Sony HCD-GPX9 Service Manual

HCD-GPX9

µ

SERVICE MANUAL

Ver. 1.0 2005.03

HCD-GPX9 is the amplifier, CD player, tape deck
and tuner section in CMT-GPX9DAB.

CD
Section

Tape deck
Section

AEP Model

UK Model

Model Name Using Similar Mechanism HCD-GPX5
CD Mechanism Type CDM80B-K6BD80A
Base Unit Name BU-K6BD80A
Optical Pick-up Block Name KSM-213DCP
Model Name Using Similar Mechanism HCD-GPX5
Tape T ransport Mechanism Type CMAL1Z234A

AUDIO POWER SPECIFICATIONS

Main unit

Amplifier section

DIN power output (rated): 30 + 30 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

35 + 35 W
(6 ohms at 1 kHz, 10%
THD)

Music power output (reference):

60 + 60 W

Inputs
AUDIO IN: Sensitivity 250 mV,

impedance 47 kilohms
Outputs
PHONES: Accepts headphones with

an impedance of 8 ohms or

more
SPEAKER: Accepts impedance of 6 to

16 ohms.

CD player section

Laser Diode Properties

Emission Duration:

Continuous

Laser Output*:

Less than 44.6 µW

SPECIFICATIONS

*This output is the value measurement at a distance of

200 mm from the objective lens surface on the
Optical Pick-up Bloc k wit h 7 mm operture.

Frequency response 20 Hz – 20 kHz
Wavelength 780 – 790 nm

Tape deck section

Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),

using Sony TYPE I
cassettes

Tuner section

DAB tuner section

Frequency range
Band-III: 174.928 (5A) –

239.200 (13F) MHz

L-Band: 1452.960 MHz (L1) –

1490.624 MHz (L23)
(L-Band is not available
for the UK model.)

*For details, see “DAB frequency table” below.

Aerial terminal 75 Ω, F female

FM stereo, FM/AM superhe ter odyne tuner

FM tuner section

Tuning range 87.5 – 108.0 MHz
Aerial FM lead aerial
Aerial terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz

AM tuner section

Tuning range

Aerial AM loop aerial, external

Intermediate frequency 450 kHz

– Continued on next page –

531 – 1,602 kHz
(with the tuning inte rval
set at 9 kHz)

aerial terminal

9-879-468-01

2005C05-1
© 2005.03

Sony Corporation

Personal Audio Group
Published by Sony Engineering Corporation

COMPACT DISC DECK RECEIVER

HCD-GPX9

DAB frequency table

Band-III

Frequency Label Frequency Label

174.928 MHz 5A 209.936 MHz 10A

176.640 MHz 5B 211.648 MHz 10B

178.352 MHz 5C 213.360 MHz 10C

180.064 MHz 5D 215.072 MHz 10D

181.936 MHz 6A 216.928 MHz 11A

183.648 MHz 6B 218.640 MHz 11B

185.360 MHz 6C 220.352 MHz 11C

187.072 MHz 6D 222.064 MHz 11D

188.928 MHz 7A 223.936 MHz 12A

190.640 MHz 7B 225.648 MHz 12B

192.352 MHz 7C 227.360 MHz 12C

194.064 MHz 7D 229.072 MHz 12D

195.936 MHz 8A 230.784 MHz 13A

197.648 MHz 8B 232.496 MHz 13B

199.360 MHz 8C 234.208 MHz 13C

201.072 MHz 8D 235.776 MHz 13D

202.928 MHz 9A 237.488 MHz 13E

204.640 MHz 9B 239.200 MHz 13F

206.352 MHz 9C

208.064 MHz 9D

Note

Frequencies are display ed to two pl aces of decimal s on
this system.

General

Power requirements

Power consumption 85 W

Dimensions (w/h/d) Approx. 181.5 × 261.5 ×

Mass Approx. 5.8 kg

Design and specifications are subject to change
without notice.

