Sharp PC-1211, CE-121 Service Manual

Page 1
SHARP CORPORATION
CONTENTS
1. Specifications . .
. . . . . . . .
. . . . . . .
. . . .
. . . . . . . . . . . . . . . . . . 2
2. Block diagram
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. .
. . .
. .
. .
4
3. LSI signal description
12
4
.
About servicing
17
5. Cassette operation
. . . . . . . . . . . . . . . .
. . .
. . . . . . . . . . . . . . . . . . . . . . .
18
6. Check program
·
· · ·
25
7. Circuit diagram
. . . . . . .
. .
. . . . . . . .
. .
. . .
. . . . . . . . . . . . . . . . . . . . . .
26
8. PC-1211 parts list & guide
· ·
32
9. CE-
121 parts list & guide . . . .
. . . . . . . . . . .
. .
. . . . .
· · · · . ·
· · ·
· ·
· ·
· · ·
34
MODEL
PC-1211, CE-121
----SHARP----
SERVICE
MANUAL
Page 2
2
Add
(+),Subtract(-), Multiply
(+),Divide(/), Power raising (A
)
Trigonometric
functions
:
SIN (sine), COS (cosine), TAN (tangent)
Inverse trigonometric functions: ASN (sine " ), ACS
(cosine
-
1
),
ATN (tangent
-
1
)
Logarithmic functions: LOG (common logarithm), LN (natural
logarit
hm
[ln]
)
·
Exponential functions: EXP (exponential)
Angular transformations: DMS (decimal notation to sexagesimal notation),
DEG (sexagesimal notation to decimal n
otation
)
Square root extraction:
r
Signum
function
.
SGN
Absolute
value
:
ABS
(IX
I)
In terization: INT Execution of arithmetic operation
is
commanded by the ENTER key
.
1-3. Arithmetic functions
Buffers
:
Capacities
:
12
digits of mantissa and 2 digits of exponent. According to mathematical formula (with priority consideration and judge function) Program memory; 1424
steps, max (PC1211)
Data memory; Fixed memory
26 memories Flexible memory (commonly usable with the program memory)
178 memories, max (PC 1211) Reserve program; 18 kinds, 48 steps, max Input buffer; 80 steps Data buffer;
8
stages
Functional buffer;
16
stages (but
15
stages for
parenthesis
) Subroutine buffer; 4 stages "FOR NEXT" stagement
buffer: 4 stages
Computational capacity:
Computational method:
1-2. Basic
functions
Displaytube: LF8017JE
Display method: 5 x 7 dot matrix liquid crystal
Display capacity: 24 coulumns (alphanumerics and symbols)
1-1 . Display
INS
OJ
ITJ []]
El G
DEL
w w
rn
w
@g
G] [[] []]
W
[
MODE
\
CA/BREA
K
1(
A
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WER
IT]
[TI
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[SHFTj
!
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s
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0
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IT]
[TI~
IT]
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[I]
0
0
0 ~
~
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ERi
RESERVABLE
KEY
S
1. SPECIFICATIONS
Page 3
3
Data
protection
:
Program memory, data
memory, reserve program memory
P
eripheral unit: Audio cassette unit
(recording/reading of the program memory,
d
ata
memory and reserve program memory)
Physical dimensions: 175(W)
x 70(D) x 44(H) mm
1-7. Others
Four MR44 (mercury batteries) 300 hours
0.01
iw
About 6 minutes
B
attery:
B
attery life:
Power con
sumption:
Automatic power shut off:
1
-6. Power source
1-5. Programming language
BAS
IC (Beginne
r's All purpose Symbolic Instruction Code)
....
(right), ~(left) INS D
EL
+(down), t (up)
Cursor shift:
Insertion
.
Deletion
:
Line control:
1-4. Editorial
functions
Page 4
4
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Page 5
5
The CPU I functions to read key-in data or read the instruction to be executed from the
RAM
,
and decides what
is
to be done for the control of arithmetical operation (i.e. control of
arithmetic sequence, memorizing of arithmetical
data, and its readout), or interprete the syntax
of the BASIC instruction for deciding what
is
to be executed, or determines and prepares the
information to be displayed, but the CPU I does not perform any execution by
itself
.
It
only arranges the data and information in proper sequence and acts to provide instruction code to the CPU II via the buffer. On the other
hand, the CPU II constantly receives execution instructions from the CPU I via the transfer buffer and executes operation against each of instructions or sometimes performs to exchange data depending on the
situation. Although it shares major part of execution in term of execution, it performs some kinds of auxiliary CPU when looked in the view that it does not perform any decision by
itself
.
Clock stop
Clock stop control
I
Power shut off control
I
Power off
Display processing routine
Input buffer Computational result Error
Arithmetic routine
Character generator
Cassette routine Print routine Buzzer
Recognition of printer
Key input routine Acknowledgement of the remaining
program One instruction to one program step
incorporation Interpreter:
Program execute statement
Cassette control statement Command statement
Printer control
Execution of manual operation
CPU
II
CPUI
These CPUs are provided with internal ROM, and each of CPUs shares the following assignments:
2-1. CPU I,
CPU II
System
configuration
(see
the
system
block
diagram)
System of this unit consists of the following components:
1)
CPU I (SC43157) x 1
2) CPU II (SC43178) x 1
3) 4K-bit RAM (TC5514P x 3)
4) Display chip (SC43125 x 3, with built-in RAM)
5) 2AND gate (TC401 l UBP x 1)
6) 2AND
20R
(TC4019BP x 1)
7) Inverter (TC4069BP x 1)
8) Quard Analog Switch Multiplexer (TC4066BP)
9) LCD (24-digit FEM dot LCD)
10) Key
11) Crystal (CSB2560)
8
Page 6
6
In the case of manual operation of the pocket computer, the instruction code (key code)
is
written
into the RAM in the display chip (input buffer) after information
is
put through the keyboard and
converted into the instruction code by the CPU
I,
then this instruction code (display, at this case)
is
transfered to the CPU II
via
the transfer buffer.
As
the CPU II receives this instruction, the CPU
II
then decodes this instruction
(display, at this case) and executes display processing. Upon the
completion of this processing,
it
is
then notified to the CPU I, then the CPU I confirms the comple-
tion of the task by the CPU II before terminating their jobs.
CPU
Il
Ex: Actions of CPU I and CPU II at the time of key data entry.
Page 7
7
Although RAM area is mainly shared by the
program, data
and reserve program
memories, it
is
also used for the sub-
routine stack, FOR NEXT statement stack and fixed
memories (W, X, Y, Z).
1536
1472 1504
001
048
(PC1211)
Reserve pro
gram
------- - - - - - --
Program
or
flexible
memory
~------
-------
Fixed memories (W - Z)
Subroutine I FOR
NEXT
stack statement
stack
A certain number
of
C-MOS RAM
(1
-
3
chips, 4K bits each) and another RAM incorporated inside
the display chip are used in this pocket computer, having varieties of configurations
as
described
below:
Map
of
4K-bit RAM
153
6 Bytes
2-2.
