Sony CDX-MP40 User Manual

CDX-MP40

SERVICE MANUAL

Ver 1.0 2003. 01

• The tuner and CD sections have no adjustments.

AUDIO POWER SPECIFICATIONS (US Model)

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

23.2 watts per channel minimum continuous average power into 4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than 5% total harmonic distortion.

SPECIFICATIONS

CD player section

Signal-to-noise ratio 90 dB Frequency response 10 – 20,000 Hz Wow and flutter Below measurable limit

Tuner section

Tuning range 87.5 – 107.9 MHz (US, Canadian Model)

87.5 – 108.0 MHz (AEP, UK Model) Antenna terminal External antenna connector Intermediate frequency 10.7 MHz/450 kHz Usable sensitivity 9 dBf Selectivity 75 dB at 400 kHz Signal-to-noise ratio 67 dB (stereo),

69 dB (mono)

Harmonic distortion at 1 kHz

0.5% (stereo),

0.3% (mono) Separation 35 dB at 1 kHz Frequency response 30 – 15,000 Hz

AM (US, Canadian Model) Tuning range 530 – 1,710 kHz Antenna terminal External antenna connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity 30 µV

US Model

Canadian Model

AEP Model

UK Model

Model Name Using Similar Mechanism NEW CD Drive Mechanism Type MG-393MC-121 Optical Pick-up Name KSS-721A

Power amplifier section

Outputs Speaker outputs

(sure seal connectors) Speaker impedance 4 – 8 ohms Maximum power output 52 W × 4 (at 4 ohms) (US, Canadian Model)

50 W × 4 (at 4 ohms) (AEP, UK Model)

General

Outputs Audio outputs (front/rear)

Power antenna relay control terminal

Power amplifier control terminal Inputs Telephone ATT control terminal

BUS control input terminal

BUS audio input terminal

Remote controller input terminal

Antenna input terminal Tone controls Low: ±10 dB at 60 Hz (XPLOD)

Mid: ±10 dB at 1 kHz (XPLOD)

High: ±10 dB at 10 kHz (XPLOD)

– Continued on next page –

MW/LW (AEP, UK Model) Tuning range MW : 531 – 1,602 kHz

Aerial terminal External aerial connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity MW : 30 µV

9-877-000-01

LW : 153 – 279 kHz

LW : 40 µV

Sony Corporation

e Vehicle Company Published by Sony Engineering Corporation

FM/AM COMPACT DISC PLAYER

US, Canadian Model

FM/MW/LW COMPACT DISC PLAYER

AEP, UK Model

CDX-MP40

Power requirements 12 V DC car battery

(negative ground)

Dimensions Approx. 178 × 50 × 180 mm

(7 1/8 × 2 × 7 1/8 in.) (w/h/d)

Mounting dimensions Approx. 182 × 53 × 161 mm

(7 1/4 × 2 1/8 × 6 3/8 in.) (w/h/d)

Mass Approx. 1.2 kg

(2 lb. 10 oz.)

Supplied accessories Parts for installation and connections

Front panel case (1) Card remote commander RM-X115

Note

This unit cannot be connected to a digital preamplifier or an equalizer which is Sony BUS system compatible.

Design and specifications are subject to change without notice.

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

• US, Canadian model

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block.

optical pick-up bloc

semi-fixed resistor

• AEP, UK model

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

TEST DISCS

This set can playback CD-R and CD-ROM discs. The following test discs should be used to check the capability:

CD-R test disc TCD-R082LMT (Part No. J-2502-063-1) CD-RW test disc TCD-W082L (Part No. J-2502-063-2)

This label is located on the bottom of the chassis.

This label is located on the drive unit’s internal chassis.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

Notes on CD-Rs (recordable CDs)/CD-RWs (rewritable CDs)

This unit can play the following discs:

Type of discs Label on the disc

Audio CD

MP3 files

• Some CD-Rs/CD-RWs (depending on the equipment used for its recording or the condition of the disc) may not play on this unit.

• You cannot play a CD-R/CD-RW that is not finalized∗.

• You can play MP3 files recorded on CD-ROMs, CD-Rs, and

CD-RWs.

• A CD-R/CD-RW to which a session can be added can be played.

CDX-MP40

∗ A process necessary for a recorded CD-R/CD-RW disc to be

played on the audio CD player.

EXTENSION CABLE AND SERVICE POSITION

When repairing or servicing this set, connect the jig (extension cable) as shown below.

• Connect the MAIN board (CNP701) and the SER V O board (CN1)

with the extension cable (Part No. J-2502-062-1).

