Sony HCD-MX700Ni, HCD-MX750Ni Schematic

HCD-MX700Ni/MX750Ni

SERVICE MANUAL

US Model

Canadian Model

Ver. 1.2 2013.02

AEP Model

Note:

Be sure to keep your PC used for service and checking of this unit always updated with the latest version of your anti-virus software. In case a virus affected unit was found during service, contact your Service Headquarters.

Photo: HCD-MX750Ni

• HCD-MX700Ni is the ampliﬁ er, wireless LAN, CD player, tuner, iPod/iPhone and USB section in CMT-MX700Ni.

• HCD-MX750Ni is the ampliﬁ er, wireless LAN, CD player, DAB/DAB+ tuner, iPod/iPhone and USB section in CMT-MX750Ni.

Model Name Using Similar Mechanism NEW CD Mechanism Type CDM85CD-DVBU102 Optical Pick-up Block Name KHM-313CAA

SPECIFICATIONS

Main unit

AUDIO POWER SPECIFICATIONS POWER OUTPUT AND TOTAL HARMONIC DISTORTION: (The United States model only) With 6 ohm loads, both channels driven, from 120 Hz – 10,000 Hz; rated 50 watts per channel minimum RMS power, with no more than 10% total harmonic distortion from 250 milliwa tts to rated output.

Amplifier section

European model:

DIN power output (rated):

40 watts + 40 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

Music power output (reference):

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

Other models:

DIN power output (rated):

40 watts + 40 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

Wireless LAN section

Compatible standards:

IEEE 802.11 b/g (WEP 64 bit, WEP 128 bit, WPA/WPA2-PSK (AES), WPA/WPA2-PSK (TKIP))

Radio frequency:

2.4 GHz

CD player section

System:

Compact disc and digital audio system

Laser Diode Properties

Emission Duration: Continuous Laser Output*: Less than 44.6μW

* This output is the value measurement at a distance of

200mm from the objective lens surface on the Optical Pick-up Block with 7mm aperture.

Frequency response:

20 Hz – 20 kHz

Signal-to-noise ratio:

More than 90 dB

Dynamic range:

More than 90 dB

Tuner section

FM tuner section:

FM stereo, FM superheterodyne tuner

Tuning range:

North American model:

87.5 MHz – 108.0 MHz (100 kHz step)

Other models:

87.5 MHz – 108.0 MHz (50 kHz step)

Antenna:

FM lead antenna

Intermediate frequency:

10.7 MHz

DAB/DAB+ tuner section (MX750Ni only):

FM stereo, DAB/FM superheterodyne tuner

Frequency range

Band-III:

174.928 (5A) MHz – 239.200 (13F) M Hz

Antenna:

DAB/FM lead antenna

DAB/DAB+ frequency table (Band-III)

Frequency Label

174.928 MHz 5A

176.640 MHz 5B

178.352 MHz 5C

180.064 MHz 5D

181.936 MHz 6A

183.648 MHz 6B

185.360 MHz 6C

187.072 MHz 6D

188.928 MHz 7A

190.640 MHz 7B

192.352 MHz 7C

194.064 MHz 7D

195.936 MHz 8A

197.648 MHz 8B

199.360 MHz 8C

201.072 MHz 8D

202.928 MHz 9A

204.640 MHz 9B

206.352 MHz 9C

208.064 MHz 9D

Frequency Label

209.936 MHz 10A

211.648 MHz 10B

213.360 MHz 10C

215.072 MHz 10D

216.928 MHz 11A

218.640 MHz 11B

220.352 MHz 11C

222.064 MHz 11D

223.936 MHz 12A

225.648 MHz 12B

227.360 MHz 12C

229.072 MHz 12D

230.784 MHz 13A

232.496 MHz 13B

234.208 MHz 13C

235.776 MHz 13D

237.488 MHz 13E

239.200 MHz 13F

iPod/iPhone section

Compatible iPod/iPhone models :

iPhone 3GS iPhone 3G iPhone iPod nano

iPod classic

iPod nano

120 GB 160 GB

4th generation

(2009)

(video)

iPod classic

iPod nano

80 GB

2nd generation

(aluminum)

iPod mini

iPod

eneration

4th

iPod classic

160 GB

(2007)

iPod

5th generation

(video)

5th generation (video camera)

iPod touch

1st generation

iPod nano

1st generation

USB section

Supported bit rate:

MP3 (MPEG 1 Audio Layer-3): 32 kbps – 320 kbps, VBR WMA: 48 kbps – 192 kbps, VBR AAC: 48 kbps – 320 kbps

Sampling frequencies:

MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz WMA: 44.1 kHz AAC: 44.1 kHz

Inputs/Outputs

FM Antenna terminals:

75 ohms unbalanced

DAB/DAB+ Anten na terminal:

75 ohms, F female

AUDIO IN (stereo mini jack):

Sensitivity 700 mV, impedance 47 kilo hms

iPod touch

2nd generation

iPod nano

3rd generation

(video)

iPod 4th generation (color display)

HCD-MX700Ni/MX750Ni

UK Model

Australian Model

SPEAKERS:

Accepts impedance of 6 ohms

iPod/iPhone Dock:

Output voltage: DC 5.0 V The maximum output current: 500 mA

(USB) port:

Type A, maximum current 500mA

NETWORK port:

10BASE-T/100BASE-TX

General

Power requirements:

North American model:

AC 120V, 60Hz

Latin American models (except for Brazilian models):

AC 110 V – 120 V or 220 V – 240 V, 50/60 Hz, adjustable with voltage selector

Brazilian model:

AC 127 V or 220 V, 60 Hz, adjustable with voltage selector

Taiwan model:

AC 120 V, 50/60 Hz

Other models:

AC 220 V – 240 V, 50/60 Hz

Power consumption:

43 watts

Dimensions (W/H/D) (excl. speakers):

Approx. 309 mm × 122 mm × 247 mm

(approx. 12

/4inch × 47/8 inch × 93/4 inch)

Mass (excl. speakers):

Approx. 3.0 kg (approx. 6 lb 10 oz)

Design and specifications are subject to change without notice.

s Standby power consumption: 0.5 W s Halogenated flame retardants are not used in the

certain printed wiring boards.

E Model

HCD-MX700Ni

HCD-MX750Ni

9-889-945-03

2013B33-1

2013.02

COMPACT DISC RECEIVER

Sony Corporation

Published by Sony Techno Create Corporation

HCD-MX700Ni/MX750Ni

• PARTY STREAMING and PARTY STREAMING logo are trademarks of Sony Corporation.

