Datasheet STPCI01 Datasheet (SGS Thomson Microelectronics)

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STPC INDUSTRIAL

PC Compatible Embedded Microprocessor

1/555/11/99

Issue 1.1

ISA

I/F

Figure 1. Logic Diagram

■ POWERFUL X86 PROCESSOR

■ 64-BIT BUS ARCHITECTURE

■ 64-BIT 66MHz DRAM CONTROLLER

■ SVGAGRAPHICS CONTROLLER

■ 135MHz RAMDAC

■ UMA ARCHITECTURE

■ TFT DISPLAY CONTROLLER

■ PCI MASTER / SLAVE / ARBITER

■ LOCAL BUS INTERFACE

■ ISA (MASTER/SLAVE) INTERFACE

-INCLUDING THE IPC

■ PC-CARD INTERFACE

- PCMCIA

- CARDBUS

■ I/O FEATURES

- PC/AT+ KEYBOARD CONTROLLER

- PS/2 MOUSE CONTROLLER

- 2 SERIAL PORTS

- 1 PARALLEL PORT

■ IPC

- DMA CONTROLLER

- INTERRUPT CONTROLLER

- TIMER / COUNTERS

■ POWER MANAGEMENT

STPC INDUSTRIAL OVERVIEW

The STPC Industrial integrates a fully static x86 processor, fully compatiblewithstandardfifthgeneration x86 processors,and combines it with powerful chipset, graphics, TFT, PC-Card, Local Bus, keyboard, mouse, serials andparallelinterfacesto provide a single Industrial oriented PC compatible subsystem ona single device.The performanceof the device is comparable with the performance of a typical P5 generation system. The device is packaged in a 388 Plastic Ball Grid Array (PBGA).

TFT

ext

x86

Core

Host I/F

Serial2

// Port

Serial1

Kbd

Mouse

DRAM

I/F

VGA

PCI m/s

Local

Bus I/F

PCMCIA

CARDBUS

PCI BUS

IPC

82C206

PCI

CONTROLLER

ISA BUS

CRTC

HW Cursor

Monitor

TFT Output

SYNC Output

TFT I/F

PBGA388

STPC INDUSTRIAL

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Issue 1.1

■ X86 Processor core

■ Fully static 32-bit 5-stage pipeline, x86

processor fully PC compatible.

■ Access up to 4GB of external memory.

■ 8Kbyte unified instruction and data cache

with write back capability.

■ Parallelprocessing integral floating point unit,

with automatic power down.

■ Clock core speeds up to 100 MHz.

■ Fully static design for dynamic clock control.

■ Low power and system management modes.

■ Optimized design for3.3V operation.

■ DRAM Controller

■ Integrated system memory and graphic frame

memory.

■ Supports up to 128-MByte system memory in

4 banks and down to as little as 2Mbytes.

■ Supports 4-MByte, 8-MByte, 16-MByte, and

32-MByte single-sided and double-sided DRAM SIMMs.

■ Four quad-word write buffers for CPU to

DRAM and PCI to DRAM cycles.

■ Four quad-word read prefetch buffers for PCI

masters.

■ Supports Fast Page Mode & EDO DRAMs.

■ Programmable timing for DRAM parameters

including CAS pulse width, CAS pre-charge time, and RAS to CAS delay.

■ 60, 70, 80 & 100ns DRAM speeds.

■ Memory hole between 1 MByte & 8 MByte

supported for PCI/ISA busses.

■ Hidden refresh.

■ Graphics Controller

■ 64-bit windows accelerator.

■ Complete backward compatibility to VGA and

SVGAstandards.

■ Hardware acceleration for text (generalized

bit map expansion), bitblts, transparent blts and fills.

■ Up to 64 x 64 bit graphics hardware cursor.

■ Up to 4MB long linear frame buffer.

■ 8, 16, 24 and 32 bit pixels.

■ Drivers for Windows and other operating

systems.

■ CRT Controller

■ Integrated 135MHz triple RAMDAC allowing

for 1280 x 1024 x 75Hz display.

■ Requires external frequency synthesizer and

reference sources.

■ 8, 16,24 and 32-bit pixels.

■ Interlaced or non-interlaced output.

■ TFT Interface

■ Programmable panel size up to 1024 by 1024

pixels.

■ Support for 640 x 480, 800 x 600 & 1024 x

768 active matrix TFT flat panels with 9, 12, 18-bit interface.

■ Support 1 & 2 Pixels per Clock.

■ Programmable image positionning.

■ Programmable blank space insertion in text

mode.

■ Programmable horizontal and vertical image

expansion in graphic mode.

■ A fully programmable PWM (Pulse Width

Modulator) signals to adjust the flat panel brightness and contrast.

■ Supports PanelLink

high speed serial transmitter externally for high resolution panel interface.

■ PCI Controller

■ Fully compliant with PCI Version 2.1

specification.

■ Integrated PCI arbitration interface. Up to 3

masters can connect directly. External PAL allows for greater than 3 masters.

■ Translation of PCI cycles to ISA bus.

■ Translation of ISA master initiated cycle to

PCI.

■ Support for burst read/write from PCImaster.

■ 0.33X and 0.5X CPU clock PCI clock.

■ Local Bus interface

■ 66MHz, low latency bus.

■ Asynchronous / synchronous.

■ 22-bit address and 16-bit data busses.

■ 2 Programmable Flash EPROM Chip Select.

■ 4 Programmable I/O Chip Select.

■ Separate memory and I/O address spaces.

■ Memory prefetch (improved performances).

STPC INDUSTRIAL

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Issue 1.1

■ ISA master/slave

■ Generation of the ISA clock from either

14.318MHz oscillator clock or system clock

■ Programmable extra wait state for ISA cycles

■ Supports I/O recovery time for back to back

I/O cycles.

■ Fast Gate A20 and Fast reset.

■ Supports the single ROM that C, D, or E.

blocks shares with F blockBIOS ROM.

■ Supports flash ROM.

■ Supports ISA hidden refresh.

■ Buffered DMA & ISA master cycles to reduce

bandwidth utilization of the PCI and Host bus. NSP compliant.

■ PC-Card interface

■ Support one PCMCIA 2.0 / JEIDA 4.1 68-pin

standard PC Card Socket.

■ Power Management support.

■ Support PCMCIA/ATA specifications.

■ Support I/O PC Card with pulse-mode

interrupts.

■ Provides an ExCA

implementation to

PCMCIA 2.0 / JEIDA 4.1 standards.

■ DMA support.

■ Keyboard interface

■ Fully PC/AT&compatible

■ Mouse interface

■ Fully PS/2 compatible

■ Serial interface

■ 15540 compatible

■ Programmable word length, stop bits, parity.

■ 16-bit programmable baud rate generator.

■ Interrupt generator.

■ Loop-back mode.