MAIN BOARD CNP701

SERVO BOARD CN1

CDX-MP40

1. GENERAL

Location of Controls (US, Canadian Model) .......................... 5

Location of Controls (AEP, UK Model) .................................. 5

Connections (US, Canadian Model)........................................ 6

Connections (AEP, UK Model) ............................................... 7

2. DISASSEMBLY

2-1. Sub Panel Assy (CD)........................................................... 9

2-2. CD Mechanism Block ....................................................... 10

2-3. Main Board ....................................................................... 10

2-4. Heat Sink ........................................................................... 11

2-5. Chassis (T) Sub Assy ........................................................11

2-6. Lever Section..................................................................... 12

2-7. Servo Board....................................................................... 12

2-8. Shaft Roller Assy, Load Sw Board .................................... 13

2-9. Floating Block Assy .......................................................... 14

2-10. Optical Pick-up Block ....................................................... 14

3. DIAGRAMS

3-1. IC Pin Descriptions ...........................................................15

3-2. Circuit Boards Location ....................................................20

3-3. Block Diagram –CD Section–........................................... 21

3-4. Block Diagram –Main Section–........................................ 22

3-5. Block Diagram –Display Section–.................................... 23

3-6. Printed Wiring Boards –CD Mechanism Section–............ 24

3-7. Schematic Diagram –CD Mechanism Section (1/2)– .......26

3-8. Schematic Diagram –CD Mechanism Section (2/2)– .......27

3-9. Printed Wiring Boards –Main Section– ............................ 28

3-10. Schematic Diagram –Main Section (1/2)– ........................ 29

3-11. Schematic Diagram –Main Section (2/2)– ........................ 30

3-12. Printed Wiring Board –Relay Section– .............................31

3-13. Printed Wiring Board –Key Section

(US, Canadian Model)– ...............32

3-14. Schematic Diagram –Relay, Key Section

(US, Canadian Model)–.................. 33

3-15. Printed Wiring Board –Key Section

(AEP, UK Model)– ......................34

3-16. Schematic Diagram –Relay, Key Section

(AEP, UK Model)– .........................35

3-17. IC Block Diagrams............................................................ 36

4. EXPLODED VIEWS

4-1. Chassis Section ................................................................. 38

4-2. Front Panel Section ...........................................................39

4-3. CD Mechanism Section (1) ............................................... 40

4-4. CD Mechanism Section (2) ............................................... 41

4-5. CD Mechanism Section (3) ............................................... 42

5. ELECTRICAL PARTS LIST ........................................43

SECTION 1

GENERAL

CDX-MP40

This section is extracted from instruction manual.

(US, Canadian Model)

(AEP, UK Model)

CDX-MP40

Connections (US, Canadian Model)

Connections (AEP, UK Model)

CDX-MP40

SECTION 2

DISASSEMBLY

Note : This set can be disassemble according to the following sequence.

SET

2-5. CHASSIS (T) SUB ASSY

2-1. SUB PANEL ASSY (CD)

(Page 9)

(Page 11)

CDX-MP40

2-2. CD MECHANISM BLOCK

(Page 10)

2-3. MAIN BOARD

(Page 10)

2-6. LEVER SECTION

(Page 12)

2-8. SHAFT ROLLER ASSY,

LOAD SW BOARD (Page 13)

2-4. HEAT SINK

(Page 11)

2-9. FLOATING BLOCK ASSY

(Page 14)

2-10. OPTICAL PICK-UP BLOCK

(Page 14)

Note : Follow the disassembly procedure in the numerical order given.

2-1. SUB PANEL ASSY (CD)

2-7. SERVO BOARD

(Page 12)

PTT 2.6x6

claws

sub panel assy (CD)

CN802

claws

CDX-MP40

2-2. CD MECHANISM BLOCK

CD mechanism block

PTT 2.6x6

bracket (CD)

PTT 2.6x

2-3. MAIN BOARD

screws (+BTT)

MAIN board

screw (+BTT)

CNP701

PTT 2.6x6

PTT 2.6x8

PTT 2.6x

2-4. HEAT SINK

heat sink

PTT 2.6x12

P 2.6x8

CDX-MP40

PTT 2.6x

2-5. CHASSIS (T) SUB ASSY

Unsoldering three lead wires.

P 2x3

PTT 2.6x8

P 2x3

chassis (T) sub ass

SERVO board (SIDE A)

black red white

CDX-MP40

2-6. LEVER SECTION

lever (R)

tension spring (LR)

guide (disc)

lever (L)

special screw

DISC IN SW board

2-7. SERVO BOARD

Removal the solders.

