Sony RCDW-50-C Service manual

RCD-W50C
SERVICE MANUAL
Ver 1.1 2003. 12
Model Name Using Similar Mechanism NEW
CD Section
CD-R/CD-RW Section
CD Mechanism Type CDM53L-30B61B Base Unit Type BU-30BBD61B Optical Pick-up Type A-MAX.3 Model Name Using Similar Mechanism NEW CD Mechanism Type CDM65-RBD1 Base Unit Type RBD1 Optical Pick-up Type KRM-220CAA
US Model
Canadian Model
E Model
DECK A (the CD player section)
System Compact disc digital audio Laser Semiconductor laser (λ =
Frequency response 20 Hz – 20,000 Hz (±0.5
DECK B (the CD-R and CD-RW recording section)
System Compact disc digital audio Laser Semiconductor laser (λ =
Playable discs CD, CD-R, CD-RW Recordable discs CD-R, CD-RW (for music
Frequency response 20 Hz - 20,000 Hz (±0.5
system 780 nm)
Emission duration: continuous
dB)
system 780 nm)
Emission duration: continuous
use) dB)
SPECIFICATIONS
Inputs
ANALOG IN (Phono jacks) Impedance: 47 kilohms
DIGITAL OPTICAL IN (Square optical connector jack)
Outputs
ANALOG OUT (Phono jacks) Impedance: 47 kilohms
DIGITAL OPTICAL OUT (Square optical connector jack)
PHONES (Phono jack) Load impedance: 32 ohms
Rated input: 500 mVrms Minimum input 250 mVrms
Optical wavelength: 660 nm
Rated output: 2 Vrms Load impedance: over 10 kilohms
Wavelength: 660 nm Output level: –18 dBm
Output level: 12mW
COMPACT DISC RECORDER
General
Power requirements North American model: 120 V AC, 60 Hz Other models: 110-120/220-240V AC,
Power consumption 25 W Dimensions (approx.) (w/h/d) incl. projecting parts and control 430 × 108 × 399 mm
Mass (approx.) 6.8 kg Supplied accessories
Design and specifications are subject to change without notice.
50/60 Hz
3
/8 × 15 3/4 inch)
( 17 × 4 (15 lbs)
• Audio connecting cords Phono jack × 2 (red/white) Phono jack × 2 (red/white) (2)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
9-874-151-02
2003L16-1 © 2003.12
Sony Corporation
Home Audio Company Published by Sony Engineering Corporation
RCD-W50C
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
The following caution label is located inside the apparatus.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for A C leakage. Check leakage as described below.
LEAKAGE
The A C leakage from any e xposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA WT -540A. Follo w the manufacturers’ instructions to use these instruments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated A C voltmeter . The “limit” indication is 0.75 V, so analog meters must have an accurate low-volta ge scale. The Simpson 250 and Sanwa SH-63Trd are e xamples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)
To Exposed Metal
Parts on Set
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
0.15 µF
Fig. A. Using an A C v oltmeter to check A C leakage.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No. MODEL
4-238-401-0π 4-238-401-1π 4-238-401-3π
1.5 k
Earth Ground
US Canadian E
AC Voltmeter (0.75 V)
Parts No.
2

