I
SPEC. No.
ED-94054D
SW 1 ISSUE Junel4, 1996
ELECTRONIC COMPONENTS
GROUP SHARP CORPORATION
SPECIFICATION
DEVICE SPECIFICATION FOR Business
dealing name
PHOTOCOUPLER
MODEL No.
PC817
1. These specification sheets include materials protected under copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas :
[
* OA equipment * Audio visual equipment * Home appliances
* Telecommunication equipment (Terminal)
* Measuring equipment
* Tooling machines
* Computers
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(21 or (31. please be sure to observe the precautions given in those respective paragraphs.
(21 Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as :
[
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Rescue and security equipment
* Other safety equipment
1
(31 Please do not use this product for equipment which require extremely high reliability
and safety in function and precision. such as :
[
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
,I
(41 Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE
PRESENTED “I
BY
L/
DATE
T. Matsumura,
Department General Manager of
Engineering
Dept.,11
BY
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION
SHARP CORPOMITION
ED-94054D 1 June 14, 1996
MODEL No.
PAGE
PC8 17x
l/8
1. Application
This speciiication applies to the outline and characteristics of photocoupler
Model-No. PC8 17series.
Refer to the attached drawing No. CY696
lK02.
2. Outline
3. Ratings and characteristics
Refer to the attached sheet, page 3 to 6.
4. Reliability
Refer to the attached sheet, page 7.
5. Incoming inspection
Refer to the attached sheet, page 8.
6. Supplement
6.1 Isolation voltage shall be measured in the following method.
(1) Short between anode to cathode on the primary side and between collector
to emitter on the secondary side.
(2) The dielectric withstand tester with zero-cross circuit shall be used.
(31 The wave form of applied voltage shall be a sine wave.
(It is recommended that the isolation voltage be measured in insulation oil.)
SHflRP CORPORATION
ED-94054D 1 June 14. 1996
I
MODEL No.
PC817X
PAG E
2/B
6.2 Business dealing name
(,, 0” mark indicates business dealing name of ordered product)
6.3 This Model is approved by UL.
Approved Model No. : PC8 17‘
UL file No. : E64380
6.4 This product is not designed against irradiation.
This product is assembled with electrical input and output.
This product incorporates non-coherent light emitting diode.
7. Notes
Refer to the attached sheet- 1 - 1, 2.
Test
conditions
IF=5mA
Ta=25C
SHARP CORPORATION
ED-94054D 1 June 14, 1996
MODEL
No.
PAGE
PC8 17x
3/8
3. Ratings and characteristics
3.1 Absolute maximum ratings
Ta=25%
Collector current
* 1 Collector power dissipation PC 150 mW
* 1 Total power dissipation Ptot 200
mW
*3 Isolation voltage
Vii0
5 kVrms
Operating temperature Topr -30 to +lOO ‘C
Storage temperature
Tstg
-55 to +125 “C
*4 Soldering temperature Tsol 260 “C
*l The derating factors of absolute maximum ratings due to ambient temperature
are shown in Fig. 1 to 4.
*2 Pulse widths100 /IS, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for 1 min. 40 to 6O%RH
*4 For 10s
SHARP CORPORATION
ED-94054D 1 June 14. 1996
MODEL No. PAGE
PC8 17x
4/B
3.2 Electra-optical characteristics
Ta=25’C
Peak forward volta
Dark current
E
EO
v,,=2ov, I,-0 - - 100 nA
Collector-emitter
BvCEO
Ic=O. 1mA 35 - -
V
output breakdown voltage
I,=0
Emitter-collector
BvECO
I,=10 PA, I,=0 6 - -
V
breakdown voltage
Collector current
IC
IF=5mA, V,,=5V 2.5 - 30 mA
Collector-emitter V
CEbat)
1,=2omA
0.1 0.2 v
saturation voltage Ic=lmA
Isolation resistance R
IS0
DC500V 5XlO’O 10” - R
Transfer
40 to 6O%RH
characteristics Floating capacitance
c-f v=o, f=lMHz
0.6 1.0 pF
Cut-off frequency fc v,,=5v, Ic=2mA - 80 - kJ3z
R,=lOO R, -3dB
Rise time
Fall time
tr v,,=2v
4 18 /IS
Ic=2mA
tf R,=lOO n 3 18 ps
ED-94054D 1 June 14, 1996
MODEL No. PAGE
PC8 17X
5/8
SHARP CORPORATION
Rank mark
Anode mark
Factory identification
m cu
d d
&G
34 d
1, \
!,
/
mark l 2
m
4
3
Pin Nos. and internal
connection diagram
k
7. 62’0.3
?
*11 2-digit number shall be marked according to DIN standard.
UNIT: l/l mm
*2) Factory identification mark shall be or shall not be marked.
I
I
*3) Marking is laser marking
PC817
Name
Outline Dimensions
(Business dealing
name : PC8 17X1
I
Drawing
hh I
CY696 1 K02
SHFIRP CORPORATION
I
ED-94054D 1 June 14. 1996
PAGE
6/8
MODEL No.
PC817X
(Fig.