• VAIO and VAIO Media are registered trademarks of Sony Corporation.

• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.

• Microsoft, Windows, Windows Vista, Windows 7™, Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries.

• iPod is a trademark of Apple Inc., registered in the U.S. and other countries.

• iPhone is a trademark of Apple Inc.

• “Made for iPod” and “Works with iPhone” means that an electronic accessory has been designed to connect speciﬁ cally to iPod or iPhone, respectively, and has been certiﬁ ed by the developer to meet Apple performance standards.

• Apple is not responsible for the operation of this device or its compliance with safety and regulatory standards.

• “

• DLNA®, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or certiﬁ ca-

• Wake-on-LAN is a trademark of International Business Machines Corporation in the United

• This product is protected by certain intellectual property rights of Microsoft Corporation. Use

• The system names and product names indicated in this manual are generally the trademarks or

• In this manual, Microsoft Windows XP Home Edition, Microsoft Windows XP Professional and

• In this manual, Microsoft Windows Vista Home Basic, Microsoft Windows Vista Home Pre-

• In this manual, Microsoft Windows 7 Starter, Microsoft Windows 7 Home Premium, Microsoft

• ™ and ® marks are omitted in this manual.

” is a mark of the Wi-Fi Alliance.

tion marks of the Digital Living Network Alliance.

States.

or distribution of such technology outside of this product is prohibited without a license from Microsoft or an authorized Microsoft subsidiary.

registered trademarks of the manufacturer.

Microsoft Windows XP Media Center Edition are referred to as Windows XP.

mium, Microsoft Windows Vista Business and Microsoft Windows Vista Ultimate are referred to as Windows Vista.

Windows 7 Professional, Microsoft Windows 7 Ultimate are referred to as Windows 7.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter . The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)

To Exposed Metal Parts on Set

NOTES ON CHIP COMPONENT REPLACEMENT

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

• Keep the temperature of soldering iron around 270 °C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classiﬁ ed as a CLASS 1 LASER product. This marking is located on the rear exterior.

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

1.5 kΩ0.15 μF

voltmeter (0.75 V)

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

ATTENTION AU COMPOSANT AYANT RAPPORT

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

À LA SÉCURITÉ!

1. SERVICING NOTES ............................................. 4

2. DISASSEMBLY

2-1. Disassembly Flow ........................................................... 9

2-2. Case ................................................................................. 9

2-3. NET Board Block ........................................................... 10

2-4. Front Panel Block ........................................................... 11

2-5. Knob (VOL) .................................................................... 12

2-6. SP Board ......................................................................... 12

2-7. MAIN Board ................................................................... 13

2-8. POWER Board ................................................................ 13

2-9. CD Block ........................................................................ 14

2-10. BD96U Board ................................................................. 15

2-11. Belt .................................................................................. 15

2-12. FFC Holder ..................................................................... 16

2-13. Optical Pick-up Block (KHM-313CAA) ........................ 16

3. TEST MODE ............................................................ 17

4. ELECTRICAL CHECK ......................................... 20

HCD-MX700Ni/MX750Ni

5. DIAGRAMS

5-1. Block Diagram - CD, USB Section - .............................. 21

5-2. Block Diagram

- TUNER, iPod/iPhone, AUDIO IN Section - ................ 22

5-3. Block Diagram

- NETWORK, OUTPUT, PANEL Section - ................... 23

5-4. Block Diagram - POWER SUPPLY Section - ................ 24

5-5. Printed Wiring Board - BD96U Board (Side A) - ........... 26

5-6. Printed Wiring Board - BD96U Board (Side B) - ........... 27

5-7. Schematic Diagram - BD96U Board (1/2) - ................... 28

5-8. Schematic Diagram - BD96U Board (2/2) - ................... 29

5-9. Printed Wiring Board - DAB Board (MX750Ni) - ......... 30

5-10. Schematic Diagram - DAB Board (MX750Ni) - ............ 31

5-11. Printed Wiring Board - MAIN Section (1/2) - ................ 32

5-12. Printed Wiring Boards - MAIN Section (2/2) - .............. 33

5-13. Schematic Diagram - MAIN Section (1/4) - ................... 34

5-14. Schematic Diagram - MAIN Section (2/4) - ................... 35

5-15. Schematic Diagram - MAIN Section (3/4) - ................... 36

5-16. Schematic Diagram - MAIN Section (4/4) - ................... 37

5-17. Printed Wiring Board - NET Board - .............................. 38

5-18. Schematic Diagram - NET Board - ................................. 39

5-19. Printed Wiring Boards - IP/JACK/SP/USB Boards - ..... 40

5-20. Schematic Diagram - IP/JACK/SP/USB Boards - .......... 41

5-21. Printed Wiring Boards - PANEL Section - ..................... 42

5-22. Schematic Diagram - PANEL Section - .......................... 43

5-23. Printed Wiring Board - POWER Board - ........................ 44

5-24. Schematic Diagram - POWER Board - .......................... 45

6. EXPLODED VIEWS

6-1. Case Section .................................................................... 58

6-2. Front Panel Section ......................................................... 59

6-3. iPod Dock Section .......................................................... 60

6-4. MAIN Board Section ...................................................... 61

6-5. Chassis Section ............................................................... 62

6-6. CD Mechanism Deck Section

(CDM85CD-DVBU102) ................................................ 63

7. ELECTRICAL PARTS LIST .............................. 64

HCD-MX700Ni/MX750Ni

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body . During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The ﬂ exible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reﬂ ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C. Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to ﬂ ow)

than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

NOTE OF REPLACING THE WIRELESS LAN MODULE (MOD1)

When replacing the wireless LAN module (MOD1), MAC address is changed. Print the following explanation, cut it, and hand over it to the customer with the set, when returning the set that the repair is completed to the customer.

MAC address of the main unit has been changed by this repair. When using the MAC address ﬁ ltering function of connection destina- tion access point equipment, set it again..

CHECKING METHOD OF NETWORK OPERATION

It is necessary to check the network operation, when replacing the wireless LAN module (MOD1). Check the operation of wireless and wired LAN, according to the following method.

1. Checking Method of Wireless LAN Operation

Check that access point is recognized surely.