P2x3

two claws

special screws

CN3

SERVO board

special screw

CN2

Unsolder the

lead wires.

black

loading motor assy

yellow

optical pick-up block

2-8. SHAFT ROLLER ASSY, LOAD SW BOARD

• When installing, take note of the positions

arm (roller) and washers. (Fig. 1)

special screw

retaining ring

(RA)

shaft retainer

(roller)

retaining ring (RA)

shaft retainer (roller)

washer

arm

shaft roller assy

arm

(roller)

Fig. 1

washer

arm

shaft retainer (roller)

CDX-MP40

LOAD SW board

tension spring (RA)

CDX-MP40

2-9. FLOATING BLOCK ASSY

compression spring (FL)

tension spring (KF1)

Turn loading ring in the

direction of the arrow.

floating block assy

compression spring (FL)

Fit lever (D) in the direction of the arrow.

damper (T)

2-10. OPTICAL PICK-UP BLOCK

P 2x3

sled motor assy (M902)

shaft (feed) assy

P 2x3

plate spring (feed)

damper (T)

PICK-UP FLEXIBLE board

optical pick-up (KSS-721A)

SECTION 3

DIAGRAMS

3-1. IC PIN DESCRIPTIONS

• IC3 HD6432238RWN35TEI (CD MASTER CONTROL) (SERVO BOARD)

Pin No. Pin Name I/O Pin Description

1 TEST I Test mode selection pin Not used. (Open) 2 DECXRST O Reset signal output to the DSP IC “L”: reset 3 DECSTBY O Standby mode control signal output to the DSP IC “H”: standby

4 – 7 NC O Not used. (Open)

8PH3 I CD PH3 photo sensor detection signal input Not used. (Open)

9 INSW/PH2 I CD mechanism disc in switch detection signal input 10 LIMIT_SW I CD mechanism in-limit switch detection signal input 11 D_SW I CD mechanism down switch detection signal input 12 CVCC — System power supply pin (+3.3 V) 13 NC O Not used. (Open) 14 VSS — Ground pin 15 NC O Not used. (Open) 16 PH1 I CD PH1 photo sensor detection signal input Not used. (Open) 17 EJECT O CD mechanism loading motor control signal output (eject operation) 18 LOAD O CD mechanism loading motor control signal output (load operation)

19 – 26 NC O Not used. (Open)

27 FLAG I Correction unable detection signal input 28 RFOK I RFOK signal input from the servo IC

29, 30 NC O Not used. (Open)

31 TXD O UART TXD PC connection output Not used. (Open) 32 RXD I UART RXD PC connection input Not used. (Open) 33 XTALEN O Crystal oscillation control signal output to the servo IC 34 TSTB O CD text parameter strobe signal output to the servo IC 35 STB O Data strobe signal output to the servo IC

36 A0 O

37 CD_RST O Reset signal output to the servo IC 38 PACK I CD text pack sync signal input from the servo IC 39 NC O Not used. (Open) 40 SELF_SW I CD mechanism self load position detection switch signal input 41 NC O Not used. (Open) 42 AVSS — Ground for A/D converter

43, 44 NC O Not used. (Open) 45, 46 NC I Not used. (Open)

47 KEY0 I Key switch signal input in the test mode Not used. (Open) 48 KEY1 I Mode switch signal input in the test mode Not used. (Open)

49 – 52 NC I Not used. (Open)

53 AVREF — Reference voltage for A/D converter 54 AVCC — Power supply for A/D converter 55 MD0 — CPU operation mode setting pin Connecting to +3.3 V in this set. 56 MD1 — CPU operation mode setting pin Connecting to +3.3 V in this set. 57 X1A — Sub clock oscillator terminal Not used. (Open) 58 X0A — Sub clock oscillator terminal Not used. (Open) 59 RSTX I Microcomputer reset signal input 60 NMI — Not used. (Fixed at “H”) 61 STBY — Not used. (Fixed at “H”) 62 VCC — Power supply pin (+3.3 V) 63 XTAL — Main clock oscillator pin (12.288 MHz) 64 VSS — Ground pin 65 XTEAL — Main clock oscillator pin (12.288 MHz) 66 FWE I Flash write enable signal input

Command/parameter identification signal output to the servo IC “L”: command, “H”: parameter