230 V AC, 50/60 Hz

0.25 W (in Power Saving
Mode)

357.5 mm incl. projecting
parts and controls

L-Band

Frequency Label

1452.960 MHz L1

1454.672 MHz L2

1456.384 MHz L3

1458.096 MHz L4

1459.808 MHz L5

1461.520 MHz L6

1463.232 MHz L7

1464.944 MHz L8

1466.656 MHz L9

1468.368 MHz L10

1470.080 MHz L11

1471.792 MHz L12

1473.504 MHz L13

1475.216 MHz L14

1476.928 MHz L15

1478.640 MHz L16

1480.352 MHz L17

1482.064 MHz L18

1483.776 MHz L19

1485.488 MHz L20

1487.200 MHz L21

1488.912 MHz L22

1490.624 MHz L23

Notes

•L-Band is not available for the UK model.

• Frequencies are displayed to two places of decimals
on this syste m.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.r may be damaged by heat.

Flexible Circuit Board Repairing

• Keep the tempera ture of the soldering iron around 270 ∞C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

2

TABLE OF CONTENTS

HCD-GPX9

1. SERVICING NOTES ............................................... 4

2. GENERAL

Location of Controls........................................................ 6

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 8

3-2. Side Plate (L)/(R) ............................................................ 9

3-3. Top Block Assy ............................................................... 9

3-4. Tape Mechanism Deck (CMAL1Z234A)........................ 10

3-5. Front Panel Section ......................................................... 10

3-6. MAIN Board.................................................................... 11

3-7. DAB Board...................................................................... 11

3-8. CD Mechanism Deck Block............................................ 12

3-9. Base Unit (BU-K6BD80A) ............................................. 12

3-10. BD Board......................................................................... 13

3-11. Driver Board.................................................................... 13

3-12. Chassis (Top) ................................................................... 14

3-13. Lever (Loading-L/R) ....................................................... 15

3-14. Lever (Disc Sensor)/(Disc Stop) ..................................... 16

3-15. Holder (BU215) Assy...................................................... 16

3-16. Lever (BU Lock) ............................................................. 17

3-17. Close Lever...................................................................... 17

3-18. Lever (Dir), Gear (IDL-B)............................................... 18

3-19. Gear (IDL-C) ................................................................... 18

4. TEST MODE.............................................................. 19

7. EXPLODED VIEWS

7-1. Side Plates Section .......................................................... 52

7-2. Front Panel Section ......................................................... 53

7-3. Top Block Section ........................................................... 54

7-4. MAIN Section ................................................................. 55

7-5. Chassis Section-2 ............................................................ 56

7-6. CD Mechanism Deck Section-1

(CDM80B-K6BD80A) .................................................... 57

7-7. CD Mechanism Deck Section-2

(CDM80B-K6BD80A) .................................................... 58

7-8. CD Mechanism Deck Section-3

(CDM80B-K6BD80A) .................................................... 59

7-9. CD Mechanism Deck Section-4

(CDM80B-K6BD80A) .................................................... 60

7-10. Base Unit Section (BU-K6BD80A) ................................ 61

8. ELECTRICAL PARTS LIST................................ 62

5. ELECTRICAL ADJUSTMENTS

Deck Section.................................................................... 21

CD Section ...................................................................... 22