Necessary Equipment:

Wireless access point with router function (AP)

Procedure:

1. Press the [FUNCTION] button to select the Home Network function.

2. Press the [ + v]/[V –] buttons to select “Network,” then press the [ENTER] button.

3. Press the [ + v]/[V –] buttons to select “Settings,” then press the [ENTER] button.

4. Press the [ + v]/[V –] buttons to select “Wireless LAN Settings,” then press the [ENTER] button.

5. Press the [ + v]/[V –] buttons to select “Access Point Scan,,” then press the [ENTER] button.

6. The system starts searching for access points, and displays a list of up to 20 available network name (SSID).

7. Check that access point (SSID) is displayed on the searching result.

Note: Refer to the instruction manual about details of the setting method.

2. Checking method of wired LAN operation

Check that access point is recognized surely.

RELEASING THE DISC TRAY LOCK

The disc tray lock function for the antitheft of an demonstration disc in the store is equipped.

Releasing Procedure:

1. Press the [

2. Press two buttons of [x] and [Z] for 5 seconds.

3. The message “UNLOCKED” is displayed on the liquid crystal element and the disc tray is unlocked.

Note: When “LOCKED”is displayed, the disc tray lock is not released by

turning power on/off with the [

NOTE OF REPLACING THE MS-203 BOARD

When the MS-203 board is damaged, exchange the entire CDM85 (CD) ASSY.

NOTE OF REPLACING THE CN1003 ON THE NET BOARD

CN1003 on the NET board cannot exchange with single. When these parts are damaged, exchange the entire mounted board.

] button to turn the power on.

?/1

] button.

Procedure:

1. Connect the main unit to the router or the hub, etc. with the LAN cable.

2. Press the [FUNCTION] button to select the Home Network function.

3. Press the [ + v]/[V –] buttons to select “Network,” then press the [ENTER] button.

4. Press the [ + v]/[V –] buttons to select “Settings,” then press the [ENTER] button.

5. Press the [ + v]/[V –] buttons to select “Wired LAN Settings,” then press the [ENTER] button.

Note: If “Change Setting?” appears, select “OK,” then press the [ENTER]

button.

6. On the IP setting, press the [ + v]/[V –] buttons to select “Auto,” then press the [ENTER] button.

7. On the proxy setting, press the [ select “Do Not Use,” then press the [ENTER] button.

8. Press the [ + v]/[V –] buttons to select “OK,” then press the [ENTER] button.

9. Perform the server settings.

10. Press the [OPTIONS] buttons to select “Network,” then press the [ENTER] button.

11. Press the [OPTIONS] buttons to select “Information,” then press the [ENTER] button.

12. Check that IP address can be acquired.

Note: Refer to the instruction manual about details of the setting method.

+ v]/[V –] buttons to

MODEL IDENTIFICATION

– Back Panel –

Model Part No.

HCD-MX700Ni: AEP model HCD-MX700Ni: US model HCD-MX700Ni: Canadian model HCD-MX700Ni: Taiwan model HCD-MX700Ni: Latin American model HCD-MX700Ni: Brazilian model HCD-MX750Ni: AEP, UK models HCD-MX750Ni: Australian model

PART No.

HCD-MX700Ni/MX750Ni

4-189-496-0[] 4-189-496-1[] 4-189-496-2[] 4-189-496-4[] 4-189-496-5[] 4-189-496-6[] 4-189-496-7[] 4-189-496-8[]

CAPACITOR ELECTRICAL DISCHARGE PROCESSING

When checking the board, the electrical discharge is necessary for the electric shock prevention. Connect the resistors referring to the ﬁ gure below.

• POWER board (C10) (AEP and UK models)

Both ends of respective capacitors.

– POWER Board (Conductor Side) –

C10

800 :/2 W

• POWER board (C11, C12) (Except AEP and UK models)

Both ends of respective capacitors.

– POWER Board (Conductor Side) –

C12

C11

800 :/2 W

HCD-MX700Ni/MX750Ni

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

bottom side

1 Insert the hard metal fittings of L character type in the hole of the chassis, and push the lever in the direction of the arrow.

MAIN BOARD (COMPONENT SIDE), BD96U BOARD (COMPONENT SIDE) AND SP BOARD SERVICE POSITION

SP board

MAIN board

BD96U board

NET BOARD SERVICE POSITION

MAIN board

HCD-MX700Ni/MX750Ni

NET board

insulating sheet

LCD, KEY, JACK AND USB BOARDS SERVICE POSITION

WIRELESS LAN MODULE (MOD1)

JACK board

LCD board

JUNCTION board

KEY board

USB board

HCD-MX700Ni/MX750Ni

MAIN BOARD (CONDUCTOR SIDE) AND BD96U BOARD (CONDUCTOR SIDE) SERVICE POSITION

MAIN board (conductor side)

BD96U board (conductor side)

POWER board

DAB board (MX750Ni only)

POWER BOARD SERVICE POSITION

Note: Please disassemble each board from the chassis.

POWER board

MAIN board

LCD board

DISASSEMBLY

• This set can be disassembled in the order shown below.

2-1. DISASSEMBLY FLOW

SET

2-2. CASE (Page 9)

HCD-MX700Ni/MX50Ni

SECTION 2

2-4. FRONT PANEL BLOCK (Page 11)

2-5. KNOB (VOL) (Page 12)

Note: Follow the disassembly procedure in the numerical order given.

2-3. NET BOARD BLOCK (Page10)

2-7. MAIN BOARD (Page 13)

2-9. CD BLOCK (Page 14)

2-10. BD96U BOARD (Page 15)

2-12. FFC HOLDER (Page 16)

2-13. OPTICAL PICK-UP BLOCK (KHM-313CAA) (Page 16)

2-6. SP BOARD (Page 12)

2-8. POWER BOARD (Page 13)

2-11. BELT (Page 15)

2-2. CASE

1 two screws (BV/RING)

– Bottom view –

5 case

2 three screws

(BV/RING)

HCD-MX700Ni/MX750Ni

2-3. NET BOARD BLOCK

5 screw (BV3)

2 Lift up the coating clip.

3 flexible flat cable (11 core) (CN1005)

7 NET board block

1 antenna cable

Note:

surely connected when you install the NET board block.

