Sony HCDRG-551 Service manual

HCD-GX750/RG551/RX550

SERVICE MANUAL

Ver 1.0 2004. 04

• HCD-GX750/RG551/RX550 is the tuner, deck, CD and amplifier section in MHC-GX750/RG551S/ RX550.

(Photo: HCD-GX750)

CD Section

Tape Deck Model Name Using Similar Machanism NEW Section T ape Transport Mechanism Type CWM43FF-05

US Model

HCD-GX750/RX550

Canadian Model

HCD-GX750

E Model

HCD-RG551

Model Name Using Similar Mechanism NEW CD Mechanism Type CDM74-F1BD81 Optical Pick-up Name KSM-215DCP/C2NP

AUDIO POWER SPECIFICATIONS (HCD-GX750 USA model only) POWER OUTPUT AND TOTAL HARMONIC DISTORTION:

With 6 ohm loads, both channels driven, from 120 – 10,000 Hz; rated 160 watts per channel minimum RMS power, with no more than 10 % total harmonic distortion from 250 milliwatts to rated output.

Amplifier section

North American models: HCD-GX750/RX550:

Front speaker Continuous RMS power output (reference):

160 + 160 watts (6 ohms at 1 kHz, 10% THD)

Total harmonic distortion less than 0.07% (6 ohms at

1 kHz, 80 W) Sub woofer Continuous RMS power output (reference):

180 watts (6 ohms at

50 Hz, 10% THD) Total harmonic distortion less than 0.07% (6 ohms at

50 Hz, 90 W)

SPECIFICATIONS

Other models: HCD-RG551:

The following measured at AC 120, 127, 220, 240 V, 50/60 Hz Front speaker DIN power output (rated): 100 + 100 watts

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

120 + 120 watts (6 ohms at

1 kHz, 10% THD) Sub woofer DIN power output (rated): 100 watts (6 ohms at

50 Hz, DIN) Continuous RMS power output (reference):

120 watts (6 ohms at

50 Hz, 10% THD)

Inputs GAME INPUT AUDIO L/R (phono jacks):

voltage 250 mV,

impedance 47 kilohms GAME INPUT VIDEO (phono jack):

1 Vp-p, 75 ohms Outputs PHONES (stereo mini jack):

accepts headphones of

8 ohms or more

– Continued on next page –

9-877-777-01

MINI HI-FI COMPONENT SYSTEM

Sony Corporation

Home Audio Company Published by Sony Engineering Corporation

HCD-GX750/RG551/RX550

VIDEO OUT (phono jack):max. output level

1 Vp-p, unbalanced, Sync negative, load impedance 75 ohms

SPEAKER: accepts impedance of 6 to

16 ohms

SUB WOOFER OUT: accepts impedance of 6 to

16 ohms

CD player section

System Compact disc and digital

audio system

Laser Semiconductor laser

(λ=770 – 810 nm) Emission duration:

continuous Frequency response 2 Hz – 20 kHz (±0.5 dB) Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB

Tape deck section

Recording system 4-track 2-channel, stereo Frequency response 50 – 13,000 Hz (±3 dB),

using Sony TYPE I

cassettes

Tuner section

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range North American model: 87.5 – 108.0 MHz (100 kHz step) Other models: 87.5 – 108.0 MHz (50 kHz step) Antenna FM lead antenna Antenna terminals 75 ohms unbalanced Intermediate frequency 10.7 MHz

General

Power requirements North American models: 120 V AC, 60 Hz Argentine model: 220 V AC, 50/60 Hz Mexican model: 127 V AC, 60 Hz Other models: 120 V, 220 V or 230 –

240 V AC, 50/60 Hz Adjustable with voltage selector

Power consumption USA model: HCD-GX750/RX550: 230 watts Canadian models: HCD-GX750: 280 VA Other models: HCD-RG551: 275 watts

Dimensions (w/h/d) incl. projecting parts and controls Amplifier/Tuner/Tape/CD section:

Approx. 280 × 327 × 425 mm

Mass North American models: HCD-GX750/RX550: Approx. 10.5 kg Other models: HCD-RG551: Approx. 10.5 kg

Design and specifications are subject to change without notice.

