Siemens S75 Service Manual
09/2005
Release 1.0
Service Repair Documentation
Level 4 (level 2,5e) – S75
Release Date Department Notes to change
R 1.0
Technical Documentation
TD_Repair_L2.5_S75_R1.0.pdf Page 1 of 35
26.09.2005 BenQ MD CC GRM T New document
09/2005
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Table of Content
1 Introduction ...............................................................................................................................4
1.1 PURPOSE...............................................................................................................................4
1.2 SCOPE ...................................................................................................................................4
1.3 TERMS AND ABBREVIATIONS ...................................................................................................4
2 List of available level 4 (level 2,5e) parts ...............................................................................5
3 Required Software for Level 4 (level 2,5e) ..............................................................................6
4 Radio Part ..................................................................................................................................7
4.1 BLOCK DIAGRAM RF PART.......................................................................................................8
4.2 POWER SUPPLY RF-PART ......................................................................................................8
4.3 FREQUENCY GENERATION.......................................................................................................9
4.4 RECEIVER ............................................................................................................................11
4.5 TRANSMITTER.......................................................................................................................12
4.6 BRIGHT IC OVERVIEW...........................................................................................................13
4.7 MECHANICAL ANTENNA SWITCH ............................................................................................14
4.8 POWER AMPLIFIER AND POWER CONTROL.............................................................................15
5 Logic / Control.........................................................................................................................16
5.1 OVERVIEW HARDWARE STRUCTURE S75...............................................................................16
5.2 SGOLD2 .............................................................................................................................17
5.3 SDRAM...............................................................................................................................19
5.4 FLASH ................................................................................................................................19
5.5 SIM......................................................................................................................................19
5.6 VIBRATION MOTOR ...............................................................................................................20
6 Display......................................................................................................................................20
7 ATI Gimmick ............................................................................................................................20
8 Camera .....................................................................................................................................20
9 Bluetooth..................................................................................................................................21
10 Flashlight .................................................................................................................................22
11 IRDA..........................................................................................................................................22
12 Power Supply...........................................................................................................................22
12.1 ASIC MOZART / TWIGO4.......................................................................................................22
12.1.1 Battery.......................................................................................................................23
12.1.2 Charging Concept.....................................................................................................23
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12.2 EXTERNAL STEP-UP CONVERTER...........................................................................................25
13 Illumination ..............................................................................................................................26
14 Interfaces .................................................................................................................................27
14.1 MICROPHONE (XG2001).......................................................................................................27
14.2 BATTERY (X1400) ................................................................................................................28
14.3 IRDA (V2650)......................................................................................................................28
14.4 INTERFACE SIM MODULE WITH ESD PROTECTION .................................................................29
14.5 IO CONNECTOR WITH ESD PROTECTION ...............................................................................30
14.6 VIBRATION MOTOR (XG2100)...............................................................................................31