RAM
II
Page 8
8
Input buffer Remaining 80 bytes (10 memories equivalent) of the display chip 1 is
used for the input
buffer
,
which
is
used in the following
functions:
1.
Any information entered through the keyboard
is
stored once in this
buffer, thus allowing up
to 80 steps.
2. The display contents
is
stored by the CPU I and the CPU II makes selection out of this dat
a.
3. When an
arithmetical instruction is
entered, its procedure
is
stored in this buffer by the CPU
I
and the CPU
II
performs operation according to this procedure.
4. When program or reserve program
is to
be recorded or read out during the execution of the
cassette control
instruction, action takes place through this input buffer.
Transfer buffer 8
bytes
(1
memory
equivalent) of the
display chip 1 is used
as a transfer buffer which
is
used in
the
transaction of instruction between the CPU I and the CPU II.
16 bi
ts
----1}4bit
1
memory
Fixed memory The total memory of 176 bytes from the display chip 2 and 3 is
used
as a
fixed
memories, A-V
(22 memories).
8-digit display buffer
40 bytes of 8-digit display buffer
is
used
as a
display data buffer during displaying and also used
as a buffer memory for arithmetical result during the arithmetical operation.
128
80 step input buffer
Fixed memories (L-V, 11
memories)
Fixed memories (A-K, 11
memories)
Transfer buffer
040 04
8
8-digit display buffer
8-digit display buffer
8-digit display buffer
000
DISPLAY CHIP
3
DISPLAY CHIP
2
DISPLAY CHIP
1
Map of the RAM incorporated in the display chip There are three lK-bit RAMs (128 bytes each) incorporated in each of display chips (SC43125), having the following
configurations
:
Page 9
9
Fig 2-3-1
The
numeri
ca
figure "4
", to be displayed by the CPU II,
is converted into the relevant character
code and carried through on the address data bus. First of
all
,
the segment Sl
is
selected with the
address
A8-Al "
00000000" to store the data DI04-DI01
"1000
"
in
t
he display buffer
(see Fig
.
2-3-1
). To store second half 4 bits of the
data, only
AS
in the address in turned "1
" to make the
address "00010000" to store data "0001 ". In the same
manner, the address "00000001"
is
selected
for storing the first half 4-
bit data
"O
100" for he segment S2 and the sec
ond half 4-bit data "000 I"
is
stored with the address "00010001 ".
S40
S32 S3
3
S34
Sl6
Sl7
Sl
8
1
S2
A5=0
A5=1
DI04 DI02 DI04 DI02
'--------..,..-~
Address
0
1
0
0 0
)
F
0
1
0 0
1
)
F
0
1
0
1
0
~
F
Al
I
A8
A7
A6 A4
Hl
DDD•D
H2
oo••
o
H3
o•o•
o
H4
•oo•o
H
5
•••••
H6
ooo•o
H7
ooo•o
Sl
S2 S3
S4 S5
Ex: Displaying numerical figure
"4"
There are 8 x
40=320 bits ( 40 bytes) of area in the display buffer in the display chip.
Disp
lay bu
ffer
XOOl 0100
H8 H7 H6 H5 H4 H3 H2
Hl
X
OOl 1000
Co
unter/
decoder
HA
T
he contents of disp
lay
indicated by the CPU
I is
received
by the CPU II
via the input buffer and
m
akes converted into
respecti
ve
character codes,
then they are carried over to the display buffer in
t
he disp
lay
chi
p through the address data
bus
.
Designatio
n of the display data
The following structure is
observed in the display buffer in the display
chip
.
2-3. Display
the
ata.
'U
I
up
er
,
Page 10
10
HA: Clock frequency for the counter. This signal
is
counted and decoded to perform sy
nchroni
-
zation with the comman
signal, Hl-H7, generated from the CPU II.
DSIP: With high level of this
signal, processing of display operation
is
indicated (RAM data
designated by
Hl-H8
is
sent out on SI
-S40).
The data stored in the display buffer
is
carried through
SI-S40
(Fig. 2-3-2) to be fed to
the LCD.
(To
indicate "4
" on the
display, H4 and HS are
engag
ed for SI,
H3 and HS
for S2,
etc.,
all the same
throughout
S6-S40.)
F
ig 2-3-
2
S
2
Sl
H7
H6
LJl....____flJ
L
I
H
5
LJ
H
4
H3
H
2
Hl
-----------
--------
-
--
GND
--
---
VA
--------.
-----------Vs
--------
Vn1SP
HA
DI SP
0.5ms
~
Page 11
- -----
-3.9V
VDISP
VB
------
-2.lV
- - - --- -3.
9V
L_
VM
-------IV
...._
__ - - - --- -
2.8
V
6.8ms--
--
VA
-- ---
ov
...._
__ - - - --- -I.8V
11
E
ye positi
on
30
°
o
Adjustments of reference voltage VD ISP The VDISP had been precisely adjusted to become -3.74V at an ambient temperature of 20°C and -4.29V at 0°C.
In case there
is
a
n
eed of
readjusting the voltage after servicing the LCD or exchanging
some of power source
components, be sure to look on the LCD from
30° of angle from the ve
rtical line while adjusting the pot.
:D.
Low side voltage of common signals
(Hl-H7)
for
LCD
. High side voltage for segment signals (Sl - S40) Intermediate voltage of the common and
segment signals
Low side voltage of segment signals.
VA
,
VM and VB become pulses in an amplitude of several volts owing to influence
caused from the LSI.
VA: VM:
VB
:
NOTE
:
ata
o The
liquid
crystal
reference voltage
VDISP
is
generated in the above
circuitry in order to
avoi
d
occurrence of such unpleasant phenomena
as
blurred character or contrast
variation that might
degrade display
performance, which
is
caused by a slight voltage variation in the liquid crystal
reference voltage VD ISP, since the
5 x 7
dot matrix liquid crystal
is
used in the disp
lay of this
pocket
computer.
A) VDD is
generated in the CPU
II
on the basis of VGG.
B) The gate vol
tage of MOS FET is
controlled by the 250KS1 pot to regurate the voltage for VDISP.
Furthermore, the voltage of VDISP
is
changed by the thermistor to meet with temperature
varia
-
tion,
so as to maintain proper display
performance
.
C) Line between the reference voltage VD ISP and GND
is divided by resistor to make ou
t VA, VM
and VB
.
V
DISP
:
20°
o
o
C PUil
Yoo
Relation between
ternperture
and VDISP
M
OS FET
ioo»
2-4. Power source
Page 12
12
Pin No.