■ 8-bit scratch register.

■ Two 16-bit FIFOs.

■ Two DMA handshake lines.

■ Parallel port

■ Standard Centronics mode supported.

■ Nibblemode supported.

■ Integrated Peripheral Controller

■ Two 8237/AT compatible 7-channel DMA

controllers.

■ Two 8259/AT compatible interrupt Controller.

16 interrupt inputs - ISA and PCI.

■ Three 8254 compatible Timer/Counters.

■ Co-processor error support logic.

■ Power Management

■ Four power saving modes: On, Doze,

Standby, Suspend.

■ Programmable system activity detector

■ Supports SMM.

■ Supports IO trap & restart.

■ Independent peripheral time-out timer to

monitor hard disk, serial & parallel ports.

■ Supports APM

■ Supports RTC,interrupt and DMA wake ups

ExCA is a trademark of PCMCIA / JEIDA. PanelLink is a trademark of SiliconImage, Inc

GENERAL DESCRIPTION

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1 GENERAL DESCRIPTION

At the heart of the STPC Industrial is an advanced 64-bit processor block, dubbed the 5ST86. The 5ST86 includes a powerful x86 processor core along with a 64-bit DRAM controller, advanced 64-bit accelerated graphics and video controller, a high speed PCI local-bus controller and Industry standard PC chip set functions (Interrupt controller, DMA Controller, Interval timer and ISA bus).

The STPC Industrial has in addition to the 5ST86 a TFT output, a Local Bus interface, PC Card and super I/O features.

The STPC Industrial makes use of a tightly coupled Unified Memory Architecture (UMA), where the same memory array is used for CPU main memory and graphics frame-buffer. This means a reduction in total system memory for system performances that are equal to that of a comparable frame buffer and system memory based system, and generally much better, due to the higher memory bandwidth allowed by attaching the graphics engine directly to the 64-bit processor host interface running at the speed of the processor bus rather than the traditional PCI bus.

The 64-bit wide memory array provides the system with 320MB/s peak bandwidth, double that of an equivalent system using 32 bits. This allows for higher resolution screens and greater color depth. The processor bus runs at 66Mhz further increasing “standard” bandwidth by at least a factor of two.

The ‘standard’ PC chipset functions (DMA, interrupt controller, timers, power management logic) are integrated together with the x86 processor core; additional functions such as communication ports are accessed by the STPC Industrial via an internal ISA bus.

The PCI bus is the main data communication link to the STPC Industrial chip. The STPC Industrial translates appropriate host bus I/O and Memory cycles onto the PCI bus. It also supports the generation of Configuration cycles on the PCI bus. The STPC Industrial, as a PCI bus agent (host bridge class), fully complies with PCI specification 2.1. The chip-set also implements the PCI mandatory header registers in Type0 PCI configuration space for easy porting of PCI aware system BIOS. The device contains a PCI arbitration function for three external PCI devices.

Graphics functions are controlled through the onchip SVGA controller and the monitor display is produced through the 2D graphics display engine.

This Graphics Engine is tuned to work with the host CPU to provide a balanced graphics system with a low silicon area cost. It performs limited graphics drawing operations which include hardware acceleration of text, bitblts, transparent blts and fills. The results of these operations change the contents of the on-screen or offscreen frame buffer areas of DRAM memory. The frame buffer can occupy a space up to 4 Mbytes anywhere in the physical main memory.

The maximum graphics resolution supported is 1280x1024 in 65536 colours at 75Hz refresh rate and is VGA and SVGA compatible. Horizontal timing fields areVGA compatible while the vertical fields are extended by one bit to accommodate above display resolution.

To generate the TFT output, the STPC Industrial extracts the digital video stream before the RAMDAC and reformats it to the TFT format. The height and width of the flat panel are programmable through configuration registers up to a size of 1024 by 1024.

By default, lower resolution images cover only a part of the larger TFT panel. The STPC Industrial allows to expand the image vertically and horizontally in text mode by inserting programmable blank pixels. It allows expantion of the image vertically and horizontally in graphics mode by replicating pixels. The replication of J times every K pixel is independently programmable in the vertical and horizontal directions.

PanelLinkTMis a proprietary interconnect

protocol defined by Silicon Image, Inc. It consists of a transmitter that takes parallel video/graphics data from the host LCD graphics controller and transmits it serially at high speed to the receiver which controls the TFT panel. The TFT interface is designed to support the connection of this control signal to the PanelLinkTMtransmitter.

The STPC Industrial CARDBUS / PCMCIA controller has been specifically designed to provide the interface with PC-Cards which contain additional memory or I/O and provides an

ExCATMimplementation to PCMCIA 2.0 / JEIDA

4.1 standards. The power management control facilities include

socket power control, insertion/removal capability, power saving with Windows inactivity, NCS controlled Chip Power Down, together with further controls for 3.3v suspend with Modem Ring Resume Detection.

GENERAL DESCRIPTION

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The need for system configuration jumpers is eliminated by providing address mapping support for PCMCIA 2.0 / JEIDA 4.1 PC-Card memory together with address windowing support for I/O space.

Selectable interrupt steering from PC-Card to internal system bus is also provided.

The STPC Industrial implements a multi-function parallel port. The standard PC/AT compatible logical address assignments for LPT1, LPT2 and LPT3 are supported.

The parallel port can be configured for any of the following 3 modes and supports the IEEE Standard 1284 parallel interface protocol standards as follow:

-Compatibility Mode (Forward channel, standard)

-Nibble Mode (Reverse channel, PC compatible)

-Byte Mode (Reverse channel, PS/2 compatible)

The STPC Industrial BGA package has 388 balls, but this is not sufficient for all the integrated functions, therefore some features are sharing the same balls and can not be used at the same time. The STPC Industrial configuration is done by ‘strap options’. It is a set of pull-up or pull-down resistors on the memory data bus, checked on reset, which auto-configure the STPC Industrial.

We can distinguish three main blocks

independently configurables

: The ISA / Local Bus block, the Serial 1 / TFT block, and the PCI / PC Card block.

From the first block,we can activateeither the ISA bus and some IPC additionnal features, or the Local bus, the parallel port and the second serial interface.

From the second block, we can activate either the first serial port, or the TFT extension to get from 4 bit per colour to 6 bit per colour.

From the third block, we can activate either the PCI bus, or the PC Card interface (CardBus/ PCMCIA/ZoomVideo).

The STPC Industrial core is compliant with the Advanced Power Management (APM) specification to provide a standard method by which the BIOS can control the power used by personal computers. The Power Management Unit module (PMU) controls the power consumption providing a comprehensive set of features that control the power usage and supports compliance with the United States Environmental Protection Agency’s Energy Star Computer Program. The PMU provides following hardware structures to assist the software in managing the power consumption by the system.

- System Activity Detection.

