Siemens S11, S11 MMI Service Manual

Information and Communication

Communication Devices

S11 / S11 MMI

Repair Documentation

Level 2.5

V 1.2

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Information and Communication

Communication Devices

Table of Contents:

1 INTRODUCTION................................................................................................................................................3

2 ANTENNA SPRING

...................................................................................................................................................................................4

3 TCXO

...................................................................................................................................................................................7

4 FUSE 1A

.................................................................................................................................................................................10

5 FUSE 0.25 A

.................................................................................................................................................................................14

6 MOLEX CONNECTOR

.................................................................................................................................................................................19

7 RINGER

.................................................................................................................................................................................23

8 CARDREADER

.................................................................................................................................................................................27

9 VOLUMESLIDER

.................................................................................................................................................................................31

10 MEMOSWITCH

.................................................................................................................................................................................35

11 ANTENNASWITCH

.................................................................................................................................................................................39

12 COIL

.................................................................................................................................................................................44

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Information and Communication

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1Introduction

The product familiy S1x consists of S10 (GSM-900), S11 (GSM-1800) and S12
(GSM-1900). The S10 is also available as a special outdoor version, the S10 Active. This
phone has different display and RF/Control modules, even though many of the components
are identical.

This manual is intended to help you carry out S11 repairs on level 2.5, meaning limited
component repairs. Failure highlights are documented and should be repaired in the local
workshops.

It must be noted that all repairs have to be carried out in an environment set up according to
the ESD (Electrostatic Discharge Sensitive Devices) regulations defined in international
standards.

If you have any questions regarding the repair procedures or spare parts do not hesitate to
contact our technical support team in Kamp-Lintfort, Germany:

Tel.: [phone]
Fax: [phone]
e-mail: [e-mail]

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2Antenna Spring

2.1Affected Units

2.1.1Type: S11

2.1.2Affected IMEIs / Date Codes: All / All

2.1.3Affected SW-Versions: All

2.1.4Fault Code for LSO reporting: 3ANS

2.2Fault Description

2.2.1Fault Symptoms for customers:

Customers experience problems registering to the
network and making calls.

2.2.2Fault Symptom on GSM-Tester:

The GSM-Tester will show a low Tx-Power only on the
internal antenna (aerial coupler measurement!).

2.3Priority:

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 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

2.4Repair Documentation

2.4.1Description of procedure:

2.4.1.1Diagnosis

Visually check the status of the antenna spring. Look for a bent
contact or dry soldering joint.

2.4.1.2Repair by component change

Use soldering iron to remove defective spring.

Resolder new spring afterwards.

2.4.1.3Repair by SW-Booting

Not possible!

2.4.1.4Test

Retest handset after repair.

2.4.2List of needed material

2.4.2.1Components

Antenna Spring

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Part-Number: L36158-A11-C23

2.4.2.2 Jigs and Tools

Soldering Iron

2.4.2.3Special Tools

None

2.4.2.4Working materials

Desolder Wick / Braid
Solder

2.4.3Drawings

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Figure 1: S11 Board Antenna Spring Side

Figure 2: S11 Antenna Spring (X900) Placement (Top View)

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3TCXO

3.1Affected Units

3.1.1Type: S11

3.1.2Affected IMEIs / Date Codes: All / All

3.1.3Affected SW-Versions: All

3.1.4Fault Code for LSO reporting: 3TCX

3.2Fault Description

3.2.1Fault Symptoms for customers:

Network Search
Handset not logging into network

3.2.2Fault Symptom on GSM-Tester:

Frequency error in synchronized mode >90 Hz
No location update possible

The TCXO (Temperature Compensated Crystal Oscillator) is responsible for generating the
13 MHz reference frequency of the handset.
If it is defective, the handset cannot synchronize to the base station anymore.

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Buffer

Lowpass

VC OUT 13MHz

SIN13MHz

(from µP)

AFC_PNM

TCXO

DC Voltage

Information and Communication

Communication Devices

All other frequencies are derived from this 13MHz reference, its stability is vital for the
handset function.

The TCXO output frequency is determined by a DC tuning voltage applied to its VC pin. The
voltage comes from the microprocessor as a pulse number modulated digital signal.
A lowpass then converts this digital signal to a proportional DC voltage, which is then used
to fine tune the TCXO output frequency.

3.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

3.4Repair Documentation

3.4.1Description of procedure:

3.4.1.1Diagnosis

Check the output frequency of the TCXO using the level-2 testing
program for S11.
Switch off the „CMD in Use“ option in the config file (S6xx.CFG or
S6xx.INI depending on the version of the testsoftware) and restart
the program. Start the S11 test, when the program says „Check power
and phase of external antenna with your GSM-Tester“, switch the
CMD to „LOCAL“ mode and enter the „MODULE TEST“.
On the CMD display you can see the frequency error of the handset.
(Make sure that the CMD is on channel number defined in the [PCN]
section of the S6xx.ini, power level 0!)