Please confirm the antenna cable is

4 connector (CN1004)

5 two screws (BV3)

:LUHVHWWLQJ

rear

WIRELESS LAN MODULE (MOD1)

MAIN board

NET board

2-4. FRONT PANEL BLOCK

5 Lift up the coating clip.

8 flexible flat cable

qs two screws

(BV3)

qg two claws

(15 core) (CN403)

6 flexible flat cable (13 core) (CN409)

7 ferrite core

9 connector

(CN402)

qd screw (BV3)

HCD-MX700Ni/MX50Ni

lead wire (from HP board)

qh front panel block

3 two claws

4 panel (CD) block

qg two claws

qs three screws

(BV3)

2 Draw out the tray.

0 connector (CN402)

qa screw (BV3)

bottom side

1 Insert the hard metal fittings of L character type in the hole of the chassis, and push the lever in the direction of the arrow.

HCD-MX700Ni/MX750Ni

2-5. KNOB (VOL)

knob (VOL)

2-6. SP BOARD

2 connector (CN703)

1 connector (CN702)

hole

LCD board

Push the knob (VOL) by flat-head screwdriver.

– Front panel block inside view –

front panel block

5 SP board

3 screw (BV3)

2-7. MAIN BOARD

ql flexible flat cable (11 core) (CN411)

qd two screws (BV3)

HCD-MX700Ni/MX50Ni

qj heatsink (AMP)

qf two coating clips

w; cushion (ferrite)

2 ferrite core

1 flexible flat cable

(13 core) (CN409)

3 connector (CN704)

4 connector (CN412) 5 flexible flat cable

(13 core) (CN404)

6 connector (CN402)

7 connector (CN417)

8 flexible flat cable

(5 core) (CN410)

9 flexible flat cable (27 core) (CN415)

qk radiation sheet

qd three screws (BV3)

wa MAIN board

qh two screws (BV3)

qs connector (CN401)

qd screw (BV3)

(MX750Ni)

qa flexible flat cable (9 core) (CN407)

0 flexible flat cable (9 core) (CN405)

(Except AEP, UK)/ flexible flat cable (11 core) (CN406) (AEP, UK)

2-8. POWER BOARD

6 two screws (BV3)

lead wire (from HP board)

2 screw (BV3)

6 two screws (BV3)

2 two screws (BV3)

7 POWER board

1 power cord connector

(CN1)

4 claw

HCD-MX700Ni/MX750Ni

2-9. CD BLOCK

4 screw (BV3)

2 four screws (BV3)

6 bracket (center)

8 screw

(BV3)

Note 1: Do not remove this connector (CN201) at this point. It is necessary to process electrostatic measures of optical pick-up.

1 connector (CN301)

7 two claws

bracket (front)

7 two claws

8 screw (BV3)

9 claw

8 screw (BV3)

flexible flat cable 24P

filament tape

9 claw

0 bracket (front)

guard board

flexible flat cable (5 core)

5 two claws

– Front side view –

qa filament tape

qs three screws

(BV3)

qf CD block

Note 2: When you install CD block, fix the flexible flat cable 24P with the filament tape firmly as shown in figure.

2-10. BD96U BOARD

Note 1: When disconnection the wire (ﬂ at type) (24 core) of optical pick-up block, solder the short-land.

flexible flat cable 24P

2 (CN201)

Note 2: When assembling the optical pick-up block, remove the solder of short-land after connecting the flexible flat cable 24P.

– CD mechanism deck block bottom view –

HCD-MX700Ni/MX50Ni

Solder the short-land.

2-11. BELT

3 BD96U board

7 chuck cam

8 belt

6 shaft

3 claw

4 tray

5 two hooks

3 claw

bottom side

1 Push the lever in the direction of the arrow.

HCD-MX700Ni/MX750Ni

2-12. FFC HOLDER

3 FFC holder

Note: Remove the FFC holder from the

original set and install it again.

1 two claws

2 two claws

– CD mechanism deck block bottom view –

2-13. OPTICAL PICK-UP BLOCK (KHM-313CAA)

 +ow to bend the flexible flat cable 24P

two screws

optical pick-up block

(KHM-313CAA)

two screws

(PTPWH M2.6)

insulator

connector

insulator

(PTPWH M2.6)

insulator

1 two claws

to BD96U board (CN201)

flexible flat cable 24P

insulator

40 mm

The upper side is contact side.

The lower side is contact side.

40 mm

to optical pick-up block (KHM-313CAA)

50 mm

– CD mechanism deck block bottom view –

mechanism deck

(CDM85 (CD))

SECTION 3

TEST MODE

HCD-MX700Ni/MX750Ni

COLD RESET

The cold reset clears all data including preset data stored in the memory to initial conditions. Execute this mode when returning the set to the customer.

Procedure:

1. In the standby status, press the [?/1] button to turn the power on.

2. Press two buttons of [ENTER] and [

3. When “RESET” appears, the set enters.

AUTO STANDBY MODE

This mode is used to change the automatic standby function. With this function, the system enters standby mode automatically in about 30 minutes when there is no operation or audio signal output. By default, the automatic standby function is turned on.

Procedure:

1. Press the [

2. Press the [

3. The message “AUTO STANDBY” is displayed on the liquid crystal element and the automatic standby OFF mode is set.

4. T o turn this function on, press the [ onds.

The message “AUTO STANDBY” is displayed on the liquid

crystal element and the automatic standby ON mode is set.

COMMON TEST MODE

This mode is used to check operations of ampliﬁ er.

Procedure:

1. Press the [

2. Press two buttons of [ENTER] and [FUNCTION] simultaneously.

3. When the COMMON test mode is activated, “AUDIO IN” is displayed on the liquid crystal element and “c PLA Y SLEEP” blink on the liquid crystal element.

4. Each time [EQ] button on the remote commander is pressed, the display changes starting “TONE MAX”, “TONE MIN” and “TONE FLAT” this order.

5. Turn the [VOLUME] knob counterclockwise, “VOLUME MIN” is displayed on the liquid crystal element. Turn the [VOLUME] knob clockwise, “VOLUME MAX” is displayed on the liquid crystal element.

Releasing method:

Press the [

PANEL TEST MODE

This mode is used to check the liquid crystal element, LED, model, destination, software version and key.

Procedure:

1. Press the [?/1] button to turn the power on.

2. Press two buttons of [ENTER] and [x] simultaneously.

3. All segments on the liquid crystal element, [STANDBY] LED light up.

4. Press the [ENTER] button, the model and destination are displayed on the liquid crystal element.

5. Press the [ENTER] button again, MC version is displayed on the liquid crystal element.

6. Each time [ENTER] button is pressed, the display changes starting from MC version, GC version, USBL version , USBM version, NWA version, NWD version, NWM version, IPL version, CD version, CDD version, CDMA version, CDMB version, BDA version, BDB version, ST version, TA version and TM version this order, and returns to the MC version display.