AM tuner section

Tuning range Pan-American models: 530 – 1,710 kHz (with the tuning

Other models: 530 – 1,710 kHz (with the tuning

Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz

interval set at 10 kHz)

531 – 1,710 kHz (with the tuning

interval set at 9 kHz)

interval set at 10 kHz)

531 – 1,602 kHz (with the tuning

interval set at 9 kHz)

HCD-GX750/RG551/RX550

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for A C leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter . The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)

To Exposed Metal

Parts on Set

0.15

Fig. A. Using an A C v oltmeter to check A C leakage.

Ω

1.5 k

Earth Ground

Voltmeter (0.75 V)

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

HCD-GX750/RG551/RX550

The release method of a CD disc tray LOCK function

There is a disc lock function for the disc theft prevention for a demonstration at a shop front in this machine. Procedue:

1. Press the ?/1 button to turn the set on.

2. Press two buttons of x and Z (EJECT) simultaneously for five seconds.

3. The message “LOCKED” is displayed and the tray is locked. (Even if exiting from this mode, the tray is still locked.)

4. Press two buttons of x and Z (EJECT) simultaneously for five seconds again.

5. The message “UNLOCKED” is displayed and the tray is unlocked.

6. T o exit from this mode, press the ?/1 button to turn the set off.

Unleaded solder

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270°C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

HCD-GX750/RG551/RX550

1. SERVICE NOTE

1-1. Service Position-1 (AMP Board) ........................................6

1-2. Service Position-2 (BD81A Board) .................................... 6

2. GENERAL

Main Unit ................................................................................ 7

Remote Control ....................................................................... 8

3. DISASSEMBLY

3-1. Case (Top) ......................................................................... 10

3-2. CD Door ............................................................................ 10

3-3. Front Panel Section ........................................................... 11

3-4. CD Mechanism Deck ........................................................ 11

3-5. Tape Mechanism Deck, Game Jack Board........................ 12

3-6. Panel Board ....................................................................... 12

3-7. Back Panel Section, Sub Trans Board............................... 13

3-8. Trans Board .......................................................................13

3-9. Main Board ....................................................................... 14

3-10. Sub Woofer Board .............................................................14

3-11. Amp Board ........................................................................ 15

3-12. BD81A Board ................................................................... 15

3-13. Connect Board................................................................... 16

3-14. Driver Board, SW Board...................................................16

3-15. Optical Pick-up ................................................................. 17

3-16. Sensor Board ..................................................................... 17

3-17. Motor (TB) Board ............................................................. 18

3-18. Motor (LD) Board ............................................................. 18

4. TEST MODE ..................................................................... 19

5. DIAGRAMS

5-1. IC Pin Descriptions ........................................................... 22

5-2. Block Diagram –CD Section–........................................... 27

5-3. Block Diagram –Main Section–........................................ 28

5-4. Block Diagram –Panel/Power Section– ............................ 29

5-5. Block Diagram –Sub Woofer Section– ............................. 30

5-6. Circuit Boards Location .................................................... 30

5-7. Note for Printed Wiring Boards

and Schematic Diagrams .................................................. 31

5-8. Waveforms......................................................................... 31

