Sharp LH5496D-20, LH5496D-15, LH5496-65, LH5496-50, LH5496-35 Datasheet

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LH5496/96H
CMOS 512 × 9 FIFO
FEATURES
•• Fast Access Times : 15 */20/25/35/50/65/ 80 ns
•• Full CMOS Dual Port Memor y Arr ay
•• Fully Async hronous Read and Write
•• Expandable-in Width and Depth
•• Read Retransmit Capability
•• TTL Compatible I/O
•• Packages:
28-Pin, 300-mil PDIP 28-Pin, 600-mil PDIP 32-Pin PLCC
•• Pin an d Fu nct io n all y C omp at ibl e wi th I DT 72 01
FUNCTIONAL DESCRIPTION
The LH5496/ 96H are dual por t memor ies with inter nal addressing to implement a First-In, First-Out algorithm. Through an advanc ed dual por t archit ecture, they provide fully asynchr onous read/wr ite ope ration. Empty, Full, and Half-Full status flags are provided to prevent data over­flow and underflow . In addition, interna l logic provides for unlimited expansion in bot h word size and depth.
Read and write operations automatically access se­quential locat ions in memory in that data is read out in the same order that it was written, that is on a First-In, First-O ut basis. Since the addr ess s equen ce is internally predefined, no external address info rmation is required for the oper ation of this dev ice. A nint h data bit is pro vided for parity or contro l inform at ion oft en needed in comm u­nication applicat ions.
Empty, Full, and Half-Full status flags monitor the extent to which data has been writt en int o the FIFO, and prevent improper operations (i.e., Read if the FIFO is empty, or Write if the FIFO is full). A retransmit feature resets the Read address pointer to i ts initial position, thereby allowing repetitive readout of the same data. Expansion In and Expansion Out pins implement an expansion scheme that allows individual FIFOs to be cascaded to greater depth without incurring additional latency ( bubblet hrough) delays .
PIN CONNECTIONS
5496-1D
1
2 3 4 5 6
7 8 9
10
11 12 13 14
W
D
8
D
3
D
2
D
1
D
0
XI
FF
Q
0
V
SS
28 27 26 25 24 23 22
21 20 19 18 17 16 15
V
CC
D
4
FL/RT RS EF XO/HF
R
Q
1
Q
2
Q
3
Q
8
D
6
D
5
D
7
Q
7
Q
6
Q
5
Q
4
28-PIN PDIP TOP VIEW
Figur e 1. Pin Connections for PDIP Packages
5 6 7 8 9
10
D
2
D
1
D
0
XI FF Q
0
11Q
1
2
3
4
32
31
30
29
28
27
26
25
24
D
6
D
7
NC
EF
D3D
8
W
NC
V
CC
D
4
D
5
14
15
16
20
19
18
17
FL/RT RS
23
XO/HF
22
Q
7
21
Q
6
12NC 13Q
2
1
Q3Q
8
V
SS
NC
R
Q
4
Q
5
5496-2D
32-PIN PLCC TOP VIEW
Figure 2. Pin Connections for PLCC Package
* LH5496 only.
1
PIN DESCRIPTIONS
PIN PIN TYPE * DESCRIPTION
D0 – D
8
I
Input Data Bus
Q0 – Q
8 O/Z
Output Dat a Bu s
W
I
Write Request
R
I
Read Request
EF
O
Empty Flag
FF
O
Full Flag
* I = Input, O = Output, Z = High-Impedance, V = Power Volta ge Level
PIN PIN TYPE * DESCRIPTION
XO/HF
O
Expansion Out/Half-Full Flag
XI
I
Expansion In
FL/RT
I
First Load/ Retransmit
RS
I
Reset
V
CC
V
Positive Power Supply
V
SS
V
Ground
DATA OUTPUTS
Q
0
- Q
8
FLAG
LOGIC
WRITE
POINTER
READ
POINTER
DATA INPUTS
D
0
- D
8
DUAL-PORT
RAM
ARRAY 512 x 9
EF FF
. . .