TABLE OF CONTENTS

RCD-W50C
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
1. SERVICING NOTE·····················································4
2. GENERAL ···································································5
3. DISASSEMBLY··························································6
3-1. Case (409538) ······························································· 7 3-2. Loading Panel (CDR) ··················································· 7 3-3. Front Panel Section······················································· 8 3-4. CD-SW Board, LED Board, DISPLAY Board ············· 8 3-5. CD Mechanism Deck (CDM65-RBD1) ······················· 9 3-6. Tray··············································································· 9 3-7. CDR Board ································································· 10 3-8. Holder (MG) Sub Assembly, Dust Cover ··················· 10 3-9. Optical Pick-Up (KRM-220CAA)······························ 11 3-10. Motor Assembly (Loading) (M201) ··························· 11 3-11. Cam (CH)···································································· 12 3-12. MAIN Board ······························································· 12 3-13. CD Mechanism Deck (CDM53L-30B61B) ················ 13 3-14. Fitting Base (Magnet) Assembly ································ 13 3-15. CLAMP MOTOR Board,
Motor (Clamp) Assembly (M701)······························ 14 3-16. Fitting Base (Guide) Assembly, Bracket (Chassis) ····· 14 3-17. Tray (Sub) ··································································· 15 3-18. Chassis (Mold B) ························································ 15 3-19. LOAD MOTOR Board,
Motor (Loading) Assembly (M702) ···························16 3-20. Stocker Section ··························································· 16 3-21. Slider (Selection), Tension Spring (Shutter),
Slider (Shutter)···························································· 17 3-22. Gear (Gear A), Gear (Gear B), Gear (U/D Slider)······ 17
Precaution During Gear (Gear U/D Slider),
Gear (Gear B), Gear (Gear A) Installation·················· 18 3-23. Gear (Chucking) ························································· 18 3-24. BD Board ···································································· 19 3-25. Optical Block Section ················································· 19
4. TEST MODE ···································································· 21
5. ELECTRICAL ADJUSTMENTS ······························· 24
CD SECTION ····························································· 24
CD-R/RW SECTION·················································· 25
6. DIAGRAMS······································································ 55
6-1. Block Diagrams – CD-R Section – ··························· 56
6-2. Printed Wiring Board – BD Section – ························ 59 6-3. Schematic Diagram – BD Section – ··························· 60 6-4. Printed Wiring Board
6-5. Schematic Diagram 6-6. Printed Wiring Board – CD-R Section (Side A) – ······ 63
6-7. Printed Wiring Board – CD-R Section (Side B) – ······ 64 6-8. Schematic Diagram – CD-R Section (1/4) – ·············· 65 6-9. Schematic Diagram – CD-R Section (2/4) – ·············· 66 6-10. Schematic Diagram – CD-R Section (3/4) – ·············· 67 6-11. Schematic Diagram – CD-R Section (4/4) – ·············· 68 6-12. Printed Wiring Board – MAIN Section (Side A) – ····· 69 6-13. Printed Wiring Board – MAIN Section (Side B) –····· 70 6-14. Schematic Diagram – MAIN Section (1/2) – ············· 71 6-15. Schematic Diagram – MAIN Section (2/2) – ············· 72 6-16. Printed Wiring Board – LED Section – ······················ 73 6-17. Schematic Diagram – LED Section – ························· 74 6-18. Printed Wiring Board – DISPLAY Section – ············· 75 6-19. Schematic Diagram – DISPLAY Section – ················ 76 6-20. IC Block Diagrams ····················································· 77 6-21. IC Pin Functions Description······································80
– CD Section – ······························· 57 – POWER/DISPLAY Section –······ 58
– SENSER/MOTOR/SW Section – ·····61 – SENSER/MOTOR/SW Section – ·····62
7. EXPLODED VIEWS ······················································ 54
7-1. Case Section··································································90 7-2. Front Panel Section ······················································· 91 7-3. Chassis Section ····························································· 92 7-4. Overall Section (CDM53L-30B61B)···························· 93 7-5.
Chassis (Mold) Assembly Section (CDM53L-30B61B) ·· 7-6. Chassis Section (CDM53L-30B61B) ··························· 95 7-7. Optical Block Section ··················································· 96 7-8. CDM65-RBD1 ······························································ 97
94
8. ELECTRICAL PARTS LIST······································· 98
3
RCD-W50C
SECTION 1

SERVICING NOTE

Self-diagnosis Function
When the self-diagnosis function is activated to prevent the player from malfunctioning, three character service numbers in a combination with a message appears in the display. In this case, check the following table.
Message
C12/ Cannot Copy
C13/ Rec Error
C14/ TOC Error
C41/ Cannot Copy
C71/ Din Unlock
Explanation
You are trying to record a disc that cannot be played back in DECK-A or with an external device, such as CD-ROM or VIDEO CD.
• Remove the disc, and then insert a music CD for playback.
Recording has not been completed successfully because of vibration.
• Relocate the unit in a place free of vibration and restart the recording again.
The disc you try to record is excessively dirty (such as oil­stained or finger marked) or scratched. Or the disc is not normal.
• Replace the disc with another one and restart the recording again.
The unit did not read the TOC information.
• Insert other discs.
The sound source you are trying to record is a copy of a commercial music software. Or you are trying to record on a CD-R/CD-RW digitally.
• Because of the restriction of the Serial Copy Management System, you cannot record a copy of a commercial music software. Neither can you record a CD-R/ CD-RW digitally.
If this message is displayed momentarily, this is not an error. It is caused by the digital signal during recording.
During recording of a digital sound source, the connecting cable has been disconnected or the player of the sound source has turned off.
• Connect the cable or turn on the digital player.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repain parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveform is output three times.
4
SECTION 2