Signal name In/Out
Description
1
F4a Out
Chip Enable signal (RAM3 select signal)
2
F3a Out
Chip Enable signal (RAM2 select signal)
3
F2a Out
Chip Enable signal (RAM 1 select signal)
4
Fla
Out
Chip Enable signal (Display chip 1 select signal, for input buffer and transfer buffer usage) During
display: Low
/
- - - -
-
- -
During read-in: turns momentarily high
6
VGG
In
Source
voltage("-"
voltage of battery)
7
VGG
In
8
Xin
In
Basic clock (pulse signal in 256KHz)
9
TESTl
Connected with GND
10
TEST2
11
RESET In All reset switch input
Normally high but turns low when the all reset switch
is
depressed.
12
R/Wa
Out
RAM Data Read/Write signal During display: High
________
Depression of the key causes it momentary
low!
13
DIO
l
In/Out
Data Bus (for address designation of the input buffer and
14
DI02
In/Out
transfer buffer in RAM and display chip 1 ).
15
DI03
In/Out
During display: High
\_
\_
\_
\_
\_
\_
\_
16
DI03
In/Out
During
read-in: Low
17
B8a
Out
Address Bus (for address designation
of
the input buffer and
18
B7a
Out transfer buffer in RAM and display chip 1 )
.
19
B6a
Out
20
BS
a
Out
During
display
:
___
Mementary generation
21
B
4a Out
22
B3a
Out During read-in
:
lllllllllll
l
llllllllllll
l
23
B2a Out
24
Bla
Out
30
GND
In
Source voltage
(OV)
40 S16a
Out
Busy signal to the CPU II (High during the execution in the CPU
I)
During display: Low During read-in: turns momentarily high
3. LSI SIGNAL DESCRIPTIONS
3-1. SC43157 (CPU
I)
Page 13
13
Pin
No
.
Signal name
In
/Out
Description
1
F4
Out
Buzzer signal When the buzzer
is
off: Low
----i
0. 2 5msl--
When the buzzer
is on:
LS1___J
2
F3
Out
Chip Enable signal (Display chip 3 select signal)
3
F2
Out
Chip Enable signal (Display chip 2 select signal)
4
Fl
Out
Chip Enable signal (Display chip 1 select signal)
During display: Low
----- ____
__
During read-in: Turns mementarily high
5
VDD
Out
For liquid crystal drive voltage preparation (VDD :; V GG)
6
VGG
In
Source
voltage("-"
voltage of the battery)
7
VGG
In
-
8
Xin
In
Basic clock (Pulse signal in 256KHz)
11
RESET
In
All reset switch input
3-2.
SC43178 (CPU
II)
Pin No.
Signal name
In/Out
Description
-
41
Sn Out
Key Strobe
signal, RAM Address signal
42
Si
Out
Key Strobe signal, RAM Address signal
43
Sl3 Out
Key Strobe signal
44
Sl2
Out
45
Sll
Out
During display: High
46 SlO
Out
Depression of the key causes it momentary low
47 S9
Out
48
S8 Out
49 S7 Out
50
S6 Out
51
SS
Out
52
S4 Out
53
S3
Out
54 S2
Out
55
Kil
In
Key input signal
56
Ki2 In
57
Ki3
In
During display: Low
58
Ki4
In
Depression of the key causes it momentary high
59
S16b
In
Busy signal of the CPU II (high during the execution
of
the
(Ki5)
CPU II)
I
During
display: Low
Depression
of
the key causes it momentary
high'.
n
Page 14
14
Pin No.
Signal name
In
/Out
Description
1
2
R/V
I
Out
RAM Data Read/Write signal During display: High During read-in: Turns momentarily
low-- - - -
- -
-
13
DI04 In/Out
Data Bus (for data transaction between RAM and display chip)
14 DI03
In/Out
During display: High
lS DI02 In/Out
During read-in: Turns
low--l[lllll
16
DIOl
In/Out
17
B8b
Out
Address Bus (for address designation of the display chip)
18
B7b
Out
During display: Bl
b=high, B2B=low, B3b=low,
B4b=low
,
19
B6b Out
BSb=high,
B6b=high,
B7b=low, B8b=low
20
BSb Out
During
read-in: Turns momentarily high
21
B4b
Out
.
______
/
22
B3b Out
23
B2b
Out
24 Blb
Out
2
S
HA Out
Display signal (Common signal counting
pulse
)
.ruu
Being generated during
displaying
--10.Smst--
26
DISP Out
Display command signal During display: High During
execution: Low
27
VM
In
LCD display voltage (Intermediate voltage of the segment signal)
28
VA
In
LCD display voltage (High side voltage
of
the segment signal)
29
GND
In
Supply voltage (OV)
30
H4 Out
LCD common signals (backplate)
31
H7
Out
32
H3 Out
33
H6 Out 34 H2 Out 3S
HS
Out
36
Hl
Out
37
VDISP
In
LCD display voltage (Low side voltage
of
the common
signal
)
38
VB
In
LCD display voltage (Lo
w side voltage of the segment
signal
)
39
Sl6
Out
Busy signal to the CPU I (
High during the ex
ecution in the CPU II) During display: Low
/
Depression of key causes it momentarily high.
40 SIS Out
Record signal to the cassette tape and print
data
.
4
1
Sl4
Out
Remote signal to the MT.
Page 15
15
Pin No.
Signal name
In/Out
Description
42
Sl3
Out
Busy signal to the printer.
43
Sl2
Out
Expansion signal
-~
During
display: Low Depression of the CA (ON) key causes an instant pulse generation
.
49
S6
Out
For DEF symbol display (engaged: low, not engaged: high)
54 Sl
Out
For symbol display
(SHIFT, DGE, RAD,
GRAD, RESERVE, PRO, RUN) Same waveform as the segment signal.
55
Kil
In
CPU I Busy signal (High during the execution in CPU
I)
(Sl6a)
56
K.i2
In
Expansion signal
To be connected to Sl 2 (CPU II) for
PC-1211
.
57
K.i3
In
Printer Busy signal Low when the priner is
not
operated
.
58
K.i4
In
Printer connection identifying signal. Low when the printer
is
not
connected
.
5
9
l~5
In
Casse
tte reproduct sign
al.
60
K.i6
In
ON key input signal
1)
)
Page 16
16
TC4019BP TC4066BP
(Quad
AND-OR
select gate)
(
Quad bilateral switch
)
1
4
13
1
5
CIN
IN/ouT
OUf/IN
1
3
1
2
1
5
2
CIN
12
4
IN/ouT our /IN
3
3
4
6
11
5
CIN
8
IN/ouT
OUT/IN
9
6
10
12
7
CJN
11
IN/our
OUT/IN
10
9
7
GND
5
4
2
6
3
2
5
4
3
7
GND
6
8
8
Vnn
14 13 1
2
11 10
9
Vno 14
13 12
11 10 9
TC4069
P
(
HEX in
verter
TC4
011UBP
(
Quad 2
- input positive
NAND gate
)
3-3
IC
Page 17
17
Fig 4 -
2
Screw(c)
Screw(e
l
Under
850µA
Under 12µA
Measuring current c
onsumption
Power source voltage. 4.72
V
Current
consumption
: After depress the ON key: After depress the OFF key
:
Fig 4-
1
Lac
h
Disassembl
y proc
edure
1
) Remove the 2 screws (a) and
2 sc
rews (b ).