7. When [ year, month and day of the software creation is displayed. When [ MC version display.

] button to turn the power on.

?/1

] button for 2 seconds.

?/1

] button to turn the power on.

?/1

] button to turn off the system.

?/1

] button is pressed while the MC version is displayed,

] button is pressed again, the display returns to the

] simultaneously.

?/1

] button again for 2 sec-

?/1

8. Press the [OPTIONS] button, the key test mode is activated and “K 0 V0” is displayed on the liquid crystal element.

9. Each time a button is pressed, “K” value increases. However, once a button is pressed, it is no longer taken into account.

All keys are pressed, display becomes “K11” .

10. “V” value increases 2, 4, 6 ... if turn the [VOLUME] knob clockwise, or it decreases 8, 6, 4 ... if turn the knob counterclockwise.

Releasing method:

Press two buttons of [ENTER] and [ nect the power cord.

CD SHIP MODE

This mode moves the optical pick-up to the position durable to vibration. Use this mode when returning the set to the customer after repair.

Procedure:

1. Press the [?/1] button to turn the power on.

2. Press the [FUNCTION] button to select “CD”.

3. Press two buttons of [OPTIONS] and [?/1] simultaneously.

4. After blink “STANDBY”, “LOCK” is displayed, disconnect the AC plug.

CD SHIP MODE & MEMORY CLEAR

This mode is used to perform CD ship mode and cold reset simultaneously.

Procedure:

1. Press the [

2. Press three buttons of [

3. After blink “STANDBY”, “LOCK” is displayed disconnect the AC plug.

DISC TRAY LOCK MODE

This mode is used to unable to take sample disc out of disc tray in the shop.

Procedure:

1. Press the [?/1] button to turn the power on.

2. Press the [Z] button to open the disc tray and set the CD disc.

3. Press the [Z] button to close the disc tray.

4. Press two buttons of [x] and [Z] for 5 seconds.

5. The message “LOCKED” is displayed on the liquid crystal element and the disc tray is locked. (Even if pressing the [Z] button, the message “LOCKED” is displayed on the liquid crystal element and the disc tray is locked)

Releasing method:

1. Press two buttons of [

2. The message “UNLOCKED” is displayed on the liquid crystal element and the disc tray is unlocked.

CD POWER MANAGE

This mode is used to changed over CD power on/off for decreasing of reception noise in the tuner mode.

Procedure:

1. Press the [?/1] button to turn the power on.

2. Press the [FUNCTION] button to select “CD”.

3. Press the [?/1] button again to turn the power off.

4. Press two buttons of [ + v] and [?/1] simultaneously.

5. The message “CD POWER ON” or “CD POWER OFF” is displayed on the liquid crystal element, and CD power on/off is changed over in the tuner mode.

] button to turn the power on.

?/1

] and [BACK] simultaneously.

] and [Z] for 5 seconds.

] simultaneously, or discon-

HCD-MX700Ni/MX750Ni

CD SERVICE MODE

This mode can run the CD sled motor freely. Use this mode, for instance, when cleaning the optical pick-up.

Procedure:

1. Press the [?/1] button to turn the power on.

2. Press the [FUNCTION] button to select “CD”.

3. Press three buttons of [x] and [ + v] simultaneously, the message “SER VICE MODE” is displayed on the liquid crystal element.

4. Press the [

l m

up to inside track and the message “SLED IN” is displayed on the liquid crystal element, or press the [ +] button to outside track and the message “SLED OUT” is displayed on the liquid crystal element.

5. Press the [u] button, “LD ON” or “LD OFF” is displayed on the liquid crystal element. Each time [u] button is pressed, laser diode on/off is changed over.

Releasing method:

Press the [

] button to turn off the system.

?/1

CD SERVO TEST MODE

This mode can check the servo system operations of the optical pick-up system (= optical unit + BD96U board).

Note 1: Do not enter the [CD SERVO TEST MODE] while any other test

mode is in progress.

Note 2: Do not enter any other test mode while the [CD SERVO TEST

MODE] is in progress.

Note 3: In RAM Read, “SBADrough”, “SBBTrough”, “DT-GI rough”,

“SBAD ﬁ ne”, “SBBT ﬁ ne”, “DT-GI ﬁ ne”, “DSPcomcnt”, and “DECcomcnt” are displayed but are not used in the service.

How to Enter the CD Servo Test Mode Procedure:

1. Press the [

?/1

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of [x], and [V –] simultaneously.

4. It enters the CD servo test mode and displays “bdt S CURVE”.

How to Exit from the CD Servo Test Mode Procedure:

1. To release this mode, press the [

Key Operation:

[ + v], [V –]: Use these keys to move between the seven modes contained in the CD Servo Test Mode, that are the S-Curve Mode, the RAM Read Mode, the RAM Write Mode, the Command Out Mode, the Error Rate Mode the LOG Initialize Mode and the LOG Read Mode as described below. Also, use these keys to move between the menus within the respective seven modes. When [ + v] is pressed, the screen advances to the next menu or to the next mode. When [

–] is pressed, the screen returns back to the previous menu or to the previous mode. Use these keys also to increase or decrease the numeric value when changing the numeric value. Pressing [ + v] increases the value and pressing [V –] decreases the value.

[ENTER], [

Use these keys to move between the different layers of the hierarchy of the CD Servo Test Mode shown below. Press [ENTER] to move down to the lower layer, and press [ higher layer.

[

M L

TUNE +], [ Use these keys to move the cursor to the right digit or to the left digit in the six-digit number, when changing the numeric value. Press [

M L

press [

l m

TUNE –] button to move the optical pick-

M L

TUNE

] button to turn the power on.

] button.

?/1

] to move up to the

l m

TUNE –]:

TUNE +] to move the cursor to the right, and

TUNE –] to return the cursor to the left.

[

Use this key to execute Command Out in the Command Out Mode.