GENERAL

RCD-W50C
2 5 978 q;
e; wl
wgwh ws
1 POWER button 2 H button 3 DISC 1 to DISC 5 A button and indicators 4 CD SYNCHRO NORMAL button
3
41
qh PLAY MODE button qj TIME button qk DISPLAY button ql YES button
6
qa qs qd
qgqhqjqkqlw;wd wawfwjwk
qf
5 CD SYNCHRO HIGH button 6 OPEN/CLOSE A button 7 H button 8 INPUT button 9 FINALIZE button q; ERASE button qa SBM button and indicator qs REC z button qd X button qf REC LEVEL knob qg x button
w; l AMS L knob wa CLEAR button ws MENU/NO button wd l AMS L knob wf CLEAR button wg PLAY MODE button wh TIME button wj x button wk PHONES jack wl X button e; PHONE LEVEL knob
5
RCD-W50C
Note : Disassemble the unit in the order as shown below.
SECTION 3

DISASSEMBLY

SET
CASE (409538)
LOADING PANEL (CDR)
TRAY
CDR BOARD
HOLDER (MG) SUB ASSEMBLY, DUST COVER
MAIN BOARD
CD MECHANISM DECK (CDM53L-30B61B)
FITTING BASE (MAGNET) ASSEMBLY
MOTOR ASSEMBLY (LOADING) (M201)
FRONT PANEL SECTION
CD MECHANISM DECK (CDM65-RBD1)
CD-SW board, LED board, DISPLAY board
OPTICAL PICK-UP (KRM-220CAA)
CLAMP MOTOR BOARD, MOTOR (CLAMP) ASSEMBLY
CAM (CH)
FITTING BASE (GUIDE) ASSEMBLY, BRACKET (CHASSIS)
BD BOARD
OPTICAL BLOCK SECTION
TRAY (SUB)
CHASSIS (MOLD B)
SLIDER (SELECTION), TENSION SPRING (SHUTTER), SLIDER (SHUTTER)
GEAR (GEAR A), GEAR (GEAR B), GEAR(U/D SLIDER)
GEAR (CHUCKING)
LOAD MOTOR BOARD, MOTOR (LOADING) ASSEMBLY
STOCKER SECTION
6
Note : Follow the disassembly procedure in the numerical order given.

3-1. Case (409538)

4
case (409538)
2
two
screws
(case 3 TP2 3
× 8
)
3
two
screws
(case 3 TP2 3
1
two
screws
(case 3 TP2 3
RCD-W50C
× 8
)
× 8
)

3-2. Loading Panel (CDR)

4
loading panel
two hooks
(CDR)
3
2
CD mechanism deck (CDM65-RBD1)
1
Slide the lever (cam (CH)) to the direction of arrow.
Front panel side
lever (cam (CH))
7
RCD-W50C

3-3. Front Panel Section

4
connector (2core)(CN920)
5
three
screws
(+BVTP 3
×
8)
1
connector (2core)(CN900)
2
connector (3core)(CN690)
7
t
wo claws
6
four screws
(+BVTP 3
×
8)

3-4. CD-SW Board, LED Board, DISPLAY Board

7
four
claws
2
two knobs (AMS)
3
flexible flat cable
(21core) (CN671)
8
front panel section
HARNESS PROCESSING
CD-SW board
5
three
screws
(+BVTP 2.6
×
4
CD-SW board
8)
1
8
knob (AMS)
9
LED board
6
twelve
(+BVTP 2.6
screws
qa
DISPLAY board
×
8)
8
Remove the soldering.
q;
flexible flat cable
(21core) (CN700)
3
four
screws
(+BVTP 2.6
×
8)

3-5. CD Mechanism Deck (CDM65-RBD1)

1
Slide the lever (cam (CH)) to the direction of arrow.
4
t
ray
2
Pull the tray while pressing the claw of
the chassis in the direction of the arrow.
3
Pull the tray while pressing the claw of the chassis and the claw
of the tray in the direction of the arrow.
front panel side
lever (cam (CH))
claw
claw
chassis
chassis
3
4
CD mechanism deck
(CDM65-RBD1)
four
screws (+BVTP 3
×
RCD-W50C
8)
2
flexible flat cable
(11core) (CN630)
1
connector
(CN631)

3-6. T ray

9
RCD-W50C
r

3-7. CDR Board

2
bottom plate
9
CDR board
5
(11core) (CN103)
flexible flat cable
1
four
screws
(+BVTP 2.6
3
flexible flat cable
(32core) (CN101)
×
8)
6
c
law
8
c
onnector
(2 core) (CN104)

3-8. Holder (MG) Sub Assembly, Dust Cover

3
holder (MG)
sub assembly
1
two claws
4
flexible flat cable
(11core) (CN102)
7
c
law
4
three s
(+BVTP 2.6
crews
5
dust cove
×
8)
10
2
two claws

