

RCD-W50C

2.

Repair Works That Require Electrical Adjustment

In the case of repair works as shown below, electrical adjustment is required.

Locating the faulty point

KRM-220CAA

is replaced.

No

RBD1

is replaced.

No

The parts shown

in the List (1)

is replaced.

No

Electrical adjustment

is not required.

Yes

Yes

Yes

Electrical adjustment

30

List (1) : IC101, IC103, IC171, IC201, IC502

3. Locating the Faulty Point

3-1. Laser Power Check

1) Select the menu as follows. Control → Macro, and select

LDPtestL_S.ttl.
Press “Open”. (Fig. 3-1, 3-2)

RCD-W50C

4 Fig. 3-1

4 Fig. 3-2

2) Press the “RESET” button (SW101) of the jig as prompted by the display.

3) Place probe of a laser power meter in the specified position

following the display as shown in Fig. 3-3. (See Fig. 3-3-a)

4 Fig. 3-3

sensor probe

CDM65-RBD1

jig

optical pick-up

4 Fig. 3-3-a

Note : Do not add stress to an optical pick-up.

31

RCD-W50C

4) When the display shown in Fig. 3-4 appears, set the Range of a

laser power meter to “1 mW” and press “OK”.

5) Check that the laser power meter reading satisfies the following

requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-5)

LEADER LPM-8001 : 0.76 to 0.86 mW

4 Fig. 3-4

6) When the display shown in Fig. 3-6 appears, set the Range of a

laser power meter to “10 mW” and press “OK”.

7) Check that the laser power meter reading satisfies the following

requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-7)

LEADER LPM-8001 : 4.5 to 4.7 mW

4 Fig. 3-5

4 Fig. 3-6

4 Fig. 3-7

8) Check that the laser power meter reading satisfies the following

requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-8)

LEADER LPM-8001 : 9.2 to 9.6 mW

32

4 Fig. 3-8

9) Check that the message “Power Check End” appears on display .

(Fig. 3-9)

If the measurement result is outside the specification value,
either perform section 4. CDM65-RBD1 Electrical Adjustment
(see page 39), or locate the cause of the error by performing
the Laser Deterioration Judgment.

3-2. Laser Deterioration Judgment

1) Select the menu as follows. Control → Macro, and select

10vwdcC_S.ttl.
Press “Open”. (Fig. 3-10, 3-11)

RCD-W50C

4 Fig. 3-9

4 Fig. 3-10

4 Fig. 3-11

2) Press the “RESET” button (SW101) of the jig as prompted by the display.

3) When the message [OK] appears as shown in Fig. 3-12, press
the “OK” button.
When the laser unit KRM-220CAA (Op) is normal without
deterioration of laser, the message [OK] appears. If the laser
unit is deteriorated, the message [NG] appears. Then, replace
the laser unit KRM-220CAA (Op).

4 Fig. 3-12

33

RCD-W50C

4) Check that the message “CDRW VWDC-CHECK completed!”

appears. (Fig. 3-13)

NG Judgment Result Indication

When the present VWDC value of the laser unit KRM-220CAA
(Op) does not satisfy the required specification, the message
“VWDC (Line End - Now) [NG]” appears.

Measure: Check the peripheral of CN101.
Replace KRM-220CAA.

4 Fig. 3-13

3-3. Use of Self Diagnosis Function-1 (In the case when result data of the past electrical adjustment, is not needed.)

Perform the self diagnosis as described below in the case when electrical adjustment is not performed yet, or when result data of the
electrical adjustment in the past, is not needed and ready to be erased.)

1) Connect the CDM65-RBD1 (abbreviated as CDM65 hereafter) that is going to be repaired, the jig and a PC following the Connection
Diagram as shown in section 1-1.

2) Turn on the power of the RCD-W50C in which the CDM65 is installed.

3) Start up the TeraTermPro that is installed in PC. Set the switch S510 on the jig to “CONTROL”.

4) Press the “RESET” button (SW101) of the jig. (Fig. 3-14)

4 Fig. 3-14

5) Type portchk [Enter] from keyboard of PC. (Fig. 3-15)

Note 5-1 : When the KRM-220CAA is connected, the spindle

motor rotates at a high speed. If the message “H8/
3064 Port Check END!” appears, press the “RESET”
button and stop the spindle.

Note 5-2 : When the CDM65 (loading mechanism) is installed,

ignore the message “PA (#93-100): NG”.

Confirm that “OK” is displayed in all items except for the cases
as described above.

If “NG” is displayed in any item, it is assumed that the pin
number of IC501 as shown in Fig. 3-15 is defective or its
peripheral has abnormality. Perform the repair wor k again and
repeat the self diagnosis. Repeat the repair work and self
diagnosis until OK is displayed.

34

4 Fig. 3-15

6) Type diagno [Enter] from keyboard of PC.

Note 6-1 : When the KRM-220CAA is connected, the spindle

motor rotates at a high speed. If the message
“Diagnosis END!” appears, press the “RESET”
button and stop the spindle.

Note 6-2: When the KRM-220CAA is connected (i.e. when

the FFC for optical laser unit is connected to CN101
is connected), ignore the message “ AK8567 (w/o OP)
check: NG”.

Confirm that “OK” is displayed in all items except for the cases
as described above.

If “NG” is displayed in any item, it is assumed that the point
indicated by the item in Fig. 3-16 is defective or its peripheral
has abnormality . Perform the repair work a gain and repeat the
self diagnosis. Repeat the repair work and self diagnosis until
“OK” is displayed.

7) Perform the operation check.

3-4. Use of Self Diagnosis Function-2

(In the case when result data of the past electrical adjustment, should be left saved.)

4 Fig. 3-16

RCD-W50C

Perform the self diagnosis as described below in the case when the faulty point could not be identified e ven after completion of the repair
work that is defined as “The repair work in which electrical adjustment is not required” in section “2. Repair Works That Require
Electrical Adjustment”.

1) Select the menu as follows. Control → Macro, and select

E2bkupF.ttl.
Press “Open”. (Fig. 3-17, 3-18)

4 Fig. 3-17

4 Fig. 3-18

35

RCD-W50C

2) Type the filename in which result of electrical adjustment is
going to be saved. Press “OK”. (Fig. 3-19)

3) Confirm that the message “completed!” appears.
The EEPROM data is backed up. (Fig. 3-20)

4 Fig. 3-19

4 Fig. 3-20

4) Perform step 1) through step 6) of section “3-3. Use of Self Diagnosis Function-1”.

5) Select the menu as follows. Control → Macro, and select E2recvF.ttl.
Press “Open”.

6) Press the “RESET” button (SW101) of the jig as prompted by
the display. (Fig. 3-21)

4 Fig. 3-21

7) Type the filename in which result of electrical adjustment is
saved. Press “OK”. (Fig. 3-22)

36

4 Fig. 3-22

8) Confirm that the message “completed!” appears.

The EEPROM data is recovered. (Fig. 3-23)

4 Fig. 3-23

9) Perform the operation check.

3-5. Acquisition of Error History and Acquisition of Elapsed Operating Hours

RCD-W50C

Check if error has occurred or not by performing the following steps. If error has occurred, it is interpreted and saved in the specific
directory. Check contents of the error by viewing the specific directory as described below.

1) Select the menu as follows. Control → Macro, and select

ErrHistGetAll_S.ttl.
Press “Open”. (Fig. 3-24, 3-25)

4 Fig. 3-24

4 Fig. 3-25

37

RCD-W50C

2) Press the “RESET” button (SW101) of the jig as prompted by the display.

3) When there is no error, the display as shown in Fig. 3-26
appears.

4 Fig. 3-26

4) When error has occurred, the display as shown in Fig. 3-27
appears showing error history. Contents of the errors are
displayed as shown in Fig. 3-28 after interpretation of the error
log. Check the contents of the error by looking at the file
“EEPROM_Errorlog.txt” in the TeraTermPro directory

5) The elapsed operating hours is shown at the top of
“EEPROM_Errorlog.txt” regardless of presence/absence of the
error history. Check the elapsed operating hours from the
display as shown in Fig. 3-28.

4 Fig. 3-27

SN = xxxx

Op elapsed time: 12:0:56
Spindle elapsed time: 17:9:44

**** Error Log data(0) ****
Error Pointer= 38
Error Code= 05,04,E0,00,00,01,0D,0D
Focus is dropped
1x speed
Servo wakeup
Lead In Start Time= 7:0:0
Laser Power= 0
ATIME= 1:13:13

**** Error Log data(-1) ****
Error Pointer= 30
Error Code= 05,04,E0,00,00,00,14,43
Focus is dropped
1x speed
Servo wakeup
Lead In Start Time= 7:0:0
Laser Power= 0
ATIME= 0:20:67

38

4 Fig. 3-28 : Error log example

4. CDM65-RBD1 Electrical Adjustment

4-1. Laser Power Adjustment

1) Start up the TeraTermPro and set the switch S510 on the jig to “CONTROL”.

2) Select the menu as follows. Control → Macro, and select

01ldp_S.ttl.
Press “Open”. (Fig. 4-1)

4 Fig. 4-1

RCD-W50C

3) Press the “RESET” button (SW101) of the jig as prompted by the display.

4) Press the “RESET” button (SW101) of the jig again as prompted by the display.

5) When the display as shown in Fig. 4-2 appears, type the serial

number (see Fig. 4-3) that is printed on the label attached to
the RBD1. (This dialog appears only when the EEPROM IC502
is replaced.)

4 Fig. 4-2

4 Fig. 4-3

When the display as shown in Fig. 4-4 appears, press “No”.

When the display as shown in Fig. 4-5 appears after that, press
“Yes”.

4 Fig. 4-4

4 Fig. 4-5

39

RCD-W50C

6) When the display as shown in Fig. 4-6 appears, place the probe
of the laser power meter on top of the optical laser unit, and
press “OK”. (See Fig. 3-3-a, page 31)

7) When the display as shown in Fig. 4-7 appears, set the Range
of a laser power meter to “1 mW” and press “OK”.

8) Adjust the laser output power as follows.
The laser output power (i.e., laser power meter reading) should
satisfy the specification shown below.

LEADER LPM-8001 : 0.81 +/- 0.05 mW (0.76 to 0.86 mW)

*To increase the laser output power

Press [Yes] of the “Up?” dialog box.

*To decrease the laser output power

Press [No] of the “Up?” dialog box and then press [Y es] of the
“Down?” dialog box.

4 Fig. 4-6

4 Fig. 4-7

Repeat until the laser output power satisfies the specification.

(Fig. 4-8, 4-9)

*When the setting value is determined

Press [No] of the “Up?” dialog box
and then press [No] of the “Down?” dialog box
and press [Yes] of the “Save?” dialog box. (Fig. 4-10)

9) When the display shown in Fig. 4-11 appears, set the Range of
a laser power meter to “10 mW” and press “OK”.

4 Fig. 4-8

4 Fig. 4-9

4 Fig. 4-10

4 Fig. 4-11

40

10) Adjust the laser output power as follows.
The laser output power (i.e., laser power meter reading) should
satisfy the specification shown below.

LEADER LPM-8001 : 4.6 +/- 0.1 mW (4.5 to 4.7 mW)

*To increase the laser output power

Press [Yes] of the “Up?” dialog box.

*To decrease the laser output power

Press [No] of the “Up?” dialog box
and then press [Yes] of the “Down?” dialog box.

Repeat until the laser output power satisfies the specification.

(Fig. 4-12, 4-13)

RCD-W50C

4 Fig. 4-12

*When the setting value is determined

Press [No] of the “Up?” dialog box
and then press [No] of the “Down?” dialog box
and press [Yes] of the “Save?” dialog box. (Fig. 4-14)

11) Adjust the laser output power as follows.
The laser output power (i.e., laser power meter reading) should
satisfy the specification shown below.

LEADER LPM-8001 : 9.4 +/- 0.2 mW (9.2 to 9.6 mW)

*To increase the laser output power

Press [Yes] of the “Up?” dialog box.

*To decrease the laser output power

Press [No] of the “Up?” dialog box
and then press [Yes] of the “Down?” dialog box.

Repeat until the laser output power satisfies the specification.

(Fig. 4-15, 4-16)

4 Fig. 4-13

4 Fig. 4-14

4 Fig. 4-15

*When the setting value is determined

Press [No] of the “Up?” dialog box
and then press [No] of the “Down?” dialog box
and press [Yes] of the “Save?” dialog box. (Fig. 4-17)

4 Fig. 4-16

4 Fig. 4-17

41

RCD-W50C

12) When the display shown in Fig. 4-18 appears, remov e probe of
the laser power meter and press OK.

13) Check that the message “Laser Power CAL completed!”
appears. (Fig. 4-19)
NG Judgment Result Indication

4 Fig. 4-18

4 Fig. 4-19

4-1-1. Sled Speed NG!

Contents : This message appears when the movement performance of sled is outside the specification.
Measure : Check if there is any abnormality in the sled drive circuit (IC171 peripheral) and the sled drive mechanism.

4-1-2. Power CAL NG!

Contents : This message appears when the laser emission intensity is outside the specification.
Measure : Check peripheral of CN101.
Replace KRM-220CAA.

4-2. CD/CD-R Playback Adjustment

1) Select the menu as follows. Control → Macro, and select 02cdr_S.ttl.
Press “Open”.

2) Place the test CD disc PATD-012 on the tray as prompted by
the display and press “OK”. (Fig. 4-20)

4 Fig. 4-20

3) Press the “RESET” button (SW101) of the jig as prompted by the display.

4) As prompted by the message shown in Fig. 4-21, check that
the waveform as sho wn in Fig. 4-22 appears on an oscilloscope.

42

4 Fig. 4-21

Note :The clear RF signal waveform means that the shape “ ” can be clearly distinguished at the center of the waveform.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-22

5) As prompted by the message shown in Fig. 4-24, check that
the waveform as sho wn in Fig. 4-23 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

RCD-W50C

4 Fig. 4-23

6) As prompted by the message shown in Fig. 4-26, check that
the waveform as sho wn in Fig. 4-25 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-25

7) Check that the message “CDR PB-CAL completed!” appears.

NG Judgment Result Indication

4-2-1. Playback Measurement NG!

4 Fig. 4-24

4 Fig. 4-26

Contents : This message appears when the BLER (Block Error Rate) during playback is outside the specification.
Measure : Check if there is any abnormality in RBD1.
Replace KRM-220CAA.

43

RCD-W50C

4-3. CD-RW Playback Adjustment

1) Select the menu as follows. Control → Macro, and select 03cdr_S.ttl.

Press “Open”.

2) Place the test CD TCD-W091W on the tray as prompted by

the display and press “OK”. (Fig. 4-27)

4 Fig. 4-27

3) Press the “RESET” button (SW101) of the jig as prompted by the display.

4) As prompted by the message shown in Fig. 4-29, check that
the waveform as sho wn in Fig. 4-28 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-28

5) As prompted by the message shown in Fig. 4-31, check that
the waveform as sho wn in Fig. 4-30 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-30

6) As prompted by the message shown in Fig. 4-33, check that
the waveform as sho wn in Fig. 4-32 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-29

4 Fig. 4-31

44

4 Fig. 4-32

4 Fig. 4-33

7) Check that the message “CDRW PB-CAL completed!” appears.

(Fig. 4-34)

RCD-W50C

NG Judgment Result Indication

4-3-1. Playback Measurement NG!

