HCD-HPX10W is the amplifier, CD player,
tape deck and tuner section in CMT -HPX10W .
CDCD Mechanism TypeCDM82A-F1BD81
SectionBase Unit NameBU-F1BD81A
Tape deckModel Name Using Similar MechanismHCD-HPX9
SectionT ape Transport Mechanism TypeCMAL5Z225A
US Model
Canadian Model
Model Name Using Similar MechanismHCD-HPX9
Optical Pick-up Block NameKSM-215DCP
Main unit
Am
plifier section
For the United States model
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
With 6-ohm loads, both channels driven, from
120 – 10,000 Hz: rated 55 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to
rated output.
DIN power output (rated): 50 + 50 W
Continuous RMS power output (reference):
Music power output (reference): 100 + 100 W
Inputs
MD/VIDEO:Sensitivity 450/250 mV,
Outputs
PHONES:Accepts headphones with
(6 ohms at 1 kHz, DIN)
60 + 60 W
(6 ohms at 1 kHz, 10%
THD)
impedance 47 kilohms
an impedance of 8 ohms or
more.
SPECIFICATIONS
SPEAKER:o Accepts impedance of 6 t
CD player section
Laser
Frequency response
Tape deck section
Recording system
Frequency response
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Antenna
Antenna terminals
ntermediate frequency
I
16 ohms.
Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
20 Hz – 20 kHz
4-track 2-channel, stereo
50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
87.5 – 108.0 MHz
FM lead antenna
75 ohms unbalanced
10.7 MHz
AM tuner section
Tuning range530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,710 kHz
(with the tuning interval
set at 9 kHz)
AntennaAM loop antenna, external
antenna terminal
Intermediate frequency 450 kHz
General
Power requirements120 V AC, 60 Hz
Power consumption110 W
Design and specifications are subject to change
without notice.
8-4. CD Mechanism Deck Section-1 (CDM82A) .................. 86
8-5. CD Mechanism Deck Section-2 (CDM82A) .................. 87
8-6. CD Mechanism Deck Section-3 (CDM82A) .................. 88
8-7. CD Mechanism Deck Section-4 (CDM82A) .................. 89
8-8. CD Mechanism Deck Section-5 (CDM82A) .................. 90
8-9. CD Mechanism Deck Section-6 (CDM82A) .................. 91
8-10. CD Mechanism Deck Section-7 (CDM82A) .................. 92
8-11. CD Mechanism Deck Section-8 (CDM82A) .................. 93
8-12. CD Mechanism Deck Section-9 (CDM82A) .................. 94
8-13. CD Mechanism Deck Section-10 (CDM82A) ................ 95
8-14. Base Unit Section (BU-F1BD81A) ................................. 96
9.ELECTRICAL PARTS LIST .................................. 97
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HCD-HPX10W
r
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follow the manuf acturers’ instructions to use these
instruments.
2. A battery-operated A C milliammeter . The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC v oltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-v oltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V A C range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
AC
0.15 µF
1.5 k
Ω
Earth Ground
voltmete
(0.75 V)
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
À LA SÉCURITÉ!
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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HCD-HPX10W
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.