6. DIAGRAMS

6-1. Block Diagram – CD SERVO Section – ........................ 23

6-2. Block Diagram – AUDIO Section – ............................... 24

6-3. Block Diagram

– PANEL/POWER SUPPLY Section – ........................... 25

6-4. Printed Wiring Board – DRIVER Board – ..................... 27

6-5. Schematic Diagram – DRIVER Board –........................ 27

6-6. Printed Wiring Board – BD Board – .............................. 28

6-7. Schematic Diagram – BD Board – ................................. 29

6-8. Printed Wiring Board – DAB Board –............................ 30

6-9. Schematic Diagram – DAB Board – .............................. 31

6-10. Printed Wiring Board – MAIN Board – ......................... 32

6-11. Schematic Diagram – MAIN Board (1/3) – ................... 33

6-12. Schematic Diagram – MAIN Board (2/3) – ................... 34

6-13. Schematic Diagram – MAIN Board (3/3) – ................... 35

6-14. Printed Wiring Board – AMP Board – ........................... 36

6-15. Schematic Diagram – AMP Board – .............................. 37

6-16. Printed Wiring Board – PANEL (1) Board –.................. 38

6-17. Schematic Diagram – PANEL (1) Board – .................... 39

6-18. Printed Wiring Board – PANEL (2) Board –.................. 40

6-19. Schematic Diagram – PANEL (2) Board – .................... 41

6-20. Printed Wiring Board – POWER Board – ...................... 42

6-21. Schematic Diagram – POWER Board –......................... 43

3

HCD-GPX9

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

LASER DIODE AND FOCUS SEARCH OPERATION
CHECK

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

SERVICE POSITION

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

– Tape Mechanism Deck –

tape mechanism deck

4

– CD Mechanism deck –

HCD-GPX9

CD mechanism deck

– AMP Board –

1

two screws
(BVTP3

2

Remove the AMP board
from heat sink.

×

16)

heat sink

AMP board

heat sink

5

HCD-GPX9

12 3 56

w;q

wdwsw

q

qhq

4

SECTION 2

GENERAL

List of button locations and reference pages

Main unit

ALPHABETICAL ORDER

A – O P – Z

BASS +/– wk
Cassette compartment 4
CD SYNCHRO 7
DAB qf
DIRECTION 6
Disc slot wf
DISPLAY ea
Display window 3
DSGX qs
FM MODE wh
FUNCTION e;

PHONES jack wd
PLAY MODE ws
Remote sensor 2
REPEAT wa
TREBLE +/– qd
TUNER/BAND qg
TUNING MODE wj
TUNING +/– wg
VOLUME qa

This section is extracted from
instruction manual.

BUTTON DESCRIPTIONS

?/1 (power) 1
./> (CD skip back/skip

forward) w;

m/M (CD rewind/fast

forward) ql

m/M (tape rewind/fast

forward) wl

x (CD stop) qj
x (tape stop) 9
z REC PAUSE/START 8

CD/NX (play/pause) qk
TAPE/nN (play) 0

A (CD eject) qh
A PUSH EJECT (tape open/close)

5

ea
e;
wl

wk
wj

wh
wg

wf

?

/

1

mM

x

Y

7
8
9
0
qa
qs
qd
qf
qg

.>

N

Xx

Z

k

j

a

mM

l

6

Remote control

HCD-GPX9

ALPHABETICAL ORDER

A – O P – Z

CD qh
CLEAR qd
CLOCK/TIMER SELECT 2

CLOCK/TIMER SET 3
DAB 6
DISPLAY ql
ENTER 9

EQ qs
FM MODE 4
FUNCTION q;

PLAY MODE qk
REPEAT 4
SLEEP w;
TAPE qg
TUNER BAND 5
TUNER MEMORY qj
TUNING MODE qk
VOLUME +/– qa

w; 1
ql

qk
qj
qh
qg
qf

qd
qs

BUTTON DESCRIPTIONS

?/1 (power) 1
m/M (rewind/fast forward)

7

./> (skip back/skip

forward) qf

x (stop) 8
X (pause) 8
N (play) 8

+/– (tuning) qf

2
3
4
5
6

7
8

9
0

qa

Setting the clock

Use buttons on the remote for the operation.

1

Press ?/1 to turn on the unit.

2

Press CLOCK/TIMER SET.

3

Press . or > repeatedly to set the
hour.

4

Press ENTER.

5

Press . or > repeatedly to set the
minute.

6

Press ENTER.

The clock starts working.

To adjust the clock

1

Press CLOCK/TIMER SET.

