On-state resistance
Load current (ISO)
Current limitation
V
bb(AZ
V
bb(on
R
ON
I
L(ISO
I
L(SCr
43V
5.0 ... 24 V
60
7.0A
17A
auto-restart and hysteresis
•
Open drain diagnostic output
•
Open load detection in ON-state
•
CMOS compatible input
•
Loss of ground and loss of
•
Electrostatic discharge (ESD) protection
V
protection
bb
Application
•
µC compatible power switch with diagnostic
Standard
TO-220AB/5
5
Straight leads
5
1
1
SMD
feedback for 12 V DC grounded loads
•
Most suitable for resistive and lamp loads
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection
functions.
m
Ω
5
+ V
bb
Voltage
source
V
Logic
Voltage
sensor
IN
2
ESD
4
ST
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
GND
Current
limit
Open load
Short to Vbb
detection
Gate
protection
Temperature
sensor
PROFET
R
O
GND
3
OUT
5
Load
1
Signal GND
Load GND
)
1
With external current limit (e.g. resistor R
=150 Ω) in GND connection, resistor in series with ST
GND
connection, reverse load current limited by connected load.
Semiconductor Group102.97
BTS 425 L1
)
)
PinSymbolFunction
1GND-Logic ground
2INIInput, activates the power switch in case of logical high signal
3Vbb+Positive power supply voltage,
the tab is shorted to this pin
4STSDiagnostic feedback, low on failure
5OUT
OOutput to the load
(Load, L)
at
T
= 25 °C unless otherwise specified
Maximum Ratings
j
ParameterSymbolValuesUnit
Supply voltage (overvoltage protection see page 3)
Supply voltage for full short circuit protection
T
=-40 ...+150°C
j Start
)
Load dump protection
)
3
R
= 2 Ω,
I
R
= 1.7 Ω,
L
2
V
LoadDump
t
= 200 ms, IN= low or high
d
=
U
+
V
A
,
s
U
= 13.5 V
A
Load current (Short circuit current, see page 4)
Operating temperature range
Storage temperature range
Power dissipation (DC), TC ≤ 25 °C
Electrostatic discharge capability (ESD
(Human Body Model
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
all other pins:
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 6
IN:
V
bb
V
bb
V
Load dump
I
L
T
j
T
stg
P
tot
V
ESD
V
IN
I
IN
I
ST
43V
24V
)
4
60V
self-limitedA
-40 ...+150
°C
-55 ...+150
75W
1.0
kV
2.0
-10 ... +16V
±2.0
mA
±5.0
Thermal Characteristics
Parameter and ConditionsSymbolValuesUnit
mintypmax
Thermal resistancechip - case:
junction - ambient (free air):
R
R
thJC
thJA
--
----1.67
--
SMD version, device on PCB5):--34--
)
2
Supply voltages higher than V
150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the
protection of the input is integrated.
3)
R
= internal resistance of the load dump test pulse generator
I
4)
V
Load dump
)
5
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND and status pins, e.g. with a
bb(AZ)
2
(one layer, 70µm thick) copper area for V
Semiconductor Group2
K/W
75
bb
BTS 425 L1
)
)
j
Electrical Characteristics
Parameter and ConditionsSymbolValuesUnit
T
at
= 25 °C,
j
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
I
= 2 A
L
Nominal load current, ISO Norm (pin 3 to 5
V
= 0.5 V,
ON
Output current (pin 5) while GND disconnected or
GND pulled up,
page 7
Turn-on time IN to 90%
Turn-off timeIN to 10%
R
= 12 Ω
L
Slew rate on
10 to 30%
Slew rate off
70 to 40%
V
= 12 V unless otherwise specified
bb
T
= 85 °C
C
V
=30 V,
bb
T
=-40...+150°C
,
j
V
R
= 12 Ω
,
,
R
L
L
= 12 Ω
V
OUT
OUT
V
= 0, see diagram
IN
T
=-40...+150°C
,
j
T
=-40...+150°C
,
j
T
=25 °C:
j
T
=150 °C:
j
V
V
OUT
OUT
:
:
R
I
I
t
t
dV /dt
-dV/dt
ON
L(ISO)
L(GNDhigh)
on
off
on
off
mintypmax
--50
100
60
120
mΩ
5.87.0
--A
----10mA
80
80
200
230
400
450
0.1--1V/µs
0.1--1V/µs
µs
Operating Parameters
)
Operating voltage
6
Undervoltage shutdown
Undervoltage restart
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
=-40...+150°C:
j
Undervoltage restart of charge pump
see diagram page 10
in table of protection functions and circuit diagram page 7.
ON(CL)
I
> 0, add
ST
V
= 5.6 V typ without charge pump,
bb
I
V
, if
IN
>5.5 V
IN
V
OUT
≈
V
- 2 V
bb
Semiconductor Group3
BTS 425 L1
j
j
j
Parameter and ConditionsSymbolValuesUnit
at
T
= 25 °C,
j
Protection Functions
Initial peak short circuit current limit (pin 3 to 5)
Repetitive short circuit shutdown current limit
T
=
j
Thermal overload trip temperature
Thermal hysteresis
Reverse battery (pin 3 to 1)
Reverse battery voltage drop
= -2 A
I
L
Diagnostic Characteristics
Open load detection current
(on-condition, )
Open load detection voltage
Internal output pull down
(pin 5 to 1),
V
= 12 V unless otherwise specified
bb
T
(see timing diagrams, page 9)
jt
V
OUT
=5 V,
=-40..150°C
T
j
T
T
=+150°C:
j
)
9
(V
out
> V
bb
)
T
T
=25..150°C:
T
j
)
10
(off-condition)
=-40..150°C:
T
j
=-40°C:
T
=25°C:
=150 °C:
j
=-40 °C
:
I
L(SCp)
I
L(SCr)
T
jt
∆T
jt
-
V
bb
-V
ON(rev)
I
L (OL)
V
OUT(OL)
R
O
mintypmax
27
20
12
37
30
18
47
40
25
A
--17--A
150----°C
--10--K
----32V
150
150
--
610--
600
450
950
750
mV
mA
234V
41030k
Ω
)
9
Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 2 and circuit page 7).
10)
External pull up resistor required for open load detection in off state.
Semiconductor Group4
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