14.7 BOARD TO BOARD CONNECTOR ............................................................................................32
14.8 RSMMC READER.................................................................................................................33
14.9 CAMERA INTERFACE .............................................................................................................34
14.10 DISPLAY CONNECTOR........................................................................................................35
Technical Documentation
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1 Introduction
1.1 Purpose
This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3-4.
1.2 Scope
This document is the reference document for all BenQ authorised Service Partners which are
released to repair Siemens mobile phones up to level 2.5.
1.3 Terms and Abbreviations
Technical Documentation
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2 List of available level 4 (level 2,5e) parts
(according to Component Matrix V1.09 - check C-market for updates)
Product ID Order Number Description CM
S75 D1000 L50610-G6284-D670 IC SGOLD2 PMB8876 V2.1
S75 D1300 L50645-J4683-Y22 IC ASIC D1094ED-MOZART+ TWIGO4+
S75 D1301 L50610-B6189-D670 IC LOGIC 2 INPUT NAND NC7SP00L6X
S75 D1302 L50610-B6186-D670 IC LOGIC 2 INPUT AND NC7SZ08L6X
S75 D5100 L50610-U6122-D670 IC BLUETOOTH BRF6150 PB-FREE
S75 D5400 L50610-L6156-D670 IC AUDIO VIDEO INTERFACE W2182
S75 L1301 L50651-F5103-M1 COIL 10U (Co-Type9)
S75 L1302 L36151-F5103-M7 COIL 10U (Co-Type2)
S75 N1330 L50620-C6258-D670 IC DC DC BOOST CONVERTER LM2733
S75 N3500 L506810-C6153-D670 IC ANA RE 2.9V USMD5 PB FREE
S75 N3800 L36145-K280-Y258 IC FEM HITACHI GSM900 1800 1900 (Fem-Type1)
S75 N3801 IC MODUL PA PF09026B (PA-Type4)
S75 N3911 L50620-L6159-D670 IC TRANCEIVER HD155153NP
S75 N4800 L506810-C6153-D670 IC ANA RE 2.9V USMD5 PB FREE
S75 N5400 L50620-C6256-D670 IC ANA LM2770
S75 R3967 L36120-F4223-H RESISTOR TEMP 22K (Res-Type7)
S75 V1302 L36840-D5076-D670 DIODE SOD323 (Di-Type7)
S75 V1303 L36840-D5076-D670 DIODE SOD323 (Di-Type7)
S75 V1305 L50630-C1107-D670 TRANSISTOR SI5933 (Tra-Type2)
S75 V1400 L50640-D70-D670 DIODE BAV99T (Di-Type9)
S75 V2100 L50640-D5084-D670 DIODE RB548W (Di-Type8)
S75 V2302 L36840-C4014-D670 TRANSISTOR BC847BS BC846S (Tra-Type7)
S75 V2330 L36840-C4014-D670 TRANSISTOR BC847BS BC846S (Tra-Type7)
S75 V3961 L36840-D61-D670 DIODE 1SV305 (Di-Type4)
S75 V3962 L36840-C2074-D670 IC DAC DAC3550A
S75 V4901 L36840-C4014-D670 TRANSISTOR BC847BS BC846S (Tra-Type7)
S75 V4903 L50630-C1138-D670 TRANSISTOR FDC633 (Tra-Type12)
S75 V4904 L50630-C1138-D670 TRANSISTOR FDC633 (Tra-Type12)
S75 Z1501 L50640-U6064-D670 FILTER EMI (Fi-Type6) PB Free
S75 Z3961 L36145-F260-Y17 QUARZ 26MHZ (Q-Type4)
S75 Z5100 L50645-K280-Y330 FILTER BP BLUETOOTH
Technical Documentation
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Required Equipment for Level 4 (level 2,5e)
GSM-Tester (CMU200 or 4400S incl. Options)
PC-incl. Monitor, Keyboard and Mouse
Bootadapter 2000/2002 (L36880-N9241-A200)
Adapter cable for Bootadapter due to
Troubleshooting Frame S75 (F30032-P533-A1)
Power Supply
Spectrum Analyser
Active RF-Probe incl. Power Supply
Oscilloscope incl. Probe
RF-Connector (N<>SMA(f))
Power Supply Cables
Dongle (F30032-P28-A1) if USB-Dongle is used a special driver for NT is required
BGA Soldering equipment
Reference: Equipment recommendation V1.6
(downloadable from the technical support page)
new Lumberg connector (F30032-P226-A1)
3 Required Software for Level 4 (level 2,5e)
Windows XP
X-Focus version 1.68 or higher
GRT Version 3 or higher
Internet unblocking solution (JPICS)
Technical Documentation
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4 Radio Part
The radio part is realizes the conversion of the GMSK-HF-signals from the antenna to the baseband
and vice versa.
In the receiving direction, the signals are split in the I- and Q-component and led to the D/Aconverter of the logic part. In the transmission direction, the GMSK-signal is generated in an Up
Conversion Modulation Phase Locked Loop by modulation of the I- and Q-signals which were
generated in the logic part. After that the signals are amplified in the power amplifier.
Transmitter and Receiver are never active at the same time. Simultaneous receiving in the
GSM850/EGSM900 and GSM1800/GSM1900 band is impossible. Simultaneous transmission in the
GSM850/EGSM900 and GSM1800/GSM1900 band is impossible, too. However the monitoring band
(monitoring timeslot) in the TDMA-frame can be chosen independently of the receiving respectively
the transmitting band (RX- and TX timeslot of the band).
S75 RF-part is dimensioned for triple band operation (EGSM900, DCS1800, PCS19000) supporting
GPRS functionality up to multiclass 10.
The RF-circuit consists of the following components:
• Renesas Bright 5PL chip set (HD155153NP) with the following functionality:
PLL for local oscillator LO1 and LO2 and TxVCO
Integrated local oscillators LO1, LO2 (without loop filter)
Integrated TxVCO (without loop filter and core inductors for GSM)
Direct conversion receiver including LNA, DC-mixer, channel filtering and PGC-
amplifier
Active part of 26 MHz reference oscillator
Integrated Polar Loop, phase and amplitude control of transmitted output power
• Renesas LTCC transmit PA PF09026B (incl. integrated power control circuitry for GMSK
mode)
• Frontend-Module including RX-/TX-switch and EGSM900 / DCS1800 / PCS 1900
receiver SAW-filters
• Crystal and passive circuitry of the 26MHz VCXO reference oscillator
Technical Documentation
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4.1 Block diagram RF part
4.2 Power Supply RF-Part
The voltage regulator for the RF-part is located inside the ASIC D1300. It generates the required
2,8V “RF-Voltages” named VDD_RF1 and V DD_RF2. VDD_RF2. The voltage regulator is activated
as well as deactivated via VCXOEN_UC (Functional K19) provided by the SGOLD2. The temporary
deactivation is used to extend the stand by time.