2

Press . or > repeatedly to select
“CLOCK SET”, then press ENTER.

3

Do the same procedures as step 3 to 6
above.

Note

The clock is not displayed in Power Saving Mode.

7

HCD-GPX9

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET

3-2. SIDE PLATE

(L)/(R)
(Page 9)

3-3. TOP BLOCK

ASSY
(Page 9)

SECTION 3

DISASSEMBLY

3-5. FRONT PANEL

SECTION
(Page 10)

3-6. MAIN BOARD

(Page 11)

3-8. CD

MECHANISM
DECK BLOCK
(Page 11)

3-9. BASE UNIT

(BU-K6BD80A)
(Page 12)

3-15. HOLDER

(BU215) ASSY
(Page 15)

3-16. LEVER
(BU LOCK)

(Page 16)

3-4. TAPE MECHANISM DECK

(CMAL1Z234A)
(Page 10)

3-7. DAB BOARD

(Page 10)

3-10. BD BOARD

(Page 12)

3-11. DRIVER

BOARD
(Page 13)

3-12. CHASSIS (TOP)

(Page 13)

3-13. LEVER

(LOADING-L/R)
(Page 14)

3-14. LEVER (DISC

SENSOR)/
(DISC STOP )
(Page 15)

3-19. GEAR

(IDL-C)
(Page 17)

3-17. CLOSE

LEVER
(Page 16)

3-18. LEVER (DIR),
GEAR (IDL-B)

(Page 17)

8

Note: Follow the disassembly procedure in the numerical order given.

q;

side plate (R)

7

two screws
(BVTT3

×

6)

4

two screws
(BVTT3

×

8)

5

side plate (L)

1

screw
(BVTP3

×

10)

2

two screws
(BVTT3

×

6)

3

screw
(BVTP3

×

10)

6

screw
(BVTP3

×

10)

8

screw
(BVTP3

×

10)

9

two screws
(BVTT3

×

8)

5

8

top block assy

7

connector
(CN301)

2

screw
(BVTT3 × 6)

6

wire (flat type)
(7 core) (CN302)

4

Open the plate.

3

harness

4

Open the plate.

1

screw
(BVTT3 × 6)

3-2. SIDE PLATE (L) / (R)

HCD-GPX9

3-3. TOP BLOCK ASSY

9

HCD-GPX9

3-4. TAPE MECHANISM DECK (CMAL1Z234A)

2

harness

3

tape mechanism deck
(CMAL1Z234A)

1

four screws
(BVTP3 × 8)

3-5. FRONT PANEL SECTION

5

front panel section

4

Open the plate.

1

wire (flat type)
(21 core) (CN310)

2

connector
(CN604)

10

3

two screws
(BVTT3

4

Open the plate.

×

6)

3-6. MAIN BOARD

s

qa

wire (flat type)
(11 core) (CN315)

qs

wire (flat type) (17 core)
(CN304)

1

wire (flat type) (9 core)
(CN306)

0

wire (flat type)
(15 core) (CN305)

6

connector
(CN701)

4

2

three connectors
(CN603, 605, 901)

9

heat sink cover

HCD-GPX9

3

two screws
(BVTT3

×

7

three screw
(BVTP3 × 8)

8)

qd

3-7. DAB BOARD

MAIN board

3

8

6

1

connector

four screws
(BVTT3

×

DAB board

two holders DAB

6)

7

module (DAB tuner)

5

connector
(CN700)

8

5

connector (CN201)

screw
(BVTT3

×

6)

2

wire (flat type) (11 core)
(CN715)

4

11

HCD-GPX9

3-8. CD MECHANISM DECK BLOCK

2

two screws
(KTP3 × 8)

9

two screws
(BVTT3 × 6)

0

cover (CDM)

6

three screws
(BVTT3 × 6)

qa

CD mechanism
deck block

1

connector

7

4

DAB block

8

screw
(BVTT3 × 6)

5

screw
(BVTT3 × 6)