5-9. Printed Wiring Board –CD Mechanism Section (1/2)– .... 32

5-10. Schematic Diagram –CD Mechanism Section (1/2)– ....... 33

5-11. Printed Wiring Boards –CD Mechanism Section (2/2)–... 34

5-12. Schematic Diagram –CD Mechanism Section (2/2)– ....... 35

5-13. Schematic Diagram –Main Section (1/2)– ........................36

5-14. Schematic Diagram –Main Section (2/2)– ........................37

5-15. Printed Wiring Board –Main Section– .............................. 38

5-16. Printed Wiring Boards –Panel Section– ............................ 39

5-17. Schematic Diagram –Panel Section (1/2)– ....................... 40

5-18. Schematic Diagram –Panel Section (2/2)– ....................... 41

5-19. Printed Wiring Boards –Jack Section–..............................42

5-20. Schematic Diagram –Jack Section– .................................. 43

5-21. Printed Wiring Board –Sub Woofer Section– ................... 44

5-22. Schematic Diagram –Sub Woofer Section– ...................... 45

5-23. Printed Wiring Board

–Power Amp Section (GX750/RX550)– ........................... 46

5-24. Printed Wiring Boards

–Transformer Section (GX750/RX550)– .......................... 47

5-25. Schematic Diagram –Power Section (GX750/RX550)–...48

5-26. Printed Wiring Board –Power Amp Section (RG551)– .... 49

5-27. Printed Wiring Boards –Transformer Section (RG551)–.. 50

5-28. Schematic Diagram –Power Section (RG551)–................ 51

5-29. IC Block Diagrams............................................................ 52

6. EXPLODED VIEWS

6-1. Main Section ..................................................................... 54

6-2. Front Panel Section (1)...................................................... 55

6-3. Front Panel Section (2)...................................................... 56

6-4. Front Panel Section (3)...................................................... 57

6-5. Main Board Section .......................................................... 58

6-6. CD Mechanism Section (1) ...............................................59

6-7. CD Mechanism Section (2) ...............................................60

7. ELECTRICAL PARTS LIST ........................................ 61

HCD-GX750/RG551/RX550

1-1. SERVICE POSITION-1 (AMP BOARD)

To inspect the AMP board, turn both of the front panel and the CD mechanism deck so that the left side of the product faces down.

CD mechanism deck

SECTION 1

SERVICING NOTE

front panel

AMP boar

1-2. SERVICE POSITION-2 (BD81A BOARD)

Remove the CD mechanism deck and place it on top of the pedestal as shown. Inspect the BD81A board in this set up.

BD81A board

CD mechanism dec

SECTION 2

GENERAL

HCD-GX750/RG551/RX550

This section is extracted from instruction manual.

HCD-GX750/RG551/RX550

Note : Disassemble the unit in the order as shown below.

SET

3-1. CASE (TOP)

(Page 10)

3-2. CD DOOR

(Page 10)

3-3. FRONT PANEL SECTION

(Page 11)

HCD-GX750/RG551/RX550

SECTION 3

DISASSEMBLY

3-4. CD MECHANISM DECK

(Page 11)

3-12. BD81A BOARD

(Page 15)

3-15. OPTICAL PICK-UP

(Page 17)

3-7. BACK PANEL SECTION,

SUB TRANS BOARD (Page 13)

3-8. TRANS BOARD

(Page 13)

3-5. TAPE MECHANISM DECK,

GAME JACK BOARD

(Page 12)

3-13. CONNECT BOARD

(Page 16)

3-14. DRIVER BOARD,

SW BOARD (Page 16)

3-9. MAIN BOARD

(Page 14)

3-11. AMP BOARD

(Page 15)

3-6. PANEL BOARD

(Page 12)

3-16. SENSOR BOARD

(Page 17)

3-17. MOTOR (TB) BOARD

(Page 18)

3-18. MOTOR (LD) BOARD

(Page 18)

3-10. SUB WOOFER BOARD

(Page 14)

HCD-GX750/RG551/RX550

Note : Follow the disassembly procedure in the numerical order given.