2) Separate the
upper
cabine
t from the lower cabinet from the screw
side, as the
y are
latched
togethe
r at three
points, A, B,
and C.
Repair
ing procedu
re
1)
As
the back o
f the
arithmeti
c printed board comes into sight after the removal of the lower cabinet, the arithmetic printed board can be checked from the back
side
.
2) Replacement of
the CPU II is
possible
.
3)
If
the key
printed bo
ard is
to be
checked, the arithmetic printed boa
rd has to be bent in right
angle
after removi
ng the screws ( d) and ( e ). Inspection of the CPU I
is
possible
if
the bu
zzer is
removed af
ter re
moving
the screw
(c)
.
4) The key printed b
oar
d can be dismounted from the upper cabinet when the 9 screws
(f)
and
2 screws (g) are
removed. But, c
are must be exercised in dismounting the prin
ted
board, as
key tops may come fa
lling down one after
another
.
Replacement
of the
LSI
1)
It
will be much convenient if the LSI use soldering pencil
(UKOG
-0078CSZZ) is use
d for
replacing the LSI.
2)
Be
sure to remove t
he key printed board from the upper cabinet
first, if the LSI on the key
printed board
is
to be removed.
If
the LSI was removed with the key printed
boar
d being
fitted on the
upper cabinet,
there is a
possibilit
y of deforming the key rubber by the
heat of
the
soldering pencil.
3) Be
sure to cut the legs of IC,
if IC was removed.
~--S
crew (b)
4.
ABOUT SERVICING
Page 18
5
18
1
bit
4KHz
DATA" i
"
2
KHz
DATA"O"
1 = Check sun code (after every 8 steps or one data
memory.)
2 = 8
steps of program or reserve program 3 = End code of recording. 4 = This gap, composed of all
"l ",
is
inserted at each step the recording exceeds 80
steps, during
which teime the next 80 steps of data to be input
is
prepared in the input
buffer
.
5 = All
"l"
is
recorded for a period of about 6 seconds in order to avoid non-recordable area
located at the top of the tape and
is
also used for the cueing of the recording head.
6 = With this program or reserve program name
is
indicated. 7 = File name 8 = Data memory
is
indicated with this
code
.
9 = Area for one data memory.
Recording method
Data "O" and
"l"
are identified by changing the frequency of the recording signal
(F4")
.
Data memory recording format
Recording
format of
program or reserve program
Contents
of
program
or
reserve program
80 steps
4
1+1
5-1. Recording
Recording
metho
d
5. CASSETTE OPERATION
Page 19
19
KI
5
Amplifier circuit
Schmitt circuit
CPU
11
Output signal from the EAR PHONE jack of the tape recorder
is
amplified and shaped in the
Schmitt
circuit, to be input to the CPU II through the
KiS
terminal of the CPU II.
5-2.
Reproduction
When recording signal "1"
is to
be
rec
orded, Sl 5 is
turned l
ow level and the
sign
al
F4
(clock
pulse of'..;'.
4KHz)
is
output during that
period. When recording signal "O" is to be recorded, SI
5
is
turned high level and the F4 output
is
inhibited during that
period, at
which
duration the
reverse si
gnal of HA (clock pulse of:::
2KHz)
is carried on the recording si
gnal.
Then, this signal
is
supplied to the MIC terminal of the tape rec
order via the modulation circuit
of the
CE121.
Signal waveform at the
time of recording
Rec
ording signal
(F 4
11
)
F4
HA
s
15
., ~
F<"---+ To CE121 cassette
rnodulation circui
t
Sl5 ~
Recording signal
(F4")
generation
circuit
rea
Page 20
TI
20
Deactivation of
the· relay
(cassette
to
stop running)
Lr
\
QA-u
\
Activation of
the
relay
(cassette to
start
running)
~Startup
of the cassette operation
~
Termination of the cassette operation
Sl4----i--~~~~~~~~~__.r--
The TC 4528P
is a mono-stable multivibrator which can perform trigger operation and reset operation and two circuits are contained in the same chip. "
A" outputs a pulse which
is
dependable on the time constant of CR at the falling edge of the input
signal, and "B" outputs a pulse which
is
dependable on the time constant of CR at the rising edge of
the input signal. The relay operates
ON
and OFF according to the current flow to the
coil, and it
is
activated when "A"
is
active and deactivated when "B"
is
active.
NR-5711
-----..,
5
ru_
I
L------~
0.0
4.:7
PF
4
70Kn
100
2
Kn
4
Ain
Q
6
2
SA733
MT
A
REMOTO
5
Bin
QA
7
74'
W
(Sl4
)
TC4528BP
33
n
3
0.047
µF
VGG
100
8
1
4
Kn
8
in
QB
10
2
SA7
33
83
B
GND
11
Bin
QB
9
1
4w
TC4528BP
3
30
13
The CEl
21
will control the REMOTE terminal in automatic manner against the record, playback
and check commands.
5-3. Remote control
Page 21
21
No.
Read in
Display
Remark
s
1
l
oFF
I
2
Connect the CE121
with th
e
tape recorder.
3
Connect the PC 12
11 with the
CE121.
4
l
oNI
>
R
UN
Make sure t
hat the symb
ol
RUN
is on the display
.
Otherwise, let the symbo
l
Rillf :Jo8iEJlayed us
ing
t
he key
.
2. Checking CE121
Assumes that the st
ep 1 has alre
ady been
executed
The test data have to be written into PC-1211 in the above
manne
r.
No.
Read in
Display Remarks
1
lMODEI -
lMODE)
>
RESERVE
Make the RESERVE symbol indicated on the display
afte
r
d1f
essinf the
I
E
TER
key
.
2
NEW
NEW
_
RESERVE
3
IENTERI
>
RESERVE
4
l
SHFTI
z
Z:_
RESERV
E
5 P.#
lSHFTl
f Af
lSHF'rj; A(
204
) Z: P.#
YA'; A(204
)
RESERVE
6
!
ENTER!
Z: PRINT #fAf; A(204)RESERV
E
7 lsHFTI X
X:_
RESERVE
8
1.# !
SHFTlfAY lSHFTl; A(7
6)
X: I. #YAT; A(2
04)
_
RESERV
E
9
!
ENTER!
X: INPUT #JAY; A(204)RESERVE
10
I
SHFTI
ISP.CI
.
-
RESERV
E
11
A(76)
:
A(204
)
RESERVE
12
I
ENTERI
:
A(204
)
13
I
MODEI
>
DEF
14
!
MODEi
>
RUN
15
I
SHFTI
ISPC I =
100
A(204)=100
_
RUN
16
!ENTER!
RUN 100
5-4. Testing the CE121
1. Writing test
data t
o PC-1211
First of all, test data must be entered to PC1211 for checking CE121.
Page 22
22
NOTE:
When next CE121 check is
to
be
performed in executing secondary
test, be sure to enter
"A(204)=100"
.