CD Servo Test Mode Tree:

S Curve Mode LD ON (bdt S CURVE) (LD ON)

RAM Read Mode (bdtRAM READ) (DiscType) (AL: 0000, RW: 0001) Gain Index value indication (GainIndx) (0001) RFO GAIN value indication (RFO_GAIN) (0008) FEO GAIN value indication (FEO_GAIN) (0005) SBAD GAIN value indication (SBAD_GAIN) (0008) TEO GAIN value indication (TEO_GAIN) (0008) Disc Size value indication (DiscSize) (0000: Non disc, 0001: 8cm, 0002: 12cm)

(OpAbrkErr) (0000) SBBT Data value indication (SBBT Data) (0053) TE Peak value indication (TE P-P) (0097) FEOOCD value indication (FEOOCD) (00C0) The following items are not used (Note 3)

RAM Write Mode

(bdtRAM WRITE) (00 SPG_Mask) (Non mask:00, Mask:01) Fix RF Gain value edit (00 FixRFgain) (Non Fix:00, AL Fix:01, RW Fix:02) TMAX ON value edit (00 tmaxon) Driver Mute OFF value edit (00 d_muteoff) (Normal:00, Forced OFF:01)

Command Out Mode

(bdt COMOUT) (COMOUT6X) (000000) (ok) READ2X value edit command out (READ2X) (60) (50) REG READ value edit command out (REG_READ) (00) (0000) FEBC? command out

(FEBC?) (00) FGADD? command out (FGADD?) (FA) TEBC? command out (TEBC?) (02) TGADD? command out (TGADD?) (0D) RFGC? command out (RFGC?) (3F) FEOF? command out (FEOF?) (0000) TEOF? command out (TEOF?) (FFC0) TEIOCD1? command out (TEIOCD1?) (FEC0) TEIOCD2? command out (TEIOCD2?) (FEC0) TEIOCD3? command out (TEIOCD3?) (0080) TEOOCD? command out (TEOOCD?) (FB80) FEOOCD? command out (FEOOCD?) (00C0) MONITOR value edit command out (MONITOR) (570A00) (ok) Error Rate Mode Error rate indication (bdt ERR RATE) (0000000000) LOG Read Mode value indication (bdtLOG READ) (XX: YYYYYY: ZZZZ) XX: LOG Number YYYYYY: Communication LOG ZZZZ: LOG Number LOG Initialize Mode Initializetion Initialization execution (bdtLOG INIT) confirmation (INIT done) indication (INIT sure?)

Higher layer Lower layer of menu hierarchy

Disc Type value indication

Op ABRAKE Error

SPG Mask value edit

COMOUT6X value edit command out

value indication

HCD-MX700Ni/MX750Ni

CD ERROR CODE

The past errors of the CD mechanism (CDM) are displayed as the CDM Errors, and those of the optical pick-up system (= optical unit + BD96U board) are displayed as the BD Errors as shown below.

Procedure:

1. Press the [

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of [OPTIONS] and [

4. BD and CDM error counts are displayed on the ﬂ uoresent in- dicator tube as shown below.

] button to turn the power on.

?/1

] simultaneously.

Em**Ed** X

Mode-in count BD error count CDM error count

5. Press the [

6. Then, the CDM error code is displayed as “M0xxxxxxxx” (x means hexadecimal number) on the liquid crystal element as shown below.

7. Every pressing of the [ increments the number after “M” starting from “M0” up to “M9”, and then returns to “M0”. Every pressing of the [

TUNE –] button in this mode decrements the number after “M”. The smaller the error code number is, the newer the error content is.

Press the [

8. When the [ is displayed as “D0xxxxxxxx” (x means hexadecimal number) on the ﬂ uoresent indicator tube as shown below. In the same way as the CDM error code, use of the [ and the [ ing of the error history.

Press the [

Releasing method:

Press the [?/1] button to turn off the system.

Contents of “CDM Errors”

Error display example

M 0 FF 11 42 00 1 2 3 4 5

1 It indicates the error history number 0 to 9: The error code number 0 indicates the newest error.

2 It indicates whether the CDM error occurs in the normal opera-

tions or during the initialization operation. FF : The error has occurred in the normal opera-

Other than FF : The error has occurred during the initialization

3 It indicates the processing during which the trouble has oc-

curred. 01: The disc EJECT processing is in progress. 02: The disc INSERTION-WAITING processing is in prog-

ress.

03: Processing of the disc INSERTION-REQUEST for the up-

per CD tray is in progress.

04: Processing of the disc EJECTION-REQUEST for the up-

per CD tray is in progress. 05: The disc pulling-in operation is in progress. 06: The disc chucking processing is in progress. 07: The disc re-chucking processing is in progress.

+ v] button.

M L

–] button to return to the previous display.

+ v] button is pressed then, the BD error code

l m

TUNE –] buttons in this mode enables trac-

–] button to return to the previous display.

tions.

operation.

TUNE +] button in this mode

M L

TUNE +]

08: The disc chucking-release completion operation is in prog-

ress.

4 It indicates the operation during which the trouble has oc-

curred. 00 : Waiting for the operation. 10 to 13 : The disc EJECT operation is in progress. 20 : The disc pulling-in operation is in progress. 30 : The disc chucking-release operation is in progress. 40 to 43 : The disc EJECT operation due to error is in prog-

ress.

5 Reserve 00: Fix

Contents of “BD Errors”

Error display example

0 02 09

1 2 3 4 5

1 It indicates the error history number 0 to 9: The error code number 0 indicates the newest error.

2 It indicates the error content

01: The focus servo cannot lock-in. 02: GFS is no good (NG). 03: The startup time exceeds the speciﬁ ed period of time (time

over) 04: The focus servo is unlocked continuously. 05: Q code cannot be obtained within the speciﬁ ed period of

time. 06: The tracking servo cannot lock-in. 07: Blank disc

3 It indicates the on-going processing of optical pick-up system

(= optical unit + BD96/BD96U board) when the trouble has occurred. 01: The CD SHIP mode processing is in progress. 02: The POWER OFF processing is in progress. 03: The INITIALIZE processing is in progress. 04: The optical pick-up system (= optical unit + BD96U) is in

the stop state. 05: The STOP operation is in progress. 06: The startup processing is in progress. 07: The TOC read-in processing is in progress. 08: The SEARCH operation is in progress. 09: The PLAY operation is in progress. 0A: The PAUSE operation is in progress. 0B: The PLAY – MANUAL SEARCH operation is in prog-

ress. 0C: The PAUSE – MANUAL SEARCH operation is in prog-

ress.