3-1. CASE (TOP)

case

(top)

two

screws

(case 3 TP2)

(+BVTP 3

screw

(case 3 TP2)

screw

case (side-L)

screw

(+BVTP 3

10)

two

screws

(+BVTP 3

10)

case (side-R)

(+BVTP 3

two

(case 3 TP2)

screw

screws

10)

3-2. CD DOOR

CD mechanism deck (CDM74)

Turn the pulley to the direction of the arrow.

pulley

Front panel side

Pull-out the disc tray.

two claws

(case 3 TP2)

CD door

(+BVTP 3

screw

10)

3-3. FRONT PANEL SECTION

CN823

screw (+BVTP 3

10)

CN805

CN314

screw (+BVTP 3

HCD-GX750/RG551/RX550

screw (+BVTP 3

front panel section

3-4. CD MECHANISM DECK

CN302

three

(+BVTP 3

screw (+BVTP 3

CN309

screws

CN103

CD mechanism deck

CN102

10)

three

(+BVTP 3

screws

10)

MAIN board

CN874

CN701

HCD-GX750/RG551/RX550

)

3-5. TAPE MECHANISM DECK, GAME JACK BOARD

connector

tape mechanism deck

six

screws

(+BVTP 2.6

3-6. PANEL BOARD

seven

claws

GAME JACK board

two

(+BVTP 2.6

screws

CN604

eight

(+BVTP 2.6

screws

PANEL board

CN605

two

screws

(+BVTP 2.6

3-7. BACK PANEL SECTION, SUB TRANS BOARD

)

SUB TRANS board

CN906

two

screws

(+BVTP 3

CN904

10)

CN901

CN101

CN308

HCD-GX750/RG551/RX550

back panel section

three

screws

10)

(+BVTP 3

two

(+BVTP 3

3-8. TRANS BOARD

CN905

TRANS board

CN907

earth wire

four

screws

(+ITC 4

× 8

)

screw

(+BVIT 3

× 8R

)

HCD-GX750/RG551/RX550

3-9. MAIN BOARD

CN907

CN501

MAIN board

3-10. SUB WOOFER BOARD

two

(transistor)

screws

CN502

CN441

two

screws

(+BVTP 3

two

screws

(+BVTP 3

SUB WOOFER board

3-11. AMP BOARD

)

two

(transistor)

screw (+BVIT 3

screws

× 8R

HCD-GX750/RG551/RX550

two

screws

screw

AMP

(+BVTP 3

board

)

14)

(+BVTP 4

heat sink

3-12. BD81A BOARD

Remove soldering from the four points.

CN905

CN202

screw (+BVTP 2.6

BD81A

gap tube

× 8

board

CN101

)

HCD-GX750/RG551/RX550

3-13. CONNECT BOARD

two

screws

(+BVTP 2.6

CONNECT

× 8

board

CN871

)

3-14. DRIVER BOARD, SW BOARD

two

screws

(+BTTP (M2.6))

DRIVER

board

CN702

CN703

screw (+BTTP (M2.6))

SW board

3-15. OPTICAL PICK-UP

)

older (213) ASSY

optical pick-up

(KSM-215DCP/C2NP)

two

insulators

two

coil springs

(insulator)

wo stoppers (BU)

wo screws

(BVTT M2.6)

HCD-GX750/RG551/RX550

floating

screw

insulators

coil springs

(insulator)

screw

(BVTT M2.6)

floating

(+PTPWH M2.6)

screw

(+PTPWH M2.6

two

stopper (BU)

3-16. SENSOR BOARD

ray

floating

(+PTPWH M2.6)

floating

(+PTPWH M2.6)

screw

(+BTTP (M2.6))

screw

ear (geneva)

crew

SENSOR board

CN731

elt (table)

floating

ulley (table)

screw

(+PTPWH M2.6)

HCD-GX750/RG551/RX550

3-17. MOTOR (TB) BOARD

stopper

able motor assy (M741)

3-18. MOTOR (LD) BOARD

Remove the two solderings of motor.

oading motor assy (M751)

MOTOR (TB) board

Remove the two solderings of motor.

two

screws

(+BTTP (M2.6))

two

screws

(+BTTP (M2.6))

MOTOR (LD) board

CN742

elt (loading)

SECTION 4

TEST MODE

HCD-GX750/RG551/RX550

[Change-over of AM Tuner Step between 9 kHz and 10 kHz]

•A step of AM channels can be changed o ver between 9 kHz and 10 kHz.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “TUNER”, and press TUNER/BAND

button to select the BAND “AM”.

