• The DP-IF4000 is the digital surround
processor that comprises the MDR-DS4000.
* The digital surround processor for this system incorporates the Dolby Digital decoder, the Dolby Pro Logic II
decoder, the DTS decoder and the MPEG-2 AAC decoder.
Manufactured under licence from Dolby Laboratories and Digital Theater Systems, Inc.
“Dolby,” “Pro Logic,” the “AAC” logo and the double-D symbol are trademarks of Dolby Laboratories.
“DTS” and “DTS VIRTUAL ” are trademarks of Digital Theater Systems, Inc.
• MDR-DS4000 consists of the following models respectively.
Cordless stereo headphoneMDR-IF4000
Digital surround processorDP-IF4000
US Model
AEP Model
E Model
SPECIFICATIONS
Decoder functionsDolby Digital
Virtual surround function
Compression functionOFF
Modulation SystemDQPSK-IM
Secondary carrier wave frequency
Transmission distanceApprox. 7 m (23 ft) to the front
Transmission range12 – 24,000 Hz
Distortion rate1% or less (1 kHz)
Audio inputsOptical input
Audio outputOptical output (rectangular-type) x 1
Power requirementsDC 9 V (from the supplied AC power
DimensionsApprox. 160 x 160 x 200 mm
Mass Approx. 400 g(15 oz)
Design and specifications are subject to change without notice.
Dolby Pro Logic II
DTS
MPEG-2 AAC
OFF
CINEMA
MUSIC
ON
3.75 MHz
(rectangular-type) x 1
Analogue input (pin jack left/right) x 1
Personal Audio Company
Published by Sony Engineering Corporation
DP-IF4000
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET
2-2. CABINET (LOWER), LUMINOUS WINDOW,
IF BOARD
(Page 5)
2-3. TX BOARD
(Page 6)
Note: Follow the disassembly procedure in the numerical order given.
DP-IF4000
2-2.CABINET (LOWER), LUMINOUS WINDOW, IF BOARD
q;
IF board
8
two screws
(+B2.6)
qa
connector
(CN502)
7
luminous window
qs
connector
6
two screws (B2.6)
9
two screws
(+B2.6)
(CN501)
cabinet (upper)
5
indication window assy
4
cabinet (lower)
2
two screws (B2.6)
3
screw (B2.6)
1
rubber foot (back)
5
DP-IF4000
2-3.TX BAORD
1
two screws (B2.6)
2
TX board
6
SECTION 3
ELECTRICAL ADJUSTMENT
Note:
Feed 9V dc power supply voltage.
Set S502 INPUT SELECT to ANLOG side on feeding the power.
(In case of it goes to DIGITAL side, the RF signal is not out without
the optical input.)
Be sure to use an oscilloscope with the 200MHz bandwidth or more.
DP-IF4000
RF Level Adjustment
Connection:
Oscillscope
+
–
Adjustment method:
Connect an oscilloscope to each TP501, 502, 503, 504, 505, 506,
507, 508, 509 or 510 on IF board, adjust with RV601 on TX board
so that the output voltage goes to 1.10 ± 0.05 Vp-p.