Sony J20H084AC User Manual
Ambit Microsystems (Shanghai) LTD.
No 1925, Nanle Road Songjiang Export
Processing Zone Shanghai, China
Tel :86-21-61206688 Ext:22165
FAX:86-21-57749230
Approval Sheet of
J20H084ac
Customer Name: Sony Corporation
Project Name WiFi+BT module
Approval Sheet Rev.
Foxconn Part No. J20H084.00
Sony Part No.
1.0
Prepared by Reviewed by Approved by
Clon Liu Eddie Huang
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CONTENTS
1 REVISION HISTORY ..................................................................... 4
2 MANUFACTURING INFORMATION ........................................................ 5
3 PRODUCT OVERVIEW ................................................................... 6
3.1 APPLICATION SCOPE .................................................................... 6
3.2 REGULATION OF EACH COUNTRIES ...................................... 錯誤! 尚未定義書籤。
4 MODULE HARDWARE OVERVIEW ........................................................ 7
4.1 BLOCK DIAGRAM ....................................................................... 7
4.2 FEATURES ............................................................................ 7
4.3 INTERFACE AND CONNECTOR ............................................................. 7
5 ELECTRICAL SPECIFICATION ............................................................ 9
5.1 ABSOLUTE MAXIMUM RATING ............................................................. 9
5.2 RECOMMENDED OPERATING RATING ....................................................... 9
5.3 DC CHARACTERISTICS .................................................................. 9
5.4 ESD INFORMATION ..................................................................... 9
5.5 ENVIRONMENT STORAGE CONDITION ....................................................... 9
6 RF SPECIFICATION .................................................................... 10
6.1 IEEE802.11B ........................................................................ 10
6.2 IEEE802.11G ........................................................................ 11
6.3 IEEE 802.11N HT20 .................................................................. 12
6.4 IEEE 802.11A ........................................................................ 14
6.5 IEEE 802.11AN HT20 ................................................................. 15
6.6 IEEE 802.11AN HT40 ................................................................. 16
6.7 IEEE 802.11AC VHT20 ................................................................ 17
6.8 IEEE 802.11AC VHT40 ................................................................ 18
6.9 IEEE 802.11AC VHT80 ................................................................ 19
6.10 BLUETOOTH 3.0 ....................................................................... 20
6.11 ANTENNA ELECTRICAL SPECIFICATION..................................................... 22
7 MECHANICAL SPECIFICATIONS......................................................... 23
7.1 SHIELDING COVER DIMENSION ........................................................... 23
7.2 PCB ASSEMBLY DIMENSION ............................................................. 25
7.3 MOUNT POSITION OF MATERIALS ....................................... 錯誤! 尚未定義書籤。
8 SCHEMATICS ......................................................... 錯誤! 尚未定義書籤。
9 LAYOUT PATTERN .................................................... 錯誤! 尚未定義書籤。
9.1 MAIN PCB LAYOUT .................................................. 錯誤! 尚未定義書籤。
9.2 ANTENNA PCB LAYOUT ............................................... 錯誤! 尚未定義書籤。
10 BOM (BILL OF MATERIALS) ............................................ 錯誤! 尚未定義書籤。
11 LABEL INFORMATION ................................................. 錯誤! 尚未定義書籤。
11.1 MAC ID LABEL (FOR PVT, MP) ........................................ 錯誤! 尚未定義書籤。
12 PACKAGE AND STACK INFORMATION ................................. 錯誤! 尚未定義書籤。
12.1 CARTON ASSY ..................................................... 錯誤! 尚未定義書籤。
12.2 PALLET ASSY ...................................................... 錯誤! 尚未定義書籤。
12.3 TRAY ID LABEL ..................................................... 錯誤! 尚未定義書籤。
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12.4 CARTON LABEL ..................................................... 錯誤! 尚未定義書籤。
12.5 PALLET LABEL ...................................................... 錯誤! 尚未定義書籤。
13 RELIABILITY TEST PLAN .............................................. 錯誤! 尚未定義書籤。
14 ESD TEST REPORT ................................................... 錯誤! 尚未定義書籤。
15 NOTIFICATION ........................................................ 錯誤! 尚未定義書籤。
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1 Revision History
Date Document revision
2014/02/19 1.0
Change Description
Initial release
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2 Manufacturing Information
Manufacture Country:
Made in China
Manufacturer:
Ambit Microsystems (Shanghai) LTD.
Manufacture Address:
No 1925, Nanle Road Songjiang Export Processing Zone Shanghai, China
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3 Product Overview
The J20H084.00 802.11a/b/g/n/ac 2X2 and BT4.0+LE module provides wireless modem
functionality utilizing direct sequence spread spectrum and OFDM/CCK technology. This
module is based on MTK MT7662U solution .It fully complies with IEEE 802.11n,IEEE
802.11 a/b/g and ,IEEE 802.11 ac standards, Bluetooth v2.1+EDR,
V4.0 standard, offering feature-rich wireless connectivity at high standards, and delivering
reliable, cost-effective throughput from an extended distance. Optimized RF architecture
and baseband algorithms provide superb performance and low power consumption.
