Datasheet VNQ860SP, VNQ860 Datasheet (SGS Thomson Microelectronics)

®

VNQ860

/ VNQ860S P

QUAD CH ANNEL HIGH SIDE DRIV ER

6P

TYPE R

VNQ860 VNQ860SP

(*) Per each channel

■ CMOS COMPATIBLE I/Os

■ UNDERVOLTAGE & OV ERVOLTAGE

SHUT- DOWN

n

■ SHORTED LOAD PROTECTION

■ THERMAL SHUTDOWN

■ VERY LOW STAND-BY CURRENT

■ PROTECTION AGAINST LOSS OF GROUND

DS(on)

(*) I

OUT

V

CC

270mΩ 0.25A 36V

DESCRIPTION

The VNQ860, VNQ86 0SP are mono lithic devi ces made using| STMicroelectronics VIPower M0-3 Technology, intended for driving any kind load with one side connected to ground. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. This device is

BLO C K DIAGRA M

10

1

SO-20

PowerSO-10™

ORDER CODES

SO-20 PowerSO-10™

VNQ860 VNQ860SP

especially suitable for industrial applications in norms conformity with IEC1131 (Programmable Controllers International Standard).

V

CC

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND

I/O 1

I/O 2

I/O 3

I/O 4

STATUS

V

CC

CLAMP

LOGIC

OVERVOLTAG E

UNDERVOLTAGE

OVERTEMP

DETECTION

Power CLAMP

CURRENT LIMITER

Power CLAMP

CURRENT LIMITER

Power CLAMP

CURRENT LIMITER

Power CLAMP

CURRENT LIMITER

Januar y 20 03 1/10

1

VNQ860 / VNQ860SP

ABSOLUTE MAXIMUM RATING

Symbol Parameter

tot

DC supply voltage 41 V Reverse DC supply volt age - 0.3 V

CC

DC reverse ground pin current - 200 mA DC output current Internally Limited A Reverse DC output current - 2 A DC Input current +/- 10 mA Input voltage range -3/+V

IN

DC Status voltage + V Electrostatic discharge (R=1.5 KΩ; C=100 pF) 2000 V Power dissipation TC=25 °C 16 90 W

Junction operating temperature Internally Limited °C

j

Case operating temperature - 40 to 150 °C

c

Storage t em perature - 55 to 150 °C

1

10

20

11

GROUND I/O 3 OUTPUT 3 V

CC

V

CC

V

CC

V

CC

N.C. OUTPUT 2

I/O 2

V

CC

- V

- I

GND

I

OUT

- I

OUT

I

IN

V

STAT

V

ESD

P

T

stg

CONNECTION DIAGRAM

I/O 4 OUTPUT 4 N.C. V

CC

V

CC

V

CC

V

CC

OUTPUT 1 I/O 1 STATUS

OUTPUT 3 I/O 3 GND I/O 4 OUTPUT 4

Value

SO-20 PowerSO-10

CC

6 7 8 9

10

TAB

V

CC

5 4 3

2 1

Unit

V V

OUTPUT 2 I/O 2 STATUS I/O 1 OUTPUT 1

CURRENT AND VOLTAGE CONVENTIONS

I

I/O1

V

I/O1

V

I/O2

V

I/O3

V

I/O4

V

STAT

I

I/O2

I

I/O3

I

I/O4

I

STAT

I/O1

I/O2

I/O 3

I/O 4

STATUS

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1

GND

V

CC

OUTPUT 1

OUTPUT 2

OUTPUT 3

OUTPUT 4

I

GND

I

OUT1

I

OUT2

I

OUT3

I

OUT4

V

OUT4

V

OUT3

V

I

CC

OUT2

V

OUT1

V

CC

VNQ860 / VNQ860SP

THERMAL DATA

Symbol Parameter

R R

R

tj-amb

tj-case

tj-pin

Therma l resistance junction -pins (MAX) 8 Therma l resistance junction -ambient (*) (MAX) 58 50 Therma l resistance junction -case (MAX) - 1.4

SO-20 PowerSO-10

(*) When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35µ thick) connected to all VCC pins.

