Be sure to keep your PC used for
service and checking of this unit
always updated with the latest version of your anti-virus software.
In case a virus affected unit was
found during service, contact your
Service Headquarters.
Photo: HCD-MX750Ni
• HCD-MX700Ni is the amplifi er, wireless LAN, CD player, tuner, iPod/iPhone and USB section in CMT-MX700Ni.
• HCD-MX750Ni is the amplifi er, wireless LAN, CD player, DAB/DAB+ tuner, iPod/iPhone and USB section in CMT-MX750Ni.
Model Name Using Similar MechanismNEW
CD Mechanism TypeCDM85CD-DVBU102
Optical Pick-up Block NameKHM-313CAA
SPECIFICATIONS
Main unit
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from
120 Hz – 10,000 Hz; rated 50 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwa tts to
rated output.
• PARTY STREAMING and PARTY STREAMING logo are trademarks of Sony Corporation.
• VAIO and VAIO Media are registered trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
• Microsoft, Windows, Windows Vista, Windows 7™, Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries.
• iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
• iPhone is a trademark of Apple Inc.
• “Made for iPod” and “Works with iPhone” means that an electronic accessory has been designed
to connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer to
meet Apple performance standards.
• Apple is not responsible for the operation of this device or its compliance with safety and regulatory standards.
• “
• DLNA®, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or certifi ca-
• Wake-on-LAN is a trademark of International Business Machines Corporation in the United
• This product is protected by certain intellectual property rights of Microsoft Corporation. Use
• The system names and product names indicated in this manual are generally the trademarks or
• In this manual, Microsoft Windows XP Home Edition, Microsoft Windows XP Professional and
• In this manual, Microsoft Windows Vista Home Basic, Microsoft Windows Vista Home Pre-
• In this manual, Microsoft Windows 7 Starter, Microsoft Windows 7 Home Premium, Microsoft
• ™ and ® marks are omitted in this manual.
” is a mark of the Wi-Fi Alliance.
tion marks of the Digital Living Network Alliance.
States.
or distribution of such technology outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
registered trademarks of the manufacturer.
Microsoft Windows XP Media Center Edition are referred to as Windows XP.
mium, Microsoft Windows Vista Business and Microsoft Windows Vista Ultimate are referred
to as Windows Vista.
Windows 7 Professional, Microsoft Windows 7 Ultimate are referred to as Windows 7.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
AC
1.5 kΩ0.15 μF
voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
7. ELECTRICAL PARTS LIST .............................. 64
3
Page 4
HCD-MX700Ni/MX750Ni
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body .
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTE OF REPLACING THE WIRELESS LAN MODULE
(MOD1)
When replacing the wireless LAN module (MOD1), MAC address
is changed. Print the following explanation, cut it, and hand over it
to the customer with the set, when returning the set that the repair
is completed to the customer.
MAC address of the main unit has been changed by this repair.
When using the MAC address fi ltering function of connection destina-
tion access point equipment, set it again..
CHECKING METHOD OF NETWORK OPERATION
It is necessary to check the network operation, when replacing the
wireless LAN module (MOD1). Check the operation of wireless
and wired LAN, according to the following method.
1. Checking Method of Wireless LAN Operation
Check that access point is recognized surely.
Necessary Equipment:
Wireless access point with router function (AP)
Procedure:
1. Press the [FUNCTION] button to select the Home Network
function.
2. Press the [ + v]/[V –] buttons to select “Network,” then
press the [ENTER] button.
3. Press the [ + v]/[V –] buttons to select “Settings,” then
press the [ENTER] button.
4. Press the [ + v]/[V –] buttons to select “Wireless LAN
Settings,” then press the [ENTER] button.
5. Press the [ + v]/[V –] buttons to select “Access Point
Scan,,” then press the [ENTER] button.
6. The system starts searching for access points, and displays a
list of up to 20 available network name (SSID).
7. Check that access point (SSID) is displayed on the searching
result.
Note: Refer to the instruction manual about details of the setting method.
2. Checking method of wired LAN operation
Check that access point is recognized surely.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
2. Press two buttons of [x] and [Z] for 5 seconds.
3. The message “UNLOCKED” is displayed on the liquid crystal
element and the disc tray is unlocked.
Note: When “LOCKED”is displayed, the disc tray lock is not released by
turning power on/off with the [
NOTE OF REPLACING THE MS-203 BOARD
When the MS-203 board is damaged, exchange the entire
CDM85 (CD) ASSY.
NOTE OF REPLACING THE CN1003 ON THE NET
BOARD
CN1003 on the NET board cannot exchange with single. When
these parts are damaged, exchange the entire mounted board.
] button to turn the power on.
?/1
?/1
] button.
Procedure:
1. Connect the main unit to the router or the hub, etc. with the
LAN cable.
2. Press the [FUNCTION] button to select the Home Network
function.
3. Press the [ + v]/[V –] buttons to select “Network,” then
press the [ENTER] button.
4. Press the [ + v]/[V –] buttons to select “Settings,” then
press the [ENTER] button.
5. Press the [ + v]/[V –] buttons to select “Wired LAN Settings,” then press the [ENTER] button.
Note: If “Change Setting?” appears, select “OK,” then press the [ENTER]
button.
6. On the IP setting, press the [ + v]/[V –] buttons to select
“Auto,” then press the [ENTER] button.
7. On the proxy setting, press the [
select “Do Not Use,” then press the [ENTER] button.
8. Press the [ + v]/[V –] buttons to select “OK,” then press
the [ENTER] button.
9. Perform the server settings.
10. Press the [OPTIONS] buttons to select “Network,” then press
the [ENTER] button.
11. Press the [OPTIONS] buttons to select “Information,” then
press the [ENTER] button.
12. Check that IP address can be acquired.
Note: Refer to the instruction manual about details of the setting method.
+ v]/[V –] buttons to
4
Page 5
MODEL IDENTIFICATION
– Back Panel –
ModelPart No.
HCD-MX700Ni: AEP model
HCD-MX700Ni: US model
HCD-MX700Ni: Canadian model
HCD-MX700Ni: Taiwan model
HCD-MX700Ni: Latin American model
HCD-MX700Ni: Brazilian model
HCD-MX750Ni: AEP, UK models
HCD-MX750Ni: Australian model
Note 1: Do not remove this connector (CN201) at this point.
It is necessary to process electrostatic measures of
optical pick-up.
1 connector (CN301)
7 two claws
7 two claws
bracket (front)
7 two claws
8 screw (BV3)
9 claw
8 screw (BV3)
flexible flat cable 24P
filament tape
9 claw
0 bracket (front)
guard board
flexible flat cable (5 core)
5 two claws
– Front side view –
qa filament tape
qs three screws
(BV3)
qf CD block
qd
Note 2: When you install CD block, fix the flexible flat cable 24P with
the filament tape firmly as shown in figure.
14
Page 15
2-10. BD96U BOARD
Note 1: When disconnection the wire (fl at type) (24 core) of optical pick-up block, solder the short-land.
flexible flat cable 24P
2
(CN201)
Note 2: When assembling the optical pick-up block,
remove the solder of short-land after
connecting the flexible flat cable 24P.
– CD mechanism deck block bottom view –
HCD-MX700Ni/MX50Ni
Solder the short-land.
1
2-11. BELT
3 BD96U board
7 chuck cam
8 belt
6 shaft
3 claw
4 tray
5 two hooks
2
3 claw
bottom side
1 Push the lever in the
direction of the arrow.
15
Page 16
HCD-MX700Ni/MX750Ni
2-12. FFC HOLDER
3 FFC holder
Note: Remove the FFC holder from the
original set and install it again.