- 3 power-down timers detecting system inactivity:

- Doze timer (short durations).

- Stand-by timer (medium durations).

- Suspend timer (long durations).

- House-keeping activity detection.

- House-keeping timer to cope with short bursts of house-keepingactivity while dozing or in stand-by state.

- Peripheral activity detection.

- Peripheral timer detecting peripheral inactivity

- SUSP# modulation to adjust the system performance in various power down states of the system including full power on state.

- Power control outputs to disable power from different planes of the board.

Lack of system activity for progressively longer periods of time is detected by the three power down timers. These timers can generate SMI interrupts to CPU so that the SMM software can put the system in decreasing states of power consumption. Alternatively, system activity in a power down state can generate SMI interrupt to allow the software to bring the system back up to full power on state. The chip-set supports up to three power down states described above, these correspond to decreasing levels ofpower savings.

Power down puts the STPC Industrial into suspend mode. The processor completes execution of the current instruction, any pending decoded instructions and associated bus cycles. During the suspend mode, internal clocks are stopped. Removing power down, the processor resumes instruction fetchingand begins execution in the instruction stream at the point it had stopped. Because of the static nature of the core, no internal data is lost..

GENERAL DESCRIPTION

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Figure 1.1. Functionnal description.

x86

Core

Host I/F

Serial 2

// Port

Serial 1

DRAM

I/F

VGA

PCI m/s

Local

Bus I/F

PCMCIA

CARDBUS

PCI BUS

ISA m/s

IPC

82C206

PCI m/s

ISA BUS

CRTC

HW Cursor

Monitor

TFT Output

SYNC Output

TFT I/F

TFT

extension

Kbd

Mouse

GENERAL DESCRIPTION

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Figure 1.2. PCI, PCMCIA & CARDBUS modes:

PCI m/s

PCMCIA

CARDBUS

PCI BUS

PCI m/s

PCMCIA

CARDBUS

PCI BUS

PCI m/s

PCMCIA

CARDBUS

PCI BUS

GENERAL DESCRIPTION

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Issue 1.1

Figure 1.3. Local Bus and ISA bus modes:

Figure 1.4. TFT in normal (serial 1 available) and extended modes (serial 1 unavailable).

Serial 2

// Port

Local

Bus I/F

ISA m/s

IPC

82C206

ISA BUS

Serial 2

// Port

Local

Bus I/F

ISA m/s

IPC

82C206

ISA BUS

Serial 1 TFT

extension

TFT

extension

TFT Output

TFT I/F

Kbd

Mouse

Serial 1Kbd

Mouse

TFT Output

TFT I/F

9-bit mode

12-bit mode

18-bit mode

2 x 9-bit mode

GENERAL DESCRIPTION

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Figure 2. Typical PC oriented Application

ISA

PCI

4x 16-bit EDO DRAMs

Super I/O

Flash

IDE Serial Ports Parallel Port Floppy

Monitor

TFT

SVGA

IRQ

DMA.REQ

DMA.ACK

DMUX

MUX

STPC Industrial

RTC

Mouse

Keyboard

GENERAL DESCRIPTION

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Figure 3. Typical Embedded Application

STPC Industrial

PC-Card

4x 16-bit EDO DRAMs

Flash

Peripheral

IRQ

MUX

PCMCIA CARDBUS

Monitor

TFT

SVGA

Mouse

Keyboard

Serial Ports Parallel Port

STPC Local Bus

I/O

SRAM

STRAP OPTION

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Issue 1.1

2 STRAP OPTION

This chapter defines the STPC Industrial Strap Options and their location

Memory

Data

Lines

Refer to Designation Location

Actual Settings

Set to ’0’ Set to ’1’

MD0 - Reserved - - - MD1 - Reserved - - - MD2 DRAM Bank 1 Speed Index 4A,bit 2 User defined 70 ns 60 ns MD3 Speed Index 4A,bit 3 Pull up MD4 Type Index 4A,bit 4 User defined EDO FPM MD5 DRAM Bank 0 Speed Index 4A,bit 5 User defined 70 ns 60 ns MD6 Speed Index 4A,bit 6 Pull up MD7 Type Index 4A,bit 7 User defined EDO FPM MD8 - Reserved - - - -

MD9 - Reserved - - - MD10 DRAM Bank 3 Speed Index 4B,bit 2 User defined 70 ns 60 ns MD11 Speed Index 4B,bit 3 Pull up MD12 Type Index 4B,bit 4 User defined EDO FPM MD13 DRAM Bank 2 Speed Index 4B,bit 5 User defined 70 ns 60 ns MD14 Speed Index 4B,bit 6 Pull up MD15 Type Index 4B,bit 7 User defined EDO FPM MD16 Reserved Index 4C,bit 0 MD17 PCI Clock PCI_CLKO Divisor Index 4C,bit 1 User defined HCLK / 3 HCLK / 2 MD18 Host Clock HCLK Pad Direction Index 4C,bit 2 User defined External Internal MD19 Graphics Clock GCLK2x Pad Direction Index 4C,bit 3 User defined External Internal MD20 DOT Clock DCLK Pad Direction Index 4C,bit 4 User defined External Internal MD21 Reserved Pull up MD22 External IPC Debug Option Index 5F,bit 1 Pull up External IPC Internal IPC MD23 - Reserved Index 5F,bit 2 Pull up - MD24 HCLK HCLK PLL Speed Index 5F,bit 3 User defined 000 25 MHz MD25 Index 5F,bit 4 User defined 001 33 MHz MD26 Index 5F,bit 5 User defined 010 40 MHz

011 50 MHz 100 60 MHz 101 66 MHz 110 75 MHz 111 80 MHz

MD27 Reserved Pull down MD28 Reserved Pull down MD29 Reserved Pull down MD30 Reserved Pull down MD31 Reserved Pull down MD32 Reserved Pull down MD33 Reserved Pull up MD34 Reserved Pull down MD35 Reserved Pull up

MD 36 Reserved Pull up MD 37 Reserved Pull up MD 38 Reserved Pull up

STRAP OPTION

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2.1 STRAP OPTION REGISTER DESCRIPTION

2.1.1 STRAP REGISTER 0 INDEX 4AH (STRAP0)

Bits 7-0, This register reflect the status of pins MD[7:0] respectively. They are expected to be connected on the system board to the SIMM configuration pins as follows:

Note that the SIMM speed and type information read here is meant only for the software and is not used by thehardware. The software must program the Host and graphics DRAM controller configuration registers appropriately based on these bits.

This register defaults to the values sampled on MD[7:0] pins after reset.