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40oC<Tj<150oC; unless otherwise specified) POWER

Symbol Parameter Test Conditions Min Typ Max Unit

V

CC

V

USD

V

OV

R

ON

I

S

I

LGND

I

L(off)

I

OUTleak

I

OUTleak

Operating supply voltage 5.5 36 V Undervolt age shut-down 3 4 5.5 V Overvoltage shut-down 36 42 48 V On state resistance (per ch annel)

Supply current

Output current Off state output current VIN=V

Off state output leakage current Off state output leakage current

I

=0.25A ; Tj=25oC

OUT

I

=0.25A

OUT

Off state;

V

=24V; Tc=25oC

CC

On state (all channels on) V

CC-VSTAT=VIN=VGND

V

=0V

OUT

V

IN=VGND

T

amb

V

IN=VGND

V

OUT

=0V 0 10 µA

OUT

=0V; VCC=V

=25oC

=0V; VCC=24V;

=10V; T

amb

=24V

OUT

=25oC

=24V;

Value

70

5

Unit

o

C/W

o

C/W

o

C/W

270 540 120

10

mΩ mΩ

µA

mA

1mA

240 µA

100 µA

SWITCHING (VCC=24V) (Per channel)

Symbol Par am eter Test Conditions Min Typ Max Unit

Turn-on delay time

Turn-off delay time

/dt)onTurn-on voltage slo pe RL=96Ω from V /dt)

Turn-off voltage slope RL=96Ω from V

off

(dV (dV

t

D(on)

t

D(off)

OUT OUT

RL=96Ω from VIN rising edge to V

=2.4V

OUT

RL=96Ω from VIN falling edge to V

=21.6V

OUT

=2.4V to 19.2V 0.75 V/µs

OUT

=21.6V to 2.4V 0.2 5 V/µs

OUT

10 µs

40 µs

PROTECTIONS (Per channel)

Symbol Parameter Test Conditions Min Typ Max Unit

Current limitation 0.35 0.7 1.1 A Thermal hysteresis 7 15 Thermal shut-down temperature

150 175 200

Reset temperature 135 Turn-off output clamp voltage I

=0.25A VCC-47 VCC-52 VCC-59 V

OUT

T

V

demag

I

lim

(hyst)

TSD

T

R

o

C C C

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VNQ860 / VNQ860SP

ELECTRICAL CHARACTERISTICS (continued)

LOGIC INPUT (Per channel)

Symbol Parameter Test Conditions Min Typ Max Unit

V

IL

I

IL

V

IH

I

IH

V

I(hyst)

I

IN

V

OL

STATUS PIN

Symbol Parameter Test conditions Min Typ Max Unit

V

STAT

I

LSTAT

C

STAT

TRUTH TABLE

CONDITIONS MCOUTn I/On OUTPUTn STATUS

Normal op eration

Current limit ati on

Overtemperature

Undervoltage

Overvoltage

Low level input voltag e 1.25 V Low level input curr ent VIN=1.25V 1 µA High level input v oltage 3.25 V High level i n put current VIN=3.25V 10 µA Input hysteresis Voltage 0.5 V Input curren t VIN=VCC=36V 200 µA I/O Output voltage IIN=5mA (Faul t condition) 1 V

Status lo w output voltage I Status leakage current Normal operation; V Status pin input cap acitance Normal operation; V

L

H

L

H

L

H

L

H

L

H

=5mA (Fau lt co nd i tion) 1 V

STAT

STAT=VCC STAT

L

H

L

H

L

Driven low

L

H

L

H

=36V 10 µA

=5V 100 pF

L

H

L

X

L L L L L L

H H

L L X X H H

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2

SWITCHING CHARACTE RISTICS

V

OUT

/dt)

OUT

VNQ860 / VNQ860SP

80%

on

t

r

10%

90%

t

f

(dV

OUT

/dt)

off(dV

t

V

IN

Typical application schematic

MCOUTn

MCINn

MCU

t

d(on)

I/On

t

d(off)

OUTPUTn

VNQ860

t

5/10

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VNQ860 / VNQ860SP

Figur e 1: Waveforms

V

I/On

V

OUTn

V

STAT

V

CC

I/On

OUTn

STAT

V

USD

NORMAL OPERATION

UNDERVOLTA GE

V

USDhyst

undefined

V

V V

V

I

CC

I/On

OUTn

STAT

T

V

OUTn

V

T

TSD

T

R

j

MCOUT

I/On

STAT

VCC>V

V

USD

OVERVOLTAG E

OV

V

OVhyst

OVERTEMPERATURE

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SO-20 MECHANICAL DATA

VNQ860 / VNQ860SP

DIM.