1 two claws
2 two claws
– CD mechanism deck block bottom view –
2-13. OPTICAL PICK-UP BLOCK (KHM-313CAA)
+ow to bend the flexible flat cable 24P
two screws
optical pick-up block
6
(KHM-313CAA)
two screws
1
(PTPWH M2.6)
insulator
3
connector
5
insulator
3
1
(PTPWH M2.6)
insulator
3
1 two claws
to BD96U board
(CN201)
flexible flat cable 24P
4
insulator
3
40 mm
The upper side
is contact side.
The lower side
is contact side.
40 mm
to optical pick-up block
(KHM-313CAA)
50 mm
16
– CD mechanism deck block bottom view –
mechanism deck
2
(CDM85 (CD))
Page 17
SECTION 3
TEST MODE
HCD-MX700Ni/MX750Ni
COLD RESET
The cold reset clears all data including preset data stored in the
memory to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. In the standby status, press the [?/1] button to turn the power
on.
2. Press two buttons of [ENTER] and [
3. When “RESET” appears, the set enters.
AUTO STANDBY MODE
This mode is used to change the automatic standby function.
With this function, the system enters standby mode automatically
in about 30 minutes when there is no operation or audio signal
output. By default, the automatic standby function is turned on.
Procedure:
1. Press the [
2. Press the [
3. The message “AUTO STANDBY” is displayed on the liquid
crystal element and the automatic standby OFF mode is set.
4. T o turn this function on, press the [
onds.
The message “AUTO STANDBY” is displayed on the liquid
crystal element and the automatic standby ON mode is set.
COMMON TEST MODE
This mode is used to check operations of amplifi er.
Procedure:
1. Press the [
2. Press two buttons of [ENTER] and [FUNCTION] simultaneously.
3. When the COMMON test mode is activated, “AUDIO IN” is
displayed on the liquid crystal element and “c PLA Y SLEEP”
blink on the liquid crystal element.
4. Each time [EQ] button on the remote commander is pressed,
the display changes starting “TONE MAX”, “TONE MIN”
and “TONE FLAT” this order.
5. Turn the [VOLUME] knob counterclockwise, “VOLUME
MIN” is displayed on the liquid crystal element. Turn the
[VOLUME] knob clockwise, “VOLUME MAX” is displayed
on the liquid crystal element.
Releasing method:
Press the [
PANEL TEST MODE
This mode is used to check the liquid crystal element, LED, model,
destination, software version and key.
Procedure:
1. Press the [?/1] button to turn the power on.
2. Press two buttons of [ENTER] and [x] simultaneously.
3. All segments on the liquid crystal element, [STANDBY] LED
light up.
4. Press the [ENTER] button, the model and destination are displayed on the liquid crystal element.
5. Press the [ENTER] button again, MC version is displayed on
the liquid crystal element.
6. Each time [ENTER] button is pressed, the display changes
starting from MC version, GC version, USBL version , USBM
version, NWA version, NWD version, NWM version, IPL version, CD version, CDD version, CDMA version, CDMB version, BDA version, BDB version, ST version, TA version and
TM version this order, and returns to the MC version display.
7. When [
year, month and day of the software creation is displayed.
When [
MC version display.
] button to turn the power on.
?/1
] button for 2 seconds.
?/1
] button to turn the power on.
?/1
] button to turn off the system.
?/1
] button is pressed while the MC version is displayed,
x
] button is pressed again, the display returns to the
x
] simultaneously.
?/1
] button again for 2 sec-
?/1
8. Press the [OPTIONS] button, the key test mode is activated
and “K 0 V0” is displayed on the liquid crystal element.
9. Each time a button is pressed, “K” value increases. However,
once a button is pressed, it is no longer taken into account.
All keys are pressed, display becomes “K11” .
10. “V” value increases 2, 4, 6 ... if turn the [VOLUME] knob
clockwise, or it decreases 8, 6, 4 ... if turn the knob counterclockwise.
Releasing method:
Press two buttons of [ENTER] and [
nect the power cord.
CD SHIP MODE
This mode moves the optical pick-up to the position durable to
vibration. Use this mode when returning the set to the customer
after repair.
Procedure:
1. Press the [?/1] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press two buttons of [OPTIONS] and [?/1] simultaneously.
4. After blink “STANDBY”, “LOCK” is displayed, disconnect
the AC plug.
CD SHIP MODE & MEMORY CLEAR
This mode is used to perform CD ship mode and cold reset simultaneously.
Procedure:
1. Press the [
2. Press three buttons of [
3. After blink “STANDBY”, “LOCK” is displayed disconnect
the AC plug.
DISC TRAY LOCK MODE
This mode is used to unable to take sample disc out of disc tray in
the shop.
Procedure:
1. Press the [?/1] button to turn the power on.
2. Press the [Z] button to open the disc tray and set the CD disc.
3. Press the [Z] button to close the disc tray.
4. Press two buttons of [x] and [Z] for 5 seconds.
5. The message “LOCKED” is displayed on the liquid crystal element and the disc tray is locked. (Even if pressing the [Z] button, the message “LOCKED” is displayed on the liquid crystal
element and the disc tray is locked)
Releasing method:
1. Press two buttons of [
2. The message “UNLOCKED” is displayed on the liquid crystal
element and the disc tray is unlocked.
CD POWER MANAGE
This mode is used to changed over CD power on/off for decreasing
of reception noise in the tuner mode.
Procedure:
1. Press the [?/1] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press the [?/1] button again to turn the power off.
4. Press two buttons of [ + v] and [?/1] simultaneously.
5. The message “CD POWER ON” or “CD POWER OFF” is displayed on the liquid crystal element, and CD power on/off is
changed over in the tuner mode.
] button to turn the power on.
?/1
] and [BACK] simultaneously.
x
] and [Z] for 5 seconds.
x
] simultaneously, or discon-
x
17
Page 18
HCD-MX700Ni/MX750Ni
CD SERVICE MODE
This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the optical pick-up.
Procedure:
1. Press the [?/1] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press three buttons of [x] and [ + v] simultaneously, the
message “SER VICE MODE” is displayed on the liquid crystal
element.
4. Press the [
l m
up to inside track and the message “SLED IN” is displayed
on the liquid crystal element, or press the [
+] button to outside track and the message “SLED OUT” is
displayed on the liquid crystal element.
5. Press the [u] button, “LD ON” or “LD OFF” is displayed on
the liquid crystal element. Each time [u] button is pressed,
laser diode on/off is changed over.
Releasing method:
Press the [
] button to turn off the system.
?/1
CD SERVO TEST MODE
This mode can check the servo system operations of the optical
pick-up system (= optical unit + BD96U board).
Note 1: Do not enter the [CD SERVO TEST MODE] while any other test
mode is in progress.
Note 2: Do not enter any other test mode while the [CD SERVO TEST
MODE] is in progress.
Note 3: In RAM Read, “SBADrough”, “SBBTrough”, “DT-GI rough”,
“SBAD fi ne”, “SBBT fi ne”, “DT-GI fi ne”, “DSPcomcnt”, and
“DECcomcnt” are displayed but are not used in the service.