3-9. Optical Pick-Up (KRM-220CAA)

)
2
1
two step screws
two screws
((2X9) (G with), +p tappin)
6
optical pick-up
(KRM-220CAA)
RCD-W50C
3
two insulators (main)

3-10. Motor Assembly (Loading) (M201)

2
Remove the belt (loading) from the
pulley of the motor assembly.
4
two insulators (main)
5
flexible flat cable
(32core) (from optical device
1
Slide the cam (CH) to the direction of arrow.
3
t
wo claws
4
m
otor assembly
(loading) (M201)
11
RCD-W50C
)

3-11. Cam (CH)

5
holder (BU) sub assembly
1
1
1
2
Slide the cam (CH) to the
q;
direction of arrow pressing the claw.
A
A
while
6
(+PTPWH 2.6
qs
cam (CH)
screw
7
×
8)
g
ear (C)

3-12. MAIN Board

1
4
qd
two
screws
(+BVTT 3
1
3
qs
(+BVTT 3
×
6)
cam (CH)
four
screws
× 6
claw
qa
)
qg
power transformer
8
claw
9
g
ear (B)
8
connector
(4core) (CN631)
6
connector
(2core) (CN900)
1
flexible flat cable
(21core) (CN671)
2
connector
(3core) (CN690)
7
flexible flat cable
(23core) (CN660)
5
flexible flat cable
(17core) (CN640)
4
connector
(5core) (CN641)
qf
Remove the soldering.
qh
MAIN board
9
screw
(+BVTP 3
3
flexible flat cable
(11core) (CN630)
×
8)
q;
bracket
qa
three
(+BVTP 3
(TR)
screws
×
8
12

3-13. CD Mechanism Deck (CDM53L-30B61B)

2
four
screws (+BVTP 3
5
CD mechanism deck
(CDM53L-30B61B)
4
flexible flat cable
(17core) (CN701)
×
RCD-W50C
8)
1
connector
(CN641)
3
flexible flat cable
(23core) (CN101)

3-14. Fitting Base (Magnet) Assembly

3
fitting base (magnet)
assembly
2
four screws
(+BTTP M2.6 )
1
connector (CN710)
13
RCD-W50C
)

3-15. CLAMP MOTOR Board, Motor (Clamp) Assembly (M701)

1
belt (mode)
5
motor (clamp)
assembly (M701)
4
CLAMP MOTOR
board
2
two screws
(+BTTP M2.6)

3-16. Fitting Base (Guide) Assembly, Bracket (Chassis)

2
four screws
3
fitting base (guide) assembly
1
two connectors (CN709, 715)
(+BVTP 2.6
×
8)
4
two screws
(+BVTP 2.6
3
Remove the two solderings.
×
8)
6
bracket (chassis)
5
three screws
(+BVTP 2.6
×
8
14

3-17. T ray (Sub)

)
1
three screws
(+BTTP M2.6 )
2
Insert the gear (eject) under the gear (LD deceleration).
1
Insert the portion A of chassis (mold B) into the portion B of slider (selection).
gear (eject)
portion A
portion B of slider (selection)
3
g
ear (eject)
2
c
hassis (mold B)
chassis (mold B)
PRECAUTION DURING CHASSIS (MOLD B) INSTALLATION
1
Rotating the pulley (LD), shift the slider (selection) in the arrow A direction.
2
Rotating the pulley (mode) in the arrow direction, adjust the tray (sub) to be removed.
3
Rotating the pulley (LD), shift the slider (selection) in the arrow B direction.
4
Rotating the pulley (mode) in the arrow direction, remove the tray (sub) to be removed.
slider (selection)
pulley (LD)
RCD-W50C
stocker section
tray (sub)

3-18. Chassis (Mold B)

A
B
pulley (mode
15
RCD-W50C

3-19. LOAD MOTOR Board, Motor (Loading) Assembly (M702)

1
belt (communication)
2
3
belt (loading1)
belt (loading1)
7
motor (loading)
assembly (M702)
6
LOAD MOTOR
board

3-20. Stocker Section

2
two step screws
4
two screws
(+BTTP M2.6)
4
stocker section
5
Remove the two solderings.
PRECAUTION DURING STOCKER SECTION INSTALLATION
Hook the portion A of tray (SUB) to the slider (selection).
portion A of tray (SUB)
sticking of slider (selection)
16
1
gear (gear A)
3
two step screws

3-21. Slider (Selection), Tension Spring (Shutter), Slider (Shutter)