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4.3 Frequency generation
The 26 MHz signal is created by a discrete VCXO (Z3961). The active part is realised within the
Bright. For temperature measurements of the VCXO a temperature sensor (R3967) is used. The
frequency of the reference oscillator can be fine tuned by the SGOLD2 via a filtered PNM modulated
AFC signal (RF_AFC). Two active buffer stages are included in Bright 5PL to provide clock signals
for the SGOLD2 and the Power Supply ASIC (BB_SIN26M). An additional external buffer (V3962) is
used to deliver a 26MHz clock signal to the Bluetooth chip (BT_SIN26M).
Bright 5PL
The required voltage VDD_RF1 is provided by the ASIC D1300
Waveform of the AFC signal from SGOLD2 to Oscillator
Signalform
SGOL D2
AFC
1 2 3
1
R1
AFC_PNM
C1
GND
2
R2
C2
GND
R3
VCXO Out
SGOLD2 In
3
C3
GND
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Synthesizer: LO1
First local oscillator (LO1) consists of a PLL and VCO inside Bright (N3911) and an external loop
filter (C3901, C3902).
RF PLL
The minimum frequency step is 400 kHz in GSM1800/GSM1900 mode and 800kHz in EGSM900
bands due to the internal divider by two for GSM1800/GSM1900 and divider by four for EGSM900.
The PLL is controlled by the internal state machine which is connected to the SGOLD2 via tree-wirebus.( RF_DAT; RF_CLK; RF_STR)
RFVCO (LO1)
The first local oscillator is needed to generate frequencies which enable the transceiver IC to
demodulate the receiver signal and to perform the channel selection in the TX part. The full
oscillation range is divided into 16 sub bands and covers 3476 to 3980MHz. To do so, a control
voltage for the LO1 is used, gained by a comparator. This control voltage is a result of the
comparison of the divided LO1 and the 26MHz reference Signal. The division ratio of the dividers is
programmed by the SGOLD2, according to the network channel requirements.
Synthesizer: LO2
The second local oscillator (LO2) consists of a PLL and a VCO which are integrated in Bright 5PL
(N3911)and a second order loopfilter which is realized external (C3940, C3941, R3952). Due to the
direct conversion receiver architecture, the LO2 is only required for transmit operation in order to
generate the transmit IF. To avoid inband spurious in the transmit signal the TX IF frequency is not
fixed for the whole band. The LO2 covers a frequency range from 640 to 656MHz.
Before the LO2 signal enters the modulator it is divided by 8. So the resulting TX IF frequencies are
80/82 MHz. The complete LO2 operation is controlled by the Bright internal state machine.
he LO2 PLL and power-up of the VCO is controlled via the tree-wire-bus of Bright (SGOLD2 signals
RF_DAT; RF_CLK; RF_STR). To ensure the frequency stability, the 640MHz VCO signal is
compared by the phase detector of the 2
control signal passes the external loop filter and is used to control the 640/656MHz VCO.
The required voltage VDD_RF1 is provided by the ASIC D1300
Frontend-Module (FEM)
The frontend module (N3800) includes the RX/TX- and band-switch function based on a combined
PIN diode and diplexer-circuit. In the transmit paths a harmonic filtering for EGSM900 and
GSM1800/GSM1900 is realized to avoid additional discrete filters. The isolation in TX OFF mode is
used to achieve the isolation which is necessary before the active part of the burst. Two lines from
the SGOLD2 control the band-selection of the TX switches (RF_FE_CTRL_GSM,
RF_FE_CTRL_GSM). The three receiver chains include SAW filter for EGSM900, GSM1800 and
GSM1900 to protect the receivers from strong blocking signals.
nd
PLL with the 26Mhz reference signal. The resulting
Technical Documentation
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4.4 Receiver
Receiver: Filter to Demodulator
The Bright 5PL incorporates three RF LNAs for EGSM900, GSM1800 and GSM1900 operation
followed by direct conversion mixers which are IQ demodulators. The LNA/mixer can be switched in
normal-, low- and lower-gain mode. For the “normal gain“ state the mixers are optimised in terms of
conversion gain and noise figure, in the “low gain“ state the mixers are optimised for large-signal
behaviour for operation at a high input power levels. The "lower gain mode" reduces the RF-level by
activating a differential impedance in front of the LNA to improve the large signal performance.
Furthermore the IC includes a programmable gain baseband amplifier PGA (90dB control range,
2dB steps) with automatic DC offset calibration. The channel filtering is realized inside the chip with
a four stage baseband filter for both IQ chains. Only two capacitors which are part of the first
passive RC-filters are external (C3905, C3906). The second, third and fourth filters are active filters
and are fully integrated. The distributed channel filter is necessary to suppress adjacent channel and
inband-blocking interferer to avoid any compression in each amplifier stage.
The downconverted IQ signals are fed into the A/D converters inside the SGOLD2. By a special
algorithm the level of the IQ signals is kept constant on a defined level by varying the PGA gain and
selecting the appropriate LNA gains.
Filter
LNA
N3800 Bright(N3911)
The required voltage VDD_RF1 and VDD_RF2 are provided by the ASIC D1300
Demodulator
PGC
Technical Documentation
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