3-9. BASE UNIT (BU-K6BD80A)

2

CD mecha bracket (L)

1

two screws

×

(BVTT3

10)

qs

base unit (BU-K6BD80A)

8

two insulators

4

CD mecha bracket (R)
block

3

two screws
(BVTP3

qa

two insulators

×

10)

3

screw
(BVTT3 × 6)

12

7

two coil springs
(insulator)

6

two stoppers
(BU)

5

two screws
(BVTP M2.6)

0

two coil springs
(insulator)

9

two floating screws
(PTPWH M2.6)

3-10. BD BOARD

4

BD board

2

wire (flat type) (16 core)
(CN101)

HCD-GPX9

3-11. DRIVER BOARD

1

Remove four solders.

3

Remove two solders.

4

motor (pully) assy
(loading)

2

two screws
(BVTP 2.6)

3

screw (2.6)

5

DRIVER board

1

belt (MOT)

13

HCD-GPX9

3-12. CHASSIS (TOP)

5

chassis (top)

3

two screws
(P 2 × 10)

4

three screws
(BVTP 2.6)

1

screw
(BVTP 2.6)

2

lever (CL UP2)

14

3-13. LEVER (LOADING-L/R)

HCD-GPX9

5

lever (loading-R)

1

SPT-T (loading-R) SPT-T (loading-L)

4

two hooks

1

2

two hooks

3

lever (loading-L)

PRECAUTION DURING LEVER (LOADING R / L) INSTALLATION

— Bottom view —

Align the horizontal position.

lever (loading-L)

Install the

both levers so that they move symmetrically.

lever (loading-R)

15

HCD-GPX9

3-14. LEVER (DISC SENSOR)/(DISC STOP)

1

gear (cap)

2

gear (IDL L)

PRECAUTION DURING DISC STOP LEVER INSTALLATION

5

two hooks

6

lever (disc stop)

3-15. HOLDER (BU215) ASSY

3

two claws

4

lever (disc sensor)

hole

hole

Install the lever (disc stop) so that the both holes
are aligned.

1

screw
(BVTP 2.6 × 8)

chassis (top)

lever (disc stop)

16

5

213 down holder SPR-E

6

holder (BU215) assy

4

floating screw
(PTPWHM2.6)

3

floating screw
(PTPWHM2.6)

2

lever (CL UP2)

3-16. LEVER (BU LOCK)

4

three hooks

1

floating screw
(PTPWH M2.6)

5

lever (BU lock)

2

gear (cap)

3

gear (BU lock)

HCD-GPX9

3-17. CLOSE LEVER

3

5

claw

close lever

1

washer (3-1-0.4)

2

4

shaft disc stop

SPR-E lever close

17

HCD-GPX9

3-18. LEVER (DIR), GEAR (IDL-B)

2

washer

1

DIR SPR-E

claw

0

lever (DIR)

3

nylon washer 1.7

4

pulley (gear)

5

gear (cap)

6

gear (IDL-A)

qa

gear (IDL-B)

9

stoper

7

Loosen the screw.

8

Hold the release lever

and change the direction.

3-19. GEAR (IDL-C)

3

2

1

gear (IDL-F)

7

gear (IDL-D)

two claws

gear (IDL-C)

4

three hooks

5

gear loading lever

18

6

claw

SECTION 4

TEST MODE

HCD-GPX9

[MC COLD RESET]

The cold reset clears all data including preset data stored in the
memory to initial conditions. Execute this mode when returning
the set to the customer.

Procedure:

1. In the standby status, press the I/1 button to turn the power
on.

2. Press three buttons of I/1 , x (CD), and [DSGX]
simultaneously.

3. The set is reset, and become standby status.

[COMMON TEST MODE]

Enter The Common Test Mode

Procedure:

1. In the standby status, press the I/1 button to turn the power
on.

2. Press three buttons of [REPEAT], x (TAPE), and [DSGX]
simultaneously.

3. When the common test mode is activated, “SLEEP” and
“PLAY” icons are blink on the fluorescent indicator tube.

AMP Test

Procedure:

1. In the common test mode, if turn the [VOLUME] knob
clockwise, it displays “VOL MAX”, and if turn the knob
counterclockwise, it displays “VOL MIN”.