How to Enter the CD Servo Test Mode
Procedure:
1. Press the [
?/1
2. Press the [FUNCTION] button to select CD function.
3. Press three buttons of [x], and [V –] simultaneously.
4. It enters the CD servo test mode and displays “bdt S CURVE”.
How to Exit from the CD Servo Test Mode
Procedure:
1. To release this mode, press the [
Key Operation:
[ + v], [V –]:
Use these keys to move between the seven modes contained in the
CD Servo Test Mode, that are the S-Curve Mode, the RAM Read
Mode, the RAM Write Mode, the Command Out Mode, the Error
Rate Mode the LOG Initialize Mode and the LOG Read Mode as
described below. Also, use these keys to move between the menus
within the respective seven modes. When [ + v] is pressed, the
screen advances to the next menu or to the next mode. When [
–] is pressed, the screen returns back to the previous menu or
to the previous mode. Use these keys also to increase or decrease
the numeric value when changing the numeric value. Pressing [
+ v] increases the value and pressing [V –] decreases the value.
[ENTER], [
]:
x
Use these keys to move between the different layers of the hierarchy of the CD Servo Test Mode shown below. Press [ENTER]
to move down to the lower layer, and press [
higher layer.
[
M L
TUNE +], [
Use these keys to move the cursor to the right digit or to the left
digit in the six-digit number, when changing the numeric value.
Press [
M L
press [
l m
TUNE –] button to move the optical pick-
M L
TUNE
] button to turn the power on.
] button.
?/1
] to move up to the
x
l m
TUNE –]:
TUNE +] to move the cursor to the right, and
TUNE –] to return the cursor to the left.
V
[
]:
u
Use this key to execute Command Out in the Command Out Mode.
CD Servo Test Mode Tree:
S Curve Mode LD ON
(bdt S CURVE) (LD ON)
RAM Read Mode
(bdtRAM READ) (DiscType) (AL: 0000, RW: 0001)
Gain Index value indication
(GainIndx) (0001)
RFO GAIN value indication
(RFO_GAIN) (0008)
FEO GAIN value indication
(FEO_GAIN) (0005)
SBAD GAIN value indication
(SBAD_GAIN) (0008)
TEO GAIN value indication
(TEO_GAIN) (0008)
Disc Size value indication
(DiscSize) (0000: Non disc, 0001: 8cm,
0002: 12cm)
(OpAbrkErr) (0000)
SBBT Data value indication
(SBBT Data) (0053)
TE Peak value indication
(TE P-P) (0097)
FEOOCD value indication
(FEOOCD) (00C0)
The following items are not used (Note 3)
RAM Write Mode
(bdtRAM WRITE) (00 SPG_Mask) (Non mask:00, Mask:01)
Fix RF Gain value edit
(00 FixRFgain) (Non Fix:00, AL Fix:01, RW Fix:02)
TMAX ON value edit
(00 tmaxon)
Driver Mute OFF value edit
(00 d_muteoff) (Normal:00, Forced OFF:01)
Command Out Mode
(bdt COMOUT) (COMOUT6X) (000000) (ok)
READ2X value edit command out
(READ2X) (60) (50)
REG READ value edit command out
(REG_READ) (00) (0000)
FEBC? command out
(FEBC?) (00)
FGADD? command out
(FGADD?) (FA)
TEBC? command out
(TEBC?) (02)
TGADD? command out
(TGADD?) (0D)
RFGC? command out
(RFGC?) (3F)
FEOF? command out
(FEOF?) (0000)
TEOF? command out
(TEOF?) (FFC0)
TEIOCD1? command out
(TEIOCD1?) (FEC0)
TEIOCD2? command out
(TEIOCD2?) (FEC0)
TEIOCD3? command out
(TEIOCD3?) (0080)
TEOOCD? command out
(TEOOCD?) (FB80)
FEOOCD? command out
(FEOOCD?) (00C0)
MONITOR value edit command out
(MONITOR) (570A00) (ok)
Error Rate Mode Error rate indication
(bdt ERR RATE) (0000000000)
LOG Read Mode value indication
(bdtLOG READ) (XX: YYYYYY: ZZZZ)
XX: LOG Number
YYYYYY: Communication LOG
ZZZZ: LOG Number
LOG Initialize Mode Initializetion Initialization execution
(bdtLOG INIT) confirmation (INIT done)
indication
(INIT sure?)
Higher layer Lower layer of menu hierarchy
Disc Type value indication
Op ABRAKE Error
SPG Mask value edit
COMOUT6X value edit command out
value indication
18
Page 19
HCD-MX700Ni/MX750Ni
CD ERROR CODE
The past errors of the CD mechanism (CDM) are displayed as the
CDM Errors, and those of the optical pick-up system (= optical
unit + BD96U board) are displayed as the BD Errors as shown
below.
Procedure:
1. Press the [
2. Press the [FUNCTION] button to select CD function.
3. Press three buttons of [OPTIONS] and [
4. BD and CDM error counts are displayed on the fl uoresent in-
dicator tube as shown below.
] button to turn the power on.
?/1
] simultaneously.
u
Em**Ed** X
Mode-in count
BD error count
CDM error count
5. Press the [
6. Then, the CDM error code is displayed as “M0xxxxxxxx” (x
means hexadecimal number) on the liquid crystal element as
shown below.
7. Every pressing of the [
increments the number after “M” starting from “M0” up to
“M9”, and then returns to “M0”. Every pressing of the [
m
TUNE –] button in this mode decrements the number after
“M”. The smaller the error code number is, the newer the error
content is.
Press the [
8. When the [
is displayed as “D0xxxxxxxx” (x means hexadecimal number)
on the fl uoresent indicator tube as shown below. In the same
way as the CDM error code, use of the [
and the [
ing of the error history.
Press the [
Releasing method:
Press the [?/1] button to turn off the system.
Contents of “CDM Errors”
Error display example
M 0 FF 11 42 00
1 2 3 4 5
1 It indicates the error history number
0 to 9: The error code number 0 indicates the newest error.
2 It indicates whether the CDM error occurs in the normal opera-
tions or during the initialization operation.
FF : The error has occurred in the normal opera-
Other than FF : The error has occurred during the initialization
3 It indicates the processing during which the trouble has oc-
curred.
01: The disc EJECT processing is in progress.
02: The disc INSERTION-WAITING processing is in prog-
ress.
03: Processing of the disc INSERTION-REQUEST for the up-
per CD tray is in progress.
04: Processing of the disc EJECTION-REQUEST for the up-
per CD tray is in progress.
05: The disc pulling-in operation is in progress.
06: The disc chucking processing is in progress.
07: The disc re-chucking processing is in progress.
+ v] button.
M L
–] button to return to the previous display.
V
+ v] button is pressed then, the BD error code
l m
TUNE –] buttons in this mode enables trac-
–] button to return to the previous display.
V
tions.
operation.
TUNE +] button in this mode
M L
l
TUNE +]
08: The disc chucking-release completion operation is in prog-
ress.
4 It indicates the operation during which the trouble has oc-
curred.
00 : Waiting for the operation.
10 to 13 : The disc EJECT operation is in progress.
20 : The disc pulling-in operation is in progress.
30 : The disc chucking-release operation is in progress.
40 to 43 : The disc EJECT operation due to error is in prog-
ress.
5 Reserve
00: Fix
Contents of “BD Errors”
Error display example
D
0 02 09
1 2 3 4 5
1 It indicates the error history number
0 to 9: The error code number 0 indicates the newest error.
2 It indicates the error content
01: The focus servo cannot lock-in.
02: GFS is no good (NG).
03: The startup time exceeds the specifi ed period of time (time
over)
04: The focus servo is unlocked continuously.
05: Q code cannot be obtained within the specifi ed period of
time.
06: The tracking servo cannot lock-in.
07: Blank disc
3 It indicates the on-going processing of optical pick-up system
(= optical unit + BD96/BD96U board) when the trouble has
occurred.
01: The CD SHIP mode processing is in progress.
02: The POWER OFF processing is in progress.
03: The INITIALIZE processing is in progress.