Contents: This message appears when the BLER (Block Error Rate) during playback is outside the specification.
Measure : Check if there is any abnormality in RBD1.
Replace KRM-220CAA.

4-4. CD-R Recording Adjustment and Self Record/Playback Check

1) Select the menu as follows. Control → Macro, and select 04cdr_S.ttl.

Press “Open”.

2) Place the test CD disc PATD-012 on the Deck A. Place the
recording CD-R disc (see Note: 4-4-1) on the tray (Deck B) as
prompted by the display and press “OK”. (Fig. 4-35)

Note : 4-4-1
The disc to be used in this step.

* Use the CD-R disc CRM74 for audio, that is manufactured by

Sony.

* The disc that is used by this step cannot be used for the general

purposes and for the purpose of operation check of the RCD
series equipment. The disc that is used for the general purposes
or for the purpose of operation check of the RCD series
equipment, cannot be used in this step.

* If the recording is interrupted by any reasons during the

recording operation (i.e., the WRITE POWER ON LED of the
jig is lighting), the disc cannot be used any more in the
subsequent step. Use the un-used brand new disc and repeat
this step from the very beginning again.

4 Fig. 4-34

4 Fig. 4-35

3) When the disc that is used in step 2) is the disc that has been

used in the electrical adjustment in the past........ Press “Yes”.

When the disc that is used in step 2) is a completely blank disc.

...... Press “No”. (Fig. 4-36)

Note: The recording CD-R disc can be used only for the

electrical adjustment. The recording CD-R disc must be
controlled so that it must not be used for any other
applications.

4 Fig. 4-36

45

RCD-W50C

4) Press the H button of Deck A. After playback starts, press

“OK”. (Fig. 4-37)

5) When the message as shown in Fig. 4-38 appears some seconds
later, select 4x of the test mode (refer to page 22, Play Speed
Selection Mode (Deck A)) PLAYBACK SPEED. Then press
the H button of Deck A. After playback starts, press “OK”.

6) As prompted by the message shown in Fig. 4-40, check that
the waveform as sho wn in Fig. 4-39 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-37

4 Fig. 4-38

4 Fig. 4-39

7) As prompted by the message shown in Fig. 4-42, check that
the waveform as sho wn in Fig. 4-41 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-41

8) Check that the message “CDR REC-CHECK completed!” appears.
NG Judgment Result Indication

4-4-1. CD-R Playback Measurement NG!

4 Fig. 4-40

4 Fig. 4-42

Contents : This message appears when the BLER (Block Error Rate) *Beta/m11 of the track that is recorded and played back, is outside

the specification.
Measure : Check if there is any abnormality in RBD1.
Replace KRM-220CAA.

46

4-5. CD-RW Recording Adjustment and Self Record/Playback Check

1) Select the menu as follows. Control → Macro, and select 05cdrw_S.ttl.

Press “Open”.

2) Place the test CD disc PATD-012 on the Deck A. Place the

recording CD-RW disc (see Note: 4-5-1) on the tray (Deck

B) as prompted by the display and press “OK”. (Fig. 4-43)

RCD-W50C

Note : 4-5-1

The disc to be used in this step.

* Use the CD-RW disc CWM74 for audio, that is manufactured

by Sony.

* The disc that is used by this step cannot be used for the general

purposes and for the purpose of operation check of the RCD

series equipment as it is. The disc that is used for the general

purposes or for the purpose of operation check of the RCD

series equipment, cannot be used in this step.

When you want to use the CD-R W disc for other applications,

erase the CD-RW disc.

* If the recording is interrupted by any reasons during the

recording operation (i.e., the WRITE POWER ON LED of the

jig is lighting), the disc cannot be used any more in the

subsequent step. In such a case, erase the CD-RW disc and

repeat this step from the very beginning again.

3) When the disc that is used in step 2) is the disc that has been

used in the electrical adjustment in the past........ Press “Yes”.

When the disc that is used in step 2) is a completely blank disc.

......... Press “No”. (Fig. 4-44)

Note : The recording CD-RW disc can be used only for the

electrical adjustment. The recording CD-R W disc must
be controlled so that it must not be used for any other
applications.

4 Fig. 4-43

4 Fig. 4-44

4) Press the H button of Deck A. After playback starts, press
“OK”. (Fig. 4-45)

5) When the message as shown in Fig. 4-46 appears some seconds
later, select 4x of the test mode (refer to page 22, Play Speed
Selection Mode (Deck A)) PLAYBACK SPEED. Then press
the H button of Deck A. After playback starts, press “OK”.

4 Fig. 4-45

4 Fig. 4-46

47

RCD-W50C

6) As prompted by the message shown in Fig. 4-48, check that
the waveform as sho wn in Fig. 4-47 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-47

4 Fig. 4-48

7) As prompted by the message shown on display, check that the waveform as shown in Fig. 4-49 appears on an oscilloscope.

RF signal waveform

VOLT/DIV : suitable value
TIME/DIV : 500ns

4 Fig. 4-49

8) Check that the message “CDRW REC-CHECK completed!”
appears. (Fig. 4-50)

NG Judgment Result Indication

4 Fig. 4-50

4-5-1. CD-RW Playback Measurement NG!

Contents : This message appears when the BLER (Block Error Rate) *Beta/m11 of the track that is recorded and played back, is outside

the specification.
Measure : Check if there is any abnormality in RBD1.
Replace KRM-220CAA.

48

4-6. VWDC Check

1) Select the menu as follows. Control → Macro, and select 06vwdc_S.ttl.

Press “Open”.

2) As prompted by the message shown in Fig. 4-51, remove the
disc from the tray and press “OK”.

4 Fig. 4-51

3) Because this step saves the result of electrical adjustment in a
file, there can be a case that the dialog as shown in Fig. 4-52
appears.

When you want to overwrite.....................Press “Yes”.

When you want to create a new file..........Press “No”.

4 Fig. 4-52

4) Check that the message “CDRW VWDC-CHECK completed!”
appears. (Fig. 4-53)

RCD-W50C

NG Judgment Result Indication

4 Fig. 4-53

4-6-1. EEPROM Write NG!

Contents : This message appears when writing data into EEPROM fails.
Measure : When the steps of 01ldp_S.ttl through 05cdrw_S.ttl have no problem and the error occurs only in this step, it is assumed that

an error has occurred momentarily in the interface between PC and CDM65. Therefore, repeat execution of 06vwdc_S.ttl
again.

4-6-2. VWDC judge [Line Top - End] [NG]

Contents : This message appears when the VWDC value is outside the specification.
Measure : It is assumed that the optical laser unit has deteriorated. If this error occurs after the KRM-220CAA is replaced, the adjustment

error in the step of 01ldp_S.ttl is assumed. Therefore, repeat execution of steps of 01ldp_S.ttl through 05cdrw_S.ttl again. In
the cases other than above, check if the laser power adjustment is correctly performed or not, using LDPtestL_S.ttl.

49

RCD-W50C

4-7. NG Message List

Message Cause

Tray OPEN NG! The tray has not opened within the specified time.
Tray Close NG! The tray has not closed within the specified time.
SLEDIN NG! The sled has not moved toward inner circumference within the specified time.
SLEDOUT NG! The sled has not moved toward outer circumference within the specified time.
RIDR NG! The RID information could not be read out within the specified time.
SNread (1) NG! The SN (1) information could not be read out within the specified time.
SNread (2) NG! The SN (2) information could not be read out within the specified time.
SNread (3) NG! The SN (3) information could not be read out within the specified time.

FBIASADJ NG! The Focus Bias Adjustment has not completed within the specified time.
FEOSADJ NG! The FE Offset Adjustment has not completed within the specified time.
FESAMPADJ NG! The FE Amplitude Adjustment has not completed within the specified time.
RFACCHK NG! The RFAC amplitude is abnormal or the adjustment has not completed within the specified time.
RPINWADJ1 NG! The Read Power (during Write1) Adjustment has not completed within the specified time.
RPINWADJ2 NG! The Read Power (during Write2) Adjustment has not completed within the specified time.
SERVOSET NG! The Servo Setting has not completed within the specified time.
TSa NG! The ATIME Search has not completed within the specified time.
PLAYSW NG! The Play operation has not started within the specified time.
STOP NG! The Stop operation has not completed within the specified time.
AMS NG! The AMS operation has not completed within the specified time.

ATIPPLAY NG! The ATIP Play operation has not started within the specified time.
END TNO get NG! The record-end track information could not be obtained within the specified time.
LEADOUT info.get NG! The record-end time information could not be obtained within the specified time.
Invalid EndTrackNo./LeadoutTime ! The illegal record-end track and its time information were obtained.
Use the Blank disc The disc exceeding the allowable limit is used.
DIR unlock! The equipment could not be synchronized with the signal connected to DIN2.
RWP NG! The CD-R Write Power setting has not completed within the specified time.
RWWP NG! The CD-RW Write Power setting has not completed within the specified time.
REC NG! The record operation could not be started within the specified time.

50

5. Operation Check

5-1. Erasing the Error History

1) Select the menu as follows. Control → Macro, and select
ErrHistClear.ttl.
Press “Open”. (Fig. 5-1, 5-2)

RCD-W50C

4 Fig. 5-1

4 Fig. 5-2

2) Press the “RESET” button (SW101) of the jig as prompted by the display.

3) Check that the message “completed!” appears. (Fig. 5-3)

4 Fig. 5-3

51

RCD-W50C

5-2. Playback Check using TCD-W032W

1) Install the CDM65 in the equipment and install the TCD-W032W in Deck B.

2) Rotate the l AMS L (Deck B) knob to select the track 16. Start playback by pressing the same knob or by pressing the H
(Deck B) button.

3) Perform playback for 10 seconds or more and confirm that there is no abnormality such as sound skipping and others.

52

RCD-W50C

Supplementary Information

Method to Erase the CD-RW Disc

*Erase it in the following procedure, to reuse the CD-RW disc to electrical adjustment, or to use a disc other than blank.
* Be sure to erase it in the following procedure, to use the disc used for electrical adjustment for other uses.

1) Select the menu as follows. Control → Macro, and select

RWeraseA.ttl.
Press “Open”. (Fig. A-1, A-2)

2) Press the “RESET” button (SW101) of the jig as prompted by

the display. (Fig. A-3)

4 Fig. A-1

4 Fig. A-2

4 Fig. A-3

53

RCD-W50C

3) Check that the time display as shown by the arrow mark in Fig.
A-4 is updated after a while.

4 Fig. A-4

4) When update of time display is stopped and rotation of spindle is stopped, press the STOP button (SW501) of the Jig, and then press the
EJECT button (SW508) of the jig to remove the disc.

54

SECTION 6

d

DIAGRAMS

RCD-W50C

THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in
each block.)

For schematic diagrams.
Note:

• All capacitors are in µF unless otherwise noted. p : pF. 50 WV or
less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/

f

•

• C : panel designation.

• A : B+ Line.

• B : B– Line.

• H : adjustment for repair.

•Voltages and waveforms are dc with respect to ground under no-

•Voltages are taken with a VOM (Input impedance 10 MΩ).

•Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

: internal component.

Note:

The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

signal (detuned) conditions.
No mark : STOP

Voltage variations may be noted due to normal production toler­ances.

Voltage variations may be noted due to normal production toler­ances.

J : CD PLAY
E : CD-R PLAY (ANALOG OUT)
a : CD-R REC (ANALOG IN)
k : CD-R REC (CD)

For printed wiring boards.
Note:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

a

•

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

: Through hole.

• Indication of transistor

W or less unless otherwise specified.

4

Note:

Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.

• Waveform

1

IC103 qg (RFAC)

200mV/DIV, 400ns/DIV

2

IC101 us (XTAO)

1V/DIV, 10ns/DIV

3

IC101 i; (EQRF)

200mV/DIV, 400ns/DIV

4

IC201 <zn, (XTAL)

2V/DIV, 20ns/DIV

5

IC501 yj (XTAL)

1V/DIV, 40ns/DIV

6

IC1 ek (X2)

1.2Vp-p

4.4Vp-p29.5ns

1.0Vp-p

5.8Vp-p29.5ns

1.3Vp-p50ns

• Circuit Board Location

HP board

POWER-SW board

SENSOR board

LOAD MOTOR board

SENSOR 2 board

LED board

CLAMP MOTOR board

INIT/COUNT SW board

BD board

MAIN boar

CDR board

OUT SW board

IN SW board

VOL-SEL board

C
Q

B

E

CEB

Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor B) the pattern face are indicated.
Parts face side: Parts on the par ts face side seen from
(Component A) the parts face are indicated.

These are omitted.

These are omitted.

1V/DIV, 20ns/DIV

CONNECTOR

CD SW board

3.9Vp-p50ns

DISPLAY board

board

5555

RCD-W50C

6-1. Block Diagrams – CD-R Section –

OPTICAL

PICK-UP BLOCK

(KRM-220CAA)

CN121

FE

TE

FOR SERVICE

(TO JIG)

MPXOUT

WLDON

A

ENC
OUT

THERM

OUT

LD-VCC

PD-VCC

PD-VC

FPD-VC

FPDO

A

B

C

D

E

F
G

H

VWDC1

VRDC

ENBL

OSCEN

WE1

WE2

FCS+

FCS-

TRK+

TRK-

VWDC2

DIN1

DIN2

DOUT

SDATAI(HOST)

XREQ

SDATAO(HOST)

XRDY

RESET

+2.5V-2

+2.5V-1

FCS+

FCS-

TRK+

TRK-

+5V A

RLDON

OSCEN

WE1

WE2

M201

LOADING

MOTOR

SLED

MOTOR

IC103

IC103

FCS+

FCS-

TRK+

TRK-

M

M

RF AMP

IC101

RRFVC(1V)

86

HAVC

99

AGND2

34

FPDO

18

AIN

91

BIN

92

CIN

93

DIN

94

EIN

95

FIN

96

GIN

97

HIN

98

VWDC

27

VWDCN

29

VWDCN2

28

VRDC

20

VRDCN

21

VRDCN2

22

AUX3

84

COIL/MOTOR DRIVE

IC171

OUT1+

2

OUT1-

1

OUT4+

26

OUT4-

27

OUT2+

12

OUT2-

13

OUT3+

18

OUT3-

17

MPXOUT

RSBETA

VRDSW

VWDSW

AGCON

RCCMPI

BCENT

PHBETA

BHBETA

XTAND

RECD2

GAINUP

SPRFTR

WFPDSH

RFPDSH

SPBLVL

SPDSH

MPDSP

MCLK1

4

FWD

REV

MUTE

LDIN

VREF

IN1-1

IN4-1

IN3

EQRF

XLAT

ATFG

DFCT

CD DEC/ENC

IC201

EFM IN

80

85

66SDATA

65SCLK

67
68XRST

64

63

62
38

73

2

3
4

41
43

TZC

42

37

58WLDON

59RLDON

FOK

52

FE

10

9TE

39

46

61

57

56

60

55

54

48

MIRR

47MIRR

RC

45RC

16

15

7

+8V

19

+2.5V-1

23

3

25

20

MPXOUT

IC502

3

2

IC102

1

4

2

WLDON

FE

TE

42

2

IC301

11 10

IC301

12

Q170

EEPROM

IC204
34MHz

IC103

IC104

IC103

98

13 12

4

+5V-D

1

2

1

2

7

3

4

1

IC301

IC301

IC302

IC504

IC506

IC505

IC505

S170

LOAD IN

S171

LOAD OUT

X501

20MHz

+5V-D

1

2

4

4

+5V-D

1

2

6

5

MPX

83

SDATAI(PROM)

14

CS

59

SDATAO

12

SCLKO

16

XLAT

60

XRSTRFP

6

RSBETA

18

VRDSW

25

VWDSW

26

AGCON

23

BCENT

79

PHBETA

80

BHBETA

81

XTAND

89

RECD

88

TZC

94

XRW/R

24

SDATAI(HOST)

15

XREQI

7

SDATAO(HOST)

13

XRDYO

8

XREST

63

VWDC2

85

SLFG

93

TMP

84

INSW

97

OUTSW

98

XTAL

67

EXTAL

66

FWD

100

REV

99

XMMUTE

96

µ COM

IC501 (1/2)

µ COM

IC501 (2/2)

XCSCDR

XHWR

XRSTCDR

XINTCDR

ATIP SYNC

SUB_SYNC

MIRR/XRC

SPFG

XIN/EXT

MD2

FWE

D15

XRD

KEY

27

D8

34

36

A0

43

A7

2

70

71

9

87

61

17

RLDON

OSCEN

WE1

WE2

IC150

2

21

95

78

91

75

10

GATE

Q501

94

90

59

66

70

77

79

78

80

81

58

140

127

30

39

135

133

111

112

113

143

131

44

43

42

40

41

137

48

49

46

122

159

160

194

132

124

123

125

SLCO0

D0

D7

SUA0

SUA7

ZCS

ZRD

ZWR

ZRESET

ZINT

ATIPSYNC

SUBSYNC

MON1/EFMG

WRITE

LDON

TES

RREC

FE

TE

WOBBLE

DEF

H11TO/FSEQ

WAPC

RAPC/C2F

SSP2

SSP1

PCK2

WDAT

NWDAT

ATEST3

DA2

DIN1

DIN2

DITOUT

HFL(MIRR)

FDO

TDO

SLDO

IO0

IO15

RA0

RA8

ZOE

ZWE

ZRAS

ZCAS

XTAL

XTALCK

SPDO

10

15

.