4 It indicates the disc speed when the trouble has occurred. It indicates the step number of each processing speciﬁ ed by 3.

Because the numbers of steps are different in each processing, this number is different in each processing.

5 It indicates the disc speed when the trouble has occurred. 01: 1x (normal)

01 01

HCD-MX700Ni/MX750Ni

SECTION 4

ELECTRICAL CHECK

FM TUNE LEVEL CHECK

signal

generator

Procedure:

1. Turn on the set.

2. Input the following signal from signal generator to FM antenna input directly.

Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz Deviation : 75 kHz Modulation : 1 kHz ANT input : 35 dBu (EMF)

Note: Use 75 ohm coaxial cable to connect signal generator and the set.

You cannot use video cable for checking.

Use signal generator whose output impedance is 75 ohm.

3. Set to FM tuner function and tune A, B and C signals.

4. Conﬁ rm “TUNED” is lit on the display for A, B and C signals.

set

When the selected station signal is received in good condition, “TUNED” is displayed.

HCD-MX700Ni/MX750Ni

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,1B6:

SECTION 5

DIAGRAMS

5-1. BLOCK DIAGRAM - CD, USB Section -

(Page 22)

HCD-MX700Ni/MX750Ni

2222

R-CH

CN01

AUDIO IN

J302

SDA27SCL

IN-L1

VOL L

1 IN-L2

IN-L3

VOL IIC_SDA/E2P-SDA

VOL IIC_CLK/E2P-CLK

AUDIO_LEVEL_INPUT

SEL L

25OUT L

24SB L

ELECTRICAL VOLUME,

INPUT SELECTOR

IC502

: TUNER : CD PLAY : iPod/iPhone

SIGNAL PATH

R-ch is omitted due to same as L-ch.

: AUDIO IN

CD-L

SP_L

7IN-L5

CN332

(iPod/iPhone Dock)

27 28

LINE AMP

IC503

BUFFER

IC515

R-CH

18 19 13

LINE-OUT-L

LINE-OUT-R

RXD

Acc ID

TXD

Acc PWR(3.3V)

DGND

iPod_RxD_IN

iPod_TxD_OUT

iPod_WAKE

iPod_DET

78 77

: DAB

DAB1

DAB TUNER

MODULE

S1_DIN

S1_DOUT

35 DAB TxD_OUT

36 DAB RxD_IN

AUDR

AUDL

LINE AMP

IC511

SYSTEM CONTROLLER

IC401 (2/4)

ANTENNA

DAB 75:

FM 75: COAXIAL ANTENNA

TU1

TUNER (FM)

L-OUT

DO/STEREO

TUNED

CLK

R-OUT R-CH

ST_CE

ST_CLK

ST_DI/STEREO

ST_DO

ST_TUNED

RDS DATA

RDS INT

RDS_DATA

RDS-INT

(AEP, UK)

(MX750Ni)

iPod POWER

DETECT

Q505

iPod +5V

Acc DET

iPod POWER

DETECT

Q506

iPod WAKE

UP DETECT

Q512

AUDIO INPUT

DETECT

Q504, 517

R-CH

IN-L45

Q510

SELECT SWITCH

IC512

1Y1

1Y012

1-COM

NET_L

SINGER_L

SINGER_ON

: LAN

5-2. BLOCK DIAGRAM - TUNER, iPod/iPhone, AUDIO IN Section -

(Page 21)

(Page 23)

HCD-MX700Ni/MX750Ni

2323

SP-L

SYSTEM CONTROLLER

IC401 (3/4)

: TUNER

SIGNAL PATH

R-ch is omitted due to same as L-ch.

SPEAKERS

+ –

–

TB322

RESET_CD5SD

PWM_C PWM_D

RESET_AB

S-MASTER_RESET

OUT_A

OUT_B

OUT_C

OUT_D

6 PWM_A

PWM_B

S-MASTER_DCP

OVER LOAD

DETECT

Q702, 703

PROTECT

DETECT

Q701

LED DRIVE

Q625

BYPASS

OVER LOAD

DETECT

Q752, 753

DIGITAL POWER AMP

IC707

OUTL1

OUTL2

OUTR1

OUTR2

STREAM PROCESSOR

IC705

A/D CONVERTER

IC711

TA_LINE_MUTE

MUTING

Q106

MUTING

CONTROL

SWITCH

Q507, 508

PROTECT

DETECT

Q516

X703

49.152MHz

S-MASTER_DATA

SCDT

S-MASTER_SHIFT

S-MASTER_LATCH

S-MASTER_PG_MUTE

S-MASTER_SOFT_MUTE

S-MASTER_NSP_MUTE

SCSHIFT22SCLATCH23PGMUTE20SOFTMUTE19NSPMUTE

S-MASTER_INIT

INIT

31 DATA2 AINL

1 AINRR-CH

R-CH

SCLK

SDTO

LRCK

MCLK

BCK

LRCK

XFSIIN

XFSOIN

CLOCK

BUFFER

IC709

CLOCK

SHIFT

IC703

LCD601

LIQUID CRYSTAL ELEMENT

FL/LCD DO2FL/LCD SCL3FL/LCD CS61FL/LCD RESET

SIRCS

REMOTE CONTROL RECEIVER

IC622

I_KEY WAKE UP_POWER & DISPLAY

VOLUME_JOG

BCo_POWER

KEY_1, KEY_2

X402

5MHz

Xout

Xin

13 15

X401

32.768kHz

Xcout

Xcin

11 10

S621 - 632

(PANEL KEYS)

70, 71

LED DRIVE

Q623

STBY_LED

STANDBY

VOLUME

KEY_1

D624

LED DRIVE

Q624

LCD_BACKLIGHT

(LCD BACK LIGHT)

EVER +3.3V

D625, 626

ROTARY

ENCODER

RV621

MOD1

WIRELESS LAN MODULE

AV2CTR (ADA_LRCK)

AV2CLK (ADA_BCK)

AV2DATA0

A23

SPI_OUT (DA810)

SPI_DIN (DA810)

SPI_CLK (DA810)

SPI_NCS0

A22 (DA810)

PDOUT0

PDOUT1 (DA810)

CN1006

NETWORK

TX+

TX-

RX+

RX-

1 2

3 6

ETH TX+ ETH TX-

ETH RX+ ETH RX-

D/A CONVERTER

IC1001

4 LRCKI

AV2CTR1 (ADA_MCK)