Repeat once again from the
"l.
Writing test data to PCl 211 ",
if the contents of PCl 211
happens to change.
I.
It
requires inspection if one of following conditions is
recognized
.
1.
When the cassette starts
to
run at Step 6.
2. When the cassette fails to run or no sound is heard at Step 8.
3. When the cassette does not stop at Step 9.
4. When reproducing sound
is
not heard at Step 13.
II.
Repeat the procedure in the following case.
1.
When "5 "
is
displayed at Step 13,
repeat operation from Step 10.
If
the same indica-
tion is still on the display, repeat the procedure from Step 5 after entering "A(204)=100".
If
the same indication is
to
remain on the display even after
this, it requires detailed inspection.
2. When
"100." is
not displayed at Step 16,
repeat operation from Step 10.
If
the specific
indication does not appear on the display, repeat the procedure fro
m Step 5 after entering
"A(204)=100".
If
the specific indication
is
not to appear on the display even after
this, it
r
equires detailed
inspection
.
No
.
Read in
Display
Remarks
5
>
RUN
Make sureof the tape recording location.
6
>
RUN
Depress the [REC] and
[PLAY] buttons. Then, the
cassette will come to
halt
.
7
lsHFTI Z
PRINT
#TA';
A(204)_RUN
8
!ENTER!
RUN
The cassette starts
to
run
generating
sound
.
9
>
RUN
The cassette comes to stop quitting sound
generation
.
10
>
RUN
Depress the (PLAY) button. But, the fassette is
still at halt.
11
>
RUN
Return the cassette tape until the beginning of th" recording
.
12
lsHFTI X
INPUT
#'A';
A(204)_RUN
13
IENTERI
R
UN
The cassette
starts to run
generating reproducing
sound
.
14
>
R
UN
The cassette comes to stop
quitting sound generation.
15
lsHFTI lsPcl
A(204)
_
R
UN
16
IENTERJ
RUN
100
.
17
RUN
100
.
Push the [STOP]
button
.
18
lOFFI
19
Disconnect PCl 211 from CE121.
2
0
Disconnect CE121 from the
cassette recorder
unit
.
Page 23
23
Plug
Tape recorder
No.
Read in Display
EAR
REM
Remarks
PHOE
MIC
OTE
PLAY
REC
STOP
1 ( loFFI)
Connect PC 1211 with CE121.
2
[QH]
.
>
RUN
0 0
Determine the location of the tape to be
recorded
.
3
>
RUN
0
0 0 0
0
Make sure
that
the
cassette tape does
not
run.
4
cs. jsHIFTl'A
CS. ,A_
RUN
0
0 0
0
0
5
!ENTER!
RUN
0 0
0 0
0
The cassette tape starts to run and the recording sound is
heard
.
6
>
RUN
0
0 0
0
The sound
is
inter-
rupted
and the cassette tape comes to halt
with">" indicated on the display.
7
>
RUN
0 0
Return the tape to the beginning of the recording.
8
>
RUN
0
0
0
0
9
CLO.? lsHFTI'A
CLO.?Y A_
RUN
0
0 0
0
10
jENTERj
RUN
0
0
0
0
The display con-
tents comes to dis-
appear from the
display and the
cassette tape starts
to run generating
the reproducing
sound.
11
>
RUN
0
0 0
0
Sound generation is
interrupted
and the cassette tape comes to halt with
">" indicated on
the display.
12
RUN
13
IOFFI
The CE 121 is in proper operation
if
the following procedures are ended successfully.
0
1
PAUSE
P R I N T
#
'f D 'f
O:GOTO 10
A(201)
5-5. About repairing of CE121
Program
Page 24
24
Cassette operation ON/
OFF control must be properly executed when the above signals are observed
during the execution of program.
Deactivation of
the relay
(cassette tape
to
stop
)
n
.........
_
___.n
.......
__
#
10 pin
of TC4528
and
--Jl+---
#3 terminal
of
the relay
~ L
1
msec, mi
n
-----,
n n
rt_
#
6 pin
of TC4528
and
~
1msec, mi
n
#
5 terminal
of
the relay
_J
L__
--~,
Activation of
the relay
(cassette tape
to
start
running)
#
5 and 12 pins
of
TC4528BP
(or
equivalent)
•In display~
.
.,,4 .,14
In
.
~4
·
..j4
In
~-
-
-.j+
~~cording
recording In
display
recording In display
recording In display
L
No
.
Read in
Display
Remarks
1
RUN
RUN
_
RUN
No need of running the ta
pe recorder.
2
IENTE~--
RUN
Recording sound
is
audible.
3
RUN
Recording sound goes out and "1 O." is
displa
yed on
the
display for a period of about 1 second.
4
-
RUN
[Cautions]
1.
Check the machine with the check procedure provided
separately, if the cassette tape happens to
keep running at Step 3,
the cassette tape fails to run at Step 5,
or the cassette tape fails to stop
at Step 6.
2. Check the recording circuit of the CE121 if
no recording sound
is
audible at Step
5.
3. In case no reproducing sound
is
audible at Step 10, proceed to playback another recorded tape to
check if reproducing sound
is
audible with that
tape
.
If
reproducing sound
is
not audible with
that
tape, proceed to check the reproducing circuit of the CE121
as
it may be not
functioning
properly.
If
the reproducing sound is
audible with the second
tape, check the recording circuit
of the CE
121
as
no proper recording may not have been carried
out
.
Page 25
6. CHECK
PROG
F.
-
DISPLAY
READ
I N
1
I 21314151
6
I
1l s I
9
l1oln l12ll3lul15!16!11i
1al19I
l
[1lliJ
>
-
2
IALL RESET
!
>
I
'
3
5/9 !ENTE
R!
I
I
5
5 5 5 5
5 I 5
5
5
-
4
IMODEI
>
,
5
I
p
· ls
HFT
I
w
o
K lsHFTI
w
IENTERI
l
:
p
R
I N
T
"'
0
K
"'
2 lS
HFT
I w z lsH
FTI w P
"'
"'. p
'
l
~
6
2
z
7
I SHFT
I w s ISHFT
I w !ENTER!
2
:
"'
z
"'
p
R
I N
T
"
s
"'
I
I I
8
3
B E
E p 2
IEN
TERI
3 : B
E E
P
2
IM
ODEI
~,
'
I
9
>
I
G R A D iENTE
Rl
I
1
0
>
,
I
·l
11
I SHFTI
ISPCI
0
I
4
7 IEN
TERI
:
0 l 4
7
IMODEI
I
1
2
>
,
'
ISHFTI
z
I
1
3
s
14
IMODEI lsHFTllsPcl
0
I 4 7
15
@RA
D
IEN
TERI
I
>
I
6
R
· lE
NTER
l
0
K
1
I
ENTER
I
T
1
7
s
I
1
8
I
ENTER
I
I
I
'r
T
'r
.:
>
'
-
!OFF
I
I
1
9
-
'
T
I
I
20
'
'
'r
'r
21
I
2 2
23
I
-
2 4 25 26
I
T
l
'
'
'
27
I
;
-
28
I
I
.