18

21

.

24

29

204

207

.
2

6

203

202

200

201

168

X201

33.8688MHz

167

3.3V-D

3.3V-A

+2.5V-1

126

FG

136

18

A0

21

.

A9

24

28

XOE

29

XWE

15

XRAS

16

XUCAS

30

XLCAS

31

IC110

+3.3V

MOTOR DRIVE

VCREF

2

VC

1

FG

8

S/S

6

DRAM
IC202

REG

IC172

IO0

IO15

UIN1

UIN2

VIN1

VIN2

WIN1

WIN2

U OUT

V OUT

W OUT

2

5
.

7

10

.

35

38

.

40
43

5V-D

HALL

DEVICE

+5V-D

VH

10

15

16

13

14

11

12

20

21

22

VH+

VH-

U+

U-

V+

V-

W+

W-

SPINDLE

MOTOR

CN112

KEY

PCIFE

XFIRM

FOR SERVICE

• Signal Path

: CD PLAY

: CD-R PLAY(ANALOG OUT)

: CD-R REC(ANALOG IN)

: CD-R REC(CD)

5656

– CD Section –

OPTICAL PICK-UP

BLOCK

(A-MAX.3)

VC

PD1

PD2

I5-10

I1-6

LD

GND

PD

VR

F-

FOCUS

COIL

F+

COIL

(SPINDLE)

(SLED)

T-

T+

M

M

TRACKING

+5V

Q101

LD

DRIVE

RF AMP

IC103

27

VC

6

A

7

B

8

C

9

D

10

E

RFDCO

11

F

1

LD

2

PD

MOTOR/COIL DRIVE

IC102

47

VO1+

52

VO1-

55

VO2+

56

VO2-

5

VO4+

VO4-

10

VO3+

1

VO3-

2

+3.3V

RFC

RFAC

RFDCI

SW

IN1+

IN1-

IN2+

IN2-

IN3+

IN3-

IC201

+3.3V

REG

RCD-W50C

IC104

SELECTOR

12
14
15
11

3

AB

26

15

28

16FE

18TE

17FEI

29

12

35

34

32

31

27

26

24IN4R

23IN4

19SW

8STBY

10 9

+5V

13

1
5
2
4

1-4

+5V

CTRL1(1-2)

DIGITAL SERVO

DIGITAL SIGNAL PROC.

D/A CONV.

IC101

DOUT

50

RFAC

43

RFDC

CLOK

39

FE

41

TE

40

SE

SQCK

SCLK

SCOR

SQSO

SENS

33

FFDR

34

31

32

29

30

25

FRDR

TFDR

TRDR

SFDR

SRDR

MDP

ELEVATOR

UP/DOWN

M701

M702

LOADING

MOTOR

SSTP

XTAI

XTAO

XRST

XTSL

64

4DATA

6

5XLAT

77

8

15

76

7

26

71

72

2

69

M

M

Q703

DISC IN

SENSOR

LIMIT SW

IC701

2

MOTOR

DRIVE

7

IC702

7

MOTOR

DRIVE

2

X201

Q701

IC105

24

CD & SYSTEM CONTROL

IC1 (1/2)

98

DATA

99

CLK

27

XLT

• Signal Path

17

SQCLK

90

SCOR

15

SUBQ

18

SENSE

32

BDRST

24

CTRL1

23

X4

PWM1

12

PWM2

19

PWM3

20

LDON

14

6

3

3

6

57

56

55

54

CLP_NEG

CLP_POS

LOD_NEG

LOD_POS

CD-R IN

CD-R OUT

XRDY

XREQ

DA-DATA-IN

DA-DATA-OUT

DA-CLK

DA-LATCH

DA-RESET

DZF

INT0

INT1

A_MUTE

SCMS

DI SDA

SK

WP

6

7

28

33

3

4

5

8

25

67

94

95

29

31

EEPROM

63

64

5

6

SCL

765

WP

IC100

A/D,D/A CONV

44

RX2

9

CDTO

8

CDTI

10

CCLK

11

CS

5

PDOWN

30

DZF

6

INT0

7

INT1

16

TX3

4

RX4

IC500

TX2

L-IN

L-OUT

R-IN

R-OUT

13TX1

2RX3

42RX1

14

38

32

37

33

D181

Q310

RELAY
DRIVE

IC610

OPTICAL

DIGITAL

IN

IC620

OPTICAL

DIGITAL

OUT

MUTE SW

Q380

OUT

IN

DIGITAL

OPTICAL

RY310

DIN2

DIN1

DOUT

SDATAO(HOST)

SDATAI(HOST)

XRDY

XREQ

RESET

A

IC310

IC310

IC370

MUTE
Q181

IC370

MUTE
Q281

MUTE
Q191

MUTE
Q291

: CD PLAY

: CD-R PLAY(ANALOG OUT)

: CD-R REC(ANALOG IN)

: CD-R REC(CD)

IC390

IC390

RV790

PHONE LEVEL

J310

L

R

L

R

OUT

J790

PHONES

IN

ANALOG

B

D SENS

86

5757

RCD-W50C

– POWER/DISPLAY Section –

S701

S702

S703

S704S704

S705

S706

S708

S700-709

CD FUNCTION

KEY

S724-729

FUNCTION

KEY

S718,719

FUNCTION

KEY

S700-704

FUNCTION

KEY

g

ROTARY/

ENCODER

+5V

S707

REC LEVEL

4

4

3

RV780

S720-722

FUNCTION

KEY

S723

ENCODER

S710-716

FUNCTION

KEY

S717

ENCODER

IC781

REMOTE
CONTROL
RECEIVER

CD & SYSTEM CONTROL

IC1 (2/2)

ENCODER1

43

ENCODER2

44

ENCODER3

45

MIDOUT SW

50(MID OUT)

DOOR_SW

49(LID)

MIDIN SW

51(MID IN)

IN_SW

53(IN)

INIT_SW

47(INIT)

COUNT_SW

48(COUNT)

OUT _SW

52(OUT)

+5V

81

VOL

80

KEY-3

79

KEY-2

1

3

1

3

1

CD-JOG-068

CD-JOG-169

78

KEY-1

R-JOG-070

R-JOG-171

77

KEY-0

SIRCS

13

FL-LD-DT

FL-LD-CLK

FLCS

FL-LED-RST

LED-STB

RESET

AC CUT

1

2

72

66

73

34

11

39

X1

X2

X38

20MHz

38

70

DA

69

CP

68

CS

67

RESET

10

DATA

11

SCK

13

CLR

12

STB

FL DRIVER

IC760

LED DRIVER

IC750

SEG01

SEG35

COM2

COM23

VFL2

P5

P6

P7

P8

P9

P10

P11

P12

FL750

3

37

40

61

Q761,762
39COM1

62COM24

P1

72

76

14P1

15P2

1

2

3

4

6

7

8

9

GRID

DRIVER

Q775

-36V

D775

D751-755

DISC1-5

LED

SBM

B

FLUORESCENT
DISPLAY TUBE

AC AC

RESET

IC480

21

TO

CD-R

CD+8V

CD+7V

M+8V

D+5V

D+5V

A+5V

CD+5V

IC476

POWER

DOWN

IC460

-36V
REG

IC430

+8V

REG

IC440

+7V

REG

IC450

+8V

REG

IC410

+5V

REG

IC420

+5V

REG

13-36V

13

13

13

13

13

D473

D461

D431-434

D451-454

D411

D412

D421

D422

D401-404

+B

-B
D471

D472

TR900

AC

AC

E

EXCEPT E

S911

VOLTAGE

SELECTOR

LF900

FILTER

LINE

S921

POWER SW

AC IN

5858

RCD-W50C

6-2. Printed Wiring Board – BD Section –

• : Uses unleaded solder.

1

3

IC201

• See page 55 for Circuit Boards Location.

(A-MAX.3)

IC103

MAIN

(Page 69)

C

IC102

IC101

TP

(FE)

TP

(TE)

TP

(RFAC)

IC105

IC104

TP

(DVC)

• Semiconductor

Location

Ref. No. Location

IC101 B-2
IC102 C-1
IC103 B-3
IC104 C-2
IC105 B-7
IC201 A-2

Q101 A-3

5959

RCD-W50C

6-3. Schematic Diagram – BD Section –

TP39

CN101

23P

TP33

R234

100

RN201

RN202

FB101

0UH

• See page 55 for Waveform. • See page 77 for IC Block Diagrams.

TP49

(RFAC)

TP28

C210
820p

C213
820p

C214

0.0022

L230

R230

0

C230 C221 C225

33 0.1 0.1

C223

2.2

C209
220p

R209
100

R208
100k

IC105

MC74VHC1G0

TP41

R212

100

R226

100

4DFT1

C218

0.1

C227

0.1

TP48

TP35

IC201

BA033FP-E2

C231

100
10V

C229

0.1
C201

220

4V

TP37

33.8688MHz

C203

10p

C204

10p

TP47

TP46

X201

R217

4.7k

R216

220

TP40

R213

0

TP12

C202

0.1

C205

0.1

C212
470p

C207

0.01

1k

R218

R204

0.47

10k

C211

0.47

820k

R206

R207

270k

0

R214

TP38

TP32

TP34

C215

1.5k
100k

R205

R203

IC101

CXD3068Q

TP3

TP2

TP1

TP29

R215

0

TP36

TP42

0.01

C216

10k

R202

TP3

IC104

TC74HC4052 AFT(EL)

0.1

33k

C224

R201

TP6

TP5

TP31

IC103

C107 R120

33p 120k

R116

33k

RV101

R102

R105

15k

C101
470p

C102

0.1

TP

TP18

(TE)

TP8

TP7

(FE)

TP20

TP11

TP10

TP9

1k

C104

0.0033

R103
100k

TP21

R104

15k

C103
470p

TP

TP

(DVC)

C234

C219

0.1

C222

0.1

R219

1k

0.022

C235

0.01

C236

C115

47

6.3V

R109
120k
1/10W

R112

39k

1

L171

R152

22k

R151

10k

C151

0.0047

47k

C117

R115

0.1
33k

120k

R114
160k

R111

R113

2.4k

R118

0

R227

33k

220k

R228

R229

680

C165

16V

TP100

C152

0.001

CXA2581N-T 4

F

16V

0.1

C153

10

R179

22k

C112

C120

47

47

4V

4V

C109

0.1

TP24

TP23

0.1

C110

C108

0.1

0.1

C232

C169

1k

R177

100p

C167

C171

0.01

0

R178

C111

47
4V

0.1

C179

0.1

R126

33k

R125

33k

C168

0.1

C178

0.1

C163

100
16V

R165 R166

00

R122
100k

C182

100
10V

C166

0.1

0.1

C164

C119

C114

0.001

R124

C113

10

100

4V

R123

10

0

R167

0

R168

TP26

1

C118

TP25

1

TP54

X

TP51

TP53

Q101

TP22

0

R169

2SB710A-RT

TP50

TP52

TP13

TP14

TP15

TP16

IC102

AN41050

R170

0

CN102

16P

(SLED)

(SPINDLE)

6060

RCD-W50C

6-4. Printed Wiring Board – SENSER/MOTOR/SW Section –

• See page 55 for Circuit Boards Location.

C

MAIN

CN640

(Page 69)

DISC IN
DETECT SENSOR

IC 702

IC 701

B

MAIN

CN641

(Page 70)

6161

RCD-W50C

6-5. Schematic Diagram – SENSER/MOTOR/SW Section –

• See page 55 for Waveform. • See page 77 for IC Block Diagrams.

S

IC B/D

4.9

-T-72

3.9

4.9

4.9

4.9

L

IC B/D

C

TO

MAIN BOARD(1/2)

CN640

(Page 71)

T-72-

B

TO

MAIN BOARD(1/2)

CN641

(Page 71)

6262

RCD-W50C

6-6. Printed Wiring Board – CD-R Section (Side A) –

• See page 55 for Circuit Boards Location.

NOT USED

(TO JIG)

(LASER POWER METER)

IC 150

IC 102

IC 104

• Semiconductor

Location

70

69

Ref. No. Location

IC102 B-5
IC104 A-6
IC150 B-4
IC202 D-6
IC502 D-5

IC 502

IC 202

6363

RCD-W50C

6-7. Printed Wiring Board – CD-R Section (Side B) –

IC 110

IC 302

IC 301

• See page 55 for Circuit Boards Location.

21

IC 204

IC 201

IC 103

IC 101

• Semiconductor

Location

Ref. No. Location

D101 C-6
D102 C-6

IC101 C-5
IC103 A-5
IC110 B-1
IC171 E-6
IC172 E-7
IC201 C-3
IC204 A-3
IC301 C-1
IC302 B-1
IC501 E-4
IC504 E-2
IC505 F-2
IC506 E-2

IC 505

IC 504
IC 506

IC 501

IC 171

Q170 F-7
Q501 E-3

IC 172

6464

RCD-W50C

6-8. Schematic Diagram – CD-R Section (1/4) –

TP281

TP265

TP245

TP287

D101

1SS355

TP263
OPVCC

TP110

TP111

1SS355

D102

TP261

CMOD

CFREQ

TP112

FPD-VC

FCS+

TRK+

TRK-

FCS-

CN101

32P

• See page 55 for Waveform. • See page 82 for IC Pin Function.