2. If the [TREBLE] knobs are turned clockwise or
counterclockwise, it displays “TONE FLAT”.

3. If the [BASS] knobs are turned clockwise, it displays “TONE
MAX”, and if turn the knob counterclockwise, it displays
“TONE MIN”.

4. To release from this mode , disconnect the AC plug to turn the
power off.

Tape Test

Procedure:

1. In the common test mode, insert a tape.

2. Input any audio signal from the [VIDEO/MD] jack (J301) on
the MAIN board.

3. Press the [ REC] button, and press the [ TAPE] button to

z

select the tape direction.

4. Press the [ REC] button again to start recording.

5. If press the

z

m (TAPE) or M (TAPE) button, the tape is

returned to recording start point by cue or review operation,
and starts playback.

6. To release from this mode , disconnect the AC plug to turn the
power off.

nN

[PANEL TEST MODE]

Enter The Panel Test Mode

Procedure:

1. In the standby status, press the I/1 button to turn the power
on.

2. Press three buttons of [PLAY MODE], x (TAPE), and [DSGX]
simultaneously.

3. When the panel test mode is activated, LEDs and segments of
fluorescent indicator tube are all turned on.

Version Check

Procedure:

1. In the panel test mode (all LEDs and segments of fluorescent
indicator tube are turned on), press the [TUNING MODE] button.

2. Destination indication and model type indication are displayed
on the fluorescent indicator tube alternately.

3. From this status, each time the [TUNING MODE] button is
pressed, it changes the version display of each module
cyclically as follows.

Display Module

MC Main controller
GC Display
CD CD system
CDD CD device master
CDMA CDM upper module
CDMB CDM lower module
BDA BD upper module
BDB BD lower module
ST Tuner
TA Amplifier
TM Timer
TC Tape

4. To date of any module, press the [DSGX] button.

5. To release from this mode, press three buttons of [PLAY MODE],
x (TAPE), and [DSGX] simultaneously.

Key Check

Procedure:

1. In the panel test mode (all LEDs and segments of fluorescent
indicator tube are turned on), press the [PLAY MODE] button.

2. It displays “K 0 J0 V0” on the fluorescent indicator tube.

3. Each time a button is pressed, “K” value increases. Howe ver,
once a button is pressed, it is no longer taken into account.

All keys are pressed, display becomes “K26”.

4. “V” value increases like 0, 2, 4... or 1, 3, 5... if turn the

[VOLUME] knob clockwise, or it decreases like 0, 8, 6... or 1,
9, 7... if turn the knob counterclockwise.
“J” value increases like 1, 2, 3... if turn the [BASS] or [TREBLE]
knob clockwise, or it decreases like 0, 9, 8 ... if turn the knob
counterclockwise.

5. To release from this mode, press three buttons of [PLAY

MODE], x (TAPE), and [DSGX] simultaneously.

19

HCD-GPX9

[CD REPEAT 5 LIMIT CANCEL MODE]

Number of repeat for CD playback is 5 times when the repeat mode
is “REPEA T”. This mode enables CD to repeat playback for limitless
times.

Procedure:

1. Press the I/1 button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of m (CD), x (TAPE), and [DSGX]
simultaneously.

4. It enters the CD repeat 5 limit cancel mode and display “LIMIT
OFF”

5. To release this mode, press the I/1 button to turn the power
off.

[CD SHIP MODE]

This mode can run the CD sled motor optionally. Use this mode,
for instance, when cleaning the optical pick-up.
Procedure:

1. Press the I/1 button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of [TUNING MODE], x (CD),
and I/1 simultaneously. *1

4. Set to the CD ship mode. (chucking on)

5. After blink “STANDBY”, “LOCK” is displayed, disconnect
the AC plug.
*1) If press three buttons of [DIRECTION], u (CD), and

[DSGX] simultaneously, Activate the CD ship mode and
MC cold reset.