I
29 3
0
I
3
1
I
I
'
'
'
I
32 33
I
I
'
' '
l l
'
"l
34
I
I
'
l
'
'
'
35
I
'
l
l
I
v
B
I
3 6
I
I
' ' '
'
37
I
'
3
8
I
I
'
3
9
'
'
'
40
Page 26
25
DISPLAY
SYMBOL
Cassete
11
I 12 I 1
3
lu
I
15
I
!6 I 1
1
I
i
s
I
19
I 20 I 21I22 I 2 3 I 2 4
S
HFT
DEG PRO
~
S
mm
PL
A) REC
STO
P
REMJT]
RAD
GRAD DE
F
RUN
I
0 0
I
5
5 5 5 5 5
5
5
5
E -
0
1
0 0
I
0
0
K
'f
(
0)
0 0
I
(
0)
0 0
T'
s
T'
I
(0)
I
0 0 0
0
I
0
0
0 0
(0)
0 0
I
0 0
(0)
0 0
(0)
0 0
I
I
0
0
0
0
0 0
I
0 0
0
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
·
'
I
I
I
I
I
I
!HECK PROGRAM
Page 27
26
H ~~Hn
....
.
SUB PWB
n
n
VGG*
--
D
DF/F
Q
~
s
0000
16
1 2 3
4
a
K'
C
P
G
L i PR
l
1
1
H
A
,
S
16L
lOOKn
--ir-+-+--+-l--1...J""-/C-H-+-L---'''
5 6
l~O~
P;;;F
t---f-+-H----1J
50
WV
I
I
D-7-
GND
I
nl
~
VGG
I
I
L..----....J
S4"
'-
,_
--
-
µ_,.-
,
•B
2a
~~
~:
I
t:-:t--'A_2
__
-J.. __
'--------!lrt--++-----i· ill
1
I
I
I
5
:
I
~
I
Bla
~-~
I
I
T.Q''~A=l
~--r------=i-
---r-tt-t---++----+'~D
·101
I
7
I
'Q
'"
";,
- -
_
J
ioxo
r
' 3
~
1-1-
CMT ' lOKn"\....___,.
~lt-t---t-+-t---~-l--1-LJ
J'k/1..,/ e
Recording
TC4011 UBP
.,,,..._] - -
Signe
q
[rc
4-059
p
l
12 I
I
I
A3
-
514
R
EM OTO
Signet
I
I
I
VGG
I
Op
tion
Jo
Co
ntrol
I I
51
3
I
l
I
D
AT
AI
515
I I
I
c
M
T
I
I
Ki4
~
~~C!_l~
!_,
CCZZ
J
I
Opt ion: I/0 connect signal
I
7-1. Operation Circuit
Diagram
7. CIRCUIT DIAGRAM PARTS
Page 28
5
16L
R/Wb Xin
A S Sn
8
i
AAAAAAA
7654321
GRAM
PARTS
&
SIGNALS
POSITION
F
2a
F 3a
F
4a
BP
13
1
1
9
TC40
69P
[~J_
1
2
I
D
8
V
M
,____
_
1:::
-
-
-
B
P
VM
§=
~
·-v.
-
56'
BP
>--'-
D51
5BBL1
L:
56'
._~
i
TC4019P
(2)
~
V
nrsP Vnrsi ~
1AS
'-----
i2
i2
gi
0
TC4066
P
113
I
~
~
l
M
I
I
I
I
(RAM
)
A
7
-
TC 5514PX
3
12
I
~
I
,___
I
,___
-
I IA6
-
-
(3)
-
'-'-
11
1
'-'-
150Kn
I
-
~
L-
F
4a
1
GKD
Tbermi stor
I
-
h
~
~
tJ
GND
I I
VA
_
IA5
10
l
>
~
,!
<R
"~:
~
"'
~
I
~
-
~
-H
I
~
,___
VM~
r----
....J
>
--,TC4019P(I
J
--
,.
'-
i
!OW
V
I
-
--
=z~
~
=-
IOOKn
~
~
.._
~
-
- JOQ
µF
IA4
Vg
-
i.lf
13 I
'-'-
(21
I
>-
'-'-
i~~
}
2~
Kn
I
--
'-'-
-
I
F3a
1
Vmsr
~
.--
'-'
Von
'-
.._
I
~
::;J
1
'-
IA3
'-
1
2
I
L-~
I
VGG
"
I I
~
I
!A2
A
7
GND
-
A6
AB>--
1
11
I
A5
Si
-r-
I
A4
Sn
~
I
'-
Al
DIOl
-
I
A
2
(I)
DI0
2
-
A
3
DI03
I
F
2a
1
,
.
•A
l
DI04
-
vGG
R
A''
~
10
I
I
IOOKn
.
"
_J
·
~
1~PF
-
-
-
.,,
r=n
PWB
'
~
Page 29
Page 30
Page 31
0
28
FUNCTI
ON
7-3. Key
Circuit
Page 32
DODOO
0
0
0
D
0
D
ODOO
0
D
0 0
0
D D D
0 0 0 0
D 0
0
D
0
o o o
D
0
D
D
0
D
0
D D D 0 D
D D
0
DD
00
D D
0
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B
D~
00
0
D
D D
0
0
ODD
D 0
0
D
D
0
DO
qoo
D
D D D D O D D D , D
DO
D
ODD
D D D D
DODD
D
D
DO
D D
DD OD
D D D D D D
D D
D D
0
D
D D D D D D
DODOO
DODOO
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D O
o o
D
0
D D
D D
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ODO
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ODD
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DOD
D
0
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DO
D
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D
D
o
D
D D
D
D
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D D D D O D D O D O D D
ODD
0000
0
D D D D D D
D
0
D D D 0 000
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D
0
D D
D
0
ODD
O
D D D DD
D
D
D D
ODO
DO
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DD
D
D
DODOO DD DD DODOO
D
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DODOO
DODOO
D
D D D D D
D
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D D O
DDO D D D D
D
OD
DO
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0
o o o o o
o
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o o o o o
o
D
0
O
ODD
o o o
00
0
o
o o
DO
D
ODDO
o o
D 0
0000
o
o
o o
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D D
0 D
D D
D D D
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DD
D
DOD
OO
D
0
DODD
D
0
DO
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DODOO
0 D
DODO
0 0 D
DO
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D D
D 0
0
D
0
D
0 0
DODO
D 0
000
00 DODOO D D
D
D
0
D
D
DODOO
0
ODDO
D D
0 0 DD
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D
DO
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D
0
DODOO
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0 0
0 0
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0
0
DOD
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0
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0
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DOD
D D
0
0
DODOO
D
D
DOD
D
D
0000
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D D
D O
0 D
D 0
D
0
O
DO
0000
D
0
D
D
ODD
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0000
D
D
D D D
D
D
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.