5496-3
INPUT
PORT
CONTROL
R
W
RESET
LOGIC
RS
OUTPUT
PORT
CONTROL
EXPANSION
LOGIC
XO/HF
XI
FL/RT
Figure 3. LH5496/96H Block Diagram
LH5496/96H CMOS 512 × 9 FIFO
2
ABSOLUTE MAXIMUM RATINGS
1
PARAMETER RATING
Supply Volt age t o VSS Potential –0.5 V to 7 V Signal Pin Voltage to VSS Potential
3
–0.5 V to VCC + 0.5 V (not to exceed 7 V)
DC Output Current
2
±50 mA Storage T e mperature Range –65oC to 150oC Power Dissipation (Package Limit) 1.0 W DC Voltag e Applied T o Outpu ts In High-Z State –0.5 V to Vcc + 0.5 V (not to exceed 7 V)
NOTES:
1. Stresses greater than those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is a device stress rating for transient conditions only. Functional operatio n at these or any other conditions above those indicated in the ‘Operating Range’ of this specification is not implied. Exposure to absolute maximum rating conditi ons for extended periods may affect reliability.
2. Outputs should not be shorted for more than 30 seconds. No more than one output should be shorted at any time.
3. Negative undershoots of 1.5 V in amplitude ar e permitted for up to 10 ns once per cycle.
OPERATING RANGE
SYMBOL PARAMETER MIN MAX UNIT
T
A
T emperat ure, Ambient, LH5496
070
o
C
T
A
T emperature, Ambient, LH5496H
–40 85
o
C
V
CC
Supply Voltage
4.5 5.5 V
V
SS
Supply Voltage
00V
VILLogic ‘0 ’ Input V oltag e
1
–0.5 0.8 V
V
IH
Logic ‘1 ’ Input V oltag e
2.0 VCC + 0.5 V
NOTE:
1. Negative undershoots of 1.5 V in amplitude ar e permitted for up to 10 ns once per cycle.
DC ELECTRICAL C HARACTERISTICS (O ver Operat ing Range)
SYMBOL PARAMETER TEST CO NDITIONS MIN MAX UNIT
I
LI
Inpu t Leakage Cur rent VCC = 5.5 V, VIN = 0 V to V
CC
–10 10
µA
I
LO
Output Leakage Current
R VIH, 0 V V
OUT
V
CC
–10 10
µA
V
OH
Output High Voltage IOH = –2.0 mA
2.4 V
V
OL
Output Low Voltage IOL = 8.0 mA
0.4 V
I
CC
Aver age Supply Cur rent
1
Measu red at f = 40 MHz
100 mA
I
CC2
A ver age Sta ndby Cur re nt
1
All Inputs = V
IH
15 mA
I
CC3
Power Down Current
1
All Inputs = VCC – 0.2 V
5mA
NOTE:
1. ICC, I
CC2
, and I
CC3
are dependent upon actual output loading and cycle rates. Specified values are with outputs open.
CMOS 512 × 9 FIFO LH5496/96H
3
AC TE ST C O NDI T IO N S
PARAMETER RAT IN G
Input Pulse Levels
VSS to 3 V
Input Rise and Fall Times (10% to 90%)
5 ns
Input Tim ing Ref ere nce Lev els
1.5 V
Output Refer ence Le vels
1.5 V
Output L oad, Timing Test s
Figure 4
CAP ACI TANCE
1,2
PARAMETER RATING
CIN (Input Capacitance)
5 pF
C
OUT
(Output Capacitance)
7 pF
NOTES:
1. Sample tested only.
2. Capacitances are maximum values at 25oC measured at 1.0 MHz
with VIN = 0 V.
