BDP 947
NPN Silicon AF Power Transistors
• For AF drivers and output stages
• High collector current
• High current gain
• Low collector-emitter saturation voltage
• Complementary type: BDP948, BDP950 (PNP)
Type Marking Ordering Code Pin Configuration Package
BDP 947 BDP 947 Q62702-D1335 1 = B 2 = C 3 = E 4 = C SOT-223
BDP 949 BDP 949 Q62702-D1337 1 = B 2 = C 3 = E 4 = C SOT-223
Maximum Ratings
Parameter Symbol Values Unit
Collector-emitter voltage
BDP 947
BDP 949
Collector-base voltage
BDP 947
BDP 949
Emitter-base voltage
DC collector current
Peak collector current
Base current
Peak base current
Total power dissipation,
Junction temperature
T
= 99°C
S
V
V
V
I
C
I
CM
I
B
I
BM
P
T
CEO
CBO
EBO
tot
j
V
45
60
45
60
5
3 A
5
200 mA
500
3 W
150 °C
Storage temperature
Thermal Resistance
Junction ambient
1)
Junction - soldering point
1) Package mounted on pcb 40mm x 40mm x 1.5mm / 6cm2 Cu
Semiconductor Group
T
R
R
stg
thJA
thJS
- 65 ... + 150
≤
42 K/W
≤
17
1 Nov-28-1996
BDP 947
Electrical Characteristics at
T
=25°C, unless otherwise specified
A
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
I
= 10 mA,
C
I
= 10 mA,
C
Collector-base breakdown voltage
I
= 100 µA,
C
I
= 100 µA,
C
I
= 0 mA, BDP 947
B
I
= 0 mA, BDP 949
B
I
= 0 , BDP 947
B
I
= 0 , BDP 949
B
Base-emitter breakdown voltage
I
= 10 µA,
E
I
C
= 0
Collector cutoff current
V
V
CB
CB
= 45 V,
= 45 V,
I
= 0 ,
E
I
= 0 ,
E
T
= 25 °C
A
T
= 150 °C
A
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
45
60
45
60
-
-
-
-
5 - -
-
-
-
-
V
-
-
-
-
100 nA
20
µA
Emitter cutoff current
V
= 4 V,
EB
I
C
= 0
DC current gain
I
= 10 mA,
C
I
= 500 mA,
C
I
= 1 A,
C
V
V
CE
= 5 V
CE
V
CE
= 2 V
= 1 V
Collector-emitter saturation voltage 1)
I
= 2 A,
C
I
= 0.2 A
B
Base-emitter saturation voltage 1)
I
= 2 A,
C
I
= 0.2 A
B
AC Characteristics
Transition frequency
I
= 50 mA,
C
V
= 10 V, f = 100 MHz
CE
Collector-base capacitance
V
= 10 V, f = 1 MHz
CB
I
EBO
h
FE
V
CEsat
V
BEsat
f
T
C
cb
- - 100
25
85
50
-
-
-
475
-
- - 0.5
- - 1.3
- 100 -
- 25 -
nA
-
V
MHz
pF
1) Pulse test: t < 300µs; D < 2%
Semiconductor Group
2 Nov-28-1996