NOT USED

CN115

2P

R157

10

C116

16V B

C160

C102 C101

TP106

OP-ENBL

TP107

TP108

TP109

TP283
VWDC1

TP262

TP185

OPGND

TP267

TP271

TP274

TP273

TP266

TP256

TP255

TP272

TP117

1000p

25V

50V

25V

B

B

B

WE1

WE2

OSCEN

R116

VWDC2

VRDC

0

R123

OP-E

OP-C

OP-D

OP-G

OP-H

OP-A

OP-B

OP-F

FGND

1k E

R114

1k E

C111

C200

16V

6.3V

B

C202

6.3V

R113

2.2k
E

C110

16V B

C104
100p

50V

C103

CH

100p 50V CH

C105

100p 50V CH

C142

1000p 50V B

R127

33k

E

R128

22k E

TP246

TP102

RRFTOP

TP101

RRFBTM

C119

TP149

TP187

TP188

16V B

AGND

RFAC

TP105

AUX1

TP104

PM-DC

TP123

AUX3

R124

2.2k

RRF

WRF

C106

0.1 16V B
C107

0.1 16V B

(TO JIG)

CN121

FE

TE

TP184

TP186

C126

C123 C125

2200p

4700p

50V

10V

50V

B

B

B

C122

680p
50V

B

100

R121

RSBETA

TP148

VRDSW

TP147

VWDSW

TP146

SPRFTR

TP145

SPBLVL

TP144

RLDON

TP143

XLAT

SDATA

SCLK

TP252

TP250

TP124

100

R120

RF AMP

IC101

C118

16V

B

100

CH

CH

100

100

R101

50V

50V

R102

R103

220p

C108

0.1
16V

B

220p

C115

C114

SBAD

E

F

TP199

10k

MPP

TP193

C135
330p

50V

CH

6.3V

TP237

TZCLVL

R104

CH

C138

50V

100p

0

C109

R105

FPDO

4.7k

R106

TP190

C137

16V

B

C136

6.3V

WLDON

TP142

CH

50V

100p

C112

WFPDSH

TP141

RREF

TP192

TP139

R107

C128

C129

0.01
25V

10V

RFPDSH

1M

B

B

TP138

WREF

TP191

MPDSH

TP103

TP189
5V-RF

FOK

C140

6.3V

TP269

C139

16V

B

TP137
34MHZ

TP285

MIRR

TP270

DFCT

TP119

RC

TP127

R126

RECD1

0

TP198
RECD1

TP258

TZC
TP116
XTAND
TP115

R125

0

R133

10

TP238

ATFGAK8567
TP125
AGCON

TP126
GAINUP

C143

R110

100

R109

100

R108

100

TP120

ATFM

C117

10V

B

WDAO

C141

16V

B

TP235

C113

C121

100p

50V

6.3V

CH

6.3V B

10k

R139

C146

10V B

C145

10V B

C144

10V B

C124

4700p

R122

50V

1M

B

(3225)

L103

100

100

R153

R154

R151

TC7S02FU

C150

25V

F

R152

0

5P

MPXO

AGND

WLDON

TP201

TP197

TP200

100

100

R156

R155

0

IC150

IC SN74HC00APWR

IC102

C151

25V

F

C120

TP196

6.3V B (2012)

VREF

L101

(3225)

(3225)

L102

6565

RCD-W50C

6-9. Schematic Diagram – CD-R Section (2/4) –

R522
100k

RB514

100k

(3216)

RB511

100k

(3216)

C506

TP502

1000p

XRESET

50V

B

TP537

XP.DOWN

C520

RB508

0.1
100k

25V

(3216)

F

R550

0

C501

R549

0

16V

1000p

R534

R547

0

R546

0

0

R519

R543

10k

C514

50V

B

20MHz

R509

10k

R540

R505

X501

47k

TP503

XRD

TP504

XHWR

TP505

TP507

1000p

MD0

MD2

C502

50V

B

10k

4.7k

• See page 55 for Waveform. • See page 88 for IC Pin Function.

RB519

100k

(3216)

INSW

TP523

OUTSW

TP524

REV

TP525

FWD

TP526

RB521

100k

(3216)

C518

25V

0

R506

R507

0

RB504

100k

(3216)

RB505

100k

(3216)

RB520

100k

(3216)

RB518

100k

(3216)

IC501

HD64F3064BFBL25

10k

R542

TP506

MD1

C519

25V

F

C521

25V

F

R529

2.2k

BCENT

TP508

PHBETA

TP509

BHBETA

TP510

VREF

TP511

MPXO

TP512

TMP

TP513

VWDC2

TP514

100k

R524

RB506

(3216)

100k

XINTCDR

TP515

0

R508

RECD

TP516

(3216)

(3216)

RB517

RB522

100k

100k

F

25V

C517

MUTE

TZC

SPFG

XM

SLFG

SPFG

XIN/EXT

TP517

TP518

0

C509

R523

B

50V

1000p

TP522

TP521

TP519

TP520

0

0

0

0

R527

R526

R528

R530

IC504

TC7SET08FU

IC506

TC7SET08FU

RB516

(3216)

F

CN112 CN111 CN110

R556

10k

R555

10k

RB515

100k

R511

100k

R537

R536

RB509

100k

R533

TP534

SDATAI

RB510

100k

(3216)

0

C512

1000p

50V

B
C511

1000p

50V

B

TP532 TP533
XRDYO SDATAO

C513

25V

F

C508

25V

F

0

0

0

R517

0

R516

0

0

R544

0

R538

RB513

TP501

100k

FWE

(3216)

0

0

0

0

R548

R545

0

0

IC505

TC7W08FK

TP531
XREQI

R513

R518

100k

(3216)

0

R532

RB512

0

R539

(3216)

R535

R515

(3216)

5P 4P 11P

KEY

IFVCC

XFIRM

PCIFE

TP202

TP538

TP536

TP535

F

25V

C510

R520

10k

Q501

DTC114EKA

TP226

TP225

21P600SG

FB102

(2012)

21P600SG

FB101

(2012)

BLM

BLM

C270

16V
C263 C268

25VF25V

ND

8V

MG

TP289

TP224

(3225)

L503

IC110

L4931ABD33

TP228

TP227

DIN2

DIN1

TP350

TP349

TP352

DOUT

21P600SG

FB103

(2012)

BLM

C271

6.3V

F

DGND

5V-D

TP229

TP230

R350

1k

C269

6.3V

C262

25V

F

10k

R353

5V-A

AGND

TP231

R369

2.2

R301
100k

IC301

SN74LVU04APWR

L303

(3225)

R370

2.2

C303

25V F

2.2

R356

IC302

TC7SH08FU

L204

(3225)

C304

R302

C302

0.1
100k

0.1

16V

16V

B

B

R351

1k

R354

10k

C301

25V

F

IC502

BR93LC46RF-WE2

(SOP)

C272

25V

L501

C526

25V F

R504

TP527

0

DO

TP528

R503

R502

DI

TP529

100

SK

TP530

CS

100

(3225)

F

TP233

3.3V-D

3.3V-A

TP232

C275

16V F

C273

6.3V

6666

RCD-W50C

6-10. Schematic Diagram – CD-R Section (3/4) –

CN102

• See page 78 for IC Block Diagrams.

11P

CN104

2P

TP248

TP249

S170

S171

LMO+

LMO-

TP122

ENCO

TP268

TP251

TP253

TP257

TP259

TP118

TP121

SLED+

SLED-

THERMO

ENC5V

TC7SET04FU

IC104

C191
1000p

IC103(1/4)

IC103(2/4)

NJM2902V

R189
R190

NJM2902V

R141

10k

R137R136

6.8k E10k E

4.7k

4.7k

TP356

2.5V-2

C130

R140

25V

IC103(4/4)

NJM2902V

F

C134

R187

10k

R188

0

10k

C158

6.3V

C157

TP355

6.3V

25V

2.5V-1

F

TP204

TDO

TP205

SLDO

TP207

FWD

R176

0

TP236

R177

0

REV

R131

0

C132

25V

F

R111

IC103(3/4)

NJM2902V

TP264

SLFG

C156

0.1
25V

F

TP244

LOAD_IN

TP247

LOAD_OUT

C192

1000p

50V

B

50V

B

R186

10k

Q170

DTC114EKA

33k

E

R112

22k

E

R142

10k

2
9

0

1
R

TP206

FDO

TP239

MGND

10k E

IC171

BA5937AFP

R134

F

C131

25V

R135

4.7k E

C194C193

16V25V

C133

25V

F

F

CN103

R193

0.39

11P

C188

C189

C190

25V B

25V B

25V B

TP301

TP302

TP303

TP304

TP305

TP306

TP307

TP308

TP309

TP310

TP311

W

V

U

UIN1

UIN2

VIN1

VIN2

WIN1

WIN2

VH-

VH+

R173

220

E

C184

16V

0

10

10

1

1

70
1

17

172

R

R

R

C181

1

16V

C183C182

B

1

16V

B

C185

1/2W

C179

25V

F

C180

16V

R194

TP240

MGND

TP241

0

DGND

1

16V

B

25V

F

IC172

LB11698H

TP242

XMMMUTE

C178

16V

TP312

TP313

SPFG

4700p 50V B

B

RS

R196

0

TP316

SPDO

C187

16V

B

R198C186

0

6767

RCD-W50C

6-11. Schematic Diagram – CD-R Section (4/4) –

C204

R200

16V

4.7k

B

C207

C208

16V

16V

B

C212

C213

6.3V

100

TP321

R241

C218

25V

F

C219

25V F

C221

25V F

6.8k E

R242

R243

R244

C223

16V

B

R253

0

C228

6800p

25V

B

680p 50V B

C232

C234

R258

10k

R246

10k

C235

16V

B

• See page 55 for Waveform. • See page 84 for IC Pin Function.

R201

ENCERR

TP129

0

C226

MON2

16V

B

470

TP131

R202

MON4

TP130

IC201

LC89587-UK1

LOCK

SHOCK

TP221

TP220

100

R231

TP171

0

R232

TP223

R305

0

TP243

6.8k E

10V B

0

0

0

0

0

0

0

0

R211

R209

R205

R204

R218

R224

R223

TP218

ATEST1

C216

25V

C201

25V

F

220

R207

R216

15k E

B

ZINT

TP277

TP278

TP279

TP284

TP288

TP290

TP291

TP292

25V F

TP293

TP294

TP295

TP296

TP300

TP314

TP315

TP317

TP318

ZRD

TP319

ZCS

TP320

ZWR

ZRESET

0

R251

22k

E

R262

10k E

R263

10k E

R265

270 E

C236

25V

F

WDAT

NWDAT

F

5.6k

TP215

TP216

470

TP217

R213

C259

1000p

50V

B

R271

E

R203

R225

10k

10k

ATEST3

H11TO

WAPC

LDH

TP213

TP212

TP214

TEI

RREC

FEI

TP323

TP365

TP322

0

0

R229

R226

FEO

TEO

2.5V

TP324

TP325

TP179

0

RAPC

SSP1

SSP2

WRITE

R228

R215

TP211

TP210

TP209

TP299

TP128

TP169

TP170

C237

25V

F

C260

0.001

F

50V

B

25V

R264

10

C244

6.3V

C247

16V

B

C238

C233

25V

F

EFMO

470

TP165

R269

C248

25V

F

PCK2

TP222

R270
1k E

FMCK

FMDT

F

ATIPSYNC

25V

TP286

TP280

TP358

C239

10k

10k

R303

R304

C257

25V

F

TP297

0

0

R325

R324

TP172

E

E

33k

680

F

R267

R276

C245

6.3V

25V

B

R281

R277

1k E

5.6k
E

C240

C250

25V

B

C251

B

16V

C246

25V B

C289

25V

0

0

0

0

F

R322

R321

R320

R323

R268

5.1k
E

C241

75

25V

F

R278

C249

16V

B

(3225)

L207

C258

25V

6.3V

F

R206

0

R208

0

R210

0

R217

0

R219

22

R220

22

R221

22

R222

22

100k

RB201

R300

10k

R307

0

TP359

ADSTBY

10

R227

C214

25V F

TP336

AUXDATA

R274

10k

10k

R212

C217

25V F

2.2

R239

C220

25V F

R290

10k

2.2

R240

C222

25V F

R245

R248

R250

R254

C242

25V

F

4.7k

C224

220 E

C225

10k

R230

470

1M

33.8688MHz

TP331

TP330

16V B

16V B

C227

7p

50V

CH

C230

7p

50V

CH

X201

R260

10k

DIN2

DIN1

(3225)

L202C210

L203

(3225)

L205

(3225)

R294

0

C206

C205

6.3V

L208

(3225)

TP333

LOUT

AGND

TP335

C203

25V

25V

F

F

IC202

MSM54V16258BSL

-40TSK

C209

25V

F

(3225)

L301

TP334

ROUT

CN114
3P PH

TC7SU04FU

R291

R292

R283

IC204

150

C254

100

25V

F

10k

6868

RCD-W50C

6-12. Printed Wiring Board – MAIN Section (Side A) –

75

IC 100

• : Uses unleaded solder.

IC 1

• See page 55 for Circuit Boards Location.

63

59 61

IC 480

IC 476

• Semiconductor

Location

Ref. No. Location

D181 B-3
D310 E-2
D311 E-1
D316 E-1
D426 C-2
D462 C-5
D471 C-5
D472 C-6
D473 B-6

IC 310

IC 500

IC1 B-2
IC100 B-1
IC310 F-1
IC370 F-2
IC390 F-3
IC476 C-6
IC480 B-7
IC500 D-1

Q181 F-2
Q191 E-3
Q281 F-2
Q291 E-3
Q380 B-3

IC 370

IC 390

6969

RCD-W50C

6-13. Printed Wiring Board – MAIN Section (Side B) –

75

• : Uses unleaded solder.

IC 460

• See page 55 for Circuit Boards Location.

61

IC 420

• Semiconductor

Location

Ref. No. Location

D401 D-4
D402 D-4
D403 D-4
D404 D-4
D411 E-4
D412 E-4
D421 D-4
D422 D-4
D431 F-4
D432 E-4
D433 E-4
D434 E-4
D451 F-3
D452 F-3
D453 F-3
D454 F-3
D461 D-4

IC410 F-3
IC420 D-5
IC430 F-4
IC440 F-5
IC450 F-2
IC460 C-4
IC610 F-6
IC620 F-5

75

Q310 E-7

IC 440

75

IC 450

IC 410 IC 430

63

IC 620

IC 610

7070

RCD-W50C

6-14. Schematic Diagram – MAIN Section (1/2) –

RB77

3.3k

C76

0.1

• See page 55 for Waveform. • See page 79 for IC Block Diagrams. • See page 80 for IC Pin Function.