04: The optical pick-up system (= optical unit + BD96U) is in
the stop state.
05: The STOP operation is in progress.
06: The startup processing is in progress.
07: The TOC read-in processing is in progress.
08: The SEARCH operation is in progress.
09: The PLAY operation is in progress.
0A: The PAUSE operation is in progress.
0B: The PLAY – MANUAL SEARCH operation is in prog-
ress.
0C: The PAUSE – MANUAL SEARCH operation is in prog-
ress.
4 It indicates the disc speed when the trouble has occurred.
It indicates the step number of each processing specifi ed by 3.
Because the numbers of steps are different in each processing,
this number is different in each processing.
5 It indicates the disc speed when the trouble has occurred.
01: 1x (normal)
01 01
19
Page 20
HCD-MX700Ni/MX750Ni
SECTION 4
ELECTRICAL CHECK
FM TUNE LEVEL CHECK
signal
generator
Procedure:
1. Turn on the set.
2. Input the following signal from signal generator to FM antenna
input directly.
Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz
Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)
Note: Use 75 ohm coaxial cable to connect signal generator and the set.
You cannot use video cable for checking.
Use signal generator whose output impedance is 75 ohm.
3. Set to FM tuner function and tune A, B and C signals.
4. Confi rm “TUNED” is lit on the display for A, B and C signals.
set
When the selected station signal is received in good condition,
“TUNED” is displayed.
20
Page 21
HCD-MX700Ni/MX750Ni
HCD-MX700Ni/MX750Ni
2121
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,1B6:
SECTION 5
DIAGRAMS
5-1. BLOCK DIAGRAM - CD, USB Section -
(Page 22)
Page 22
HCD-MX700Ni/MX750Ni
HCD-MX700Ni/MX750Ni
2222
R-CH
R-CH
CN01
AUDIO IN
J302
28
SDA27SCL
13
IN-L1
VOL L
1 IN-L2
IN-L3
VOL IIC_SDA/E2P-SDA
47
VOL IIC_CLK/E2P-CLK
48
AUDIO_LEVEL_INPUT
12
SEL L
25OUT L
24SB L
ELECTRICAL VOLUME,
INPUT SELECTOR
IC502
: TUNER
: CD PLAY
: iPod/iPhone
SIGNAL PATH
R-ch is omitted due to same as L-ch.
: AUDIO IN
A
B
CD-L
SP_L
7IN-L5
CN332
(iPod/iPhone Dock)
27
28
LINE AMP
IC503
BUFFER
IC515
R-CH
18
19
13
LINE-OUT-L
LINE-OUT-R
RXD
10
Acc ID
TXD
Acc PWR(3.3V)
30
DGND
iPod_RxD_IN
iPod_TxD_OUT
iPod_WAKE
3
75
iPod_DET
76
78 77
: DAB
DAB1
DAB TUNER
MODULE
S1_DIN
S1_DOUT
35 DAB TxD_OUT
36 DAB RxD_IN
AUDR
AUDL
LINE AMP
IC511
SYSTEM CONTROLLER
IC401 (2/4)
ANTENNA
DAB 75:
FM 75:
COAXIAL
ANTENNA
TU1
TUNER (FM)
L-OUT
DO/STEREO
CE
TUNED
DI
CLK
R-OUTR-CH
ST_CE
52
ST_CLK
54
ST_DI/STEREO
55
ST_DO
53
ST_TUNED
51
RDS DATA
RDS INT
RDS_DATA
56
RDS-INT
18
(AEP, UK)
(MX750Ni)
iPod POWER
DETECT
Q505
iPod +5V
20
Acc DET
iPod POWER
DETECT
Q506
iPod WAKE
UP DETECT
Q512
AUDIO INPUT
DETECT
Q504, 517
R-CH
32
IN-L45
66
+
Q510
SELECT SWITCH
IC512
1Y1
14
1Y012
1-COM
13
A
10
NET_L
E
SINGER_L
D
SINGER_ON
F
SINGER_ON
84
: LAN
5-2. BLOCK DIAGRAM - TUNER, iPod/iPhone, AUDIO IN Section -
5-12. PRINTED WIRING BOARDS - MAIN Section (2/2) -
Note: When the MS-203 board is damaged, exchange
the entire CDM85 (CD) ASSY.
(Page 30)
(Page 26)
(Page 26) (Page 44)(Page 40)
(Page 40)
(Page 44)
(Page 40)
(Page 44)
(Page 40)
(Page 42)
• : Uses unleaded solder.
• See page 25 for Circuit Boards Location.
(Page 38)
(Page 38)
Page 34
HCD-MX700Ni/MX750Ni
HCD-MX700Ni/MX750Ni
3434
12 11
BOARD
2
MAIN
(3/4)
BOARD
3
MAIN
(3/4)
BOARD
MAIN
1
(2/4)
IC B/D
IC B/D
G
BOARD
CN651
LCD
0
3.3
003.3
0
000000000
3.3
3.3
3.3
3.3
3.3
3.333.3
2.2
3.3
3.302.500
0
0
0
0
0
0
0
0
0
0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
<3.3>
3.3
3.3
<3.3>
3.3
3.3
3.3
3.3
3.3
0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
<3.3>
<0>
0
3.2
3.1
3.3
3.3
3.3
3.300.813.3
1.7
0.4
0
0
1.5
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.9
1.3
3.9
3.3
3.2
3.2
3.3
3.5
0
0
6.9
6.9
0
0
0
3.3
03.3
C535
0.1
1k
R463
ISA1235AC1-T112-1EF
Q509
1k
R520
10k
R519
10k
R583
R565
0.1
C530
R478
100
R477 100
1M
R474
100R404
32.768kHz
X401
10k
R409
10kR417
0.1
C416
R418
100
47kR420
100R421
100R423
100R425
10k
R412
C412
0.1
R529
10k
C540
0.1
100
R427
100
R428
CL400
CL429
CL430
10kR546
100
R444
100
R443
100
R442
100R441
100
R438
100R436
100R435
100
R431
100R432
4.7k
R429
4.7k
R430
100
R451
100
R452
100
R456
100R460
100R433
100R489
100R490
100R491
100
R492
220kR411
R465
10k
R577
100R493
100R494
100R495
100
R482
4.7k
R548
4.7k
R547
R475 10k
0
R413
CL441
CL446
R410 10M
18p
C511
1k
R483
47k
R536
1
2
3
4
5
6789
10
11
12
13
14
15
16
17181920
MFI341S2164
IC402
NC
MODE1
NC
RESET
VCC
NCNCNCNCNC
VSS
I2C_SCL
I2C_SDA
MODE0
NC
NCNCNCNCNC
C502
10p
1
C518
0.01
C563
100
R448
100R447
R450
100
100
R449
R461 100
R466 100
100
R401
100
R402
100
R403
100
R497
100R419
4.7k
R522
4.7k
R524
100
R453
100
R454
100R455
1kR457
1kR458
10kR557
10kR558
100R459
100R434
100R437
100R439
100R440
100R446
100R487
100R488
0.1
C529
R470 100
R471 100
10kR571
10k
R570
1k
R472
0.01
C472
10kR576
100R476
CL473
RT1N141C-TP-1
Q512
100R484
R480
1k
R556
47k
CL439
1k
R532
129876543
BA6956AN
IC507
VREF
OUT2
RNF
OUT1VMVCC
FIN
GND
RIN
4.7k
R535
4.7k
R388
1
C564
JL513
JL515
JL516
JL517
JL518
JL519
JL522
JL523
JL524
JL520
JL521
JL525
JL527
JL528
JL530
JL531
JL529
C501
10p
R400
10k
10kR541
100R445
CL469
CL481
CL482
CL483
CL484
CL420
CL412
CL434
JL514
0
R245
0
R246
100
R247
0
R250
0
R251
100
R252
100R253
100R254
100R255
0
R591
5P
CN410
1OPEN
2CLOSE
3DGND
4CLOSE SW
5OPEN SW
100R486
MC[47]
MC[48]
15p
C487
68p
C494
68p
C490
15p
C489
15p
C491
68p
C492
15p
C493
68p
C488
220k
R579
1k
R574
2SC3052EF-T1-LEF
Q516
1
2
3
4
5
6
7
8
9
9P
CN401
GND
RST
PGM
TXD
SCLK
VDD
BUSY
RXD
GND
10kR534
R5F364AMDFA
IC401
FL/LCD DO
FL/LCD SCL
FL/LCD CS
SIRCS
BCo_SPI_DOUT
BCo_SPI_DIN
BCo_SPI_CLK
BYTE
CNVss
Xcin
Xcout
RESET
Xout
Vss
Xin
Vcc
NMI
RDS-INT
SBSY
AC-CUT
BCo_POWER
iPod CP IIC SCL
BCo_SPI_CS