3. Press ?/1 button to turn the set OFF.

4. Press TUNER/BAND and ?/1 buttons simultaneously, and

the display of fluorescent indicator tube changes to “AM 9 k STEP” or “ AM 10 k STEP”, and thus the channel step is changed over.

[Cold Reset]

• The cold reset clears all data including preset data stored in the RAM to initial conditions. Execute this mode when returning the set to the customer.

Procedure:

1. Press three buttons x , PLAY MODE/TUNING MODE ,

and DISC 1 simultaneously.

2. The fluorescent indicator tube displays “COLD RESET” and

the set is reset.

[Aging Mode]

This mode can be used for operation check of CD section and tape deck section.

• If an error occurred: The aging operation stops and is displayed status.

• If no error occurs: The aging operation continues repeatedly.

1. Operating method of Aging Mode

Turn on the main power and select “CD” of the function.

1) Set three discs in tray. Select ALL DISCS, and REPEAT OFF .

2) Load the tapes recording use into both decks.

3) Press three buttons x , PLAY MODE/TUNING MODE ,

and EX-CHANGE simultaneously.

4) Aging operations of CD and tape are started at the same time.

5) To exit the aging mode, perform [Cold Reset].

2. Aging mode in CD section

1) Operation during aging mode

• In the agining mode, the program is excuted in the following sequence.

(1) The disc tray opens and closes. (2) The disc tray turns to select a disc 3. (3) The pick-up accesses to the first track, and plays 3 seconds. (4) The pick-up accesses to the last track, and plays 3 seconds. (5) The disc tray opens and closes. (6) The disc tray turns to select a disc 1. (7) The same operation starts like step (3). (8) After a disc 1 aging operation, a disc 2 is selected. (9) When an aging operation of a disc 3 is completed, the display

“AGING

∗∗∗∗” value increases.

(10) If no error occurs, the aging operation continues repeatedly.

2) Error display

Disc error

Display Error

E00D01022 Focus error (No disc) E00D02022 Sub Q error (Focus is good) E00D02023 TOC reading error E00D02014 Access error (Unable within regular time)

Mechanism error

Display Error

E00M__E_0 Error during opening tray E00M__C_2 EX-CHANGE disc error E00M__D_0 Error during closing tray

E00M__F_3 EX-OPEN error E00M__D_5 EX-CLOSE error E00M__C_2 Chuck-up error E00M__C_3 Unchucking error

3. Aging mode in Tape Deck section

1) Operation during aging mode

• In the agining mode, the program is excuted in the following sequence.

Step

Rewind the TAPE A

Rewind the TAPE B

Play the TAPE A (1 minute)

Stop the TAPE A (1 second)

Play the TAPE A (3 minutes)

Rewind(AMS) the TAPE A

F.F.(AMS) the TAPE A

Play the TAPE B (1 minute)

Stop the TAPE B (1 second)

Record the TAPE B (3 minutes)

Rewind(AMS) the TAPE B

F.F.(AMS) the TAPE B

Operation

Display

TAPE AAG-1 TAPE BAG-2 TAPE AAG-2 TAPE AAG-3 TAPE AAG-4 TAPE AAG-5 TAPE AAG-6 TAPE BAG-2 TAPE BAG-3 TAPE BAG-4 TAPE BAG-5 TAPE BAG-6

2) Error display

• If error occurred, the display remains like “TAPE BAG-2”.

4. Exiting from the aging mode

• Be sure to perform Cold Reset to exit from the aging mode.