CN671

21P

C100

0.1

R107

IC100

BR24C02FV-W

RB68

10k

10k

10k

0.1

R73

R72

C74

100k

R66

RB54 RB51

10k 10k

10k

R64

R63

10k

10k

C58

0.1

CN630

11P

0

L636

C670

0.1

0

R636

C630

0

CN641

CN640

5P

17P

RB47

10k

RB43

R87

0

R88

0

R90

10k

R94

10k

R95

10k

10k

10k

R3

CN1

8P

100k

C9

0.1

R6

R12

C11

0.001

UPD70F3033AYGF

0.01

C12

IC1

-3BA

10k

10k

4700p

4.7k

R18

R15

C19

2.2k

220k

R20

R19

100k

R21

R25

C20

0.47

D181

1SS181

10k

C41

0.1

X38

20MHz

C37

1

50V

C34

0.1

R500

0

D426

0

R550

R544

0

R507

R508

R509

R510

R511

0

R504

C505

0

0.1

R506

100

100

100

100

100

100

C539

100
16V

L539

0

R516

0

0

R513

C541

0.1

R540

12k

CXD9692R

IC500

C518

0.1

C517
100

R514

16V

0

C535

100

C534

16V

0.1

C531

0.1

R526

10k

D311

1SS184

D316

1SS181

C530

100
16V

UN5111

Q380

7171

RCD-W50C

6-15. Schematic Diagram – MAIN Section (2/2) –

C460

100
63V

D461

11ES2-TB5

CN910

3P

CN900

2P

LF900

LINE FILTER

C900 C901

2200p 2200p

TR900

JW900

D402

11ES2-TB5

11ES2-TB5

D404

11ES2-TB5

M5293L

D433

11ES2-TB5

D434

11ES2-TB5

D453

11ES2-TB5

D454

11ES2-TB5

D411

11ES2-TB5

D412

11ES2-TB5

D403

IC460

11ES2-TB5

D421

11ES2-TB5

D422

11ES2-TB5

D471

1SS355

D472

1SS355

D401

11ES2-TB5

11ES2-TB5

11ES2-TB5

11ES2-TB5

C410

10000

16V

C401
1000

16V

C403
1000

16V

D431

D432

D451

D452

R471

C465

47

R461
47k

50V

R462

C463

0.1

C431
4700

25V

100

100k

R463 R464
220 220

D462

MA8047

IC430

AN7808

C432 C433 C442

0.1 0.1 0.1

IC450

C451

AN7808

4700

25V

C452

0.1

IC410

AN7805

C411

C413

0.1

0.1

R474

R472

C471

25V

22k

D473

470

1SS355

R473

33

470

C454

10V

C453

0.1

C414
1000

10V

R475
56k

C472

22

C476

25V

0.1

IC476(3/3)

TC7WU04F

CN631

4P(PH)

C434
1000

10V

C420

10000

16V

R476
330k

IC476(1/3)

TC7WU04F

CN660

23P

8

R310

2.2k

Q310

2SD2144S-TP-UVW

NJM4558V

IC310(2/2)

NJM4558V

R278C277

330470p

R311
47k

C113

22

25V

C213

22 25V

Q181

2SD1938

R177

100k

R277

100k

Q281

2SD1938

R611
470

C611

0.1

IC310(1/2)

C312

C311

100

0.1

8

IC440

AN7807

C443

C444
1000

0.1
10V1000

C424
1000

10V

TC7WU04F

IC420

AN7805

C423

0.1

R480

47k

C480

0.1

IC480

S-80942

C481

0.01

C421

0.1

R477

1k

IC476(2/3)

16V

C316

100
16V

R380
100k

R381
R113
220k

C112 C212

22 25V 22 25V

R112

22k

R111

33k

C111 C211 C177
470p 470p 470p

150k

R213
220k

R212

22k

R211

33k

C317

0.1

R181

10k

R281

10k

R178

330

D310

1SS355

RY310

R176

680

C176

C361

22

100

25V

16V

C362

0.1

C276

22

25V

R276

680

C600

4.7
50V

C621

0.1

R272

C366

100
16V

C367

0.1

L600

R115

47

L667

R215

C118

47

22 25V

C218

22 25V

R172

10k

10k

IC370(1/2)

NJM4558V

IC370(2/2)

NJM4558V

R171

C170

22
25V

10k

R170
100k

C391

R271

10k

R270
100k

C270

22

25V

0.1

L390

0

C396

0.1

L665R665

00

IC390(2/2)

IC390(1/2)

NJM4565V

NJM4565V

0

Q191

UN2116

R191

47

R192

47

R193

L391

0

0

R293

0

R291

47

R292

Q291

47

UN2116

CN690

3P

IC610

J310

4P

GP1FA512RZB

IC620

GP1FA512TZC

7272

RCD-W50C

6-16. Printed Wiring Board – LED Section –

• : Uses unleaded solder.

• See page 55 for Circuit Boards Location.

IC 750

• Semiconductor
Location

Ref. No. Location

D751 C-2
D752 C-3
D753 C-4
D754 C-5
D755 C-6

IC750 A-7

75

7373

RCD-W50C

6-17. Schematic Diagram – LED Section –

R701 R702 R703 R704 R705 R706 R707 R708 R709

220 330 470 680 1k 1.5k 2.2k 4.7k 10k

S700 S701 S702 S703 S704 S705 S706 S707 S708 S709

• See page 78 for IC Block Diagrams.

100

R763

100

R762

100

R761

100

R760

C762
470p

L787

L785

CN780

8P

0

0

R771

220

D751

SML78423C-

TP15

R781

220

R772

220

D752

SML78423C-

TP15

R782

220

R773

220

IC750

NJU3713G

D753

SML78423C-

TP15

C750

0.1
C782

100
10V

R783

220 220

R774

220

D754

SML78423C-

TP15

R784

R775

220

D755

SML78423C-

TP15

R785

220

C790

0.1

EP790

7474

RCD-W50C

6-18. Printed Wiring Board – DISPLAY Section –

70

: Uses unleaded solder.

•

• See page 55 for Circuit Boards Location.

70

70

69

73

IC 760

IC 781

• Semiconductor Location

Ref. No. Location

D775 F-1

IC760 G-9
IC781 G-13

Ref. No. Location

Q761 G-6
Q762 G-6
Q775 G-3

7575

RCD-W50C

6-19. Schematic Diagram – DISPLAY Section –

CN911

3P

S911

R725R726R727R728R729

1k1.5k2.2k4.7k10k

S725S726S729 S728 S727 S720S721S722S724

C720

0.1
50V

EP720

• See page 79 for IC Block Diagrams.

CN921

CN720

2P(WIRE)

CN920

2P

C921

CN725

2P(WIRE)

S921

2200p

CN700

21P

8P

CN710

C791

R791

470p

10

J790

L799

JW

CN790

WIRE(3P)

S723

ENCORDER

R721

R722

R724

680

R723

470

220

330

RV790
1k/1k

R796

10

L1790

C796
470p

IC781

NJL63H400A

R704

470

680

C763

0.1

C760

10

50V

C764

C765

10

IC760

MSM9201-04GS

C751

10

50V

0.1
50V

C769

0.001

C768

0.001

3.3k

R766

0.1

C767

C766

C770

0.001

47p

R763
100k

2SC2603TP

C761 C762

0.001 0.001

R761

100

100

R770

100

R769

100

R768

100

R767

Q762

2SC2603TP

R762

100

Q761

R764
100k

R719

10k

S719 S718

R718

4.7k

S717

ENCORDER

C753

10

50V

Q775

UN4211

R716

1.5k

S716 S715

D775

SEL5821A-TP15

R715R717

1k2.2k

R713

R714

470

680

S713

S714

220

330

S700S701S702S703S704

R775

220

R711

R712

220

330

S710S711S712

RV780

10k

C780

0.1

EP780

R701

R702

R703

EP750

FL750

R742

47

C743

R741

0.1

100

C750

0.1

C742

100
10V

7676

6-20. IC Block Diagrams

RCD-W50C

IC101 CXD3068Q (BD Board)

FSTO

CM4

RFAC

ASYI

ASYO

ASYE

BIAS

XPCK

FILO

PCO

CLTV

MDP
LOCK
PWMI

SENS

DATA

XLAT
CLOK
SCOR
SBSO
EXCK
SCSY
SQSO
SQCK

FCK

VCTL

VPCO

V16M

XTSL

XTAO

XTAI

CLOCK

GENERATOR

ASYMMETRY
CORRECTOR

FILI

DIGITAL

PLL

DIGITAL

CLV

CPU

INTERFACE

EMPH

GFS

XUGF

EFM

DEMODURATOR

SERVO

AUTO

INTERFACE

W

SUB CODE

PROCESSOR

CORRECTOR

SERVO

INTERFACE

MIRR
DFCT

FOK

ERROR

32K
RAM

C2PO

WDCK

D/A

INTERFACE

SERVO BLOCK

PCMD

LRCK

DIGITAL

OUT

BCLK

MUTE

TES1
TEST
XRST

MD2
DOUT

SOUT
SOCK
XOLT
SCLK
COUT
SSTP
ATSK

MIRR
DFCT
FOK

RFDC

IGEN

SERVO DSP

CE

TE

SE

FE

VC

OPAMP

ANALOG SW

A/D

CONVERTER

ADIO

FOCUS
SERVO

TRACKING

SERVO

SLED

SERVO

PWM GENERATOR

FOCUS PWM
GENERATOR

TRACKING PWM

GENERATOR

SLED PWM

GENERATOR

FFDR
FRDR

TFDR
TRDR

SFDR
SRDR

IC701 M54641L (CLAMP MOTOR Board)
IC702 M54641L (LOAD MOTOR Board)

VCC VCC

IN1

IN2

1

REG

INPUT

3

AMP.

POWER
AMP.

CONTROL

INPUT

6

AMP.

POWER
AMP.

8

VREF

5

OUT2

2

OUT1

7

GND

4

77

RCD-W50C

IC171 BA5937AFP-E2 (CDR Board)

OUT1-

OUT1+

IN1-1

IN1-2

MUTE

GND

VCC2

OUT2+

OUT2-

SGND

1

D

x2

2

D

x2

3

10k

T.S . D

LEVEL SHIFT

D

D

4

+

LEVEL SHIFT

MUTE

ch1,4

10k

NC

5

NC

6

7

10k

+

10k

+

SGND

28

OUT4-

27

x2

OUT4+

26

x2

IN4-1

25

IN4-2

24

VREFIN

23

VCC1

22

VCC(ch1,4)

+

8

NC

9

VCC(ch2)

10

NC

11

D

12

x2

D

13

x2

14

x1/4

LEVEL SHIFT

VOLTAGE

CTRL

15k

10k

LOGIC

FWD

REV

D

D

x2

x2

21

VCC(ch3)

20

19

18

17

16

15

VCC3

IN3

LDIN

OUT3+

OUT3-

FWD

REV

UIN1

UIN2

VCC1

VCC2

UOUT

VOUT

WOUT

VLMC

VREF

IC172 LB11698H-TE-L (CDR Board)

15

16

17

18

RF

19

20

21

22

23

NC

NC

24

25

NC

26

NC

27

28

CURRENT

LIMITER

CONTROL

REFERENCE VOLTAGE

THERMAL SHUTDOWN

SHORT BRAKE

REVERSE BRAKE

SWITCH FUNCTION

LIMITER

CURRENT

MATRIX

HALL
POWER
SUPPLY

WAVEFORM DISTRIBUTER

FORWARD
/REVERSE

ROTATION
DIRECTION
DETECTOR

1 HALL FG/

3 HALL FG

14

13

12

11

10

9

8

7

6

5

4

3

2

1

VIN2

VIN1

WIN2

WIN1

VH

RS

FG

BREAK

S/S

SIGGND
FGSEL

FC

VCREF

VC

IC750 NJU3713G (TE2) (LED Board)

1

P5

2

P6

3

P7

4

P8

5

VSS

P10

P11

P12

6

P9

7

8

9

LATCH

SHIFT

REGISTER

CIRCUIT

CONTROL

VDD

18

P4

17

P3

16

15

P2

P1

14

CLR

13

STB

12

CLK

11

10

DATA

78

RX2

44

IC500 CXD9692R (MAIN Board)

PVSS

RX1

TST1

43 42 41

R

40

PVDD

39 38 37

L-IN

R-IN

RCD-W50C

AVSS

AVDD

VREF

36

35 34

TST2

RX3

RX4

PDOWN

INT0

INT1

CDTI

CDTO

CCLK

1

2

12

TST3

IPGA

13 14 15

TX2

TX1

X-ENABLE

NC

3

4

5

6

7

8

9

CONTROL

REGISTER

10

11

CS

DATT

HPF

SBM

DIR

16

S_LRCK
S_BICK
S_DATAI
S_DATAO

TX3

A_LRCK
A_BICK
A_DATA
A_MCLK

INTERFACE

R_LRCK
R_BICK
R_DATA
R_MCLK

MCKI

17 18 19

DVSS

DVDD

AUDIO

X'TAL

OSC

D_LRCK
D_BICK
D_DATA
D_MCLK

T_LRCK
T_BICK
T_DATA
T_MCLK

DIVIDER

20 21 22

TXO

TVDD

DATT

SMUTE

DIT

MCLK

SELECTOR

TXI

DACADC

DMCK

R-OUT

33

L-OUT

32

VCOM

31

DZF

30

M/S

29

LRCK

28

BCK

27

SDTI

26

SDTO

25

MCKO2

24

MCKO1

23

COM03

|

COM22

IC760 MSM9201-04GS-K (DISPLAY Board)

COM2

COM1

39 3840

DUTY

CONTROL

DIGIT

CONTROL

41

|

GRID DRIVER

60

TIMING

GENERATOR2

CONTROL CIRCUIT

TIMING

GENERATOR1

OSCILLATOR

VDISP1

COMMAND

DECODER

8-bit SHIFT

REGISTER

DCRAM

24w x 8b

DCRAM
ADDRESS
COUNTER

READ
ADDRESS
COUNTER

PORT

DRIVER

CGROM

240w x 35b

CGRAM

16w x 35b

ADDRESS

SELECTION

WRITE
ADDRESS
COUNTER

SEG35|SEG19

37 – 21

SEGMENT

DRIVER

ADRAM

24w x 8b

AD

DRIVER

20

SEG18

|

|

3

SEG01

AD4

2

AD3

1

61

COM23

62

63

COM24

VFL1

72 – 75

67

66

65

64

GND

OSCI

OSCO

CS

RESET

71

70DA69CP68

P1|P4

VDD

VFL2

78

77NC76

VDISP2

80

79

AD1

AD2

79

RCD-W50C

6-21. IC Pin Function Description

• IC1 µPD70F3033AYGF-3BA CD & SYSTEM CONTROL (MAIN Board)

Pin No.

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42

43 to 45

46
47
48
49
50
51

Pin Name

FL-LD-DT

FL-LD-CLK

DA-DATA-IN

DA-DATA-OUT

DA-CLK
CD-R IN

CD-R OUT

DA-LATCH

EVDD

EVSS

AC CUT

PWM1

SIRCS
LDON
SUBQ

NC
SQCLK
SENSE

PWM2
PWM3

VPP

NC

X4
CTRL1

DA-RESET

NC

XLT

XRDY

A_MUTE

NC

SCMS

BDRST

XREQ

RESET

XT1
XT2

REGC

X2

X1

VSS

VDD

CLKOUT

ENCODER1 to

ENCODER3

D-OUT ON/OFF

INIT_SW

COUNT_SW

DOOR_SW

MIDOUT_SW

MIDIN_SW

I/O

O

Data output to the FL and LED drivers

O

Clock output to the FL and LED drivers

I

Data input from the AD/DA converter (IC500)

O

Data output to the AD/DA converter (IC500)

O

Clock output to the AD/DA converter (IC500)

I

Data input from the µCOM (IC501)

O

Data output to the µCOM (IC501)

O

Data latch signal output to the AD/DA converter (IC500)

—

Power supply (+5V)

—

Ground terminal

I

AC CUT signal input “L” : AC CUT

O

PWM signal output to FE

I

SIRCS signal input from the remote control receiver

O

Laser ON signal output

I

Sub-code Q serial data input

—

Not used (open)

O

Sub-code Q output serial clock output

I

SENSE signal input from the IC101

O

PWM signal output toTE

O

PWM signal output to RFDC

—

Flash programming power supply

—

Not used (open)

O

Disc rotation speed selection signal output

O

Disc rotation speed selection signal output

O

Reset signal output to the AD/DA converter (IC500)

—

Not used (open)

O

Serial data latch signal output to the IC101

I

Data ready signal input from the µCOM (IC501)

O

Muting control signal output “L” : ON

—

Not used (open)

O

Analog line selection signal output “H” : SCMS ON at SYNC mode

O

BD reset signal output “L” : reset

O

Data request signal output to the µCOM (IC501)

I

Reset signal input

I

Sub-clock input

O

Sub-clock output

—

Electrolytic capacitor terminal for the regulator

O

Ceramic resonator terminal

I

Ceramic resonator terminal

—

Ground terminal

—

Power supply (+5V)

O

Clock output (open)

I

Disc tray address detection signal input from the rotary encoder

O

Not used (open)

I

INIT detection switch signal input

I

COUNT detection switch signal input

I

DOOR detection switch signal input

I

MIDOUT detection switch signal input

I

MIDIN detection switch signal input

Description

80

RCD-W50C

Pin No.