)
1
two floating screws
(+PTPWHM 2.6 x 6)
2
4
slider (selection), tension spring (shutter), slider (shutter)
washer
3
compression
spring (gear)
RCD-W50C
PRECAUTION DURING SLIDER (SELECTION) INSTALLATION (2)
Insert the slider (selection) into the portion A.
portion A

3-22. Gear (Gear A), Gear (Gear B), Gear (U/D Slider)

6
gear (gear B)
7
screw
(+BTTP M2.6)
8
gear (U/D slider)
PRECAUTION DURING SLIDER (SELECTION) INSTALLATION (1)
gear (chuking)
Insert a convex portion into the groove of gear (chucking).
slider (selection)
5
gear (gear A)
3
2
washer
compression spring
4
gear (selection
1
gear (relay)
17
RCD-W50C

Precaution During Gear (Gear U/D Slider), Gear (Gear B), Gear (Gear A) Installation

3
gear (gear B)
portion A
Adjust the gear (gear B) with the portion A as shown.
slider (U/D)
1
Slide the slider (U/D) fully in the arrow direction.
4
2
gear (U/D slider)
slider (U/D) gear
gear (gear A)
gear (gear B)
linearly
Adjust the gear so that it meshes with the bottom tooth of slider (U/D) gear, as shown.

3-23. Gear (Chucking)

PRECAUTION DURING GEAR (CHUCKING) (2)
rotary encoder (S707)
NG
OK
Align with the slot of rotary encoder.
PRECAUTION DURING GEAR (CHUCKING) (1)
rotary encoder (S707)
gear (chucking)
2
1
Adjust so as to be aligned with gear B linearly, as shown.
3
gear (chucking)
rotary encoder (S707)
18
Align marking.

3-24. BD Board

2
Remove soldering from the four points.
4
BD board
1
flexible flat cable
(16core) (CN102)
3
hook
RCD-W50C

3-25. Optical Block Section

4
3
shaft (BU holder)
gear (chucking)
optical block section
2
1
two floating screws
(+PTPWHM 2.6)
Rotate the pulley (LD) in the direction of 2 to move the shaft (BU holder) upper.
gear (chucking)
19
RCD-W50C
MEMO
20
SECTION 4