CDX-MP40

Pin No. Pin Name I/O Pin Description

67 MD2 — CPU operation mode setting pin 68 FL_BOOT I Flash write selection signal input (“L”: flash write mode) 69 FL_W O Flash write control signal output connected to pin 66 (FWE) 70 NC O Not used. (Open) 71 CDMON O CD mechanism power supply control signal output 72 DECINT I Interrupt signal input from the DSP IC 73 CLOSE O Front panel operation request output (Close) 74 OPEN O Front panel oparation request output (Open) 75 LINKOFF O LINK OFF signal output for UNI_LINK “H”: link off, “L”: link on 76 UNI_SO O Sony-Bus serial data output to the bus interface 77 UNI_SI I Sony-Bus serial data input from the bus interface 78 UNI_CK I Sony-Bus serial clock input from the bus interface 79 NC O Not used. (Open) 80 SDA I/O I2C interface data input/output 81 SCL O I2C interface clock output 82 NC O Not used. (Open) 83 TSO O Serial data output to the servo IC 84 TSI I Serial data input from the servo IC 85 TSCK O Serial clock output to the servo IC 86 LEDDAT O LED data output for the jig 87 LEDCLK O LED clock output for the jig 88 LEDLAT O LED latch signal output for the jig

89, 90 NC O Not used. (Open)

91 BUSON I Sony-Bus BUS ON signal input from the bus interface 92 BUCHK I Back up power supply detection signal input 93 A-ATT O Audio muting control signal output 94 CDON O Power control signal output for the CD servo “H”: servo on, “L”: during loading 95 NC O Not used. (Open) 96 U/J_SEL I Destination setting pin 97 TEXTSEL I CD text function setting pin 98 NC O Not used. (Open) 99 CFSEL I Custom file function setting pin

100 DOUT SEL I Digital output selection setting pin “H”: digital output available

• IC5 CXD9684R-005 (DSP) (SERVO BOARD)

Pin No. Pin Name I/O Pin Description

1 /RESET I Reset input pin “L”: reset

2MIMD I Microcomputer interface mode selection input “H”: I2C, “L”: TSB

3, 4 AD0, AD1 O External SRAM address signal output

5 MIDIO (I2C_SDA) I/O Serial data input/output

6 MICK (I2C_SCL) I Serial clock input

7 AD2 O External SRAM address signal output

8 VDDT (3.3V) — Power supply (3.3 V) for digital circuit

9 SDO O Data output

10, 11 AD3, AD4 O External SRAM address signal output

12 SDI0 I Data input 0 13 BCKIA I Bit clock input A 14 LRCKIA I LR clock input A 15 AD5 O External SRAM address signal output 16 CE O External SRAM chip enable signal output 17 OE O External SRAM output enable signal output 18 VDD (2.5V) — Power supply pin (2.5 V) for digital circuit 19 STANDBY I Standby mode control signal input “H”: STB, “L”: normal 20 VSS (2.5VGND) — Ground pin for digital circuit 21 VSSL (2.5VGND) — Ground pin for DAC Lch 22 VRAL — Reference voltage pin for DAC Lch 23 LO O DAC Lch signal output (Open) 24 VDAL (2.5V) — Power supply pin (2.5 V) for DAC Lch 25 VDAR (2.5V) — Power supply pin (2.5 V) for DAC Rch 26 RO O DAC Rch signal output (Open) 27 VRAR — Reference voltage pin for DAC Rch 28 VSSR (2.5VGND) — Ground pin for DAC Rch 29 TESTP I Pin for test “H”: test mode, “L”: normal (fixed at “L”) 30 CKS I VCO selection input “H”: VCO, “L”: X1 input

31 – 34 AD12 to AD9 O External SRAM address signal output

35 VDDT (3.3V) — Power supply pin (3.3 V) for digital circuit

36 – 38 AD8 to AD6 O External SRAM address signal output

39 REQ O Interrupt request signal output to the CD master control 40 VSS — Ground pin for digital circuit

41, 42 AD13, AD14 O External SRAM address signal output

43 WR O External SRAM write signal output

44, 45 AD16, AD15 O External SRAM address signal output 46, 47 IO0, IO1 I/O External SRAM data input/output

48 VSS — Ground pin for digital circuit

49 – 51 IO2 to IO4 I/O External SRAM data input/output

52 VDD (2.5V) — Power supply pin (2.5 V) for digital circuit

53 – 55 IO5 to IO7 I/O External SRAM data input/output

56 VSSP — Ground pin for VCO circuit 57 PDO O PLL phase error detection signal output 58 VCOI I VCO control voltage input 59 VDDP — Power supply pin for VCO circuit 60 XRDE I/O External clock input, audio clock output Not used. (Open) 61 VDDX (2.5V) — Power supply pin for oscillation circuit 62 XI I Resonator pin 63 XO O Resonator pin 64 VSSX — Ground pin for oscillation circuit

CDX-MP40

+ 37 hidden pages

Sony CDX-MP40 User Manual

TABLE OF CONTENTS

GENERAL

DISASSEMBLY

sub panel assy (CD)

CD mechanism block

MAIN board

heat sink

SERVO board

floating block assy

DIAGRAMS