52
53
54
55
56
57
58
59

60 to 62

63
64
65
66
67
68
69
70
71
72
73
74
75
76

77 to 80

81

82 to 85

86
87
88
89
90

91 to 93

94, 95
96, 97

98
99

100

Pin Name

OUT_SW

IN_SW

LOD_POS

LOD_NEG

CLP_POS

CLP_NEG

BVDD

BVSS

NC

DI
SK
WP

FL-LED-RST

DZF
CD-JOG-0
CD-JOG-1

R-JOG-0
R-JOG-1

FLCS

LED-STB

AVDD

AVSS

AVREF

KEY-0 to KEY-3

VOL

AD-5 to AD-8

DSENS

MODEL

DESTINATION

NC

SCOR

NC

INT0, INT1

NC

DA T A

CLK

ADJ

I/O

I

Tray open/close detection switch signal input

I

Tray open/close detection switch signal input

O

Loading motor control signal output

O

Loading motor control signal output

O

Elevator up/down motor control signal output

O

Elevator up/down motor control signal output

—

Power supply (+5V)

—

Ground terminal

—

Not used (open)

I/O

EEPROM I2C data input/output

O

EEPROM I2C clock output

O

EEPROM write protect signal output

O

Reset signal output to the FL and LED drivers

I

Zero data detect signal input from the AD/DA converter (IC500)

I

CD jog signal input

I

CD jog signal input

I

CD-R jog signal input

I

CD-R jog signal input

O

Chip select signal output to the FL driver

O

Strobe signal output to the LED driver

—

Power supply for analog circuit (+5V)

—

Ground terminal for analog circuit

—

Analog reference voltage input terminal

I

Key data input

I

Analog recording level signal input from the RV780

—

Not used (ground)

I

Disc in detection sensor signal input

I

Model setting terminal

I

Destination setting terminal

—

Not used (open)

I

Sub-code sync (S0+S1) detection signal input from the IC101

—

Not used (open)

I

Interrupt signal input from the AD/DA converter (IC500)

—

Not used (open)

O

Data output to the IC101

O

Clock output to the IC101

I

ADJ mode selection input terminal Not used (open)

Description

81

RCD-W50C

• IC101 AK8567 S/H & MATRIX, MPX (CDR Board)
Pin No.

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

Pin Name

AVDD3
BCENT

PHBETA

BHBETA

PHBTC
BHBTC

MPP

TEIN

TE

FE

SBAD

TZCLVL

VREF

AGND1

BIAS

VSS

FVREF

FPDO
RREF

VRDC

VRDCN

VRDCN2

WREF

WDAO

AVDD2

AVSS2

VWDC

VWDCN2

VWDCN

ATFM
AGC1C
AGC2C
AGC3C
AGND2

VSS

SGAINDN

GAINUP

AGCON

ATFG

XTOR

XTAND

TZC
RECD2
RECD1

RC
DFCT
MIRR

MCLK1
MCLK2

DVSS

I/O

—

Power supply (analog)

O

Center signal output

O

β signal top level signal output

O

β signal bottom level signal output

O

Extrenal capacitor teminal for PHBETA droop rate setting

O

Extrenal capacitor teminal for BHBETA droop rate setting

O

Main push-pull signal output Not used (open)

I

Tracking signal processing input

O

Tracking error signal output

O

Focus error signal output

O

SBAD signal output Not used (open)

I

Tracking zero cross comparate level input

I/O

Decoupling teminal for internal reference voltage / internal reference voltage input terminal

O

Decoupling teminal for internal reference voltage

O

Bias resistor connection terminal BIAS = 4.7kΩ

—

Ground terminal (analog)

I

APC reference voltage input terminal

I

Laser monitor voltage input

I/O

Power setting voltage input for read APC / internal DAC setting voltage output

O

Read laser driver control signal output

I

Read laser driver control amplifier (-) teminal

I

Read laser driver time constant setting terminal

I/O

Power setting voltage input for write APC / internal DAC setting voltage output

O

Power setting internal DAC voltage output for write APC Not used (open)

—

Power supply (analog)

—

Ground terminal (analog)

O

Write laser driver control signal output

I

Write laser driver time constant setting terminal

I

Write laser driver control amplifier (-) teminal

O

Wobble signal output

O

External capacitor terminal for AGC response speed setting

O

External capacitor terminal for AGC response speed setting

O

External capacitor terminal for AGC response speed setting

O

Decoupling teminal for internal reference voltage

—

Ground terminal (analog)

I

Gain selection signal input

I

CD-RW selection control signal input

I

Wobble AGC enable signal input “H” : AGC ON, “L” : AGC reset

O

ATIP FG signal output (Wobble signal after formation of 2 values)

O

Tracking amplitude detection signal output

O

Tracking failure detection signal output

O

Tracking zero cross detection signal output

O

Recorded block detection signal output 2 “H” : recorded block, “L” : unrecorded block

O

Recorded block detection signal output 1 “H” : recorded block, “L” : unrecorded block

O

RC signal output

O

DFCT signal output

O

MIRR signal output

I

Main clock input 1 (sine wave input) 34.5744MHz

I

Main clock input 2 (sine wave input) fixed at “L”

—

Ground terminal (digital)

Description

82

RCD-W50C

Pin No.

51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99

100

Pin Name

DVDD

FOK
RZC

MPDSH

SPDSH

RFPDSH

WFPDSH

WLDON

RLDON
SPBLVL
SPRFTR

VWDSW

VRDSW
RSBETA

SCLK

SDATA

XLAT
XRST

VSS

OSTCC

AGCC

PHD2C

RCCMPI

PBHO

AVDD1

AVSS1

RRFTOP

RRFBTM

N.C.

EQRF

N.C.
AUX1
AUX2
AUX3

MPXOUT

RRFVC(1V)

RECDIN

RRF

WRF

VSS
AIN
BIN
CIN
DIN
EIN
FIN
GIN
HIN

HAVC

AVSS3

I/O

—

Power supply (digital)

O

FOK signal output

O

RF zero cross detection signal output Not used (open)

I

Sampling pulse input for main beam signal “H” : sample, “L” : hold

I

Sampling pulse input for side beam signal “H” : sample, “L” : hold

I

Sampling pulse input for read APC “H” : sample, “L” : hold

I

Sampling pulse input for write APC “H” : sample, “L” : hold

I

Write LD control signal input “H” : set write APC value to zero, “L” :LD ON

I

Read LD control signal input “H” : set read APC value to zero, “L” :LD ON

I

BLEVEL sampling pulse input “H” : sample, “L” : hold

I

WRFTR sampling pulse input “H” : sample, “L” : hold

I

Write laser driver time constant setting switch control signal input “H” : ON, “L” : OFF

I

Read laser driver time constant setting switch control signal input “H” : ON, “L” : OFF

I

β measuring circuit reset signal input “H” : reset the outputs of PHBETA and BHBETA

I

Clock input for register setting

I

Serial data input for register setting

I

Latch siganl input for register setting

I

Register reset terminal “L” : reset

—

Ground terminal (analog)

O

Capacitor connection terminal for setting fc of the equalizer output offset canceller

O

External capacitor connection terminal for setting the RFAGC response speed

O

External capacitor connection terminal for setting the P/H2 droop rate

I

RC detection comparator input

O

Bottom/top level output of RRF signal

—

Power supply (analog)

—

Ground terminal (analog)

O

Peak level output of RRF signal Not used (open)

O

Bottom level output of RRF signal Not used (open)

—

Not used (ground)

O

Equalizer filter output

—

Not used (ground)

I

Auxiliary input terminal (1) for monitoring signal Not used

I

Auxiliary input terminal (2) for monitoring signal from the CN115 Not used

I

Auxiliary input terminal (3) for monitoring VWDC2 signal from the optical pick-up

O

Multiplexer signal output for the signal monitoring

I

Level shift voltage input terminal for RRF signal

I

RF signal input for the recorded block detection

O

Read RF signal output

O

Write RF signal output (open)

—

Ground terminal (analog)

I

Main beam signal (A) input

I

Main beam signal (B) input

I

Main beam signal (C) input

I

Main beam signal (D) input

I

Side beam signal (E) input

I

Side beam signal (F) input

I

Side beam signal (G) input

I

Side beam signal (H) input

I

Main/side beam signal center voltage input

—

Ground terminal (analog)

Description

83

RCD-W50C

• IC201 LC89587-UK1-E CD DEC/ENC (CDR Board)
Pin No.

1

2 to 6

7
8
9

10 to 15

16
17

18 to 21

22
23

24 to 29

30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58

59 to 66

67
68
69

70 to 77

78
79
80
81

Pin Name

DVSS

RA4 to RA8

RA9

DVDD

DVSS

IO0 to IO5

DVDD

DVSS

IO6 to IO9

DVDD

DVSS

IO10 to IO15

MON1
MON2
MON3
MON4
DVDD

DVSS
TEST0
TEST1
TEST2

WRITE

SSP2
SSP1

RAPC/C2F

WAPC

H11TO/FSQ

LDH/WRQ

ATEST3
ATEST1

WDAT

NWDAT

DVDD

DVSS

AVDD

AVSS

R1
VCNT1
DCNT1

PD1

ZINT

D0 to D7

SRSTNBY

AVDD

AVSS

SUA0 to SUA7

ZRD
ZCS

ZWR

ZRESET

I/O

—

Ground terminal (digital)

O

Address signal output to the buffer RAM for audio data delay

O

Address signal output to the buffer RAM for audio data delay Not used (open)

—

Power supply +3.3V (DRAM I/F)

—

Ground terminal (digital)

I/O

Data input/output to the buffer RAM for audio data delay

—

Power supply +3.3V (digital)

—

Ground terminal (digital)

I/O

Data input/outputto the buffer RAM for audio data delay

—

Power supply +3.3V (DRAM I/F)

—

Ground terminal (digital)

I/O

Data input/output to the buffer RAM for audio data delay

O

Monitor output EFMG signal

O

Monitor output ATIPCRC/PCK/DATA signal (open)

O

Monitor output CDETR/CK2 signal

O

Monitor output EMP/LRCK signal (open)

—

Power supply +5V (digital)

—

Ground terminal (digital)

I/O

ENCERR signal output (pull-up)

I/O

TESTOUT signal output (pull-up)

I/O

TESTIN signal input (ground)

I

Write strategy signal control terminal

O

Servo sampling pulse output

O

Servo sampling pulse output

O

Laser sampling pulse output

O

Laser sampling pulse output

O

Running OPC sampling pulse output

O

LD control signal output for recording Not used (open)

O

Analog block test signal output (WE2)

O

Analog block test signal output Not used (open)

O

LD control signal output for recording

O

LD control signal output for recording

—

Power supply +5V (digital)

—

Ground terminal (digital)

—

Power supply 3.3V (analog) for the write strategy

—

Ground terminal (analog)

I

Analog terminal for the write strategy (fixed at “H”)

I

Analog terminal for the write strategy

I

Analog terminal for the write strategy Not used (open)

O

Analog terminal for the write strategy

O

Interrupt request signal output to the µcom (IC501)

I/O

Data input/output with the µcom (IC501)

I

Back up control terminal for CD-TEXT SRAM

—

Power supply +3.3V (analog) for CD-TEXT SRAM

—

Ground terminal (analog)

I

Command register selection address signal input

I

Data read out signal input from the µcom (IC501)

I

Chip select signal input from the µcom (IC501)

I

Data write signal input from the µcom (IC501)

I

Reset signal input

Description

84

RCD-W50C

Pin No.

82
83
84
85
86
87

88, 89

90 to 93

94
95
96
97
98

99
100
101
102
103
104
105

106 to 108

109
110
111
112
113
114
115
116
117

118, 119

120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138

Pin Name

DVDD

DVSS

DVDD

DVSS

AVDD

AVSS

SLCIST1, SLCIST2

SLCO0 to SLCO3

EFMIN

EFMIN2

DSLB

JITIN

JITC
RPO

OPP
PCKISTF
PCKISTP

PD0

AVDD

AVSS

PDS1 to PDS3

FR

AD0

RREC

FE
TE

VREF

AD1

AVDD

AVSS

DA0, DA1

DVDD

DVSS

DA2
TDO

FDO
SLDO
SPDO

SUBSYNC

ZRFDET

SHOCK

LOCK

DEF

HFL(MIRR)

TES
EFMO
LDON

FG

PCK2

DVDD

I/O

—

Power supply +5V (digital)

—

Ground terminal (digital)

—

Power supply +3.3V (digital)

—

Ground terminal (digital)

—

Power supply +3.3V (analog) for slice level setting

—

Ground terminal (analog)

I

EFM slice level setting signal input

O

EFM slice level output

I

EFM signal input

I

EFM signal input Not used (open)

O

PWM signal output for SLC Not used (open)

I

Jitter judgement input

O

Jitter output

O

P/N balance adjustment terminal

I

P/N balance adjustment terminal

I

Charge pump terminal for the frequency comparison

I

Charge pump terminal for the phase comparison

O

Filter for the charge pump

—

Power supply +3.3V (analog) for the charge pump

—

Ground terminal (analog)

O

Charge pump selection terminal Not used (open)

I

VCO frequency setting input teminal

I

AD input

I

FOK signal input for optical judgement

I

Focus error signal input

I

Tracking error signal input

I

Servo system reference voltage input

I

AD input

—

Power supply +5V (analog) for the servo block AD/DA

—

Ground terminal (analog)

O

DA output Not used (open)

—

Power supply +3.3V (digital)

—

Ground terminal (digital)

O

DA output

O

Tracking signal output

O

Focus signal output

O

Sled signal output

O

Spindle signal output

O

Sub-code sync signal output

I

Judgement signal input for the existence of RF signal (fixed at “H”)

O

Shock detection signal output Not used (open)

O

PLL lock status signal output Not used (open)

I

Defect detection signal input

I

MIRR detection signal input

I

Tracking zero cross signal input

O

EFM signal output after formation of 2 values (open)

O

Laser control signal output for play back

I

Rotation monitor signal input from the spindle motor driver

O

Bit clock output for EFM playback

—

Power supply +5V (digital)

Description

85

RCD-W50C

Pin No.