HCD-GX750/RG551/RX550

[P ANEL T est Mode]

• All fluorecent segments and LEDs are tested.

•Keyboard check.

Procedure:

1. Press ?/1 button to turn the set ON.

2. To enter the test mode, press the three buttons x , PLAY MODE/TUNING MODE and ENTER simultaneously.

3. All segments and LEDs (without STANDBY LED) are turned on.

4. Press X and ENTER buttons simultaneously, and the key check mode is activated.

5. The message “KEY 0 0 0 ” is displayed. Each time a button is pressed, the key code number is displayed.

6. Press X and ENTER buttons simultaneously, and the key count mode is activated.

7. The message “KEYCNT 0” is displayed. Each time a button is pressed, “KEYCNT 0” value increased. However, once a button is pressed, it is no longer taken into account.

8. Press X and ENTER buttons simultaneously, and the head phone detect mode is activated.

9. The message “H_P OFF” is displayed when a headphone jack is not inserted. “H_P ON ” is displayed when a headphone jack is inserted.

10. Press X and ENTER buttons simultaneously, and the volume control detect mode is activated.

11. The message “VOLUME FLAT” is displayed. “VOLUME UP” is displayed if rotating MASTER VOLUME knob clockwise, or “VOLUME DOWN” is displayed if rotating counterclockwise.

12. T o exit from the GC test mode after the head phone detect mode, press X and ENTER buttons simultaneously.

[Version and Destination Display Mode]

•The version or destination is displayed.

Procedure:

1. Press ?/1 button to turn the set ON.

2. To enter the test mode, press the three buttons x , PLAY MODE/TUNING MODE and DISC 2 simultaneously.

3. The destination is displayed.

4. Press DISPLAY buttons simultaneously.

5. The version is displayed.

6. To exit from this mode, press ?/1 button to turn the set OFF.

[CD Service Mode]

•This mode can run the CD sled motor freely. Use this mode, for

instance, when cleaning the pick-up.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. T o enter the test mode, press three b uttons x , PLAY MODE/ TUNING MODE , and Z simultaneously.

4. The CD service mode is selected.

5. With the CD in stop status, press M pick-up to outside track, or press m button to inside track.

6. To exit from this mode, perform as follows:

1) Move the pick-up to the most inside track.

2) Press ?/1 button to turn the set OFF.

Note: • Always move the pick-up to most inside tr ack when exiting from

this mode. Otherwise, a disc will not be unloaded.

• Do not run the sled motor excessi vely, otherwise the gear can be chipped.

button to move the

[MC T est Mode]

•This mode is used to test the function of the equalizer.

Procedure:

1. Press ?/1 button to turn the set ON.

2. To enter the test mode, press the three buttons x , PLAY MODE/TUNING MODE and DISC 3 simultaneously.

3. Press the EQ + button. The function of the equalizer is set to “MIN”.

4. Press the EQ – button. The function of the equalizer is set to “MAX”.

5. Press the PRESET EQ button. The function of the equalizer is set to “EQ FLAT”.

6. MASTER VOLUME up and down. “VOLUME MIN” “VOLUME 16” “VOLUME MAX” is displayed.

7. Press the GROOVE button. The message “VACS OFF” or “VACS ON” is displayed.

8. To exit from this mode, press ?/1 button to turn the set OFF.

[CD Ship Mode (LOCK) ]

•This mode moves the pick-up to the position durable to vibra-

tion. Use this mode when returning the set to the customer after repair.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. Press ?/1 button to turn the set OFF.

4. Press CD button and ?/1 button simultaneously.

5. The “STANDBY” display blinks instantaneously, and the CD ship mode is set.

[CD Ship (LOCK) & COLD RESET MODE]

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. Press ?/1 button to turn the set OFF.

4. Press three buttons x , CD and DISPLAY simultaneously .

5. The “STANDBY” display blinks instantaneously and CD ship

mode is set.