TEST MODE

RCD-W50C
Setting the Test Mode
Procedure:
1. Press the POWER button to POWER on.
2. Pr ess the l AMS L (DECK A), [SBM] and l AMS L (DECK B) buttons in order without releasing the button.
3. Turn the l AMS L (DECK B) knob to select the men u.
4. Pr ess the l AMS L (DECK B) knob to execute the test mode.
Releasing the Test Mode
Procedure 1:
1. Turn the l AMS L (DECK B) knob to select the Ship Mode.
2. Pr ess the l AMS L (DECK B) knob to execute the Ship Mode.
3. Press the POWER button to POWER off.
Procedure 2:
1. Pr ess the l AMS L (DECK A), [SBM] and l AMS L (DECK B) buttons in order without releasing the button.
2. Press the POWER button to POWER off.
Contents of test mode
No. Display Function
1 SYS Version System version display 2 CDR Version CDR version display 3BU Test Deck A BU test mode 4 SERVICE Deck A Service mode 5 Ship Mode CD Shipment mode 6 FL ALL ON Fluorescent indicator tube test 7 FL ALL OFF Fluorescent indicator tube test 8 FL ITIMATSU Fluorescent indicator tube test
9 LED CHECK LED check 10 KEY CHECK Keyboard check 11 RM CHECK Remote commander check 12 CDR History CDR error history display 13 Play Speed Deck A x4 speed
System Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “SYS Version”, and press the l AMS L (DECK B) knob.
2. The system version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
CDR Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “CDR Version”, and press the l AMS L (DECK B) knob.
2. The CDR version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
BU Test Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “BU Test”, and press the l AMS L (DECK B) knob.
2. “bdt S CURVE” is displayed. This test mode is used in the Elec­trical Adjustment section.
3. T urn the l AMS L (DECK B) knob. “bdt RAM READ”, “bdt RAM WRITE”, “bdt COMOUT”, “bdt FB TUNE” and “bdt ERR RATE” are displayed.
4. To exit from this mode, press the MENU/NO button and turn the l AMS L (DECK B) knob to display “bdt ERR RATE”.
5. Press the l AMS L (DECK A), [SBM] and l AMS L (DECK B) buttons in order without releasing the button.
6. Press the POWER button to POWER off.
Service Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “SERVICE”, and press the l AMS L (DECK B) knob.
2. “SERVICE MODE” is displayed.
3. Press the ERASE button, the “SLED OUT” is displayed and the sled moves to the outermost position.
4. Press the FINALIZE button, the “SLED IN” is displayed and the sled moves to the innermost position.
5. Press the l AMS L (DECK B) knob, then “SERVICE MODE” is displayed again.
6. To exit from this mode, press the l AMS L (DECK A), [SBM] and l AMS L (DECK B) buttons in order with- out releasing the button.
7. Press the POWER button to POWER off.
Note: Always move the pick-up to the most inside position when
exiting from this mode.
Ship Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob.
2. “Push POWER!” is displayed.
3. Press the POWER button to POWER off.
FL ALL ON Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “FL ALL ON”, and press the l AMS L (DECK B) knob.
2. All segments of fluorescent indicator tube and all LEDs turn on.
3. Press the MENU/NO button, then “FL ALL ON” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
21
RCD-W50C
FL ALL OFF Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “FL ALL OFF”, and press the l AMS L (DECK B) knob.
2. All segments of fluorescent indicator tube and all LEDs turn off.
3. Press the MENU/NO button, then “FL ALL OFF” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
FL ITIMATSU Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “FL ITIMATSU”, and press the l AMS L (DECK B) knob.
2. Checkered patterns of segments are displayed.
3. Press the MENU/NO button, then “FL ITIMATSU” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
LED Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “LED CHECK”, and press the l AMS L (DECK B) knob.
2. Turn the l AMS L (DECK A) or (DECK B) knob clock- wise. The green LED (DISC 1) turns on, then the orange LED (DISC 1) turns on. The each orange LED turns on after the green LED from DISC 1 to DISC 5. The LED (SBM) turns on at last. Counterclockwise rotation gives a performance in re verse order .
3. Press the MENU/NO button, then “LED CHECK” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
KEY Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “KEY CHECK”, and press the l AMS L (DECK B) knob.
2. “Got l keys” is displayed.
3. Press the buttons, and when all the buttons are pressed (without the POWER button), “Got 36 keys” will be displayed.
4. To exit from this mode, press the l AMS L (DECK A), [SBM] and l AMS L (DECK B) buttons in order with- out releasing the button.
5. Press the POWER button to POWER off.
Remote Commander Check
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “RM CHECK”, and press the l AMS L (DECK B) knob.
2. Press the H key on the remote commander, then “Got PlayCom” is displayed. Press the MENU/NO button, then “RM CHECK” is displayed again.
3.
4. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
CDR History Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “CDR History”, and press the l AMS L (DECK B) knob.
2. “00 ######## ########” is displayed as the first error hitory.
3. Turn the l AMS L (DECK B) knob to select the error history. The number of error histories is ten in all. (Refer to “Contents of CDR error history”.)
4. Press the MENU/NO button, then “CDR History” is displayed again.
5. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Play Speed Selection Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B) knob to display “Play Speed”, and press the l AMS L (DECK B) knob.
2. “x4 Play” is displayed. If a CD is in the deck A, pressing the H button executes the 4 times speed playback.
3. Press the x button to stop the playback.
4. Press the MENU/NO button, then “Play Speed” is displayed again.
5. To exit from this mode, turn the l AMS L (DECK B) knob to display “Ship Mode”, and press the l AMS L (DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Contents of CDR error history
display(example)
1 2
3 4
00 05070D80 000E2E0D
5 6
(hexadecimal)
1 Order of the error history
00 to 09: ten error histories in all
2 Error contents
01: unable to focus on 02: Q code/ATIP discontinuous (several frames preceding) 03: Q code/ATIP unreadable 04: search taking more than sixteen seconds 05: focus failure 06: sled over run 07: not passing by start time to write 08: audio buffer over 09: sync failure OA: Spindle lock taking more than 8 secouds
example : 05 is focus failure
22
RCD-W50C
3 Operation mode
bit 7: Speed
0: normal speed 1: x4 speed
bit 6 to bit 0: Number of inner condition
01: POWER off condition/during shift to POWER on 02: POWER off and shipment setting/during shift to POWER
off and shipment setting 03: stop condition/during stop 04: during start up of servo 05: during TOC reading and others 06: during CD TEXT reading 07: during standby(waiting for command from the CD sys-
tem)/during search 08: during playback 09: during manual search(playback)
0A:during pause 0B:during manual search(pause) 0C:during OPC 0D:recording standby/during recording pause
(enable to shift to recording) 0E: during recording 0F: unable to record (waiting for shift to being recordable) 10: PMA updating 11: during operation of unfinalize 12: during operation of finalize 13: PMA erasing 14: emergency 15: recording preparation 16: recording end
5 Write POWER (integer of mW x 10, availab le during write
processing)
examples: 00 means unavailable
(when 3 operation mode is not recording) : A3 means 163(decimal), i.e. 16.3 mW
6 ATIME (min)/(sec)/(frame)
example: 0E, 2E, 0D means 14 : 46 : 13
Abbreviations:
ATIP : Absolute Time In Pre-groove OPC : Optimum POWER Control PMA : Program Memory Area
examples :
bit
HEX
77654 321
0000 0111
07
00
1001 0001
91
11 1
4 Start time of read in(compression method)
bit 15 to bit 13 : (min)
0: 97 min 1: 96 min 2: 95 min 7: others
bit 12 to bit 7: (sec) bit 6 to bit 0: (frame)
examples :
HEX
bit
0 Operation mode
normal speed, during
standby(waiting for command from the CD system)/during search
during operation of
0000 1101 1000 0000
0D,80
97(min) 27(sec)
x4 speed,
unfinalize
7
654 321
0(frame)
015 14 13 12 11 10 9 8 Start time of read in
97 : 27 : 00
11,16
0001 0001 0001 0110
34(sec)97(min) 22(frame)
97 : 34 : 22
23
RCD-W50C
)
e
p
e
+ –
BD board
TP (TE)
TP (DVC)
oscilloscope
(DC range)
SECTION 5