139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160

161, 162

163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189

Pin Name

DVSS

ATIPSYNC

BIDATA

BICLK

WOBBLE

JITERR
JITPCO

JITLPFI

JITLPFO

JITVCOIN

AVSS

AVDD

DIRRS

DIRVCO

DIRLPF

AVDD

AVSS

DVDD

DVSS

DIRERR

DIN1
DIN2

DIN3, DIN4
DACCKOUT
ENCCKOUT

CDCKOUT

AUXMCKIN

XTALCK

XTAL
PDO0

VCNT0

R0

AVDD

AVSS

TEST4

ROUT
AVDD

AVSS

LOUT

DACDATA

DACLRCK

DACBCK

DVDD

DVSS

ADCDATA

ADCBCK
ADCLRCK
AUXDATA

AUXBCK
AUXLRCK

I/O

—

Ground terminal (digital)

O

ATIP sync signal output

I/O

ATIP demodulator input/output (fixed at “L”)

I/O

ATIP demodulator input/output (fixed at “L”)

I

ATIP demodulator input/output

O

Clock jitter suppressor error signal output Not used (open)

O

PLL phase frequency comparator output

I

PLL low-pass filter input terminal

O

PLL low-pass filter output terminal

I

PLL, VCO clock input terminal

—

Ground terminal (analog)

—

Power supply +3.3V (analog) for the clock jitter suppressor

I

VCO gain control signal input

I

VCO free running oscillation frequency control signal input

O

Loop filter setting terminal

—

Power supply +3.3V (analog) for the DIR

—

Ground terminal (analog)

—

Power supply +5V (digital)

—

Ground terminal (digital)

O

PLL lock data error output

I

Digital data input from the IC500

I

Digital data input from the IC101

I

Digital data input Not used (open)

O

DAC clock output Not used (open)

O

RF processor clock output Not used (open)

O

CD decoder clock output Not used (open)

I

External clock input (fixed at “L”)

I

Crystal oscillation circuit input

O

Crystal oscillation circuit output

O

Charge pump output

I

VCO control voltage input

I

VCO bias resistor terminal

—

Power supply +3.3V (analog) for the clock

—

Ground terminal (analog)

I/O

ADCCKOUT clock output

O

DAC output Not used (open)

—

Power supply +5V (analog) for the internal DAC

—

Ground terminal (analog)

O

DAC output Not used (open)

O

DAC serial data output Not used (open)

O

DAC LRCK output Not used (open)

O

DAC BCK output Not used (open)

—

Power supply +3.3V (digital)

—

Ground terminal (digital)

I

ADC serial data input Not used (fixed at “L”)

O

ADC BCK output Not used (open)

O

ADC LRCK output Not used (open)

I

External serial data input Not used (open)

I

External BCK input Not used (fixed at “L”)

I

External LRCK input Not used (fixed at “L”)

Description

86

RCD-W50C

Pin No.

190
191
192
193
194
195
196
197
198
199
200
201
202
203

204 to 207

208

Pin Name

DVDD

DVSS

ADCSTBY

AUXTX

DITOUT

TEST3

SBDATA

CLCK

SFSY
SBSY
ZRAS
ZCAS

ZWE

ZOE

RA0 to RA3

DVDD

I/O

—

Power supply +5V (digital)

—

Ground terminal (digital)

O

ADC standby signal output

I

DIT data input Not used (fixed at “L”)

O

DIT data output

I/O

Used as EXTDACEMP input (fixed at “L”)

I/O

Sub-code I/F serial data input/output (fixed at “L”)

I/O

Sub-code I/F data shift clock input/output (fixed at “L”)

I/O

Sub-code I/F frame sync signal input/output (fixed at “L”)

I/O

Sub-code I/F block sync signal input/output (fixed at “L”)

O

Row address strobe signal output to the buffer RAM for audio data delay

O

Column address strobe signal output to the buffer RAM for audio data delay

O

Write enable signal output to the buffer RAM for audio data delay

O

Read enable signal output to the buffer RAM for audio data delay

O

Address signal output to the buffer RAM for audio data delay

—

Power supply +3.3V (DRAM I/F)

Description

87

RCD-W50C

• IC501 HD64F3064BFBL25 µCOM (CDR Board)

Pin No.

1
2

3 to 5

6
7
8

9
10
11
12
13
14
15
16
17
18

19, 20

21
22
23
24
25
26

27 to 34

35

36 to 43

44

45 to 56

57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78

Pin Name

VCL

XCSCDR

NU

XRSTRFP

XREQI

XRDYO

XRSTCDR

FWE

VSS

SDATAO
SDATAO(HOST)
SDATAI(PROM)

SDATAI(HOST)

SCLKO

SUB_SYNC

RSBETA

NU

MIRR/XRC

VSS

AGCON

XRW/R

VRDSW

VWDSW

D8 to D15

VCC

A0 to A7

VSS

A8 to A19

VSS

NU
CS

XLAT

ATIPSYNC

XSTBY
XREST

XP.DOWN

VSS

EXTAL

XTAL

VCC

XAS

XRD

XHWR

XLWR
MD0(H)
MD1(L)

MD2

AVCC

AVREF

KEY

I/O

—

Capacitor connection terminal for the internal power supply

O

Chip select signal output to the IC201

—

Not used (fixed at “H”)

O

Register reset signal output to the IC101

I

Data request signal from the IC1

O

Data ready signal to the IC1

O

Reset signal to the IC201

I

Flash memory write enable signal input

—

Ground terminal

O

Serial data output to the IC101 and IC502

O

Serial data output to the IC1

I

Serial data input from the IC502

I

Serial data input from the IC1

O

Clock output to the IC101 and IC502

I

Sub-code sync signal input from the IC201

O

β measurement circuit reset signal output

—

Not used (fixed at “H”)

O

MIRR or RC selection signal output

—

Ground terminal

O

AGC enable signal output to the IC101

O

CD-RW selection signal output to the IC101

O

Read laser driver time constant selection switch control signal output to the IC101

O

Write laser driver time constant selection switch control signal output to the IC101

I/O

Data bus with the IC201

—

Power supply (+5V)

O

Command register selection address signal output to the IC201

—

Ground terminal

O

Not used (fixed at “H”)

—

Ground terminal

—

Not used terminal

O

Chip select signal output to the IC502

O

Data latch signal output to the IC101

I

ATIP SYNC signal input from the IC201

I

Not used (fixed at “H”)

I

System reset signal input

I

Not used

—

Ground terminal

I

Ceramic resonator connection terminal

I

Ceramic resonator connection terminal

—

Power supply (+5V)

O

Not used

O

Data read signal output to the IC201

O

Data write signal output to the IC201

O

Not used

I

Mode selector (fixed at “H”)

I

Mode selector (fixed at “L”)

I

Mode selector (normally fixed at “H”)

—

Power supply (+5V) for the A/D converter

—

Reference voltage for the A/D converter

I

Key scan signal input

Description

88

RCD-W50C

Pin No.

79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99

100

Pin Name

BCENT
PHBETA
BHBETA

VREF

MPX

TMP

VWDC2

AVSS

XINTCDR

RECD

XTAND

SPFG

XIN/EXT

VSS

SLFG

TZC

SPFG

XMMUTE

INSW

OUTSW

REV

FWD

I/O

I

Center signal input from the IC101

I

β signal top level signal input from the IC101

I

β signal bottom level signal input from the IC101

I

Reference voltage input terminal

I

Monitor multiplexer signal input from the IC101

I

THERMOUT signal input

O

VWDC2 signal output to the optical pick-up

—

Ground terminal for the A/D converter

I

Interrupt request signal input from the IC201

I

Recorded block detection signal input from the IC101

I

Tracking failure detection signal input from the IC101

I

Not used

I

RS-232C “H” detection signal input

—

Ground terminal

I

ENCOUT signal input

I

Tracking zero cross detection signal input from the IC101

I

FG signal input from the motor driver (IC172)

O

Muting signal output to the IC171 and IC172

I

LOAD IN switch (S170) signal input

I

LOAD OUT switch (S171) signal input

O

Loading motor control signal output to the IC171

O

Loading motor control signal output to the IC171

Description

89

RCD-W50C

NOTE:

• -XX, -X mean standardized parts, so they may
have some differences from the original one.

• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.

7-1. Case Section

3

SECTION 7

EXPLODED VIEWS

• The mechanical parts with no reference number
in the exploded views are not supplied.

• Accessories are given in the last of this parts
list.

•Abbreviation
CND : Canadian model

The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.

Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.

3

5

4

2

3

#1

Chassis section

Front panel section

1

#1

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1 4-238-393-01 PANEL (CDR), LOADING
2 3-703-571-11 BUSHING (S) (4516), CORD (E)

* 2 3-703-244-00 BUSHING (2104), CORD (US,CND)

3 4-210-291-01 SCREW (CASE 3 TP2)

4 4-231-686-11 CASE (409538)

0 5 1-783-525-21 CORD, POWER (TRACKING) (E)
0 5 1-783-531-31 CORD, POWER (US,CND)

#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 TT(B)

90

7-2. Front Panel Section

RCD-W50C

55

56

66

not
supplied

64

57

58

53

not
supplied

59

61

not
supplied

58

58

60

58

62

65

58

63

54

52

64

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

51

51 X-4954-476-1 PANEL ASSY, FRONT (US,CND)
51 X-4954-477-1 PANEL ASSY, FRONT (E)
52 4-977-358-11 CUSHION
53 4-241-393-01 SPRING, TORSION
54 4-238-396-11 KNOB (AMS)

55 4-238-396-01 KNOB (AMS)
56 4-231-973-01 BUTTON (POWER)
57 1-683-869-11 POWER-SW BOARD
58 4-951-620-01 SCREW (2.6X8), +BVTP

59 3-931-378-51 KNOB (F10)
60 1-683-868-11 HP BOARD
61 1-683-867-11 CD-SW BOARD
62 1-683-872-11 LED BOARD
63 A-4727-910-A DISPLAY BOARD, COMPLETE (US,CND)

63 A-4727-916-A DISPLAY BOARD, COMPLETE (E)
64 3-354-981-11 SPRING (SUS), RING
65 1-823-923-11 WIRE (FLAT TYPE)(21 CORE)
66 4-238-392-01 LID (5 CD)

91

RCD-W50C

7-3. Chassis Section

#1

Overall section
(CDM53L-30B61B)

107

not
supplied

103

102

T900

105

#2

#2

#2

109

not
supplied

103

111

108

#1

106

#1

#1

110

#1

CDM65-RBD1

101

102

101

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

101 X-4953-448-1 FOOT ASSY
102 4-977-358-11 CUSHION
103 4-232-237-01 FOOT (DIA. 30)
105 A-4727-907-A MAIN BOARD, COMPLETE (US,CND)
105 A-4727-914-A MAIN BOARD, COMPLETE (E)

106 3-703-249-01 SCREW, S TIGHT, +PTTWH 3X6
107 1-823-925-11 WIRE (FLAT TYPE)(17 CORE)
108 4-238-401-01 PANEL, BACK (US)
108 4-238-401-11 PANEL, BACK (CND)

108 4-238-401-31 PANEL, BACK (E)
109 1-823-924-11 WIRE (FLAT TYPE)(23 CORE)
110 1-823-922-11 WIRE (FLAT TYPE)(11 CORE)
111 A-4727-920-A VOL-SEL BOARD

0 T900 1-437-623-11 TRANSFORMER, POWER (US,CND)

0 T900 1-437-624-11 TRANSFORMER, POWER (E)

#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 TT(B)
#2 7-685-871-01 SCREW +BVTT 3X6 (S)

The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.

92

7-4. Overall Section (CDM53L-30B61B)

RCD-W50C

402

409

402

410

411

412

408

402

402

not supplied

404

A

402

Chassis (mold)
assembly section
(CDM53L-30B61B)

402

A

415

414

402

419

not supplied

423

416

417

418

413

402

422

402

Chassis section
(CDM53L-30B61B)

424

407

406

405

403

402

402

401

402

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

401 3-341-549-01 SCREW(2.6X12)(DIA.7.5),+PTP WH
402 4-218-253-11 SCREW (M2.6), +BTTP
403 1-675-724-11 INIT/COUNT SW BOARD
404 4-211-215-01 GEAR (EJECT)
405 1-675-726-11 SENSOR BOARD

406 4-212-676-01 SPRING (LID), TORSION
407 4-221-532-11 LID (DISC)
408 4-933-134-01 SCREW (M2.6), +PTPWH
409 A-4672-909-C BASE (GUIDE) ASSY, FITTING
410 1-675-725-11 OUT SW BOARD

412 4-964-461-02 HOLDER (SENSOR)
413 A-4746-928-A BASE (MAGNET) ASSY, FITTING
414 4-228-414-01 BRACKET (YOKE)
415 4-227-513-01 PULLEY (4SB)
416 4-222-783-01 LEVER (LIFTER)

417 4-221-530-01 LEVER (DETECTION C)
418 4-985-672-01 SCREW (+PTPWH M2.6), FLOATING
419 4-221-528-01 LEVER (DETECTION A)
422 1-675-723-11 IN SW BOARD
423 X-4952-916-1 PULLEY (FK) ASSY, CHUCKING

411 1-675-727-11 SENSOR 2 BOARD

424 1-675-722-11 CONNECTOR BOARD

93

RCD-W50C

7-5. Chassis (Mold) Assembly Section (CDM53L-30B61B)

452

455

456

451

453

458

451

457

not
supplied

M702

451

454

459

455

456

461

460

451

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

451 4-218-253-11 SCREW (M2.6), +BTTP
452 4-211-235-01 BELT (COMMUNICATION)
453 4-241-745-01 BELT (LOADING 1)
454 4-211-231-01 PULLEY (MODE)
455 4-211-214-01 PULLEY (LD)

456 4-211-232-01 GEAR (LD DECELERATION)

457 4-211-228-01 LEVER (GOOSENECK)
458 4-214-130-01 GEAR (TRAY)
459 4-221-505-11 CHASSIS (MOLD B)
460 1-675-728-11 LOAD MOTOR BOARD
461 X-4950-342-1 MOTOR (LOADING) ASSY

M702 1-763-790-11 MOTOR, DC (LOADING)

94

7-6. Chassis Section (CDM53L-30B61B)

530

527

532

529

531

532

510

RCD-W50C

511

512

536

535
534

501

C

503

A

538

536

BU-30BBD61B

504

536

535

534

501

D

537

532

502

536

535
511

532

505

502

not
supplied

506

C

not
supplied

M701

526

528

D

501

507

508

501

A

501

511

533

not
supplied

514

S707

516

509

525

B

B

514

515

517

513

518

519

520

521

522

523

501

524

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

501 4-218-253-11 SCREW (M2.6), +BTTP
502 4-211-244-01 SCREW, STEP
503 4-211-223-01 SLIDER (U/D)
504 4-933-134-01 SCREW (M2.6), +PTPWH
505 4-211-215-01 GEAR (EJECT)

506 4-211-232-01 GEAR (MODE DECELERATION)
507 4-211-214-01 PULLEY (LD)
508 4-211-237-01 BELT (MODE)
509 4-212-677-01 SLIDER (SHUTTER)
510 4-212-678-01 SPRING (SHUTTER), TENSION

511 4-985-672-01 SCREW (+PTPWH M2.6), FLOATING
512 4-211-233-01 SLIDER (SELECTION)
513 4-211-230-01 GEAR (CHUCKING)
514 4-211-245-01 SPRING, COMPRESSION
515 4-211-221-01 GEAR (LD MOVABLE)