iPod CP IIC SDA
BCo_RESET
iPod CP RESET
USB_RESET
USB_CTS
no use
no use
USB_TxD_OUT
USB_RxD_IN
USB_RTS
S-MASTER_DCP
DAB TxD_OUT
DAB RxD_IN
S-MASTER_PG_MUTE
S-MASTER_SOFT_MUTE
S-MASTER_RESET
S-MASTER_DATA
LCD BACKLIGHT
S-MASTER_SHIFT
S-MASTER_LATCH
S-MASTER_NSP_MUTE
S-MASTER_INIT
STBY_LED
VOL IIC_SDA/E2P-SDA
VOL IIC_CLK/E2P-CLK
DAB-POWER_3.3
DAB-POWER_1.2
ST_TUNED
ST_CE
ST_DO
ST_CLK
ST_DI/STEREO
RDS_DATA
CDM_OPEN_SW
CDM_CLOSE_SW
CDM_LOAD_IN
CDM_LOAD_OUT
FL/LCD RESET
Vcc
POWER ON
Vss
SPEC_IN
AUDIO_LEVEL_INPUT
BCo_SPI_REQ
BCo_SPI_READY
AC_DET
KEY_1
KEY_2
VOLUME_JOG
BYPASS
I_KEY WAKE UP_POWER & DISPLAY
iPod_WAKE
iPod_DET
iPod_TxD_OUT
iPod_RxD_IN
NC
HP_DET
HP_MUTE
TA_LINE_MUTE
POWER_PROTECT
SINGER_ON
BOLERO/iPod_ON
ZIPANG_ON
CD_XRST
CD_DRIVER_MUTE
MP3_IREQ
CD CCE
CD CLK
DEC BUS SEL
CD BUS3
CD BUS2
CD BUS1
Avss
CD BUS0
VREF
Avcc
LCD DI
1AVSS3-Ground terminal
2RFZIIRF ripple zero crossing signal input terminal
3RFRPORF ripple signal output terminal
4SBADOSub beam addition signal output terminal Not used
5FEOOFocus error signal output terminal Not used
6TEOOTracking error signal output terminal
7TEZIITracking error zero crossing signal input terminal
8AVDD3-Power supply terminal (+3.3V)
9FOOOFocus coil drive signal output terminal
10TROOTracking coil drive signal output terminal
11VREFIReference voltage (+1.65V) input terminal
12FMOOSled motor drive signal output terminal
13DMOOSpindle motor drive signal output terminal
14VSSP3-Ground terminal
15VCOIIVCO control voltage input terminal
16VDDP3-Power supply terminal (+3.3V)
17VDD1-Power supply terminal (+1.5V)
18VSS1-Ground terminal
19FGINIFG signal input terminal Not used
20IN_SWIDisc inner position detection signal input terminal
21/DFCTONot used
22XVSS3-Ground terminal
23XIISystem clock input terminal (16.934 MHz)
24XOOSystem clock output terminal (16.934 MHz)
25XVDD3-Power supply terminal (+3.3V)
26DVSS3-Ground terminal
27ROUTOAudio data (R-ch) output to the input selector
28DVDD3-Power supply terminal (+3.3V)
29DVROReference voltage (+1.65V) output terminal
30LOUTOAudio data (L-ch) output to the input selector
31DVSS3-Ground terminal
32VDDT3-Power supply terminal (+3.3V)
33VSS1-Ground terminal
34VDD1-Power supply terminal (+1.5V)
35VDDM1-Power supply terminal (+1.5V)
36SRAMSTBIS-RAM standby mode control signal input terminal Fixed at “L” in this set
37XRSTIReset signal input from the system controller “L”: reset
38 to 41BUS0 to BUS3ISerial data input from the system controller and USB controller
42BUCKISerial data transfer clock signal input from the system controller
43XCCEIChip enable signal input from the system controller
44TESTISetting terminal for test mode Normally fi xed at “L”
45IRQIInterrupt request signal input terminal Not used
46ST_REQ/CKO ORequest signal output terminal Not used
47AOUT2OAudio data output terminal
48REQORequest signal output to the system controller and USB controller
49PIO1/ST_REQORequest signal output to the USB controller
50PIO2ONot used
51GATEIGate signal input terminal
52VSS1-Ground terminal
53VDDT3-Power supply terminal (+3.3V)
54SBSYOSubcode block sync signal output to the system controller
55FOKONot used
56IPFONot used
57/LOCKONot used
58ZDETOZero detection signal output terminal Not used
59GPININot used
51
Page 52
HCD-MX700Ni/MX750Ni
Pin No.Pin NameI/ODescription
60MSIMicro controller interface mode selection signal input terminal Fixed at “H” in this set
61DOUTODigital audio data output terminal Not used
62AOUT1OAudio data output terminal Not used
63BCKOOBit clock signal output terminal
64LRCKOOL/R sampling clock signal output terminal Not used
65AINIDigital audio data input terminal
66BCKIIBit clock signal input terminal
67LRCKIIL/R sampling clock signal input terminal
68VDD1-Power supply terminal (+1.5V)
69VSS1-Ground terminal
70AWRC-Not used
71PVDD3-Power supply terminal (+3.3V)
72PDOOPhase error margin signal between EFM signal and PLCK signal output terminal
73TMAXSOTMAX detection signal output terminal Not used
74TMAXOTMAX detection signal output terminal
75LPFNIInverted signal input from the operation amplifi er for PLL loop fi lter
76LPFOOSignal output from the operation amplifi er for PLL loop fi lter
77PVREFIReference voltage (+1.65V) input terminal
78VCOFOVCO fi lter output terminal
79PVSS3-Ground terminal
80SLCOOEFM slice level output terminal
81RFIIRF signal input terminal
82RFRPIIRF ripple signal input terminal
83RFEQ0OEFM slice level output terminal
84VROOReference voltage (+1.65V) output terminal
85RESINOExternal resistor connection terminal
86VMDIROReference voltage (+1.65V) output terminal for automatic power control circuit
87TESTROLow-pass fi lter terminal for RFEQO offset correction
88AGCIIRF signal amplitude adjustment amplifi cation input terminal
89RFOORF signal generation amplifi cation output terminal
90RVDD3-Power supply terminal (+3.3V)
91LDOO
92MDIILight amount monitor input from the laser diode of optical pick-up block
93RVSS3-Ground terminal
94CIMain beam (D) input from the optical pick-up block
95AIMain beam (B) input from the optical pick-up block
96DIMain beam (C) input from the optical pick-up block
97BIMain beam (A) input from the optical pick-up block
98FISub beam (F) input from the optical pick-up block
99TNPCOExternal capacitor connection terminal
100EISub beam (E) input from the optical pick-up block
Laser diode on/off control signal output to the automatic power control circuit
“H”: laser diode on
46 to 54A8 to A16OAddress signal output to the S-RAM
55 to 58BUS0-U to BUS3-UOSerial data output to the CD-MP3 processor
59BUCK-UOSerial data transfer clock signal output to the CD-MP3 processor
60CCE-UOChip enable signal output to the CD-MP3 processor