If the frequency error is higher than 2kHz, the TCXO has to be
replaced.

3.4.1.2Repair by component change

Use hot air blower to remove defective TCXO.

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Avoid excessive heat!
Watch surrounding components!

Resolder new TCXO afterwards.

3.4.1.3Repair by SW-Booting

Not possible!

3.4.1.4Test

Retest handset after repair as described above.
The frequency error must now be < 2kHz.

3.4.2List of needed material

3.4.2.1Components

TCXO
Part-Number: L36145-G300-Y17

3.4.2.2 Jigs and Tools

Hot Air Blower
Soldering Iron

3.4.2.3Special Tools

None

3.4.2.4Working materials

Desolder Wick / Braid
Solder

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3.4.3Drawings

4Fuse

1A

4.1Affecte d Units

4.1.1Type:

S11

MMI

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Figure 1: S11 Board TCXO Side

Figure 2: S11 TCXO (Z601) Placement (Top View)

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4.1.2Affected IMEIs / Date Codes: All / All

4.1.3Affected SW-Versions: All

4.1.4Fault Code for LSO reporting: 3FU1

4.2Fault Description

4.2.1Fault Symptoms for customers:

Battery charging not possible

4.2.2Fault Symptom on GSM-Tester:

This fault cannot be detected with a GSM-Tester

4.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

4.4Repair Documentation

4.4.1Description of procedure:

4.4.1.1Diagnosis

Check the status of the fuse by measuring its resistance with

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Communication Devices

a multimeter. The fuse is defective if the resitance higher than 10
ohms

4.4.1.2Repair by component change

Use soldering iron to remove defective fuse.
Avoid excessive heat!
Watch surrounding components!

Resolder new fuse afterwards.

4.4.1.3Repair by SW-Booting

Not possible!

4.4.1.4Test

Retest handset after repair as described above.
The resistance must now be close to zero.

4.4.2List of needed material

4.4.2.1Components

Fuse

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Part-Number: L36145-A820-Y7

4.4.2.2Jigs and Tools

Soldering Iron

4.4.2.3Special Tools

Multimeter

4.4.2.4Working materials

Desolder Wick / Braid
Solder

4.4.3Drawings

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5Fuse 0.25 A

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Figure 1: S11 MMI Board 1A Fuse Side

Figure 2: 1A Fuse (F1) Placement (Top View)

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5.1Affected Units

5.1.1Type: S11 MMI

5.1.2Affected IMEIs / Date Codes: All / All

5.1.3Affected SW-Versions: All

5.1.4Fault Code for LSO reporting: 3FU2

5.2Fault Description

5.2.1Fault Symptoms for customers:

Supplying of external accessories through the handset’s
bottom connector is not possible

5.2.2Fault Symptom on GSM-Tester:

This fault cannot be detected with a GSM-Tester

5.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

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5.4Repair Documentation

5.4.1Description of procedure:

5.4.1.1Diagnosis

Check the status of the fuse by measuring its resistance with
a multimeter. The fuse is defective if the resitance higher than 10
ohms

5.4.1.2Repair by component change

Use soldering iron to remove defective fuse.
Avoid excessive heat!
Watch surrounding components!

Resolder new fuse afterwards.

5.4.1.3Repair by SW-Booting

Not possible!

5.4.1.4Test

Retest handset after repair as described above.
The resistance must now be close to zero.

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5.4.2List of needed material

5.4.2.1Components

Fuse
Part-Number: L36145-A820-Y10

5.4.2.2Jigs and Tools

Soldering Iron

5.4.2.3Special Tools

Multimeter

5.4.2.4Working materials

Desolder Wick / Braid
Solder

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5.4.3Drawings

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Figure 1: S11 MMI Board 0.25A Fuse Side

Figure 2: 0.25A Fuse (F2) Placement (Top View)

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6Molex Connector

6.1Affected Units

6.1.1Type: S11 MMI

6.1.2Affected IMEIs / Date Codes: All / All

6.1.3Affected SW-Versions: All

6.1.4 Fault Code for LSO reporting: 3MOC

6.2Fault Description

6.2.1Fault Symptoms for customers:

Charging or operation in a car kit not possible.

6.2.2Fault Symptom on GSM-Tester:

Output power problems on the external antenna only.

6.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

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6.4Repair Documentation

6.4.1Description of procedure:

6.4.1.1Diagnosis

Visually check the bottom connector. Watch for dry joints.

6.4.1.2Repair by component change

Use hot air blower to remove defective connector.
Avoid excessive heat!
Watch surrounding components!

Resolder new connector afterwards.
Make sure that you use just very little flux, otherwise the connector
contacts can become dirty.

6.4.1.3Repair by SW-Booting

Not possible!