1) Forward current vs.
ambient temperature
0
-30 0 25 55 75 100 125
Ambient temperature Ta ( “C )
(Fig. 3) Collector power dissipation
T
vs. ambient temperature
-30 0 25 50 75
100 125
Ambient temperature Ta ( “C )
(Fig. 2) Diode power dissipation
vs. ambient temperature
t I I
I I
3 100
a
80
z 70
,a
60
p
40
25
125
Ambient temperature Ta (‘C I
(Fig. 4) Total power dissipation
vs. ambient temperature
-30 0 25 50 75 100 125
Ambient temperature Ta (“C )
(Fig. 5) Peak forward current
vs. duty ratio
Pulse widths100 ps
Ta=25”C
Duty ratio
The reliability of products shall be satisfied with items Iisted below.
Coni?dence level : 90%
LTPD: 10%/20%
4. Reliability
SHflRP CORPORFITION
ED-94054D 1 June 14, 1996
MODEL No.
PAGE
PC817X
7/8
Test Items
Solderability *2
Soldering heat
TerminaI strength
(Tension)
Terminal strength
(Bending) *3
Mechanical shock
Variable frequency
vibration
Test Conditions Failure Judgement Samples b-i
*1 Criteria Defeclive(C
230°C. 5 s n=ll, c=o
260-C, 10 s
n=ll, C=O
Weight : 5N
n=ll, C=O
5
s/each terminal
v,>ux 1.2
Weight : 2.5N Ia>UXZ n=ll, C=O
2 times /each terminal
15000m/s2, 0.5ms
EEO
‘IJX2
n=ll, C=O
3 times/ tX, -tY, fZ direction Ic <LXO.7
100 to 2000 to 100Hz/4min
V
200m/ s2
CE(sat) ‘ux ’ *2
n=ll, C=O
4 times/ X, Y, Z direction
Temperature 1 cycle -55C to +125C n=22 ,C=O
cycling (30minl (30min)
20 cycles test
U : Upper
High temp. and high +6O”C, 9O%RH, lOOOh
specification n=22,C=O
humidity storage limit
High temp. storage +125C, lOOOh
L:Lower n=22 ,C=O
specification h
Low temp. storage -55%) 1 OOOh limit
n=22,C=O
Operation life Ir=5OmA, Ptot=200mW
n=22,C=O
Ta=25%, lOOOh
* 1 Test method, conforms to JIS C 702 1.
*2 Solder shall adhere at the area of 95% or more of immersed portion of
lead and pin hole or other holes shall not be concentrated on one portion.
*3 Terminal bending direction is shown below.
F7
SHARP CORPORATION
5. Incoming inspection
5.1 Inspection items
(11 Electrical characteristics
V,, I,, ICEO, VCEfsatl. Ic, R,,. Viso
(21 Appearance
5.2 Sampling method and Inspection level
A single sampling plan, normal inspection level II based on
IS0 2859 is applied. The AQL according to the inspection
items are shown below.
Defect Inspection item
Major Electrical characteristics
defect
Unreadable marking
Minor Appearance defect except
defect
the above mentioned.
AQL (%)
0.1
0.4
ED-94054D 1 June 14, 1996
MODEL No.
PAGE
PC817X
818
SHARP CORPORATION
ED-94054D 1 June 14, 1996
MODEL No.
PAGE
PC817X
Attach
sheet- I- 1
Precautions for Photocouplers
1 For cleaning
(1) Solvent cleaning : Solvent temperature 45C or less
Immersion for 3 min or less
(21 Ultrasonic cleaning : The affect to device by ultrasonic cleaning is different
by cleaning bath size, ultrasonic power
output, cleaning time, PWB size or device mounting
condition etc. Please test it in actual using condition
and con&-m that doesn’t occur any defect before starting
the ultrasonic cleaning.
Applicable solvent : Ethyl alcohol, Methyl alcohol
Freon TE v TF, Diflon-solvent S3-E
Please refrain form using Chloro Fluoro Carbon type solvent to clean
device as much as possible since it is internationally restricted to protect
the ozonosphere. Before you use alternative solvent you are requested
to con&-m that it does not attack package resin.
2. The LED used in the Photocoupier generally decreases the light emission power
by operation. In case of long operation time, please design the circuit with considering
the degradation of the light emission power of the LED. (50%/5years)
SHARP CORPORATION
ED-94054D 1 June 14. 1996
MODEL No.
PAGE
PC817X
Attach
sheet- l-2
3. Precautions for Soldering Photocouplers
(1) In case of soldering
An example of device temperature
to lead
vs. soldering time
260 ‘C 10 s or
less 130 -
160 -
.*--
l-10 -
*.--
_.--
120
-
*-
.-
.a
Device
temperature I
(“Cl
0. ’ ’ ’ ’ ’ ’ ’ ’
’
0 2 4 6
8 10 12 14 llj 18 20
Soldering time (s)
(2) If solder reflow :
It is recommended thatonly one soldering be done at the temperature
and the time within the temperature profile as shown in the figure.
(3) Other precautions
An infrared lamp used to heat up for soldering may cause a localized
temperature rise in the resin. So keep the package temperature within
that specified in Item (2). Also avoid immersing the resin part in the solder.
Loading...