Intelligent MAC design deploys a high efficient DMA engine and hardware data processing
accelerators which offloads the host processor.
3.1 Application scope
The wireless LAN is compliant to IEEE 802.11n,IEEE 802.11 a/b/g and IEEE 802.11 ac
standards.
Channel Spacing
2.4GHz -> 5MHz, 5GHz-> 20MHz (BW on 20MHz),40MHz (BW on 40MHz)
Data rate:
1, 2, 5.5, 11Mbps for 802.11b;
6, 9, 12, 18, 24, 36, 48 and 54Mbps for 802.11a/g;
MCS0(6.5Mbps)~MCS7(72.2Mbps) for 802.11n HT20 mode (single chain);
MCS0(13Mbps)~MCS15(144.4Mbps) for 802.11n HT20 mode (dual chains);
MCS0(13Mbps)~MCS7(150Mbps) for 802.11n HT40 (5G only) mode (single chain);
MCS0(26Mbps)~MCS15(300Mbps) for 802.11n HT40 (5G only) mode (dual chains);
MCS0(6.5Mbps)~MCS8(86.7Mbps) for 802.11ac VHT20 mode (single chain);
MCS0(13Mbps)~MCS8(173.3Mbps) for 802.11ac VHT20 mode (dual chains);
MCS0(13.5Mbps)~MCS9(200Mbps) for 802.11ac VHT40 mode (single chain);
MCS0(27Mbps)~MCS9(400Mbps) for 802.11ac VHT40 mode (dual chains);
MCS0(32.5Mbps)~MCS9(433.3Mbps) for 802.11ac VHT80 mode (single chain);
MCS0(65Mbps)~MCS9(866.6Mbps) for 802.11ac VHT80 mode (dual chains);
BT:
The BT Module is compliant to Bluetooth 4.0 and EDR standard:
Carrier Frequency: 2402MHz ~ 2480 MHz
Carrier Spacing: 1.0MHz (classic), 2MHz (LE)
Duplexing: TDD
Modulation: FHSS
1Mbps (GFSK), 2Mbps (π/4-DQPSK), 3Mbps (8DPSK),LE (GFSK)
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4 Module Hardware Overview
4.1 Block Diagram
NA
4.2 Features
♦ IEEE802.11a/b/g/n/ac (2X2) based on MTK MT7662U solution.
♦ Support BT4.0+LE
♦ USB 2.0 Interface, High and Full Speeds supported.
♦ Module is powered by the host with a 3.3V +/- 5% supply.
♦ External PCB printed antennas.
♦ 4 layers through hole PCB design with FR4 material
4.3 Interface and Connector
♦ Pin definition:
♦ Vendor: JST
♦ Vendor P/N: SM15B-GHS-TB
Pin Number
1
2
3
4
5
6
Symbol Name Status Pin definition
UART_RX Input UART_RX for BT
UART_TX Output UART_TX for BT
GND - Ground
RST_L Input “L”-drive reset signal input from Host.
WOW_H Output Wake on WLAN signal output.
“H”-drive is hoped when awake Host.
WOBT_H Output Wake on Bluetooth signal output.
“H”-drive is hoped when awake Host.
7
7
8
9
10
11
12
13
14
15
S1
S2
(old: Host_wake)
GND - Ground
DM I/O USB_DATA-
DP I/O USB_DATA+
GND - Shield Ground
VSYNC Input 3D Video sync Signal
GND - Ground
GND - Ground
VCC PWR DC 3.3V
VCC PWR DC 3.3V
Ground
Ground
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5 Electrical Specification
5.1 Absolute maximum rating
Element
DC supply voltage
5.2 Recommended operating rating
Element
DC supply voltage
5.3 DC Characteristics
Symbol
2.412GHz Tx Current(1M/16dBm) 470
2.412GHz Tx Current(MCS0/15dBm) 440
UV+
Current(MCS0/13dBm/HT40)
Current(MCS9/11dBm/VHT80)
Parameter Min Typ.
Supply voltage 2.97 3.3
5.18GHz Tx
Current(6M/13Bm/HT20)
5.19GHz Tx
Rx Current -
5.21GHz Tx
Symbol Min Typ
UV+ 3.3
Symbol Min Typ
UV+ 2.97 3.3
580
560
450
Max Unit
3.65 (V)
Max Unit
3.63 (V)
Max Unit
3.63 (V)
(mA)
(mA)
(mA)
(mA)
(mA)
(mA)
5.4 ESD Information
Mode Level Unit
HBM +/-1000 V
5.5 Environment Storage Condition
Environment condition
Temperature
Humidity
Operating Temperature: -10 deg.C ~60 deg.C
Storage Temperature: -40 deg.C ~85 deg.C
Operating Humidity: 20% ~90%
Storage Humidity: 20% ~90%
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