6.4.1.4Test

Retest handset after repair.

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6.4.2List of needed material

6.4.2.1Components

Molex Connector
Part-Number: L36334-Z93-C244

6.4.2.2Jigs and Tools

Hot Air Blower
Soldering Iron

6.4.2.3Special Tools

None

6.4.2.4Working materials

Desolder Wick / Braid
Solder
Flux

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6.4.3Drawings

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Figure 1: S11 MMI Board Bottom Connector Side

Figure 2: Bottom Connector Placement (Top View)

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7Ringer

7.1Affected Units

7.1.1Type: S11 MMI

7.1.2Affected IMEIs / Date Codes: All / All

7.1.3Affected SW-Versions: All

7.1.4Fault Code for LSO reporting: 3RIN

7.2Fault Description

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7.2.1Fault Symptoms for customers:

No ringer tone audible or ringer tone distorted.

7.2.2Fault Symptom on GSM-Tester:

Ringer check fails.

7.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

7.4Repair Documentation

7.4.1Description of procedure:

7.4.1.1Diagnosis

Check ringer functionality either manually with testing program.

7.4.1.2Repair by component change

Use hot air blower remove defective ringer.
Avoid excessive heat!
Watch surrounding components, especially the display window!
To protect the display, you can also desolder the ringer with solder

wick.

Resolder new ringer afterwards.
Watch placement of ringer!

7.4.1.3Repair by SW-Booting

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Not possible!

7.4.1.4Test

Retest handset after repair.

7.4.2List of needed material

7.4.2.1Components

Ringer
Part-Number: L36178-Z2-C15

7.4.2.2Jigs and Tools

Hot Air Blower
Soldering Iron

7.4.2.3Special Tools

None

7.4.2.4Working materials

Desolder Wick / Braid

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Solder

7.4.3Drawings

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Figure 1: S11 MMI Board Ringer Side

Figure 2: Ringer (B1) Placement (Top View)

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8Cardreader

8.1Affected Units

8.1.1Type: S11 MMI

8.1.2Affected IMEIs / Date Codes: All / All

8.1.3Affected SW-Versions: All

8.1.4Fault Code for LSO reporting: 3REA

8.2Fault Description

8.2.1Fault Symptoms for customers:

Sim card is not accepted or properly read by
the handset.
Sim card ejection mechanism may be damaged.

8.2.2Fault Symptom on GSM-Tester:

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When testing with a test-simcard the above
symptoms will come up.

8.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

8.4Repair Documentation

8.4.1Description of procedure:

8.4.1.1Diagnosis

Check cardreader functionality with sim card.
Attention: Watch for dry joints (especially pin 7!) or mechanical
damage.

8.4.1.2Repair by component change

Resolder dry joints.

If the cardreader is mechanically damaged use solder wick to remove

defective component.

Avoid excessive heat!
Watch surrounding components!!

Resolder new cardreader afterwards.

8.4.1.3Repair by SW-Booting

Not possible!

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8.4.1.4Test

Retest handset after repair.

8.4.2List of needed material

8.4.2.1Components

Cardreader
Part-Number: L36334-Z95-C994

8.4.2.2Jigs and Tools

Soldering Iron

8.4.2.3Special Tools

None

8.4.2.4Working materials

Desolder Wick / Braid
Solder

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8.4.3Drawings

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Figure 1: S11 MMI Board Cardreader Side

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9Volumeslider

9.1Affected Units

9.1.1Type: S11 MMI

9.1.2Affected IMEIs / Date Codes: All / All

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Figure 2: Cardreader Placement (Top View)

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9.1.3Affected SW-Versions: All

9.1.4Fault Code for LSO reporting: 3VSL

9.2Fault Description

9.2.1Fault Symptoms for customers:

The volume slider does not work properly.

9.2.2Fault Symptom on GSM-Tester:

During the keyboard test, the volume slider fails.

9.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

9.4Repair Documentation

9.4.1Description of procedure:

9.4.1.1Diagnosis

Check volumeslider functionality either manually or with the
testing program.
Watch for dry joints or mechanical damage.

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9.4.1.2Repair by component change

Use solder wick to remove defective slider.
Avoid excessive heat!
Watch surrounding components!!

Resolder new volumeslider afterwards.

9.4.1.3Repair by SW-Booting

Not possible!

9.4.1.4Test

Retest handset after repair.

9.4.2List of needed material

9.4.2.1Components

Volumeslider
Part-Number: L36315-Z77-C186

9.4.2.2Jigs and Tools

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Soldering Iron

9.4.2.3Special Tools

None

9.4.2.4Working materials

Desolder Wick / Braid
Solder

9.4.3Drawings

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Figure 1: S11 MMI Board Volumeslider Side

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10Memoswitch

10.1Affected Units

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Figure 2: Volumeslider Placement (Top View)

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10.1.1Type: S11 MMI

10.1.2Affected IMEIs / Date Codes: All / All

10.1.3Affected SW-Versions: All

10.1.4Fault Code for LSO reporting: 3MSW

10.2Fault Description

10.2.1Fault Symptoms for customers:

The memoswitch does not work properly.