ELECTRICAL ADJUSTMENTS

CD SECTION (DECK A)

Note :
1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M impedance.
4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.
S Curve Check
Connection :
oscilloscop
(DC range)
BD board
TP (FE)
TP (DVC)
Procedure :
1. Connect an oscilloscope to test point TP (FE) and TP (DVC) on the BD board.
2. Turn the power on.
3. Load the disc (YEDS-18).
4. Enter the test mode, select the BU Test asd press the l AMS L (DECK B) knob to display “bdt S CURVE”.
5. Press the l AMS L (DECK B) knob. “LD AL” is displayed and playback starts automatically.
6. Check the oscilloscope waveform (S-curve) is symmetrical between A and B. And confirm peak to peak level within 3.6 ±
0.5 Vp-p.
7. Press the MENU/NO button to stop playback.
8. Exit from the test mode. (Refer to the TEST MODE Section)
+ –
Note: A clear RF signal waveform means that the shape “” can be
clearly distinguished at the center of the waveform.
VOLT/DIV : 200mV TIME/DIV : 500ns
level : 1.1 ± 0.3Vp-p
E-F Balance (1 Track jump) Check
Connection :
Procedure:
1. Connect an oscilloscope to TP (TE) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Press the X (DECK A) button. (Becomes the 1 track jump mode.)
5. Confirm the level B and A (DC voltage) on the oscilloscope waveform.
Center of waveform
B
0V
A (DC voltage
symmetry
A
within 3.6
B
VOLT/DIV : 1V TIME/DIV : 2ms
±
0.5 Vp-
Note: Try to measure several times to make sure than the ratio of A
: B or B : A is more than 10 : 7.
RF Level Check
Connection :
oscilloscop
(AC range)
BD board
TP (RFAC)
TP (DVC)
+ –
Procedure :
1. Connect an oscilloscope to TP (RFAC) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Confirm that oscilloscope waveform is clear and check RF signal level is correct or not.
24
level=1.1 ±0.6Vp-p
Specification level: x 100=less than ±22%
A B
Symmetry
[BD BOARD] — SIDE A —
TP (DVC)
TP (TE)
TP (FE)
IC104
IC101
IC103
TP (RFAC)

CD-R/RW SECTION

*The following is the method of locating the faulty point and
electrical adjustment.

1. Connection and Setting of Programs

PC
3
(w/ SerialI/F)
RCD-W50C

1-1. Connection

5
Oscilloscope
(A)
MPXOUT
To RCD-W50C
(B) (C) (D)
0-756-358-11 CDM65-RBD1 SERVICE
RESET
Jig
CONTROL FIRM
(B) (C) (D)
COM1
8
RS-232C
Jig
2
9
Cables for Jig connecting
Cable
6
Laser Power Meter
7
Test Disc
CDM65-RBD1
jig
1
CDM65-RBD1
4 Fig. Position of Jig (Set the jig after removing the cover of CDM65-RBD1)
25
RCD-W50C