MD 39 Reserved Pull up MD 40 PCMCIA or PCI i/f 3C,bit 0 User defined PCI PCMCIA MD 41 Local Bus or ISA i/f 3C,bit 1 User defined ISA Local Bus MD 42 Key Board & Mouse 3C,bit 2 User defined External Internal MD 43 Parallel Port 3C,bit 3 User defined External Internal MD 44 Serial Port UART1 3C,bit 4 User defined External Internal MD 45 UART2 3C,bit 5 User defined External Internal MD 46 Reserved 3C,bit 6 Pull down MD 47 Reserved 3C,bit 7 Pull down MD 48 TFT Outputs on RFU pads 3D,bit 0 User defined Disable Enable

MD 49 Cardbus Socket 5V Availability 3D,bit 1 User defined

Not Availa-

ble

Available

MD 50 3.3V Availability 3D,bit 2 User defined

Not Availa-

ble

Available

MD 51 x.xV Available 3D,bit 3 User defined

Not Availa-

ble

Available

MD 52 y.yV Available 3D,bit 4 User defined

Not Availa-

ble

Available

MD 53 Reserved Pull uo MD 56 Reserved Pull up MD 57 Reserved Pull down MD 58 Reserved Pull up MD 59 Reserved Pull down

Bit Sampled Description

Bit 7 SIMM 0 DRAM type

Bits 6-5 SIMM 0 speed

Bit 4 SIMM 1 DRAM type Bits 3-2 SIMM 1 speed Bits 1-0 Reserved

Memory

Data

Lines

Refer to Designation Location

Actual Settings

Set to ’0’ Set to ’1’

STRAP OPTION

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Issue 1.1

2.1.2 STRAP REGISTER 1 INDEX 4BH (STRAP1)

Bits 7-0, This register reflect the status of pins MD[15:8] respectively. They are expected tobe connected on the system board to the SIMM configuration pins as follows:

Note that the SIMM speed and type information read here is meant only for the software and is not used by the hardware. The software must program the Host and graphics dram controller configuration registers appropriately based on these bits.

This register defaults to the values sampled on MD[15:8] pins after reset.

2.1.3 STRAP REGISTER 2 INDEX 4CH (STRAP2)

Bits 4-0of this register reflect the status of pins MD[20:16] respectively. Bit 5 ofthis register reflect the status of pin MD[23]. Bit 4 is writeable, writes to other bits in this register have no effect.

They are use by the chip as follows:

Bits 7-5, Reserved

Bit 4, This bit reflects the value sampled on MD[20] pin and controls the Dot clock (DCLK) source. Note this bit is writeable as well as readable.

Bit 3, This bit reflects the value sampled on MD[19] pin and controls the Graphics clock source.

Bit 2, This bit reflects the value sampled on MD[18] pin and controls the Host/CPU clock source as follows: setting to’0’: External. HCLK pin is an input, setting to ’1’: Internal. HCLK pin is an output and is connected to the internal frequency synthesizer output.

Bit 1, This bit reflects the value sampled on MD[17] pin and controls the PCI clock output as follows:

Setting to ’0’, the PCI clock output = HCLK / 3 Setting to ’1’, the PCI clock output = HCLK / 2

Bit 0, Reserved.

This register defaults to the values sampled on MD[23] & MD[20:16] pins after reset.

Bit Sampled Description

Bit 7 SIMM 2 DRAM type Bits 6-5 SIMM 2 speed

Bit 4 SIMM 3 DRAM type: Bits 3-2 SIMM 3 speed

Bit 1-0 Reserved

STRAP OPTION

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2.1.4 STRAP REGISTER 3 INDEX 3CH (STRAP3)

Bits 7-0 of this register reflect the status of pins MD[47:40] respectively.

They are use by the chip as follows:

Bit 7-6, Reserved.

Bit 5, UART2 internal or external. This bit reflects the value sampled on MD[45] pin and controls the UART2 I/F as follows:

Setting to ’0’, UART2 is external. Setting to ’1’, UART2 is internal.

Bit 4, UART1 internal or external and additional TFT outputs. This bit reflects the value sampled on MD[44] pin and controls the UART1 I/F and the additional TFT I/F as follows:

Setting to ’0’, UART1 is external and anadditional 6 TFT outputs (lowest bits - 2 red, 2 green and 2 blue) are enabled.

Setting to ’1’, UART1 is internal.

Note that when strap option testbus enabled (see Section 2.1.3 Strap Register 2 bit 0) is driven to 1 it takes priority over this strap which becomes meaningless.

Bit 3, Parallel Port internal or external. This bitreflects the value sampled on MD[43] pin and controls the Parallel Port i/f as follows:

Setting to ’0’, the Parallel Port is external Setting to ’1’, the Parallel Port is internal

Bit 2, KB/Mouse internal or external. This bit reflects the value sampled on MD[42] pin and controls the KB/Mouse controller i/f as follows:

Setting to ’0’, the KB/Mouse controller is external Setting to ’1’, the KB/Mouse controller is internal

Bit 1, Local Bus i/for ISA I/F. This bit reflects thevalue sampled on MD[41] pin and sets whether the Local Bus i/f or the ISA i/f is available at the device i/f as follows:

Setting to ’0’, selectes the ISA I/F Setting to ’1’, selectec the Local Bus I/F

Bit 0 PCMCIA I/F or PCI I/F. This bit reflects the value sampled on MD[40] pin and sets whether the PCMCIA i/f or the PCI i/f is available at the device i/f as follows:

Setting to ’0’, selects the PCI I/F Setting to ’1’, selects the PCMCIA I/F

This register defaults to the values sampled on MD[47:40] pins after reset.

STRAP OPTION

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Issue 1.1

2.1.5 STRAP REGISTER 4 INDEX 3Dh (STRAP4)

Bits 5-0 of this register reflect the status of pins MD[53:48] respectively.

They are use by the chip as follows:

Bits 7-5 Reserved. Bit 4, y.y V present on board. This bit reflects the value sampled on MD[52] pin and is used to notify the

Cardbus socket management unit if the y.y V vcc voltage (where y.y is less than x.x) is present on board as follows

Setting to ’0’, y.y V Vcc voltage is not available Setting to ’1’: y.y V Vcc voltage is available.

Bit 3, x.x V present on board. This bit reflects the value sampled on MD[51] pin and is used to notify the Cardbus socket management unit if the x.x V vcc voltage (where x.x is less than 3.3) is present on board as follows:

Setting to ’0’, x.x V Vcc voltage is not available. Setting to ’1’: x.x V Vcc voltage is available.

Bit 2, 3.3 V present on board. This bit reflects the value sampled on MD[50] pin and is usedto notify the Cardbus socket management unit if the 3.3 V vcc voltage is present on board as follows:

Setting to ’0’, 3.3 V vcc voltage is not available. Setting to ’1’, 3.3 V vcc voltage is available.

Bit 1, 5 V present on board. This bit reflects the value sampled on MD[49] pin and is used to notify the Cardbus socket management unit if the 5 V vcc voltage is present on board as follows:

Setting to ’0’, 5 V vcc voltage is not available. Setting to ’1’, 5 V vcc voltage is available.