.
•••••
DD OD O
D
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D
DOD
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D
0
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D D D D
D
.
.
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'--
$2']Vl
VlUlVlVl'Jl
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~~
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sza
sn
l----"
-
s2s
ss
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,...____
580
54 ___,;
--
cw
SC43125
ss
-'
I'- 58
1
52
____,
r--
s32
DJS
PLAY CH!P(3
)
SI
~
['--- Sas
AS
_......,
t"--
53
4
A7 ---+.
bM
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~~<~AS~
I'--- 531
52 -
C---
532
DlS
PLAY CH]P(2
)
SI
-
i'--
S3
3
A5
_......,
I'-- 53
4
A7--+.
~ 585~ ~~~~ ~~~
~~ ~~~~<~<AB~
~ S2
7~~~~~~:;~~~~~~;;~~~
)_
'--
s2s
se
-
----
529
S5
---"
'---53-0
S-
...---
GND
SC4312
5
ss
-
r
r r
~
r r
~
J
J
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s
-
,,
_
,,
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,.
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-
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=-_, .,.-_-
=-= ~~
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s
=
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Page 33
_____
..;
(' MSM401 3RS
~
i-------
~
Page 34
Page 35
,__-1•1•
AAX3
30
r
4
CMT
REMOTE
Y4
W
(
s
14)
5
33!1
3
5
0WV
0.047 FF
470Kn
VG
G
lOOK
n
e
16WV
15
14
Ef>
lO)lF
QB
2
SA7
33
12
10
GND
BQB 9
%
W
11
TC
4528
13
B
P
33
!1
50WV
0. 0
47 )lF 470 Kn
lOOKn
TC4069P
DS1588Ll
6
DS1
588
Ll
lOOKn
0.( 25
47
0Kn
2S
A 733
CMT
L
OAD output
(
KI 5 )
RECORD inp
ut
( F4")
7-5. CE-121 Circuit Diagram
Page 36
R
E.YOTE
EAR PHONE
MI
C
..
~
..
~,~
I
,
3
:
L------------J
1
4
'----1•1•
AAX3
%
W
33
.n
1
Y
4W
33
.n
N
R 5711
r---- --- --- -.,
5
I
'--~~~~~~+---<~>-----.-..
:
I
2
SC458KS
12
O.Ol
µF 2SC
458KS
25
WV
lOOK.n
0. 047
J1-
F/5
0WV
..
,t
..
.
,.
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i
uo
2
SA 733
Page 37
Page 38
PC-1211-
[gj
NO
.
PART TMANEI 5PAKCE
TiN5E2
LPLTP
I TLABZI RR-DZ
I RR-DZI RR-DZI RVR-ME VCEAAL VCKYPL VHDD51
VHHl54
VHi5C4
VH i 5C4 VHi5C4 VHiTC4 VHiTC4 VHiTC4 VHiTC4 VH i TCE VRC-M1 VRD-51 VRD-51 VRD-51 VRD-51 VRD-51 VRD-51 VRD-51 V525C4 V525..J
4 RC-5ZI RCR5PI VCKYPL VCTY
PL
RC-5Z
I
VRD-5
1
VCK
YPL
DKiT
-1
PC-1211-[j]
32
NO
.
PARTS
CODE
DESCRIP
TI
ON
NEW
PARTS
PRICE
RAN
K
MARK RAN
K
1
LX-BZ I I
02CCZZ
S
cre
w
N
c
A
B
2
LX-BZI032CCZZ
S
cre
w
c
A A
3
HDECAl705CCZZ
B
ottom
cabine
t
N
D
A
N
4
PZETLl323CCZZ
Ins
ulator sh
eet
N
c
A
B
5
PTPEHI062CCZZ
T
ap fo
r
chassis
c
A A
6
LCH551078CCZZ
C
hassis
N
c
A
c
7
GFTAAl231CCZZ
L
id
N
D
A
B
8
XBP5D20P09000
S
cre
w
c
A
A
9
RALMBl006CCZZ
Buzzer
B
A
H
10
LX-BZI060CCZZ
Screw X9
o
A A
11
XTP5D20P05000
Screw
c
A
A
12
QCNTMI036CCZZ
A
l l reset switch
o
A
B
13
PCU551081CCZZ
Cushion
c
A
A
14
QCNW-1 I 35CCZZ Flex
ib le wire (22
pin
)
N
B
A
o
15
QCNCWl259CCOi
Connector (9pin)
N
B
A
H
16
PGUM5
I I
90CCZZ
Rubber
connector
c
A
F
17
VVLLF8017..JE-I
LCD
N
B B
A
18
PTPEHl033CCZZ
Tape for LCD
c
A
A
19
LANGK1290CCZZ
Angle for LCD
c
A
D
2 0
PFiLWl230CCZZ
F
ilte
r
c
A
H
2
1
HDECAl527CCZZ
D
isp
lay mask
c
A
c
22 PFi
LWl228CCZZ
Display filter
.
c
A
c
23
PGUMMl254CCZZ
Key ru
bber
B
A
K
24
M5PRCI098CCZZ
E
arth
spring
c
A
A
25
..JKNBZ1515CC04
Key
top (18key
)
N
c
A F
26
..JKNBZl515CC05
Keyt
op
(17key
)
N
c
A F
27
..JKNBZl516CC02
Keyt op (SHIFT) X
20pcs
N
c
A
E
28
..JKNBZ1566CCOI
Keyt op (ENT ER) X 1 0 pcs
N
c
A
G
29
..JKNBZ1492CC02
Keyt
op (Numeral
)
N
c
A
E
30
..JKNBZl567CCOI
Keyt op (CL) X20pcs
N
c
A
E
3
1
QTANZl287CCZZ
"Battery terminal
(+,
-)
c
A
B
32
QTANZ1292CCZZ
Battery te
rminal
(
+)
c
A
B
33
QTANZl250CCZZ
Battery
terminal
(-)
c
A
B
34
XU55D20P04000
Screw
c
A
A
35
LANGTl336CCZZ
A
ngle
for
bottom cabinet
N
c
A
B
36
CCABB2299CC02
T
o p c
abinet
N
D
A
s
3
7
GFTAA1232CCZZ
Lid for connec
tor
N
D
A
B
38
QCNW
-1 I 37CCZZ
Flexibl
e wir e
N
B
A
c
39
QTANZl293CCZZ
B
attery te
rminal
(+.-)
N
c
A
B
UBAGZ I 2 I I
CCZZ
Hard ca se
N
D
A M
SPAKA5108CCZZ
Packing cushio
n
N D
A
F
TiNSE3137CCZZ
Instruction
book
(U.S. A)
N D
A
p
8. PC-1211 PARTS LIST & GUIDE
Page 39
PC-1211-[g]
1
33
NO
.
PARTS CODE
DESCRIPT
ION
NEW
PARTS
PRICE
::r,;.