61A23ONot used
62DVSS-Ground terminal
63DVCC3A-Power supply terminal (+3.3V)
64RDOOutput enable signal output to the S-RAM
65SRWROWrite enable signal output to the S-RAM
66SRLLBOLower-byte control signal output to the S-RAM
67SRLUBOUpper-byte control signal output to the S-RAM
68TA0INONot used
69BOOTIBoot mode selection signal input terminal “L”: boot mode
70SRAM-CSOChip select signal output to the S-RAM
71LRCKOL/R sampling clock signal output to the CD-MP3 processor
72AM1IFunction mode selection signal input terminal Fixed at “H” in this set
73X2OSystem clock output terminal (9 MHz)
74DVSS-Ground terminal
75X1ISystem clock input terminal (9 MHz)
76DVCC3A-Power supply terminal (+3.3V)
77USBOCIOver current detection signal input terminal
78USBPONOUSB VBUS power on/off control signal output terminal “H”: power on
79D+I/OTwo-way data (positive) bus with the USB connector
80D-I/OTwo-way data (negative) bus with the USB connector
81AM0IFunction mode selection signal input terminal Fixed at “H” in this set
82X1USBONot used
83DVSS-Ground terminal
84O-USB-DOOClear to send signal output to the system controller
85DATAIAudio data input from the CD-MP3 processor
86CLKIAudio data transfer clock signal input from CD-MP3 processor
87O-USB-SOOSerial data output to the system controller
88I-USB-SIISerial data input from the system controller
89SPCLK-Not used
90SO0-Not used
91SI0-Not used
92BCKOBit clock signal output to the CD-MP3 processor
93A-INOAudio data output to the CD-MP3 processor
53
Page 54
HCD-MX700Ni/MX750Ni
Pin No.Pin NameI/ODescription
94GATEO Gate signal output to the CD-MP3 processor
95DVCC3A-Power supply terminal (+3.3V)
96REQ-UIRequest signal input from the CD-MP3 processor
97ST-REQIRequest signal input from the CD-MP3 processor
98, 99PG1, PG0IFunction selection signal input terminal Fixed at “H” in this set
100DVSS-Ground terminal
54
Page 55
HCD-MX700Ni/MX750Ni
MAIN BOARD IC401 R5F364AMDFA (SYSTEM CONTROLLER)
Pin No.Pin NameI/ODescription
1FL/LCD DOOSerial data output to the liquid crystal element
2FL/LCD SCLOSerial data transfer clock signal output to the liquid crystal element
3FL/LCD CSOChip select signal output to the liquid crystal element
4SIRCSISIRCS signal input from the remote control receiver
5BCo_SPI_DOUTOSerial data output to the wireless LAN module
6BCo_SPI_DINISerial data input from the wireless LAN module
7BCo_SPI_CLKOSerial data transfer clock signal output to the wireless LAN module
8BYTEIExternal data bus width selection signal input terminal
9CNVssIProcessor mode selection signal input terminal
10XcinISub system clock input terminal (32.768 kHz)
11XcoutOSub system clock output terminal (32.768 kHz)
12RESETISystem reset signal input terminal
13XoutOMain system clock output terminal (5 MHz)
14Vss-Ground terminal
15XinIMain system clock input terminal (5 MHz)
16Vcc-Power supply terminal (+3.3V)
17NMI-Not used
18RDS-INTI
19SBSYISubcode block sync signal input from the CD-MP3 processor
20AC-CUTIAC cut on/off detection signal input terminal “L”: AC cut on
21BCo_POWEROLED (green) drive signal output terminal for STANDBY indicator “H”: LED on
22iPod CP IIC SCLOSerial data transfer clock signal output to the EEPROM
23BCo_SPI_CSOChip select signal output to the wireless LAN module
24iPod CP IIC SDAOSerial data output to the EEPROM
25BCo_RESETOReset signal output to the wireless LAN module “L”: reset
26iPod CP RESETOReset signal output to the EEPROM
27USB_RESETOSystem reset signal output to the USB controller “L”: reset
28USB_CTSIClear to send signal input from the USB controller
29, 30no use-Not used
31USB_TxD_OUTOSerial data output to the USB controller
32USB_RxD_INISerial data input from the USB controller
33USB_RTSOReady to send signal output to the USB controller
34S-MASTER_DCPIOver load detection signal input terminal
35DAB TxD_OUTOSerial data output terminal for the DAB tuner module (MX750Ni only)
36DAB RxD_INISerial data input terminal for the DAB tuner module (MX750Ni only)
37S-MASTER_PG_MUTEOPG muting on/off control signal output to stream processor
38
39S-MASTER_RESETOReset signal output to the digital power amplifi er
40S-MASTER_DATAOSerial data output to the stream processor
41LCD BACKLIGHTOLED drive signal output terminal for liquid crystal element back light “H”: LED on
42S-MASTER_SHIFTOSerial data transfer clock signal output to the stream processor
43S-MASTER_LATCHOSerial data latch pulse signal output to the stream processor
44S-MASTER_NSPMUTEONSP muting on/off control signal output to stream processor
45S-MASTER_INITOReset signal output to the stream processor
46STBY_LEDOLED (red) drive signal output terminal for STANDBY indicator “L”: LED on
47VOL IIC_SDA/E2P-SDAOSerial data output to the electrical volume
48VOL IIC_CLK/E2P-CLKOSerial data transfer clock signal output to the electrical volume
49DAB-POWER_3.3O
50DAB-POWER_1.2O
51ST_TUNEDITuned detection signal input from the tuner (FM)
52ST_CEOChip enable signal output to the tuner (FM)
53ST_DOOSerial data output to the tuner (FM)
54ST_CLKOSerial data transfer clock signal output to the tuner (FM)
55ST_DI/STEREOISerial data input from the tuner (FM)
56RDS_DATAIRDS data input from the tuner (FM) (MX700Ni: AEP/MX750Ni: AEP and UK models only)
S-MASTER_
SOFT_MUTE
RDS interrupt signal input from the tuner (FM)
(MX700Ni: AEP/MX750Ni: AEP and UK models only)
OSoft muting on/off control signal output to stream processor
Power supply on/off control signal output terminal for the DAB tuner module (+3.3V)
(MX750Ni only)
Power supply on/off control signal output terminal for the DAB tuner module (+1.2V)
(MX750Ni only)
55
Page 56
HCD-MX700Ni/MX750Ni
Pin No.Pin NameI/ODescription