Bit 0, This bit reflects the value sampled on MD[48] pin and is used to enable the TFT controller outputs on pads RFU0-RFU11 as follows:

RFU0 : R[2] RFU1 : R[3] RFU2 : R[4] RFU3 : R[5] RFU4 : G[2] RFU5 : G[3] RFU6 : G[4] RFU7 : G[5] RFU8 : B[2] RFU9 : B[3] RFU10 : B[4] RFU11 : B[5]

This register defaults to the values sampled on MD[53:48] pins after reset.

STRAP OPTION

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2.1.6 HCLK PLL STRAP REGISTER 0 INDEX 5FH (HCLK_STRAP0)

Bits 5-0 of this register reflect the status of pins MD[26:21] respectively.

They are use by the chip as follows:

Bits 7-6, Reserved.

Bits 5-3,These pins reflect the value sampled on MD[26:24] pinsrespectively and control the Host clock frequency synthesizer.

Bit 2-1, Reserved.

Bit 0, Reserved.

This register defaults to the values sampled on above pins after reset.

PIN DESCRIPTION

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Issue 1.1

3 PIN DESCRIPTION

3.1. INTRODUCTION

The STPC Industrial integrates most of the functionalities of the PC architecture. Therefore, many of the traditional interconnections between the host PC microprocessor and the peripheral devices are totally internal to the STPC Industrial. This offers improved performance due to the tight coupling of theprocessor coreand it’s peripherals. As a result many of the external pin connections are made directly to the on-chip peripheral functions.

Figure 3-1 shows the STPC Industrial’s external interfaces. It defines the main busses and their function. Table 3-1 describes the physical implementation listing signal types and their functionalities. Table 3-2 provides a full pin listing and description.

Table 3-4 provides a full listing of theSTPC Industrial package pin location physical connection. Please refer tothe pin allocation drawing for reference.

Due to the number of pins available for the package, and the number offunctional I/Os, some pins have several functions, selectable by strap option on Reset. Table 3-3 provides a summary of these pins and their functions.

Table 3-1. Signal Description

Group name Qty

Basic Clocks, Reset & Xtal (SYS) 13 DRAM Controller(DRAM) 89 PCI Controller 55

PC Card Interface 64 Keyboard/Mouse Controller (SIO) 4 Local Bus I/F, Parallel I/F,Serial 2 75

ISA Interface/IPC extensions 73 Serial 1 (SIO) 8

TFT output 24 VGA Controller (VGA) 10 Grounds 74 V

Analog specific V

CC/VDD

16 Reserved 1 TotalPin Count 388

Figure 3-1. STPC Industrial External Interfaces

PCI

x86 core

DRAM VGA TFT SYS SIO

89 10 24 12 55

75 38

STPC Industrial

CARD

ISA/

LOCAL BUS

NORTH BRIDGE SOUTH BRIDGE

PIN DESCRIPTION

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Issue 1.1

Table 3-2. Definition of Signal Pins

Signal Name Dir Description Qty

BASIC CLOCKS AND RESETS

SYSRSTI#* I System Reset / Power good 1 SYSRSTO#* O Reset Output to System 1 XTALI I 14.3MHz Crystal Input 1 XTALO O 14.3MHz Crystal Output 1 PCI_CLKI* I 33MHz PCI/CardBus Input Clock 1 PCI_CLKO O 33MHz PCI/CardBus Output Clock 1 ISA_CLK, ISA_CLK2X O ISA Clock x1 and x2 (also Multiplexer Select Line For IPC) 2 CLK14M O ISA bus synchronisation clock 1 HCLK* I/O 33 / 66MHz Host Clock (Test) 1 DEV_CLK* O 24MHz Peripheral Clock 1 GCLK2X I/O 80MHz Graphics Clock 1 DCLK I/O 135MHz Dot Clock 1

_xxx_PLL Power Supply for PLL Clocks

MEMORY INTERFACE

MA[11:0] I/O Memory Address 12 RAS#[3:0] O Row Address Strobe 4 CAS#[7:0] O Column Address Strobe 8 MWE# O Write Enable 1 MD[63:0] I/O Memory Data 64

LOCAL BUS INTERFACE(COMBINED WITH ISA BUS )

PA[21:0]* O Address Bus [21:0] 22 PD[15:0]* I/O Data Bus [15:0] 16 PRDY#* I Ready 1 PWR#[1:0]* O Memory and I/O Write signals 2 PRD#[1:0]* O Memory and I/O Read signals 2 FCS#[1:0]*, IOCS#[3:0]* O Flash Memory and I/O Chip Select 6

ISA BUS INTERFACE (COMBINED WITH LOCAL BUS, PARALLEL PORT, SERIAL INTERFACE)

LA[23:17]* O Unlatched Address 7 SA[19:0]* O Latched Address 20 SD[15:0]* I/O Data Bus 16 IOCHRDY* I I/O Channel Ready 1 ALE* O Address Latch Enable 1 BHE#* O System Bus High Enable 1 MEMR#*, MEMW#* I/O Memory Read & Write 2 SMEMR#*, SMEMW#* O System Memory Read and Write 2 IOR#*, IOW#* I/O I/O Read and Write 2 MASTER#* I Add On Card Owns Bus 1 MCS16#*, IOCS16#* I Memory Chip Select 16, I/O Chip Select 16 2 REF#* I Refresh Cycle 1 AEN* O Address Enable 1 IOCHCK#* I I/O Channel Check (ISA) 1 RTCRW#* O RTC Read / Write# 1 RTCDS#* O RTC Data Strobe 1 RTCAS#* O RTC Address Strobe 1

PIN DESCRIPTION

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RMRTCCS#* O ROM / RTC Chip Select 1

GPIOCS#* I/O General Purpose Chip Select 1

IRQ_MUX[3:0]* I Multiplexed Interrupt Request 4 DACK_ENC[2:0]* O DMA Acknowledge 3 DREQ_MUX[1:0]* I Multiplexed DMA Request 2 TC* O ISA Terminal Count 1

KEYBOARD & MOUSE INTERFACE

KBDATA*,MDATA* I Keyboard & Mouse Data Line 2 KBCLK*, MCLK* O Keyboard & Mouse Clock Line 2

SERIAL INTERFACE (SERIAL 1 COMBINED WITH TFT INTERFACE / SERIAL 2 COMBINED WITH IPC )

SIN1*, SIN2* I Serial Data In (Serial 1, 2) 2 SOUT1*, SOUT2* O Serial Data Out (Serial 1, 2) 2 CTS1#*, CTS2#* I Clear ToSend (Serial 1, 2) 2 RTS1#*, RTS2#* O Request ToSend (Serial 1, 2) 2 DSR1#*, DSR2#* I Data Set Ready (Serial 1, 2) 2 DTR1#*, DTR2#* O Data Terminal Ready (Serial 1,2) 2 DCD1#*, DCD2#* I Data Carrier Detect (Serial 1, 2) 2 RI1#*, RI2#* I Ring Indicator (Serial 1, 2) 2