6. To fluorescent indicator tube displays “COLD RESET” and

the set is reset.

[Disc Tray Lock]

Procedure:

1. Press the ?/1 button to turn the set ON.

2. Press two buttons of x and Z simultaneously for five seconds.

3. The message “LOCKED” is displayed and the tray is locked.

(Even if exiting from this mode, the tray is still locked.)

4. Press two buttons of x and Z simultaneously for five seconds

again.

5. The message “UNLOCKED” is displayed and the tray is

unlocked.

6. To exit from this mode, press the ?/1 button to turn the set

OFF.

[CD Repeat 5 Times Limit Release Mode]

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. Press three buttons x , CD and ENTER simultaneously.

4. The message “LIMIT OFF” is displayed.

5. Press ?/1 button the set OFF.

[AMP TEST MODE]

Procedure:

1. Press ?/1 button to turn the set ON.

2. To enter the test mode, press three buttons x , PLAY MODE/TUNING MODE and ENTER simultaneously.

3. Press the DISPLAY button. The message “V0 0 0” “ 000” is displayed.

4. Press the GROOVE button. The message “DBFB ON” “DBFB OFF” is displayed.

5. Press the SURROUND button. The message “SURROUND ON” “SURROUND OFF” is displayed.

6. Press the EQ BAND button. The message “LOW” “MID” “HIGH” is displayed.

7. Press ?/1 button to turn the set OFF.

HCD-GX750/RG551/RX550

SECTION 5

DIAGRAMS

5-1. IC PIN DESCRIPTIONS

• IC101 CXD3059AR (RF AMP) (BD81A BOARD)

Pin No. Pin Name I/O Pin Description

1MIRR I/O Mirror signal input/output Not used in this set. (Open) 2 DFCT I/O Defect signal input/output Not used in this set. (Open) 3 FOK I/O Focus OK signal input/output Not used in this set. (Open) 4 VSS — Internal digital ground pin

5 LOCK I/O

6 MDP O Spindle motor servo control signal output 7 SSTP I Disc innermost detection signal input 8IOVSS1 — I/O digital ground pin

9 SFDR O Sled drive signal output 10 SRDR O Sled drive signal output 11 TFDR O Tracking drive signal output 12 TRDR O Tracking drive signal output 13 FFDR O Focus drive signal output 14 FRDR O Focus drive signal output 15 IOVDD1 — I/O digital power supply pin (+3.3 V) 16 AVDD0 — Analog power supply pin (+3.3 V) 17 AVSS0 — Analog ground pin 18 NC — Not used. (Open) 19 E I E signal input 20 F I F signal input 21 TEI I Tracking error signal input 22 TEO O Tracking error signal output 23 FEI I Focus error signal input 24 FEO O Focus error signal output 25 VC O Center voltage output 26 A I A signal input 27 B I B signal input 28 C I C signal input 29 D I D signal input 30 NC — Not used. (Open) 31 AVDD4 — Analog power supply pin (+3.3 V) 32 RFDCO O RFDC signal output Not used in this set. (Open) 33 PDSENS I Reference voltage pin for PD Connect to ground in this set. 34 AC_SUM O RFAC summing amplifier signal output 35 EQ_IN I Equalizer circuit signal input 36 LD O APC amplifier signal output 37 PD I APC amplifier signal input 38 NC — Not used. (Open) 39 RFC I Equalizer cut-off frequency adjustment pin 40 AVSS4 — Analog ground pin 41 RFACO O RFAC signal output 42 RFACI I RFAC signal input or EFM signal input 43 AVDD3 — Analog power supply pin (+3.3 V) 44 BIAS I Asymmetry circuit constant current signal input 45 ASYI I Asymmetry comparator voltage signal input 46 ASYO O EFM full-swing signal output (Low=VSS, High=VDD) 47 VPCO O Wide-band EFM PLL charge pump signal output Not used in this set. (Open) 48 VCTL I Wide-band EFM PLL VCO2 control voltage signal input 49 AVSS3 — Analog ground pin 50 CLTV I Multiplier VCO1 control voltage signal input