MARK RAN
K
TMANEIOIOCCZZ
Program lib
rary
N
D
A
z
SPAKC5012CCZZ
Pack
ing
case
N
D
A
G
TiNSE2826CCZZ
Basic text
N
D
A
K
LPLTPl070CCZZ
Tenplat
e
N
D
A
8
TLABZl295CCZZ
Name lavel
D
A A
RR-DZI006CCZZ
R
esisto
r
1/BW
143Kohm ±2%
c
A
B
RR-DZl007CCZZ
R
esistor 1 /
BW
12. 7Kohm ±2%
c
A
B
RR-DZI008CCZZ
R
esistor 1 /
BW 21.0Kohm ±2
%
c
A
B
RVR-MB510QCZZ
V
aliable resistor
250Kohm
c
A
D
VCEAAUIAW107Q
Capa
cit
or
lµF
50V
c
A
E
VCKYPUIHB221K
Capacit
or 220PF 50V
c
A
8
VHDDSl588Ll-I
Diode
DS1588L1
8
A
D
VHHl54KD-5
/-I
Ther
mistor
150Kohm
B
A
c
VHiSC43125
/
-I
L. S. i (Dis
play chip
)
B
A
x
VHiSC43157
/
-I
L. S. I (
CPU-
I
)
N
B
B
F
VHiSC43178
/
-I
L. S.
i
(
CPU-
II)
N
8
8
D
VH i TC40 I I
UBP
I
i. C.
8
A F
VHiTC4019P
/-I
i.
C.
B
A
K
VHiTC4066P/-I
i. C.
8
A
K
VHiTC4069P
/
-I
i. C
.
B
A
H
VHiTC5514P/-I
L. S. i
(
RAM
)
8
B
D
VRC-MT2BGl65J
R
esistor
1/BW
1.6Mohm ±5
%
c
A
8
VRD-ST2BYIOIJ
R
esistor
1/BW 100
ohm ±5
%
c
A A
VRD-ST2BY223J
R
esisto
r
1/B
W
22Kohm ±5
%
c
A
A
VRD-ST2BYl03
J
R
esistor
1/BW 10Kohm ±5%
c
A A
VRD-ST2BY104J
Resisto
r
1/BW
100Kohm ±5
%
c
A A
VRD-ST2BYl05J
Resist
or
1/BW 1Mohm ±5%
I
c
A
A
VRD-ST2BY472
J
Resistor
1/B
W
4.7Kohm ±5%
I
c
A A
VRD-ST2BY474
J
Resist
or
1/B
W
470Kohm ±5
%
I
B
A A
VS2SC458KS
/-I
Transistor
2SC458KS
B
A
c
VS2SJ40-///-I
MOS FET
2SJ40
c
A
G
RC-SZl005CCZZ
Capacitor
0.1µ
F lOV
c
A
c
RCRSPl024CCZZ
C
rystal
N
c
A
H
VCKYPUIHBIOI
K
C
apacitor
lOOPF 50V
c
A
A
VCTYPUIEX
I03M
Capa
cito
r
l
OOOOPF 25
V
c
A
B
RC-SZl007CCZZ
Capacitor F lOV
I
c
A
F
VRD-ST2BY224J
Resistor 1 /
BW
220Kohm ± 5%
c
A A
VCKYPUIHBI02K
Capacitor 1 OOOPF 50V
c
A
A
DKiT-IOOICCZZ
SUB-PWB
Kit
N
Page 40
33
l
/.iii
Page 41
34
NO
.
PARTS CODE
DESCRIPTION
NEW PARTS
PRICE RANK
MARK RANK
1
GCABA2315CCZZ
Bot
tom cabinet
N
D
A
G
2
LX-BZl038CCZZ
Screw
c
A A
3
GLEGGIOl2CCZZ
Ru
bber foot
c
A
A
4
GFTABl235CCZZ
B
attery lid
N
D
A
c
5
XTBSD20P06000
S
crew
c
A A
6
QPLG..JI008CCZZ
P
lug
N
B
A
Q
7
QCNCMl260CCOI
C
onnector
(9pin
)
N
B
A
G
8
XTBSD20P05000
Screw
c
A A
9
LANGTl334CCZZ
An
gle
N
c
A
c
10
QTANZl266CCZZ
Bat
tery
terminal
9
c
A A
11
QTANZl072CCZZ
Ba
ttery ter
mina
l
EB
c
A
A
12
HDECAl684CCZZ
D
ec.
panel
A
N
D
A
c
1
3
HDECAl685CCZZ
Dec.
panel
B
N
D
A
D
14
GCABB2316CCZZ
T
op
cabinet
N
D
A
G
SPAKA5097CCZZ
P
acking case
N
D
A
D
SPAKC5
I I
I
CCZZ
P
acking case
N
D
A
D
SPAKA5109CCZZ
Pa
cking cushion
N
D
A
E
VCEAAUICWI06Q
Capacitor
10
µF 16
V
c
A
B
VCQYKUIHM472K
Capacitor 0.
004
7µF
50V
c
A
B
VCQYKUIHM473K
Capacitor
0.047µF 50
V
c
A
B
VCTYPUIEXI03M
C
apacitor
0.01µF 25
V
c
A
B
VCTYPUINXI04M
Capacitor
0.1µ
F 12V
c
A
B
VHDDSl588Ll-I
Diode
DS1
588
L1
B
A
B
VH i NR57
I I/ /-1 Relay
NR571
1
N
B
A
w
VHiTC4069P/-
I
I.
C. TC4069
P
B
A
H
VHiTC4528BP-I
I.
C.
TC452
8BP
N
B
A
p
VRD-ST2BYI03..J
R
esistor
1/8W
10Kohm
±5%
c
A A
VRD-ST2BYl04..J
R
esistor
1/8W 1
00K
ohm ±5%
c
A A
VRD-ST2BYl05..J
R
esisto
r
1/8
W
1Mohm ±5%
c
A A
VRD-ST2BYl83..J
R
esisto
r
1/8
W
18Kohm
±5
%
c
A A
VRD-ST2BY223..J
R
esistor
1/B
W
22Kohm ±5%
c
A A
VRD-ST2BY271..J
R
esisto
r
1/8W 270ohm ±5%
c
A A
VRD-ST2BY474..J
R
esistor
1/8W
470K
ohm ±5
%
c
A
A
VRD-ST2BY564..J
R
esistor
1/B
W
560K
ohm ±5
%
c
A A
VRD-ST2EY330..J
R
esistor
1/4
W
33ohm ±5%
c
A A
VS2SA733-
//-I
T
ransistor 2SA7
33
B
A
D
VS2SC458KS/-I
Tr
ansistor
2SC458KS
B
A
c
J
9. CE-121 PARTS LIST & GUIDE
Page 42
35
1
0
~
/
~5
7 .~
4
Page 43
SHARP CORPORATION
Industrial Instruments Group Reliability & Quality Control Department
Yamatokoriyama, Nara 639-11, Japan
1
981
March Printed
in Jap
an
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