PARALLEL PORT (COMBINED WITH ISA BUS AND IPC)

PE* I Paper End 1 SLCT* I SELECT 1 BUSY#* I BUSY 1 ERR#* I ERROR 1 ACK#* I Acknowledge 1 PDDIR#* O Parallel Device Direction 1 STROBE#* O PCS / STROBE# 1 INIT#* O INIT 1 AUTPFDX#* O Automatic Line Feed 1 SLCTIN#* O SELECT IN 1 PPD[7:0]* I/O Data Bus 8

PCMCIA INTERFACE(COMBINED WITH PCI / CARDBUS)

RESET* O Reset 1 A[25:0]* O Address Bus 26 D[15:0]* I/O Data Bus 16 IORD#*, IOWR#* O I/O Read and Write 2 DREQ#* / WP*/ IOIS16#* I DMA Request // Write Protect // I/O Size is 16 bit 1 BVD1*, BVD2* I Battery Voltage Detect 2

READY#*/BUSY#*/IREQ#* I Ready / Busy // Interrupt Request 1

WAIT#* I Wait 1 INPACK#* I Input Port Acknowledge 1 OE#* / TCw* O Output Enable // DMA Terminal Count 1 WE#* / TCr* O Write Enable // DMA Terminal Count 1 DACK* / REG#* O DMA Acknowledge // Register 1 CD1#*, CD2#* I Card Detect 2

Table 3-2. Definition of Signal Pins

Signal Name Dir Description Qty

PIN DESCRIPTION

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CE1#*, CE2#* O Card Enable 2 VS1#*, VS2#* I VoltageSense 2 VCC5_EN* O Power Switch control : 5v power 1 VCC3_EN* O Power Switch control : 3.3v power 1 VPP_PGM* O Power Switch control : Program power 1 VPP_VCC* O Power Switch control : VCC power 1

CARDBUS INTERFACE(COMBINED WITH PCI / PCMCIA)

CCLKRUN* I/O Clock 1 CRST#* O Reset 1 CSTSCHG#* I System Change 1 CAD[31:0]* I/O Address / Data 32 CBE[3:0]* I/O Bus Commands / Byte Enables 4 CFRAME#* I/O Cycle Frame 1 CTRDY#* I/O Target Ready 1 CIRDY#* I/O Initiator Ready 1 CSTOP#* I/O Stop Transaction 1 CDEVSEL#* I/O Device Select 1 CPAR* I/O Parity Signal Transactions 1 CSERR#* I System Error 1 CPERR#* I/O Parity Error 1 CBLOCK#* I/O PCI Lock 1 CCD[2:1]* I Card Detect 2 CINT#* I Interrupt Request 1 CREQ#* I Request 1 CGNT#* O Grant 1

PCI INTERFACE(COMBINED WITH PCMCIA / CARDBUS)

AD[31:0]* I/O Address / Data 32 BE[3:0]* I/O Bus Commands / Byte Enables 4 FRAME#* I/O Cycle Frame 1 TRDY#* I/O Target Ready 1 IRDY#* I/O Initiator Ready 1 STOP#* I/O Stop Transaction 1 DEVSEL#* I/O Device Select 1 PAR* I/O Parity Signal Transactions 1 SERR#* O System Error 1 LOCK#* I PCI Lock 1 PCI_REQ#[2:0]* I PCI Request 3 PCI_GNT#[2:0]* O PCI Grant 3 PCI_INT[3:0]* I PCI Interrupt Request 4

Table 3-2. Definition of Signal Pins

Signal Name Dir Description Qty

PIN DESCRIPTION

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Note; *denotes theat the pin is V5T(see Section 4 )

MONITOR INTERFACE

RED, GREEN, BLUE O Red, Green, Blue 3 VSYNC* I/O Vertical Sync 1 HSYNC* I/O Horizontal Sync 1 VREF_DAC I DAC Voltage reference 1 RSET I Resistor Set 1 COMP I Compensation 1

DDC[1:0]* I/O Display Data Channel Serial Link 2 SCL / DDC[1]* I/O I C Interface - Clock / Can be used fo r VG A DDC[1] signal 1 SDA / D DC[0]* I/O I C Interface - Data / Can be used fo r VG A DDC[0] signal 1

TFT INTE RFACE(COMBINE D W ITH S ERIAL 1)

R[5:0], G[5:0], B[ 5:0] O Red, G reen, Blue 18

FPLINE O H orizontal S ync 1

FPFRAME O Vertical S ync 1

DE O Data Enable 1

ENAVDD O E nable Vd d of f lat panel 1

ENVCC O E nable Vc c of fl at panel 1

PWM O P WM back-light control 1

MISCELLA NEO US

SPKRD* O S peaker Device Outp ut 1

SCAN_ENABLE I Test Pin - Reserved 1

Table 3-2. Definition of Signal Pi ns

Signal Name Dir Description Qty

PIN DESCRIPTION

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3.2. SIGNAL DESCRIPTIONS

3.2.2 BASIC CLOCKS AND RESETS

SYSRSTI#

System Reset/Power good.

This input is low when the reset switch is depressed. Otherwise, it reflects the power supply’s power good signal. PWGD is asynchronous to all clocks, and acts as a negative active reset. The reset circuit initiates a hard reset on the rising edge of PWGD.

SYSRSTO#

Reset Output to System.

This is the system resetsignal and is used to reset the rest of the components (not on Host bus) in the system. The ISA bus reset is an externally inverted buffered versionof this output and the PCIbus resetis an externally buffered version of this output.

XTALI

14.3MHz Crystal Input

XTALO

14.3MHz Crystal Output.

These pins are the 14.318MHz crystalinput; This clock isused as the reference clock for the internal frequency synthesizer to generate the HCLK and CLK24M. A 14.318 MHz Series Cut Quartz Crystal should be connected between these two pins. Balance capacitors of 15 pF should also be added. In the event of an external oscillatorproviding the master clock signalto the STPC Industrialdevice, the TTL signal should be provided on XTALO.

PCI_CLKI

33MHz PCI Input Clock

This signal must be connected to a clock generator and is usually connected to PCI_CLKO.

PCI_CLKO

33MHz PCI Output Clock.

This is the

master PCI bus clock output

ISA_CLK

ISA Clock Output (also Multiplexer Se-

lect Line For IPC).

This pin produces the Clock signal for the ISA bus. It is also used with ISA_CLK2X as the multiplexor control lines for the Interrupt Controller Interrupt input lines. This is a divided down version of the PCICLK or OSC14M.