GFS is sampled at 460Hz; when GFS is high , this pin outputs a high signal If GFS is low eight consecutive

HCD-GX750/RG551/RX550

Pin No. Pin Name I/O Pin Description

51 FILO O Master PLL (slave=digital PLL) filter signal output 52 FILI I Master PLL filter signal input 53 PCO O Master PLL charge pump signal output 54 AVDD5 — Analog power supply pin (+3.3 V) 55 DDVROUT O DC/DC converter signal output 56 DDVRSEN I DC/DC converter output voltage monitor pin 57 AVSS5 — Analog ground pin 58 DDCR I DC/DC converter reset pin 59 NC — Not used. (Open) 60 BCKI I D/A interface bit clock signal input 61 PCMDI I D/A interface serial data signal input (2’s COMP, MSB first) 62 LRCKI I D/A interface LR clock signal input 63 LRCK O D/A interface LR clock signal output f=Fs 64 VSS — Internal digital ground pin 65 PCMD O D/A interface serial data signal output (2’s COMP, MSB first) 66 BCK O D/A interface bit clock signal output 67 VDD — Internal digital power supply pin (+3.3 V) 68 EMPH O High when the playback disc has emphasis, low it has not 69 EMPHI I High when de-emphasis is ON, low when input OFF 70 IOVDD2 — I/O digital power supply pin (+3.3 V) 71 DOUT O Digital signal output 72 TEST I Test pin Normally ground 73 TES1 I Test pin Normally ground 74 IOVSS2 — I/O digital ground pin 75 NC — Not used. (Open) 76 XVSS — Master clock ground pin 77 XTAO O Crystal oscillation circuit signal output (16.9 MHz) 78 XTAI I Crystal oscillation circuit signal input (16.9 MHz) 79 XVDD — Master clock power supply pin (+3.3 V) 80 AVDD1 — Analog power supply pin (+3.3 V) 81 AOUT1 O Lch analog signal output 82 VREFL O Lch reference voltage signal output 83 AVSS1 — Analog ground pin 84 AVSS2 — Analog ground pin 85 VREFR O Rch reference voltage signal output 86 AOUT2 O Rch analog signal output 87 AVDD2 — Analog power supply pin (+3.3 V) 88 NC — Not used. (Open) 89 IOVDD0 — I/O digital power supply pin (+3.3 V) 90 RMUT O Rch “0” detection flag Not used in this set. (Open) 91 LMUT O Lch “0” detection flag Not used in this set. (Open) 92 NC — Not used. (Open) 93 XTSL I Crystal selection input Not used in this set. (Connect to ground.) 94 IOVSS0 — I/O digital ground pin

95 XTACN I

96 SQSO O

97 SQCK I SQSO readout clock signal input 98 SBSO O Subcode P to W serial signal output Not used in this set. (Open)

99 EXCK I SBSO readout clock signal input Not used in this set. (Open) 100 XRST I System reset signal input “L”: Reset 101 SYSM I Mute signal input “H”: Mute Connect to ground in this set.

Oscillation circuit control signal input Self-oscillation when high, oscillation stop when low Subcode Q 80-bit and PCM peak and level data signal output CD TEXT data signal output Not used in this set. (Open)

+ 53 hidden pages

Sony HCDRG-551 Service manual

TABLE OF CONTENTS

SERVICING NOTE

GENERAL

DISASSEMBLY

CD door

front panel section

CD mechanism deck

PANEL board

TRANS board

MAIN board

SUB WOOFER board

optical pick-up

SENSOR board

MOTOR (TB) board

MOTOR (LD) board

TEST MODE

DIAGRAMS