516 4-211-217-01 GEAR (SELECTION)
517 4-211-242-11 SHAFT (SELECTION GEAR)
518 4-211-240-01 GEAR (LD DECELERATION B)
519 4-211-216-01 GEAR (RELAY)
520 4-211-241-01 LEVER (SELECTION)

521 4-216-879-01 SPRING (GEAR), COMPRESSION
522 3-701-446-21 WASHER
523 4-211-218-01 GEAR (GEAR A)
524 4-211-220-01 GEAR (U/D SLIDER)
525 4-211-219-01 GEAR (GEAR B)

526 1-675-729-11 CLAMP MOTOR BOARD
527 4-211-212-51 TRAY (SUB)
528 4-221-504-01 BASE (STOCKER), FITTING
529 4-211-211-01 STOCKER (R)
530 4-211-210-01 STOCKER (L)

531 4-211-234-01 BRACKET (STOCKER T)
532 4-218-253-21 SCREW (M2.6), +BTTP
533 X-4950-341-1 MOTOR (CLAMP) ASSY
534 4-231-151-01 STOPPER (BU)
535 4-227-045-11 SPRING (INSULATOR), COIL

536 4-240-820-01 INSULATOR (B)(BU-30B)
537 4-227-899-01 SCREW (DIA.12), FROATING
538 X-4954-297-2 HOLDER (BU30) ASSY
M701 1-763-790-11 MOTOR, DC (ELEVATOR)
S707 1-418-045-01 ENCODER, ROTARY

95

RCD-W50C

7-7. Optical Block Section

553

Ref. No. Part No. Description Remarks

551 A-4727-463-A BD BOARD, COMPLETE
552 1-782-817-11 WIRE (FLAT TYPE)(16 CORE)

552

551

Ref. No. Part No. Description Remarks

553 A-4735-885-A BU-30B ASSY

96

7-8. CDM65-RBD1

RCD-W50C

605

602

606

622

603

C

608

609

610

611

623

not
supplied

not
supplied

613

604

M201

614

623

612

615

616

C

607

621

618

617

D

619

620

A

B

B

not
supplied

A

601

not supplied

D

607

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

601 1-823-651-11 CABLE, FLEXIBLE FLAT (32 CORE)
602 4-237-168-01 SCREW, STEP

0 603 8-583-104-01 OPTICAL PICK-UP (KRM-220CAA)

604 4-237-167-01 SCREW (2X9) (G WITH),+P TAPPIN
605 4-237-181-01 TRAY

606 4-237-174-01 PULLEY (MAG)
607 4-951-620-01 SCREW (2.6X8), +BVTP
608 4-240-988-02 PULLEY (UPPER), PRESS

* 609 1-452-958-11 MAGNET (CHUCKING)
* 610 4-974-710-11 YOKE, PULLEY

615 4-237-177-01 GEAR (A)
616 4-237-178-02 GEAR (B)
617 4-237-179-02 GEAR (C)
618 4-237-180-01 CAM (CH)
619 4-237-182-01 CHASSIS

620 A-4727-459-A CDR BOARD, COMPLETE
621 3-341-549-01 SCREW(2.6X8)(DIA.7.5),+ PTP WH
622 4-240-987-01 SHEET (DR)
623 4-232-682-01 CUSHION (66)
M201 A-4735-557-A MOTOR ASSY (LOADING)

611 4-237-172-01 HOLDER (MG)
612 4-974-711-01 SCREW (2X5)(P TYIGHT),(+)PTTWH
613 4-999-537-01 BELT (LOADING)
614 4-237-176-02 PULLEY (CG)

The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.

97

RCD-W50C

SECTION 8

BD

NOTE:

• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.

• -XX, -X mean standardized parts, so they
may have some difference from the original
one.

• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.

• CAPACITORS:
uF: µF

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

A-4727-463-A BD BOARD, COMPLETE

*******************

< CAPACITOR >

C101 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C102 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C103 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V

C108 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C109 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C111 1-126-607-11 ELECT CHIP 47uF 20% 4V
C112 1-126-607-11 ELECT CHIP 47uF 20% 4V

C113 1-126-209-11 ELECT CHIP 100uF 20.00% 4V
C114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C115 1-126-205-11 ELECT CHIP 47uF 20% 6.3V
C117 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C118 1-115-156-11 CERAMIC CHIP 1uF 10V

C119 1-115-156-11 CERAMIC CHIP 1uF 10V
C120 1-126-607-11 ELECT CHIP 47uF 20% 4V
C151 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C152 1-115-416-11 CERAMIC CHIP 0.001uF 5.00% 25V
C153 1-164-360-11 CERAMIC CHIP 0.1uF 16V

ELECTRICAL PARTS LIST

• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

• COILS
uH: µH

• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...

C212 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C213 1-115-414-11 CERAMIC CHIP 820PF 5.00% 25V
C214 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C215 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V
C216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C218 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C219 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C221 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C222 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C223 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V

C224 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C225 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C227 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C229 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C230 1-113-682-11 TANTAL. CHIP 33uF 20.00% 10V

C231 1-128-995-21 ELECT CHIP 100uF 20% 10V
C232 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C234 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C235 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C236 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V

CN101 1-784-834-21 CONNECTOR,FFC (LIF (NON-ZIF)) 23P
CN102 1-794-424-11 CONNECTOR, FCC/FPC 16P

•Abbreviation
CND : Canadian model

When indicating parts by reference number,
please include the board name.

The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.

Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.

< CONNECTOR >

C163 1-117-681-11 ELECT CHIP 100uF 20.00% 16V
C164 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C165 1-124-779-00 ELECT CHIP 10uF 20% 16V
C166 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C167 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C168 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C169 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C171 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C178 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C179 1-164-360-11 CERAMIC CHIP 0.1uF 16V

C182 1-128-995-21 ELECT CHIP 100uF 20% 10V
C201 1-126-246-11 ELECT CHIP 220uF 20% 4V
C202 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C203 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C204 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V

C205 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C207 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C209 1-164-230-11 CERAMIC CHIP 220PF 5.00% 50V
C210 1-115-414-11 CERAMIC CHIP 820PF 5.00% 25V
C211 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V

98

< FERRITE BEAD >

FB101 1-500-445-21 FERRITE 0UH

< IC >

IC101 8-752-408-73 IC CXD3068Q
IC102 8-759-713-71 IC AN41050
IC103 8-752-089-74 IC CXA2581N-T4
IC104 8-759-833-99 IC TC74HC4052AFT (EL)
IC105 8-759-834-29 IC MC74VHC1G04DFT1

IC201 8-759-460-72 IC BA033FP-E2

< COIL >

L171 1-412-967-31 INDUCTOR 0.1uH
L230 1-469-981-21 FERRITE 0uH

< TRANSISTOR >

Q101 8-729-049-31 TRANSISTOR 2SB710A-RTX

RCD-W50C

BD CDR

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< RESISTOR >

< VARIABLE RESISTOR >

R102 1-216-835-11 METAL CHIP 15K 5% 1/16W
R103 1-216-845-11 METAL CHIP 100K 5% 1/16W
R104 1-216-835-11 METAL CHIP 15K 5% 1/16W
R105 1-216-821-11 METAL CHIP 1K 5% 1/16W
R109 1-216-846-11 METAL CHIP 120K 5% 1/16W

R111 1-216-846-11 METAL CHIP 120K 5% 1/16W
R112 1-216-840-11 METAL CHIP 39K 5% 1/16W
R113 1-218-701-11 RES-CHIP 2.4K 5% 1/10W
R114 1-218-745-11 RES-CHIP 160K 5% 1/10W
R115 1-216-839-11 METAL CHIP 33K 5% 1/16W

R116 1-216-839-11 METAL CHIP 33K 5% 1/16W
R118 1-216-864-11 METAL CHIP 0 5% 1/16W
R120 1-216-846-11 METAL CHIP 120K 5% 1/16W
R122 1-216-845-11 METAL CHIP 100K 5% 1/16W
R123 1-216-797-11 METAL CHIP 10 5% 1/16W

R124 1-216-797-11 METAL CHIP 10 5% 1/16W
R125 1-216-839-11 METAL CHIP 33K 5% 1/16W
R126 1-216-839-11 METAL CHIP 33K 5% 1/16W
R151 1-216-833-11 METAL CHIP 10K 5% 1/16W
R152 1-216-837-11 METAL CHIP 22K 5% 1/16W

R165 1-216-864-11 METAL CHIP 0 5% 1/16W
R166 1-216-864-11 METAL CHIP 0 5% 1/16W
R167 1-216-864-11 METAL CHIP 0 5% 1/16W
R168 1-216-864-11 METAL CHIP 0 5% 1/16W
R169 1-216-864-11 METAL CHIP 0 5% 1/16W

RV101 1-223-997-21 RES, CARBON ADJ VAR 47K

< VIBRATOR >

X201 1-767-518-11 VIBRATOR, CRYSTAL 33.8688 MHz

************************************************************

A-4727-459-A CDR BOARD, COMPLETE

********************

< CAPACITOR >

C101 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C102 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C103 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C104 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C105 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C106 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C107 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C108 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C109 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

C111 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C112 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C113 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C114 1-164-230-11 CERAMIC CHIP 220PF 5.00% 50V
C115 1-164-230-11 CERAMIC CHIP 220PF 5.00% 50V

R170 1-216-864-11 METAL CHIP 0 5% 1/16W
R177 1-216-821-11 METAL CHIP 1K 5% 1/16W
R178 1-216-864-11 METAL CHIP 0 5% 1/16W
R179 1-216-837-11 METAL CHIP 22K 5% 1/16W
R201 1-216-839-11 METAL CHIP 33K 5% 1/16W

R202 1-216-833-11 METAL CHIP 10K 5% 1/16W
R203 1-216-845-11 METAL CHIP 100K 5% 1/16W
R204 1-216-833-11 METAL CHIP 10K 5% 1/16W
R205 1-216-823-11 METAL CHIP 1.5K 5% 1/16W
R206 1-216-850-11 METAL CHIP 270K 5% 1/16W

R207 1-218-917-11 RES-CHIP 820K 5% 1/10W
R208 1-216-845-11 METAL CHIP 100K 5% 1/16W
R209 1-216-809-11 METAL CHIP 100 5% 1/16W
R212 1-216-809-11 METAL CHIP 100 5% 1/16W
R213 1-216-864-11 METAL CHIP 0 5% 1/16W

R214 1-216-864-11 METAL CHIP 0 5% 1/16W
R215 1-216-864-11 METAL CHIP 0 5% 1/16W
R216 1-216-813-11 METAL CHIP 220 5% 1/16W
R217 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R218 1-216-821-11 METAL CHIP 1K 5% 1/16W

R219 1-216-821-11 METAL CHIP 1K 5% 1/16W
R226 1-216-809-11 METAL CHIP 100 5% 1/16W
R227 1-216-839-11 METAL CHIP 33K 5% 1/16W
R228 1-216-849-11 METAL CHIP 220K 5% 1/16W
R229 1-216-819-11 METAL CHIP 680 5% 1/16W

C116 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C117 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C118 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C119 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C120 1-127-760-11 CERAMIC CHIP 4.7uF 10% 6.3V

C121 1-126-392-11 ELECT CHIP 100uF 20.00% 6.3V
C122 1-162-963-11 CERAMIC CHIP 680PF 10% 50V
C123 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C124 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C125 1-128-934-91 CERAMIC CHIP 0.33uF 20% 10V

C126 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C128 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C129 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C130 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C131 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C134 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C135 1-162-959-11 CERAMIC CHIP 330PF 5% 50V
C136 1-126-391-11 ELECT CHIP 47uF 20.00% 6.3V

C137 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C138 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C139 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C140 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V
C141 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

R230 1-216-864-11 METAL CHIP 0 5% 1/16W
R234 1-216-809-11 METAL CHIP 100 5% 1/16W

< NETWORK RESISTOR >

RN201 1-233-576-11 RES, CHIP NETWORK 100
RN202 1-233-576-11 RES, CHIP NETWORK 100

C142 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C143 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C144 1-128-934-91 CERAMIC CHIP 0.33uF 20% 10V
C145 1-128-934-91 CERAMIC CHIP 0.33uF 20% 10V
C146 1-128-934-91 CERAMIC CHIP 0.33uF 20% 10V

C150 1-164-156-11 CERAMIC CHIP 0.1uF 25V

99

RCD-W50C

CDR

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C151 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C157 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V
C158 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V

C160 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C178 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C179 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C180 1-126-395-11 ELECT 22uF 20% 16V
C181 1-127-573-11 CERAMIC CHIP 1uF 10% 16V

C182 1-127-573-11 CERAMIC CHIP 1uF 10% 16V
C183 1-127-573-11 CERAMIC CHIP 1uF 10% 16V
C184 1-126-395-11 ELECT 22uF 20% 16V
C185 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C186 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

C187 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C188 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C189 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C190 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C191 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C192 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C193 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C194 1-126-395-11 ELECT 22uF 20% 16V
C200 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V
C201 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C202 1-126-392-11 ELECT CHIP 100uF 20.00% 6.3V
C203 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C204 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C205 1-126-391-11 ELECT CHIP 47uF 20.00% 6.3V
C206 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C207 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C208 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C209 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C210 1-126-392-11 ELECT CHIP 100uF 20.00% 6.3V
C212 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V

C213 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C214 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C216 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C217 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C218 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C219 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C220 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C221 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C222 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C223 1-164-677-11 CERAMIC CHIP 0.033uF 10.00% 16V

C224 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C225 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C226 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C227 1-162-912-11 CERAMIC CHIP 7PF 0.5PF 50V
C228 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V

C230 1-162-912-11 CERAMIC CHIP 7PF 0.5PF 50V
C232 1-162-963-11 CERAMIC CHIP 680PF 10% 50V
C233 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C234 1-165-908-91 CERAMIC CHIP 1uF 10% 25V
C235 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V

C236 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C237 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C238 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C239 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C240 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C241 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C242 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C244 1-126-390-11 ELECT CHIP 22uF 20.00% 6.3V
C245 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C246 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

C247 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C248 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C249 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C250 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C251 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C254 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C257 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C258 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C259 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C260 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C262 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C263 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C268 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C269 1-126-392-11 ELECT CHIP 100uF 20.00% 6.3V
C270 1-126-396-11 ELECT CHIP 47uF 20.00% 16V

C271 1-126-392-11 ELECT CHIP 100uF 20.00% 6.3V
C272 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C273 1-126-391-11 ELECT CHIP 47uF 20.00% 6.3V
C275 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C289 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C301 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C302 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C303 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C304 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C501 1-126-396-11 ELECT CHIP 47uF 20.00% 16V

C502 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C506 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C508 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C509 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C510 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C511 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C512 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C513 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C514 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C517 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C518 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C519 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C520 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C521 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C526 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

CN101 1-784-894-11 CONNECTOR, FFC/FPC 32P
CN102 1-816-220-21 CONNECTOR, FFC/FPC 11P
CN103 1-816-220-21 CONNECTOR, FFC/FPC 11P
CN104 1-770-160-21 PIN, CONNECTOR (PC BOARD) 2P
CN110 1-784-370-21 CONNECTOR, FFC/FPC 11P

* CN111 1-764-250-11 PIN, CONNECTOR (PC BOARD) 4P

CN112 1-784-365-21 CONNECTOR, FFC/FPC 5P
CN115 1-770-160-21 PIN, CONNECTOR (PC BOARD) 2P
CN121 1-774-731-21 PIN, CONNECTOR (PC BOARD) 5P

100