57CDM_OPEN_SWISwitch detection signal input terminal for loading section
58CDM_CLOSE_SWISwitch detection signal input terminal for loading section
59CDM_LOAD_INOMotor drive signal output terminal for the loading section
60CDM_LOAD_OUTOMotor drive signal output terminal for the loading section
61FL/LCD RESETOReset signal output to the liquid crystal element
62Vcc-Power supply terminal (+3.3V)
63POWER ONOMain power on/off control signal output terminal “H”: main power on
64Vss-Ground terminal
65SPEC_INIDestination setting terminal
66AUDIO_LEVEL_INPUTIAudio level detection signal input terminal
67BCo_SPI_REQIRequest signal input from the wireless LAN module
68BCo_SPI_READYOReady signal output to the wireless LAN module
69AC_DETIPower failure detection signal input terminal
72VOLUME_JOGIJog dial pulse input from the rotary encoder (for VOLUME)
73BYPASSOSystem shut down signal output terminal
74
75iPod_WAKEIWake-up signal input from the iPod/iPhone Dock
76iPod_DETIiPod/iPhone detection signal input terminal
77iPod_TxD_OUTOSerial data output to the iPod/iPhone Dock
78iPod_RxD_INISerial data input from the iPod/iPhone Dock
79NC-Not used
80HP_DETIHeadphone detection signal input terminal
81HP_MUTE-Not used
82TA_LINE_MUTEOLine muting on/off control signal output terminal
83POWER_PROTECTIPower monitor signal input terminal
84SINGER_ONOPower supply on/off control signal output to the A/D converter
85BOLERO/iPod_ONOPower supply on/off control signal output terminal for the USB/iPod section
86ZIPANG_ONOPower supply on/off control signal output terminal for the CD section
87CD_XRSTOReset signal output to the CD-MP3 processor
88CD_DRIVER_MUTEOMotor drive on/off control signal output to the motor/coil driver
89MP3_IREQIRequest signal input from the CD-MP3 processor
90CD CCEOChip enable signal output to the CD-MP3 processor
91CD CLKOSerial data transfer clock signal output to the CD-MP3 processor
92DEC BUS SELOFunction selection signal output terminal
93 to 95CD BUS3 to CD BUS1OSerial data output to the CD-MP3 processor
96Avss-Ground terminal
97CD BUS0OSerial data output to the CD-MP3 processor
98VREFIReference voltage (+3.3V) input terminal
99Avcc-Power supply terminal (+3.3V)
100LCD_DIINot used
I_KEY WAKE UP_
POWER & DISPLAY
IKey wake-up signal input terminal
56
Page 57
HCD-MX700Ni/MX750Ni
POWER BOARD IC11 CXD9841P (POWER CONTROL)
Pin No.Pin NameI/ODescription
1VSENSEIAC line input voltage detection signal input terminal
2F/BIFeedback signal input terminal for frequency modulation of oscillator
3CT-External capacitor connection terminal for oscillator
4RT-External resistor connection terminal for oscillator
5GND-Ground terminal
6PROTECT-
7SS-External capacitor connection terminal for soft start
8VC1IPower supply terminal for control circuit “L”: stop, “H”: operation start
9OCPIOver current detection signal and DIDT protection signal input terminal
10VC2OPower supply output terminal for driver
11P-GNDIGround terminal for lower side driver
12VG-LOLower side driver drive signal output terminal
13--Not used
14VBIPower supply terminal for upper side driver
15VSIReference power supply input terminal for upper side driver
16VG-HOUpper side driver drive signal output terminal
17--Not used
18VD-Terminal for drain kick start
External capacitor connection terminal for intermittent operation timer when abnormality detecting it
57
Page 58
HCD-MX700Ni/MX750Ni
Note:
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• The mechanical parts with no reference
number in the exploded views are not supplied.
6-1. CASE SECTION
SECTION 6
EXPLODED VIEWS
• Color Indication of Appearance Parts Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑ ↑
• Abbreviation
AUS : Australian model
BR : Brazilian model
CND : Canadian model
E2 : Latin American model
TW : Taiwan model
6
Parts Color Cabinet’s Color
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro spécifi é.
5
front panel section
3
1
5
4
7
5
(E2)
8
4
MAIN board section
4
2
4
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 4-175-911-11 PANEL (CD)
2 4-159-522-02 SPRING (LOADING)
3 4-183-971-01 BASE (CD)
4 3-077-331-01 +BV3 (3-CR)
5 3-704-515-22 SCREW (BV/RING)
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor .
F: nonfl ammable
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
A-1759-699-A BD96U BOARD, COMPLETE
IC101 6-712-082-01 IC TC94A70FG-101
IC102 6-714-504-01 IC MM3404A15URE
IC201 6-703-636-01 IC NJM13403V (TE2)
IC202
IC203 6-707-010-01 IC NJM2740V
IC301 6-710-637-01 IC BA5826HFP-E2
IC401 6-715-737-01 IC 92CD28AFG-7FU8 (M
IC402 6-716-654-01 IC CY7C1021CV33-10ZXIT
IC403 8-759-523-03 IC TC74HC4066AFT (EL)
IC404 8-759-523-03 IC TC74HC4066AFT (EL)
IC405 6-707-870-01 IC TC74VHC157FT (EKJ)
IC406 6-715-294-01 IC BD2220G-TR
FB508 1-216-296-11 SHORT CHIP 0
FB509 1-216-296-11 SHORT CHIP 0
FB510 1-216-864-11 SHORT CHIP 0
FB511 1-216-864-11 SHORT CHIP 0
FB512 1-216-295-00 SHORT CHIP 0
FB513 1-216-864-11 SHORT CHIP 0
FB514 1-216-864-11 SHORT CHIP 0
FB515 1-216-864-11 SHORT CHIP 0
FB516 1-216-864-11 SHORT CHIP 0 (MX750Ni)
FB517 1-216-864-11 SHORT CHIP 0
FB518 1-216-864-11 SHORT CHIP 0
FB519 1-216-296-11 SHORT CHIP 0
FB520 1-216-296-11 SHORT CHIP 0
FB521 1-216-296-11 SHORT CHIP 0
FB522 1-216-296-11 SHORT CHIP 0
FB523 1-216-864-11 SHORT CHIP 0 (MX750Ni)
FB524 1-216-864-11 SHORT CHIP 0 (MX750Ni)
FB525 1-216-864-11 SHORT CHIP 0
FB526 1-216-864-11 SHORT CHIP 0
FB527 1-216-864-11 SHORT CHIP 0
FB528 1-216-864-11 SHORT CHIP 0
FB529 1-216-864-11 SHORT CHIP 0
FB530 1-216-864-11 SHORT CHIP 0
FB531 1-216-864-11 SHORT CHIP 0
FB532 1-216-864-11 SHORT CHIP 0
FB533 1-216-864-11 SHORT CHIP 0
FB534 1-216-864-11 SHORT CHIP 0
FB535 1-216-296-11 SHORT CHIP 0
