Undervoltage and overvoltage shutdown with auto-restart and hysteresis
protection
bb
1
)
2)
Product Summary
V
Load dump
V
V
-
bb
V
bb (operation
V
bb (reverse
R
ON
I
L(SCp
I
L(SCr
I
L(ISO
Avalanche Clamp58V
OUT
80V
4.5 ... 42V
-32V
38
44A
35A
11A
Application
•
µC compatible power switch with diagnostic feedback
for 12 V and 24 V DC grounded loads
•
All types of resistive, inductive and capacitve loads
•
Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, integrated in Smart SIPMOS chip on chip technology. Fully protected by embedded protection
functions.
m
Ω
5
bb
PROFET
+ V
bb
OUT
3
5
Load
R
Voltage
source
V
Logic
Voltage
sensor
IN
2
ESD
4
ST
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
GND
Current
limit
unclamped
Open load
detection
Short circuit
Gate
protection
Limit for
ind. loads
detection
Temperature
sensor
1
Signal GND
Load GND
1)
No external components required, reverse load current limited by connected load.
2)
Additional external diode required for charged inductive loads
Semiconductor Group104.96
BTS 432 E2
)
PinSymbolFunction
1GND-Logic ground
2INIInput, activates the power switch in case of logical high signal
3Vbb+Positive power supply voltage,
the tab is shorted to this pin
4STSDiagnostic feedback, low on failure
5OUT
OOutput to the load
(Load, L)
Maximum Ratings
at Tj = 25 °C unless otherwise specified
ParameterSymbolValuesUnit
Supply voltage (overvoltage protection see page 3)
Load dump protection
R
= 2 Ω,
I
R
= 1.1 Ω,
L
V
LoadDump
t
= 200 ms, IN= low or high
d
=
U
+
V
,
A
U
s
= 13.5 V
A
Load current (Short-circuit current, see page 4)
Operating temperature range
Storage temperature range
Power dissipation (DC)
V
V
I
T
T
P
bb
)
3
s
L
j
stg
tot
self-limitedA
-40 ...+150
-55 ...+150
63V
66.5V
°C
125W
Inductive load switch-off energy dissipation,
single pulse
Electrostatic discharge capability (ESD
T
=150 °C:
j
E
V
AS
ESD
1.7J
2.0kV
(Human Body Model)
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 6...
V
I
I
IN
ST
IN
-0.5 ... +6V
±5.0
mA
±5.0
Thermal resistancechip - case:
junction - ambient (free air):
R
R
thJC
thJA
SMD version, device on pcb4):≤ tbd
3)
VS is setup without DUT connected to the generator per ISO 7637-1 and DIN 40839
)
4
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
2
(one layer, 70µm thick) copper area for V
Semiconductor Group2
≤ 1
≤ 75
K/W
bb
BTS 432 E2
j
)
Electrical Characteristics
Parameter and ConditionsSymbolValuesUnit
at Tj = 25 °C,
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
V
= 12 V unless otherwise specified
bb
mintypmax
IL = 2 A
T
=25 °C:
j
T
=150 °C:
j
Nominal load current (pin 3 to 5)
ISO Proposal:
V
ON
= 0.5 V,
T
= 85 °C
C
Output current (pin 5) while GND disconnected or
GND pulled up, VIN= 0, see diagram page 7,
T
=-40...+150°C
Turn-on time to 90%
Turn-off timeto 10%
R
= 12 Ω
L
T
=-40...+150°C
,
j
V
V
OUT
OUT
Slew rate on
10 to 30%
OUT
R
,
= 12 Ω
L
T
=-40...+150°C
,
j
V
Slew rate off
70 to 40%
V
OUT
,
R
L
= 12 Ω
T
=-40...+150°C
,
j
Operating Parameters
)
Operating voltage
5
Undervoltage shutdown
Undervoltage restart
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
=-40...+150°C:
j
Undervoltage restart of charge pump
see diagram page 12
in table of protection functions and circuit diagram page 7. Meassured without load
ON(CL)
I
> 0, add
ST
V
= 6.5 V typ without charge pump,
bb
I
V
, if
IN
>5.5 V
IN
V
OUT
≈
V
- 2 V
bb
.
Semiconductor Group3
BTS 432 E2
j
j
j
Parameter and ConditionsSymbolValuesUnit
at Tj = 25 °C,
Protection Functions
Initial peak short circuit current limit (pin 3 to 5)
( max 400 µs if VON > V
Repetitive short circuit current limit
T
j
Short circuit shutdown delay after input pos. slope
V
>
ON
min value valid only, if input "low" time exceeds 30 µs
Output clamp (inductive load switch off)
at V
OUT
Short circuit shutdown detection voltage
(pin 3 to 5)
Thermal overload trip temperature
Thermal hysteresis
Inductive load switch-off energy dissipation9),
T
j Start
Reverse battery (pin 3 to 1)
Integrated resistor in Vbb line
V
= 12 V unless otherwise specified
bb
ON(SC)
=
T
(see timing diagrams, page 10)
jt
V
= Vbb - V
ON(SC)
,
ON(CL)
I
= 30 mA
,
L
= 150 °C, single pulse
10
mintypmax
)
8
,
I
L(SCp)
)
=-40°C:
T
=25°C:
T
=+150°C:
j
T
I
L(SCr)
24
--
--
44
--
74
A
--
--
--
2235--A
T
=-40..+150°C:
j
)
V
V
bb
bb
= 12 V:
= 24 V:
t
d(SC)
V
ON(CL)
V
ON(SC)
T
jt
∆T
E
AS
E
Load12
E
Load24
-
V
bb
R
bb
80--400
µ
--58--V
--8.3--V
150----°C
jt
--10--K
----1.7
1.3
1.0
----32V
--120--
Ω
s
J
Diagnostic Characteristics
Open load detection current
(on-condition)
)
8
Short circuit current limit for max. duration of 400 µs, prior to shutdown (see t
9)
While demagnetizing load inductance, dissipated energy in PROFET is
V
2
= 1/
E
AS
)
10
Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load.
Reverse current I
these condition is dependent on the size of the heatsink. Reverse I
external GND-resistor (150 Ω). Input and Status currents have to be limited (see max. ratings page 2 and
circuit page 7).
2
*
*
L
I
L
ON(CL)
* (
V
ON(CL)
of ≈ 0.3 A at Vbb= -32 V through the logic heats up the device. Time allowed under
GND
), see diagram page 8
-
V
bb
=-40 °C
T
=25..150°C:
T
j
:
I
L (OL)
2
2
d(SC)
= ∫
E
can be reduced by an additional
GND
AS
V
ON(CL)
--
--
page 4)
*
(t) dt, approx.
i
L
900
750
mA
Semiconductor Group4
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