Sony J20H084AC User Manual
Ambit Microsystems (Shanghai) LTD.
No 1925, Nanle Road Songjiang Export
Processing Zone Shanghai, China
Tel :86-21-61206688 Ext:22165
FAX:86-21-57749230
Approval Sheet of
J20H084ac
Customer Name: Sony Corporation
Project Name |
WiFi+BT module |
Approval Sheet Rev. |
1.0 |
Foxconn Part No. |
J20H084.00 |
Sony Part No. |
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Prepared by |
Reviewed by |
Approved by |
Clon Liu |
Eddie Huang |
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1
CONTENTS
1 |
REVISION HISTORY ..................................................................... |
4 |
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2 |
MANUFACTURING INFORMATION ........................................................ |
5 |
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3 |
PRODUCT OVERVIEW ................................................................... |
6 |
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3.1 |
APPLICATION SCOPE .................................................................... |
6 |
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3.2 |
REGULATION OF EACH COUNTRIES ...................................... |
! |
4 |
MODULE HARDWARE OVERVIEW ........................................................ |
7 |
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4.1 |
BLOCK DIAGRAM ....................................................................... |
7 |
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4.2 |
FEATURES ............................................................................ |
7 |
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4.3 |
INTERFACE AND CONNECTOR ............................................................. |
7 |
5 |
ELECTRICAL SPECIFICATION............................................................ |
9 |
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5.1 |
ABSOLUTE MAXIMUM RATING ............................................................. |
9 |
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5.2 |
RECOMMENDED OPERATING RATING ....................................................... |
9 |
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5.3 |
DC CHARACTERISTICS .................................................................. |
9 |
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5.4 |
ESD INFORMATION ..................................................................... |
9 |
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5.5 |
ENVIRONMENT STORAGE CONDITION....................................................... |
9 |
6 |
RF SPECIFICATION .................................................................... |
10 |
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6.1 |
IEEE802.11B ........................................................................ |
10 |
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6.2 |
IEEE802.11G ........................................................................ |
11 |
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6.3 |
IEEE 802.11N HT20 .................................................................. |
12 |
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6.4 |
IEEE 802.11A........................................................................ |
14 |
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6.5 |
IEEE 802.11AN HT20 ................................................................. |
15 |
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6.6 |
IEEE 802.11AN HT40 ................................................................. |
16 |
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6.7 |
IEEE 802.11AC VHT20 ................................................................ |
17 |
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6.8 |
IEEE 802.11AC VHT40 ................................................................ |
18 |
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6.9 |
IEEE 802.11AC VHT80 ................................................................ |
19 |
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6.10 |
BLUETOOTH 3.0....................................................................... |
20 |
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6.11 |
ANTENNA ELECTRICAL SPECIFICATION..................................................... |
22 |
7 |
MECHANICAL SPECIFICATIONS......................................................... |
23 |
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7.1 |
SHIELDING COVER DIMENSION ........................................................... |
23 |
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7.2 |
PCB ASSEMBLY DIMENSION............................................................. |
25 |
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7.3 |
MOUNT POSITION OF MATERIALS ....................................... |
! |
8 |
SCHEMATICS......................................................... |
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9 |
LAYOUT PATTERN .................................................... |
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9.1 |
MAIN PCB LAYOUT .................................................. |
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9.2 |
ANTENNA PCB LAYOUT............................................... |
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10 BOM (BILL OF MATERIALS)............................................ |
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11 |
LABEL INFORMATION ................................................. |
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11.1 |
MAC ID LABEL (FOR PVT, MP) ........................................ |
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12 PACKAGE AND STACK INFORMATION ................................. |
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12.1 |
CARTON ASSY ..................................................... |
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12.2 |
PALLET ASSY ...................................................... |
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12.3 |
TRAY ID LABEL ..................................................... |
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2
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12.4 |
CARTON LABEL ..................................................... |
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12.5 |
PALLET LABEL ...................................................... |
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13 |
RELIABILITY TEST PLAN .............................................. |
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14 |
ESD TEST REPORT ................................................... |
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15 |
NOTIFICATION........................................................ |
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3
1 Revision History
Date |
Document revision |
Change Description |
2014/02/19 |
1.0 |
Initial release |
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4
2 Manufacturing Information
Manufacture Country:
Made in China
Manufacturer:
Ambit Microsystems (Shanghai) LTD.
Manufacture Address:
No 1925, Nanle Road Songjiang Export Processing Zone Shanghai, China
5
3 Product Overview
The J20H084.00 802.11a/b/g/n/ac 2X2 and BT4.0+LE module provides wireless modem functionality utilizing direct sequence spread spectrum and OFDM/CCK technology. This module is based on MTK MT7662U solution .It fully complies with IEEE 802.11n,IEEE
802.11 a/b/g and ,IEEE 802.11 ac standards, Bluetooth v2.1+EDR,
V4.0 standard, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance. Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design deploys a high efficient DMA engine and hardware data processing accelerators which offloads the host processor.
3.1 Application scope
The wireless LAN is compliant to IEEE 802.11n,IEEE 802.11 a/b/g and IEEE 802.11 ac standards.