10.2.2Fault Symptom on GSM-Tester:

During the keyboard test, the memobutton fails.

10.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

10.4Repair Documentation

10.4.1Description of procedure:

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10.4.1.1Diagnosis

Check memoswitch functionality either manually or with the
testing program.
Watch for dry joints or mechanical damage.

10.4.1.2Repair by component change

Use solder wick or hot air to remove defective switch.
Avoid excessive heat!
Watch surrounding components!!

Resolder new memoswitch afterwards.

10.4.1.3Repair by SW-Booting

Not possible!

10.4.1.4Test

Retest handset after repair.

10.4.2List of needed material

10.4.2.1Components

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Memoswitch
S11 Part-Number: L36315-Z77-C185

10.4.2.2Jigs and Tools

Soldering Iron
Hot Air

10.4.2.3Special Tools

None

10.4.2.4Working materials

Desolder Wick / Braid
Solder

10.4.3Drawings

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Figure 1: S11 MMI Board Memoswitch Side

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11Antennaswitch

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Figure 2: Memoswitch Placement (Top View)

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11.1Affected Units

11.1.1Type: S11

11.1.2Affected IMEIs / Date Codes: All / All

11.1.3Affected SW-Versions: All

11.1.4Fault Code for LSO reporting: 3ASW

11.2Fault Description

11.2.1Fault Symptoms for customers:

Problems with location update and call setup.
Network search.

11.2.2Fault Symptom on GSM-Tester:

Handset fails with low Tx power on both or either
antenna.
No location update possible.

11.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

11.4Repair Documentation

11.4.1Description of procedure:

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11.4.1.1Diagnosis

The antennaswitch is used to switch the Rx and Tx path between the
internal an external antenna of the handset

The function of the antennaswitch can be verified by simple resistance
measurements:
Pin 2 and 7 against ground must be around 86 kOhms.

If any of these resistances are significantly different, the
antennaswitch will have to be replaced.

11.4.1.2Repair by component change

Use solder wick or hot air to remove defective switch.
Avoid excessive heat!
Watch surrounding components!!

Resolder new antennaswitch afterwards.

11.4.1.3Repair by SW-Booting

Not possible!

11.4.1.4Test

Retest handset after repair.

11.4.2List of needed material

11.4.2.1Components

Antennaswitch
Part-Number: L36810-U6013-D670

11.4.2.2Jigs and Tools

Soldering Iron

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Hot Air Blower

11.4.2.3Special Tools

None

11.4.2.4Working materials

Desolder Wick / Braid
Solder

11.4.3Drawings

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Figure 1: S11 Board Antennaswitch Side

Figure 2: Antennaswitch (N801) Placement (Top View)

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12Coil

12.1Affected Units

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12.1.1Type: S11

12.1.2Affected IMEIs / Date Codes: All / All

12.1.3Affected SW-Versions: All

12.1.4Fault Code for LSO reporting: 3COI

12.2Fault Description

12.2.1Fault Symptoms for customers:

Loud humming noise in loudspeaker.

12.2.2Fault Symptom on GSM-Tester:

Handset fails with loud humming noise in echo loop.

12.3Priority:

 ........ Mandatory

 ........ Repair

 ........ Optional

 ........ Not Yet Defined

12.4Repair Documentation

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12.4.1Description of procedure:

12.4.1.1Diagnosis

The coil is used in the step up converter which is generating a

6.0 V supply voltage for the power amplifier out of the 2.8V battery
voltage.
If the coil is mechanically damaged (broken) it produces heavy
interference with the acoustical elements of the S11 resulting in a loud
humming noise in the earpiece.

A broken coil can easily be diagnosed by trying to move it with two
fingers. If it moves, the core is broken and the coil has to be
replaced.

12.4.1.2Repair by component change

Use hot air to remove defective coil.
Avoid excessive heat!
Watch surrounding components!!

Resolder new coil afterwards

12.4.1.3Repair by SW-Booting

Not possible!

12.4.1.4Test

Retest handset after repair, by checking the audio quality with the
echo loop of the testprogram.

12.4.2List of needed material

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12.4.2.1Components

Part-Number: L36151-F5273-M2

12.4.2.2Jigs and Tools

Soldering Iron
Hot Air Blower

12.4.2.3Special Tools

None

12.4.2.4Working materials

Desolder Wick / Braid
Solder

12.4.3Drawings

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Figure 1: S11 Board Coil (L1) Side

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Figure 2: 27nH Coil (L1) Placement (Top View)