5496-4
DEVICE UNDER
TEST
+5 V
30 pF
1.1 k
680
INCLUDES JIG & SCOPE CAPACITANCES
*
*
Figure 4. Output Load C ircuit
LH5496/96H CMOS 512 × 9 FIFO
4
AC ELECTRICAL CHARACTERISTICS 1 (Over Operat ing Range)
SYMBOL PARAMETER
tA = 15 ns 2tA = 20 ns tA = 25 ns tA = 35 ns tA = 50 ns tA = 65 ns tA = 80 ns
UNIT
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN
MAX
MIN MAX
READ CYCLE TIMING
t
RC
Read Cycle Time 25 30 – 35 – 45 65 – 80 – 100 – ns
t
A
Access T im e 15 20 25 35 50 65 80 ns
t
RR
Read Recover Time 10 10 – 10 10 15 – 15 15 ns
t
RPW
Read Pulse Width
3
15 – 20 – 25 – 35 50 – 65 80 ns
t
RLZ
Data Bus Active from Read LOW 45 – 5– 5–5– 5– 5–10– ns
t
WLZ
Data Bus Acti ve fro m Wri te HIGH
4,5
10 10 – 10 10 10 – 10 20 ns
t
DV
Data Valid from Read Pulse HIGH
5 – 5– 5–5– 5– 5–5 –ns
t
RHZ
Data Bus High-Z from Read HIGH
4
15 15 15 15 20 30 30 ns
WRITE CYCLE TIMING
t
WC
Write Cycle Time 25 30 35 45 65 80 100 ns
t
WPW
Write Pulse Width
3
15 20 – 25 35 50 65 – 80 ns
t
WR
Write Recovery Time 10 10 – 10 10 15 15 – 15 ns
t
DS
Data Setup Time 10 10 10 15 20 20 20 ns
t
DH
Data Hold Time 0 0 – 0 0 0 5 – 5 ns
RES ET TIMING
t
RSC
Reset Cycl e Ti me 25 30 35 45 65 80 100 ns
t
RS
Reset Puls e Width
3
15 20 – 25 35 50 65 80 ns
t
RSR
Reset Reco very Ti me 10 10 10 10 15 15 15 ns
t
RRSS
Read HIGH to RS HIGH 15 20 25 35 50 65 80 ns
t
WRSS
Write HIGH to RS HIGH 15 20 25 35 50 65 80 ns
RETRANSMIT TIMING
t
RTC
Retransmit Cycle Time
25 30 – 35 – 45 65 80 100 – ns
t
RT
Retransmit Pulse Width
3
15 20 – 25 – 35 50 65 80 ns
t
RTR
Retransmit Recovery Time 10 10 – 10 – 10 15 15 15 ns
FLAG TIMING
t
EFL
Reset LOW to Empt y Flag LOW 25 30 35 45 65 80 100 ns
t
HFH,FFH
Reset LOW to Half -Fu ll and Full Flags HIGH
25 30 35 45 65 80 100 ns
t
REF
Read LOW to Empty Flag LOW 20 25 25 35 45 60 60 ns
t
RFF
Read HIGH to Full Flag HIGH 20 25 25 35 45 60 60 ns
t
WEF
Write HIGH to Empty Flag HIGH 20 25 25 35 45 60 60 ns
t
WFF
Write LOW to Full Flag LOW 20 25 25 35 45 60 60 ns
t
WHF
Write LOW to Half-Full Flag LOW
25 30 35 45 65 80 100 ns
t
RHF
Read HIGH to Half -Fu ll Flag HIG H 25 30 35 45 65 80 100 ns
EXPANSION TIMING
t
XOL
Expansion Out LOW 18 20 25 35 50 65 80 ns
t
XOH
Expansion Out HIGH 18 20 25 35 50 65 80 ns
t
XI
Expansion In Pulse Width 15 20 25 35 50 65 80 ns
t
XIR
Expansi on In Reco very Tim e 10 10 10 10 10 10 10 ns
t
XIS
Expansi on in Setu p Ti me 7 10 10 15 15 15 15 ns
NOTES :
1. LH5496 only.
2. A ll timing measurements performed at ‘AC Test Condition’ levels.
CMOS 512 × 9 FIFO LH5496/96H
5
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