ISA_CLKX2

ISA Clock Output (also Multiplexer

Select Line For IPC).

This pin produces a signal at twice the frequency of the ISA bus Clock signal. It is also used with ISA_CLK as the multiplexor control lines for the Interrupt Controller Interrupt input lines.

CLK14M

ISA bus synchronisation clock.

This is the buffered 14.318 Mhzclock to the ISA bus. This clock also provides the reference clock to the frequency synthesizer that generates GCLK2X and DCLK.

HCLK

Host Clock.

This is the host 1X clock. Its frequency can vary from 50 to 75 MHz. All host transactions and PCI transactions are synchronized to this clock. Host transactions executed by the DRAM controller are also driven by this clock.

DEV_CLK

24MHz Peripheral Clock (floppydrive).

This 24MHZ signal is provided as a convenience for the system integration of a Floppy Disk driver function in an external chip.

GCLK2X

80MHz Graphics Clock.

This is the Graphics 2X clock, which drives the graphics engine and the DRAM controller to execute the graphics and display cycles. Normally GCLK2X isgenerated by the internal frequency synthesizer, and this pin is an output. By setting a bit in Strap Register 2, this pin can be made an input so that an external clock can replace the internal frequency synthesizer.

DCLK

135MHz Dot Clock.

This is the dot clock, which drivesgraphics display cycles.Its frequency can be as high as 135 MHz, and it is required to have a worst case duty cycle of 60-40. For further details, refer to Section 2.1.3 bit 4.

3.2.3 MEMORY INTERFACE

MA[11:0]

Memory Address.

These 12 multiplexed memory addresspins support external DRAM with up to 4K refresh. These include all 16M x N and some 4M x N DRAM modules. The address signals must be externally buffered to support more than 16 DRAM chips. The timing of these signals can be adjusted by software to match the timings of most DRAM modules.

MD[63:0]

Memory Data.

This is the 64-bit memory data bus. If only half of a bank is populated, MD63-32 is pulled high, data is on MD31-0. MD20-0 are also used as inputs at the rising edge of PWGD to latch in power-up configuration information into the ADPC strap registers.

PIN DESCRIPTION

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RAS#[3:0]

Row Address Strobe.

There are 4 active low row address strobe outputs, one each for each bank of the memory. Each bank contains 4 or 8-Bytes of data. The memory controller allows half of a bank (4-Bytes) to be populated to enable memory upgrade at finer granularity. The RAS# signals drive the SIMMs directly without any external buffering. These pins are always outputs, but they can also simultaneously be inputs, toallow the memory controller to monitor the value of the RAS# signals at the pins.

CAS#[7:0]

Column Address Strobe.

There are 8 active low column address strobe outputs, one each for each Byte of the memory. The CAS# signals drive the SIMMs either directly or through external buffers. These pins are always outputs, but they can also simultaneously be inputs, to allow the memory controller to monitor the value of the CAS# signals at the pins.

MWE#

Write Enable.

Write enable specifies whether the memory access is a read (MWE# = H) or a write (MWE# = L). This single write enable controls all DRAMs. It can be externally buffered to boost the maximum number of loads (DRAM chips) supported. The MWE# signals drive the SIMMs directly without any external buffering.

3.2.4 LOCAL BUS INTERFACE

(Combined with ISA Bus)

PA[21:0]

Memory Address.

This is the 22-bit Lo-

cal Bus Address

PD[15:0]

Data Bus.

This is the 16-bit bidirectional

Local Bus Data bus.

PRDY#

Ready.

This input signals the Local Bus

Ready state.

PWR#1

Memory and I/O Write signal

for MS Byte

PWR#0

Memory and I/O Write signal

for LS Byte

PRD#1

Memory and I/O Read signals

for MS

Byte

PRD#0

Memory andI/O Read signals

for LS Byte

FCS#[1:0], IOCS#[3:0]

Flash Memory and I/O

Chip select.

3.2.5 ISA BUS INTERFACE

LA[23:17]

Unlatched Address.

These unlatched ISA Bus pins address bits 23-17 on 16-bit devices. When the ISA bus is accessed by any cycle initiated from the PCI bus, these pins are in output mode. When an ISA bus master owns the bus, these pins are tristated.

SA[19:0]

Unlatched Address.

These are the 20 low bits of the system address bus of ISA. These pins are used as an input when an ISA busmaster owns the bus and are outputs at all other times.

SD[15:0]

I/O Data Bus (ISA).

These are the exter-

nal ISA databus pins.

IOCHRDY

IOChannel Ready.

IOCHRDY is the IO channel ready signal of the ISA bus and is driven as an output in response to an ISA master cycle targeted to the host bus or an internal register of the STPC Industrial. The STPC Industrial monitors this signal as an input when performing an ISA cycle on behalf of the host CPU, DMA master or refresh. ISA masters which do not monitor IOCHRDY are not guaranteed to work with the STPC Industrial since the access to the system memory can be considerably delayed due to CRT refresh or a write back cycle.

ALE

Address Latch Enable.

This is the address latch enable output of the ISA bus and is asserted by the STPC Industrial to indicate that LA23-17, SA19-0, AEN and SBHE# signals are valid. The ALE is driven high during refresh, DMA master or an ISA master cycles by the STPC Industrial. ALE is driven low after reset.

BHE#

System Bus HighEnable.

This signal,when asserted, indicates that a data Byte is being transferred on SD15-8 lines. It is used as an input when an ISA master owns the bus and is an output at all other times.

MEMR#

Memory Read.

This is the memory read command signal of the ISAbus. It is used as an input when an ISA master owns the bus and is an output at all other times. The MEMR# signal is active during refresh.

MEMW#

Memory Write.

This is the memory write command signal of the ISAbus. It is used as an input when an ISA master owns the bus and is an output at all other times.

PIN DESCRIPTION

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SMEMR#

System Memory Read.

The STPC Industrial generates SMEMR# signal of the ISA bus only when the address is below one MByte or the cycle is a refresh cycle.

SMEMW#

System Memory Write.

The STPC Industrial generatesSMEMW# signal of the ISA bus only when the address is below one MByte.

IOR#

I/O Read.

This is the IO read command signal of the ISA bus. It is an input when an ISA master owns the bus and is an output at all other times.

IOW#

I/O Write.

This is the IO write command signal of the ISA bus. It is an input when an ISA master owns the bus and is an output at all other times.

MASTER#

Add On CardOwns Bus.

This signal is active when an ISA device has been granted bus ownership.

MCS16#

Memory Chip Select16.

This is the decode of LA23-17 address pins of the ISA address bus without any qualification of the command signal lines. MCS16# is always an input. The STPC Industrial ignores this signal during IO and refresh cycles.

IOCS16#

IO Chip Select16.