1MCLK 2 BICK

6SMUTE

AV2DATA2

9SDTO

3SDTI

R OUT

L OUT

NET_L

R-CH

6 BCo_SPI_DIN 5 BCo_SPI_DOUT 7 BCo_SPI_CLK

23 BCo_SPI_CS

68 BCo_SPI_READY

NRESET_MOD

BCo_RESET

67 BCo_SPI_REQ

MCLK

SCLK

A/D CONVERTER

IC1005

RESET

LRCK

AINR

AINL

R-CH

RSTN

iPod CP IIC SDA

SINGER_ON

SINGER_L

iPod CP IIC SCL26iPod CP RESET

EEPROM

IC402

I2C_SCL

RESET

I2C_SDA

ANT1

: LAN

5-3. BLOCK DIAGRAM - NETWORK, OUTPUT, PANEL Section -

(Page 22)

(Page 24)

(Page 22)

HCD-MX700Ni/MX750Ni

2424

20 12

POWER ON 63

D923

POWER CONTROL

IC11

D14

D603

EVER +4V

EVER +3.3V

(AC IN)

LINE FILTER

RECT

TH1

D902

15 VS

18 VD

1 VSENSE

2 F/B

16 VG-H

12 VG-L

8VC1

POWER CONTROL

IC601

5 DRAIN

2FB

4VCC

ISOLATOR

PC11

ISOLATOR

PC602

ISOLATOR

PH601

T031

MAIN POWER

TRANSFORMER

T603

SUB POWER

TRANSFORMER

POWER

ON/OFF CONTROL Q901 - 903

SWITCHING

Q012

SWITCHING

Q011

SHUNT

REGULATOR

IC909

RECT

D904

+12V

REGULATOR

IC710

Q601

9OCP

D905

AMP +27V

AMP +12V

RESET

AC_DET

D927 D914

POWER_PROTECT

+3.3V

REGULATOR

IC405

AMP +3.3V

+3.3V

REGULATOR

IC704

VBUS +5V

+5V

REGULATOR

IC506

+3.3V

REGULATOR

IC1004

iPod +5V

LED +7V

AMP +1.8V

+1.8V

REGULATOR

IC712

CD D +3.3V

CD D +1.5V

+1.5V

REGULATOR

IC102

DAB +3.3V

+3.3V

REGULATOR

IC671

A +9V

M +7V

+9V

REGULATOR

IC905

A +5V

+5V

REGULATOR

IC908

+1.2V

REGULATOR

IC1003

+7V

REGULATOR

IC904

+3.3V

REGULATOR

IC1002

RECT

D903

D911

D922

D1002

AC-CUT

DAB-POWER_3.3

USB +3.3V

+3.3V

REGULATOR

IC509

BOLERO/iPod_ON

ZIPANG_ON

DAB +1.2V

+1.2V

REGULATOR

IC672

DAB-POWER_1.2

PROTECT

DETECT

Q904

OVER CURRENT

PROTECT

Q509

SYSTEM CONTROLLER

IC401 (4/4)

D913

(MX750Ni)

+3.3V

REGULATOR

IC508

+5V

REGULATOR

IC510

CD A +3.3V

+3.3V

+1.2V

+3.3V

REGULATOR

IC505

CD +5V

+5V

REGULATOR

IC504

A/D +3.3V

+3.3V

REGULATOR

IC702

S001

220

240V

110

12V

VOLTAGE

SELECTER

Latin American,

Brazilian

5-4. BLOCK DIAGRAM - POWER SUPPLY Section -

(Page 23)

HCD-MX700Ni/MX750Ni

2525

For Schematic Diagrams.

Note:

• All capacitors are in μF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise speciﬁ ed.

• f : Internal component.

• 2 : Nonﬂ ammable resistor.

• C : Panel designation.

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.)

• A : B+ Line.

• B : B– Line.

• Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions.

– BD96/BD96U Board –

no mark : CD PLAY

– Other Boards –

no mark : TUNER FM

< > : TUNER DAB * : Impossible to measure

• Voltages are taken with VOM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal production

tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal production

tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F : TUNER J : CD PLAY d : USB i : iPod/iPhone f : AUDIO IN L : DAB G : LAN

• Abbreviation

AUS : Australian model BR : Brazilian model CND : Canadian model E2 : Latin American model TW : Taiwan model

For Printed Wiring Boards.

Note:

• X : Parts extracted from the component side.

• Y : Parts extracted from the conductor side.

• f : Internal component.

• : Pattern from the side which enables seeing. (The other layers’ patterns are not indicated.)

• Indication of transistor.

Caution:

Pattern face side: (SIDE B) Parts face side: (SIDE A)

Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.

Caution:

Pattern face side: (Conductor Side) Parts face side: (Component Side)

Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.

• Circuit Boards Location.

• Abbreviation AUS : Australian model BR : Brazilian model CND : Canadian model E2 : Latin American model TW : Taiwan model

Note:

The components identiﬁ ed by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number speciﬁ ed.

Note:

Les composants identiﬁ és par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spéciﬁ é.

These are omitted.

LCD board

POWER board

IP board

MAIN board

JACK board

JUNCTION board

SP board

KEY board

USB board

DAB board (MX750Ni)

MODULE (DAB TUNER) (MX750Ni)

NET board

WIRELESS LAN MODULE

TUNER (FM)

BD96U board

MS-203 board

+ 56 hidden pages

Sony HCD-MX700Ni, HCD-MX750Ni Schematic

TABLE OF CONTENTS

SERVICING NOTES

DISASSEMBLY

2-1. DISASSEMBLY FLOW

2-2. CASE

2-3. NET BOARD BLOCK

2-4. FRONT PANEL BLOCK

2-5. KNOB (VOL)

2-6. SP BOARD

2-7. MAIN BOARD

2-8. POWER BOARD

2-9. CD BLOCK

2-10. BD96U BOARD

2-11. BELT

2-12. FFC HOLDER

2-13. OPTICAL PICK-UP BLOCK (KHM-313CAA)

TEST MODE

ELECTRICAL CHECK

DIAGRAMS

5-1. BLOCK DIAGRAM - CD, USB Section -

5-2. BLOCK DIAGRAM - TUNER, iPod/iPhone, AUDIO IN Section -

5-3. BLOCK DIAGRAM - NETWORK, OUTPUT, PANEL Section -

5-4. BLOCK DIAGRAM - POWER SUPPLY Section -