A 2.65 0.104 a1 0.10 0.20 0.004 0.007 a2 2.45 0.096

b 0.35 0.49 0.013 0.019 b1 0.23 0.32 0.009 0.012

C 0.50 0.020

c1 45° (typ.)

D 12.60 13.00 0.496 0.512

E 10 .00 10.65 0.393 0.419

e 1.27 0.050

F 7.40 7.60 0.291 0.299

L 0.50 1.27 0.19 0.050

M 0.75 0.029

S8° (max.)

MIN. TYP M AX. MIN. TYP . MAX.

mm. inch

7/10

VNQ860 / VNQ860SP

PowerSO-10™ MECHANICAL DATA

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

mm. inch

A 3.35 3.65 0.132 0.144

A (*) 3.4 3.6 0.134 0.142

A1 0.00 0.10 0.000 0.004

B 0.40 0.60 0.016 0.024

B (*) 0.37 0.53 0.014 0.021

C 0.35 0.55 0.013 0.022

C (*) 0.23 0.32 0.009 0.0126

D 9.40 9.60 0.370 0.378 D1 7.40 7.60 0.291 0.300

E 9.30 9.50 0.366 0.374 E2 7.20 7.60 0.283 300

E2 (*) 7.30 7.50 0.287 0.295

E4 5.90 6.10 0.232 0.240

E4 (*) 5.90 6.30 0.232 0.248

e 1.27 0.050 F 1.25 1 .35 0.049 0.053

F (*) 1.20 1.40 0.047 0.055

H 13.80 14.40 0.543 0.567

H (*) 13.85 14.35 0.545 0.565

h 0.50 0.002 L 1.20 1.80 0.047 0.070

L (*) 0.80 1.10 0.031 0.043

α 0º 8º 0º 8º

α (*) 2º 8º 2º 8º

(*) Muar only POA P013P

8/10

HE

h

A

F

A1

10

1

eB

0.25

D

= =

D1

= =

E2

DETAIL "A"

DETA IL "A"

B

0.10 A

SEATING

PLANE

A

C

α

B

E4

SEATING PLANE

A1

L

P095A

VNQ860 / VNQ860SP

PowerSO-10™ SUGGESTED PAD LAYOUT

14.6 - 14.9

10.8 - 11

6.30

0.67 - 0.73 1 2 3

9.5 4

5

10

0.54 - 0.6

9 8

7

1.27

6

TAPE AND REEL SHIPMENT (suffix “1 3TR”)

TUBE SHIPMENT (no suffix)

C

A

B

A

All dimensi ons ar e in mm.

Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)

Casablanca 50 1000 532 10.4 16.4 0.8

Muar 50 1000 53 2 4.9 17.2 0.8

MUARCASABLANCA

B

REEL DIMENSIONS

Base Q.ty 600 Bulk Q.ty 600 A (max) 330 B (min) 1.5 C (± 0.2) 13

F 20.2 G (+ 2 / -0) 24.4 N (min) 60 T (max) 30.4

C

TAPE DIMENSIONS

According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 198 6

Tape width W 24 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 24 Hole Diameter D (± 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 11.5 Compartm ent Depth K (max) 6.5 Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

Top

cover

tape

End

500mm min

All dimensions are in mm.

Empty components pockets saled with cover tape.

User direction of feed

Start

No componentsNo components Components

500mm min

9/10

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VNQ860 / VNQ860SP

Information furnished is believed to be a c c ur ate and reliab le. However, STMicroelectronics ass um es no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or oth er wise under any patent or patent r ights of STMicroelectronics . Specificatio ns m entioned in this publication are subject to c hange without notice. This publication s upersedes an d r eplaces all information p r ev iously suppl ied. STMicroelectronic s pr oducts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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Datasheet VNQ860SP, VNQ860 Datasheet (SGS Thomson Microelectronics)

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Frequently Asked Questions

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