Channel Spacing
2.4GHz -> 5MHz, 5GHz-> 20MHz (BW on 20MHz),40MHz (BW on 40MHz) Data rate:
1, 2, 5.5, 11Mbps for 802.11b;
6, 9, 12, 18, 24, 36, 48 and 54Mbps for 802.11a/g;
MCS0(6.5Mbps)~MCS7(72.2Mbps) for 802.11n HT20 mode (single chain);
MCS0(13Mbps)~MCS15(144.4Mbps) for 802.11n HT20 mode (dual chains); MCS0(13Mbps)~MCS7(150Mbps) for 802.11n HT40 (5G only) mode (single chain); MCS0(26Mbps)~MCS15(300Mbps) for 802.11n HT40 (5G only) mode (dual chains); MCS0(6.5Mbps)~MCS8(86.7Mbps) for 802.11ac VHT20 mode (single chain);
MCS0(13Mbps)~MCS8(173.3Mbps) for 802.11ac VHT20 mode (dual chains);
MCS0(13.5Mbps)~MCS9(200Mbps) for 802.11ac VHT40 mode (single chain); MCS0(27Mbps)~MCS9(400Mbps) for 802.11ac VHT40 mode (dual chains); MCS0(32.5Mbps)~MCS9(433.3Mbps) for 802.11ac VHT80 mode (single chain); MCS0(65Mbps)~MCS9(866.6Mbps) for 802.11ac VHT80 mode (dual chains);
BT:
The BT Module is compliant to Bluetooth 4.0 and EDR standard: Carrier Frequency: 2402MHz ~ 2480 MHz
Carrier Spacing: 1.0MHz (classic), 2MHz (LE) Duplexing: TDD
Modulation: FHSS
1Mbps (GFSK), 2Mbps (π/4-DQPSK), 3Mbps (8DPSK),LE (GFSK)
6
4 Module Hardware Overview
4.1 Block Diagram
NA
4.2Features
♦IEEE802.11a/b/g/n/ac (2X2) based on MTK MT7662U solution.
♦Support BT4.0+LE
♦USB 2.0 Interface, High and Full Speeds supported.
♦Module is powered by the host with a 3.3V +/- 5% supply.
♦External PCB printed antennas.
♦4 layers through hole PCB design with FR4 material
4.3Interface and Connector
♦Pin definition:
♦Vendor: JST
♦Vendor P/N: SM15B-GHS-TB
Pin Number |
Symbol Name |
Status |
Pin definition |
1 |
UART_RX |
Input |
UART_RX for BT |
2 |
UART_TX |
Output |
UART_TX for BT |
3 |
GND |
- |
Ground |
4 |
RST_L |
Input |
“L”-drive reset signal input from Host. |
5 |
WOW_H |
Output |
Wake on WLAN signal output. |
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“H”-drive is hoped when awake Host. |
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6 |
WOBT_H |
Output |
Wake on Bluetooth signal output. |
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“H”-drive is hoped when awake Host. |
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7
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(old: Host_wake) |
7 |
GND |
- |
Ground |
8 |
DM |
I/O |
USB_DATA- |
9 |
DP |
I/O |
USB_DATA+ |
10 |
GND |
- |
Shield Ground |
11 |
VSYNC |
Input |
3D Video sync Signal |
12 |
GND |
- |
Ground |
13 |
GND |
- |
Ground |
14 |
VCC |
PWR |
DC 3.3V |
15 |
VCC |
PWR |
DC 3.3V |
S1 |
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Ground |
S2 |
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Ground |
8
5 |
Electrical Specification |
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5.1 |
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Absolute maximum rating |
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Element |
Symbol |
Min |
Typ |
Max |
Unit |
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DC supply voltage |
UV+ |
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3.3 |
3.65 |
(V) |
5.2 |
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Recommended operating rating |
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Element |
Symbol |
Min |
Typ |
Max |
Unit |
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DC supply voltage |
UV+ |
2.97 |
3.3 |
3.63 |
(V) |
5.3 |
DC Characteristics |
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Symbol |
Parameter |
Min |
Typ. |
Max |
Unit |
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Supply voltage |
2.97 |
3.3 |
3.63 |
(V) |
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2.412GHz Tx Current(1M/16dBm) |
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470 |
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(mA) |
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2.412GHz Tx Current(MCS0/15dBm) |
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440 |
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(mA) |
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5.18GHz Tx |
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580 |
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(mA) |
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UV+ |
Current(6M/13Bm/HT20) |
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5.19GHz Tx |
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560 |
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(mA) |
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Current(MCS0/13dBm/HT40) |
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Rx Current |
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- |
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(mA) |
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5.21GHz Tx |
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450 |
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(mA) |
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Current(MCS9/11dBm/VHT80) |
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5.4ESD Information
Mode |
Level |
Unit |
|
HBM |
+/-1000 |
V |
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5.5Environment Storage Condition
Environment condition
Temperature
Operating Temperature: -10 deg.C ~60 deg.C
Storage Temperature: -40 deg.C ~85 deg.C
Humidity
Operating Humidity: 20% ~90%
Storage Humidity: 20% ~90%
9
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