[CD SLOT LOCK]

This mode is for the antitheft of CD disc in shop. (not for transport)

Procedure:

1. Press the

2. Press the [FUNCTION] button to select CD function.

3. Insert a disc.

4. While pressing the x (CD) button, press the A (CD) button
for more 5 seconds.

5. The message “LOCKED” is displayed and the disc slot is
locked. (Even if exiting from this mode, the disc slot is still
locked)

6. If press the A (CD) button to eject the disc, the message
“LOCKED” is displayed and can not eject the disc.

7. To release this lock, while pressing the x (CD) button, press
the A (CD) button for 5 seconds again.

8. The message “UNLOCKED” is displayed and the disc slot is
unlocked.

I/1 button to turn the power on.

[CD POWER MANAGE]

This mode is for switch the CD power supply on/off. Even if this
state pulls out AC plug, it is held.
Procedure:

1. Press the I/1 button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press the I/1 button again to turn the power off (standby).

4. While pressing the x (CD) button, press the I/1 button.

5. It turns power on and display “CD POWER”, then display
“ON” or “OFF”.

20

SECTION 5

ELECTRICAL ADJUSTMENTS

DECK SECTION

1. Demagnetize the record/playback head with a head
demagnetizer.

2. Do not use a magnetized screwdriver for the adjustments.

3. After the adjustments, apply suitable locking compound to
the parts adjust.

4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.

5. The adjustments should be performed for both L-CH and R­CH.

6. Switches and controls should be set as follows unless otherwise
specified.

REC BAIS ADJUSTMENT

Setting:

digital voltmeter

(AC range)

MAIN board

TP101 (L), TP201 (R)

TP (GND)

HCD-GPX9

Procedure:

1. Connect a digital voltmeter (AC range) to TP101 (L), TP201
(R) and TP (GND) on the MAIN board.

2. Insert a tape.

3. Press the I/1 button to turn the power on, and press the
[FUNCTION] button to select TAPE function.

4. Press the [ REC] button twice to start recording.

5. Adjust RV101 (L-ch), RV201 (R-ch) on the MAIN board so
that the digital voltmeter reads AC 6.15 V.

6. Connect an oscilloscope or frequency counter to TP101 (L),
TP201 (R) and TP (GND) on the MAIN board.

7. Confirm that the frequency is 82 kHz ±3 kHz.

Adjustment Location:

– MAIN BOARD (Conductor Side) –

z

REC BIAS ADJUSTMENT

(R-CH) (L-CH)

RV201 RV101

TP201 (R)

TP101 (L)

TP (GND)

21

HCD-GPX9

CD SECTION

Note:

1. CD Block is basically constructed to operate without
adjustment.

2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10 MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.

5. Check the focus bias check when optical block is replaced.

FOCUS BIAS CHECK

oscilloscope

(DC range)

BD board

TP012 (RFACO)
TP013 (VC)

+
–

Procedure :

1. Connect the oscilloscope to TP012 (RFA CO) and TP013 (VC)
on the BD board.

2. Insert the disc (YEDS-18). (Part No. : 3-702-101-01)

3. Press the [ CD] button.

u

4. Confirm that the oscilloscope waveform is as shown in the
figure below. (eye pattern)
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.

• RF signal reference waveform (eye pattern)

VOLT/DIV: 0.2 V (with the 10: 1 probe in use.)
TIME/DIV: 500 ns

0.7

0.3 Vp-p

When observing the eye pattern, set the oscilloscope
for AC range and raise vertical sensitivity.

Checking Location:

– BD BOARD (Conductor Side) –

TP012

(RFACO)

22

TP013

(VC)