FB701 1-216-864-11 SHORT CHIP 0
FB702 1-216-864-11 SHORT CHIP 0
FB703 1-216-864-11 SHORT CHIP 0
FB704 1-216-864-11 SHORT CHIP 0
FB705 1-216-864-11 SHORT CHIP 0
FB706 1-216-864-11 SHORT CHIP 0
< IC >
IC401 A-1784-413-A IC R5F364AMDFA (for SERVICE) (MX700Ni)
IC401 A-1784-415-A IC R5F364AMDFA (for SERVICE) (MX750Ni)
IC402 6-713-362-01 IC MFI341S2164
IC405 6-702-302-01 IC TK11133CSCL-G
IC502 6-713-384-01 IC BD3491FS-SE2
IC503 8-759-278-58 IC NJM4558V-TE2
IC504 6-705-337-01 IC TK11150CSCL-G
IC505 6-712-613-01 IC SI-3010KM-TLS
IC506 6-715-266-01 IC BD8410FPS-E2
IC507 8-759-598-69 IC BA6956AN
IC508 6-702-302-01 IC TK11133CSCL-G
IC509 6-702-302-01 IC TK11133CSCL-G
IC510 6-715-266-01 IC BD8410FPS-E2
IC511 8-759-278-58 IC NJM4558V-TE2 (MX750Ni)
IC512 8-759-596-39 IC SN74LV4052APWR
FB101 1-216-864-11 SHORT CHIP 0
FB201 1-216-864-11 SHORT CHIP 0
FB501 1-216-864-11 SHORT CHIP 0
FB502 1-216-864-11 SHORT CHIP 0
FB503 1-216-296-11 SHORT CHIP 0
FB504 1-216-864-11 SHORT CHIP 0 (MX750Ni)
FB505 1-216-864-11 SHORT CHIP 0
FB506 1-216-864-11 SHORT CHIP 0
FB507 1-216-864-11 SHORT CHIP 0
72
IC515 8-759-278-58 IC NJM4558V-TE2
IC702 6-715-134-01 IC MM3404A33URE
IC703 6-701-261-01 IC MC74VHC74DTR2
IC704 6-702-302-01 IC TK11133CSCL-G
IC705 6-705-979-01 IC CXD9788AR
IC707 6-713-634-01 IC CXD9965TN
IC709 6-701-189-01 IC MC74VHC1GU04DFT1
IC710 6-713-034-01 IC KIA7812API-U/PF
IC711 6-715-392-01 IC AK5358BET-E2
Page 73
HCD-MX700Ni/MX750Ni
MAIN
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R102 1-216-851-11 METAL CHIP 330K 5% 1/10W
R103 1-216-845-11 METAL CHIP 100K 5% 1/10W
R104 1-216-845-11 METAL CHIP 100K 5% 1/10W
R108 1-216-829-11 METAL CHIP 4.7K 5% 1/10W
R111 1-216-821-11 METAL CHIP 1K 5% 1/10W
R112 1-216-833-11 METAL CHIP 10K 5% 1/10W
R113 1-216-833-11 METAL CHIP 10K 5% 1/10W
R114 1-216-829-11 METAL CHIP 4.7K 5% 1/10W
(EXCEPT E2)
R114 1-216-835-11 METAL CHIP 15K 5% 1/10W
R115 1-216-821-11 METAL CHIP 1K 5% 1/10W
(MX750Ni)
R120 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
R121 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
R125 1-216-809-11 METAL CHIP 100 5% 1/10W
R127 1-216-809-11 METAL CHIP 100 5% 1/10W
R134 1-216-864-11 SHORT CHIP 0
R137 1-216-809-11 METAL CHIP 100 5% 1/10W
R142 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
(MX750Ni)
R143 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
(MX750Ni)
R144 1-216-809-11 METAL CHIP 100 5% 1/10W
(MX750Ni)
R245 1-216-864-11 SHORT CHIP 0
R246 1-216-864-11 SHORT CHIP 0
R247 1-216-809-11 METAL CHIP 100 5% 1/10W
R248 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
R249 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
R250 1-216-295-00 SHORT CHIP 0
R251 1-216-295-00 SHORT CHIP 0
R252 1-216-809-11 METAL CHIP 100 5% 1/10W
R253 1-216-809-11 METAL CHIP 100 5% 1/10W
R254 1-216-809-11 METAL CHIP 100 5% 1/10W
R255 1-216-809-11 METAL CHIP 100 5% 1/10W
R257 1-216-849-11 METAL CHIP 220K 5% 1/10W
(E2)
R258 1-216-845-11 METAL CHIP 100K 5% 1/10W
R259 1-216-845-11 METAL CHIP 100K 5% 1/10W
R262 1-216-813-11 METAL CHIP 220 5% 1/10W
R349 1-216-864-11 SHORT CHIP 0
R350 1-216-864-11 SHORT CHIP 0
R351 1-216-864-11 SHORT CHIP 0
R352 1-216-864-11 SHORT CHIP 0
R353 1-216-864-11 SHORT CHIP 0
R354 1-216-864-11 SHORT CHIP 0
R355 1-216-864-11 SHORT CHIP 0
R356 1-216-864-11 SHORT CHIP 0
R357 1-216-864-11 SHORT CHIP 0
Note: CN1003 on the NET board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
Page 77
HCD-MX700Ni/MX750Ni
POWERNET
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
FB1008 1-216-864-11 SHORT CHIP 0
FB1009 1-216-864-11 SHORT CHIP 0
FB1011 1-216-864-11 SHORT CHIP 0
FB1012 1-216-864-11 SHORT CHIP 0
FB1013 1-216-864-11 SHORT CHIP 0
FB1014 1-216-864-11 SHORT CHIP 0
FB1015 1-216-864-11 SHORT CHIP 0
FB1016 1-216-864-11 SHORT CHIP 0
FB1017 1-216-864-11 SHORT CHIP 0
FB1019 1-216-864-11 SHORT CHIP 0
FB1020 1-216-864-11 SHORT CHIP 0
FB1021 1-216-864-11 SHORT CHIP 0
FB1022 1-216-864-11 SHORT CHIP 0
FB1023 1-216-864-11 SHORT CHIP 0
FB1024 1-216-864-11 SHORT CHIP 0
FB1025 1-218-990-11 SHORT CHIP 0
< IC >
R1043 1-218-937-11 METAL CHIP 47 5% 1/16W
R1044 1-218-937-11 METAL CHIP 47 5% 1/16W
R1045 1-218-937-11 METAL CHIP 47 5% 1/16W
R1046 1-218-937-11 METAL CHIP 47 5% 1/16W
R1047 1-218-941-11 METAL CHIP 100 5% 1/16W
R1049 1-218-847-11 METAL CHIP 1K 0.5% 1/10W
R1050 1-218-847-11 METAL CHIP 1K 0.5% 1/10W
R1051 1-218-871-11 METAL CHIP 10K 0.5% 1/10W
R1052 1-218-863-11 METAL CHIP 4.7K 0.5% 1/10W
R1053 1-218-879-11 METAL CHIP 22K 0.5% 1/10W
R1054 1-218-871-11 METAL CHIP 10K 0.5% 1/10W
R1055 1-216-835-11 METAL CHIP 15K 5% 1/10W
R1056 1-216-837-11 METAL CHIP 22K 5% 1/10W
R1057 1-216-837-11 METAL CHIP 22K 5% 1/10W
R1058 1-216-817-11 METAL CHIP 470 5% 1/10W
R1059 1-216-817-11 METAL CHIP 470 5% 1/10W
R1060 1-218-990-11 SHORT CHIP 0
R1061 1-218-990-11 SHORT CHIP 0
IC1001 6-713-862-01 IC AK4388AET-E2
IC1002 6-714-032-01 IC BD9321EFJ-E2
IC1003 6-712-613-01 IC SI-3010KM-TLS
IC1004
IC1005 6-715-392-01 IC AK5358BET-E2
Note: When replacing the wireless LAN module (MOD1), refer to “NOTE
OF REPLACING THE WIRELESS LAN MODULE (MOD1)” and
“CHECKING METHOD OF NETWORK OPERATION” (page 4).
(for SERVICE)
80
Page 81
HCD-MX700Ni/MX750Ni
REVISION HISTORY
Checking the version allows you to jump to the revised page.
Also, clicking the version at the top of the revised page allows you to jump to the next revised page.
Ver.DateDescription of Revision
1.02010.08New
1.12011.01Addition of Note for computer virus measures
Change of Part for Ref. No. IC402 on BD96U board
Change of MAIN board (Suffi x-21)
1.22013.02Change of Part No. for Ref. No. CN332 on IP board (SMR-12068)
(SUPPLEMENT-1)
(SMR-10073)
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