1-2. Equipments to prepare

1 Test Object Both RBD1 and CDM65-RBD1 shall be tested.
RBD1 : Flash Memory Writing of of
Circuit Test by Self-diagnostics
CDM65-RBD1 : Electrical Adjustment
Performance Test
2 Jig (With 9 Cables, Parts No.J-2501-223-A) 3 PC Windows95/98/2000/Me with COMport (RS-232C) 4 Programs TeraTerm Pro + Service macro 5 Oscilloscope More than 150MHz 6 Laser Power Meter LEADER LPM-8001 (Parts No.J-2501-046-A) 7 Test Disc
PATD-012 : (Parts No.4-225-203-1) Adjustment for Playback (CD,CD-R) TCD-W091W : (Parts No.J-2501-226-A) Adjustment for Playback (CD-RW) CRM74 (Blank CD-R) : Adjustment and Check for Recording (CD-R) CWM74 (Blank CD-RW) : Check for Recording (CD-RW) TCD-W032W : (Parts No.J-2501-227-A) Defocus tolerance (CD-RW)
8 RS-232C Cable
L=2000mm
(E)
D-sub 9pin Female cross cable
54321
9876
1 2 3 4 5 6 7 8 9
54321
9876
1 2 3 4 5 6 7 8 9
9 Cables for Jig connecting
:mandatory : not use
L=300mm
(A)
PH 5p
(B)
PH 4p
(C)
FFC 11p 1.0mm pitch (J-2501-200-A)
(D)
FFC 5p 1.0mm pitch (J-2501-212-A)
26

1-3. Setting of Programs (Tera Term Pro and Service macro)

* Confirmation of System (Windows 98 is used in this explanation) Preparation for Terminal software
1) Set up the serial port from OS. a) Select Start → Settings → Control Panel and select System
Device manager Communication Port (COMn)
(see Fig. 1-1)
* Specify the COM port that connected with JIG of CDM65.
RCD-W50C
b) Double click COMn (as you connect to the Jig-CDM65)
Set the parameters as below.
Bits per second : 38400 Data bits : 8 Parity : non Stop bits : 1 Flow control : hardware
(see Fig.1-2)
4 Fig. 1-1
4 Fig. 1-2
27
RCD-W50C
Ver 1.1 2003.12
c) Press “Advanced...” button (see Fig.1-2)
Remove the check “Use FIFO buffers ...”
(see Fig.1-3)
4 Fig. 1-3
2) Unzip the file “ttermp23.zip” by PC.
(The file “ttermp23.zip” is distributed together with the service manual.)
3) After unzip the files, you can find setup.exe.
Double click the setup.exe. Please install as the installer is. Do not change the directory that files are installed. (use default)
4) Unzip the file “files-0208.zip” by PC.
Copy all “ttl” file and “FUNC” folder which are contained in “files-0208” and paste them in the “Ttermpro” file as below. (The file “files-0208.zip” is distributed together with the service manual.)
Ttermpro
01ldp_S.ttl
...
10vwdcC_S.ttl
FUNC
AMS.ttl
...
VERCHK.ttl
4 Fig. 1-4
Note : Do not change the directory path.
5) Start-up the TeraTermPro
Double click the ttermpro.exe.
6) Set up the TeraTermPro (IMPORTANT!!)
a) Select Setup Serial Port... and set the parameters as below.
Port : (As you connect to the Jig-CDM65) Baud rate : 38400 Data : 8 bit Parity : none Stop : 1 bit Flow control : hardware Transmit delay : 0 msec/char 10 msec/line
After settings, press “OK” button. (see Fig.1-5)
28
4 Fig. 1-5
b) Terminal setup
Set the parameters as below.
New-line receive : CR
transmit : CR
After settings, press “OK” button. (see Fig.1-6)
c) General setup
Select the language and press “OK” button. (see Fig.1-7)
RCD-W50C
4 Fig. 1-6
4 Fig. 1-7
d) Saving the setup
Select Setup Save setup... and save as teraterm.ini in the Ttermpro directory. (see Fig.1-8)
7) Connect the JIG and CDM65.
8) Confirm the S510 on JIG is ‘CONTROL’.
9) Power on the CDM65 and press SW101(RESET) on JIG.
“CDM65-RBD1 has connected with this PC (^^)” is displayed.
(see Fig.1-9)
If above message is not displayed, you may hav e some mistakes. Please confirm previous setting procedures again.
4 Fig. 1-8
4 Fig. 1-9
29
RCD-W50C
2.

Repair Works That Require Electrical Adjustment

In the case of repair works as shown below, electrical adjustment is required.
Locating the faulty point
KRM-220CAA
is replaced.
No
RBD1
is replaced.
No
The parts shown
in the List (1)
is replaced.
No
Electrical adjustment
is not required.
Yes
Yes
Yes
Electrical adjustment
30
List (1) : IC101, IC103, IC171, IC201, IC502
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