This signal is the decode of SA15-0 address pins of the ISA address bus without any qualification of the command signals. The STPC Industrial does not driveIOCS16# (similar to PC-AT design). An ISA master access to an internal register of the STPC Industrial is executed as an extended 8-bit IO cycle.

REF#

Refresh Cycle.

This is the refresh command signal of the ISA bus. It is driven as an output when the STPC Industrial performs arefresh cycle on the ISA bus. It is used as an input when an ISA master owns the bus and is used to trigger a refresh cycle. The STPC Industrial performs a pseudo hidden refresh. It requests the host bus for two host clocks to drive the refresh address and capture it in external buffers. The host bus is then relinquished while the refresh cycle continues on the ISA bus.

AEN

Address Enable.

Address Enable is enabled when the DMA controller is the bus owner to indicate that a DMA transfer will occur. The enabling of the signal indicates to IO devices to ignore the IOR#/IOW# signal during DMA transfers.

IOCHCK#

IO Channel Check.

IO Channel Check is enabled by any ISA device to signal an error condition that can not be corrected. NMI signal becomes active upon seeing IOCHCK# active if the corresponding bit in Port B is enabled.

GPIOCS#

I/O General Purpose Chip Select 1.

This output signal is used by the external latch on ISA bus to latch the data on the SD[7:0] bus. The latch can be use by PMU unit to control the external peripheral devices to power down or any other desired function. This pin is also serves as a strap input during reset.

RTCRW#

Real Time Clock RW#.

This pin is used as RTCRW#. This signal is asserted for any I/O write to port 71h.

RTCDS#

Real Time Clock DS

. This pin is used as RTCDS. This signal is asserted for any I/O read to port 71h.

RTCAS#

Real time clock address strobe.

This sig-

nal is asserted for any I/O write to port 70h.

RMRTCCS#

ROM/Real Time clock chip select.

This pin is a multi-function pin. This signal is asserted if a ROM access is decoded during a memory cycle. It should be combined with MEMR# or MEMW# signals to properly access the ROM. During an IO cycle, this signal is asserted if access to the Real Time Clock (RTC) is decoded. It should be combined with IOR# or IOW# signals to properly access the real time clock.

IRQ_MUX[3:0]

Multiplexed Interrupt Request.

These are the ISA bus interrupt signals. They are to be encoded before connection to the STPC Industrial using ISACLK and ISACLKX2 as the input selection strobes. Note that IRQ8B, which by convention is connected to the RTC, is inverted before being sent to the interrupt controller, so that it may be connected directly to the IRQ# pin of the RTC.

PIN DESCRIPTION

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3.2.6 IPC (Combined with Serial Interface)

DACK_ENC[2:0]

DMA Acknowledge.

These are the ISA bus DMA acknowledge signals. They are encoded by the STPC Industrial before output and should be decoded externally using ISACLK and ISACLKX2 as the control strobes.

DREQ_MUX[1:0]

ISA Bus Multiplexed DMA Re-

quest.

These are the ISA bus DMA request signals. They are to be encoded before connection to the STPCIndustrial using ISACLK and ISACLKX2 as the input selection strobes.

ISA Terminal Count.

This is the terminal count output of the DMA controller and is connected to the TCline of the ISA bus. It isasserted during the last DMA transfer, when the Byte count expires.

3.2.7 KEYBOARD/MOUSE INTERFACE

KBCLK,

Keyboard Clock line.

Keyboard data is latched by the controller on each negative clock edge produced on this pin. The keyboard can be disabled by pulling this pinlow by software control.

KBDATA,

Keyboard Data Line.

11-bits of data are shifted serially through this line when data isbeing transferred. Data is synchronised to KBCLK.

MCLK,

Mouse Clock line.

Mouse data is latched by thecontroller on each negative clock edge produced on this pin. The mouse can be disabled by pulling this pin low by software control.

MDATA,

Mouse Data Line.

11-bits of data are shifted serially through this line when data isbeing transferred. Data is synchronised to MCLK.

3.2.8 SERIAL INTERFACE

(Serial 1 combined with TFT Interface) (Serial 2 combined with IPC)

SIN1, SIN2

Input Serial input.

Data is clocked in

using RCLK/16.

SOUT1, SOUT2

Serial Output.

Data isclocked out

using TCLK/16 (TCLK=BAUD#).

DCD1#, DCD2#

Input Data carrier detect.

RI1#, RI2#

Input Ring indicator.

DSR1#, DSR2#

Input Data set ready.

CTS1#, CTS2#

Input Clear to send.

RTS1#, RTS2#

Output Request to send.

DTR1#, DTR2#

Output Data terminal read.

3.2.9 PARALLEL PORT (Combined with ISA Bus an IPC)

Paper End.

Input status signal from printer.

SLCT

Printer Select.

Printer selected input.

BUSY#

Printer Busy

Input status signal from printer.

ERR#

Error

. Input status signal from printer.

ACK#

Acknowledge.

Input status signal from printer.

PDDIR#

Parallel Device Direction.

Bidirectional control line output.

STROBE#

PCS/Strobe#.

Data transfer strobe line to printer.

INIT#

Initialize Printer.

This output sends an initial-

ize command to the connected printer.

AUTPFDX#

Automatic Line feed.

This output sends a command to the connected printer to automatically generate line feed on received carriage returns.

SLCTIN#

Select In.

Printer select output.

PPD[7-0]

Printer Data Lines

Data transfer lines to

printer. Bidirectional depending on modes.

PIN DESCRIPTION

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3.2.10 PCMCIA INTERFACE (Combined with PCI / Cardbus)

RESET

Card Reset.

This output forces a hard

reset to a PC Card.

A[25:0]

Address Bus.

These are the 25 low bits of the system address bus of the PCMCIA bus. These pins areused as an input when an PCMCIA bus owns the bus and are outputs at all other times.

D[15:0]

I/O Data Bus (PCMCIA).

These are the

external PCMCIA databus pins.

CA[25-0]

Card Address

. Used with the lower 11 bits of the ISA Address Bus to generate the Card Address.

IORD#

I/O Read.

Thisoutput is used with REG#to gate I/O read data from the PC Card, (only when REG# is asserted).

IOWR#

I/O Write

. This output is used with REG# to gate I/O write data from the PC Card, (only when REG# is asserted).

Write Protect.

This input indicates the status of the Write Protect switch (iffitted) on memory PC Cards (asserted when the switch is set to write protect).

BVD1, BVD2

Battery Voltage Detect.

These inputs will be generated by memory PC Cards that include batteries and are an indication of the condition of the batteries. BVD1 and BVD2 are kept asserted high when the battery is in good condition.

READY#/BUSY#/IREQ#

Ready/busy/Interupt re-

quest.

This input is driven low by memory PC Cards to signal that their circuits are busy processing a previous write command.

WAIT#

Bus Cycle Wait.

This input is driven by the PC Card to delay completion of the memory or I/O cycle in progress.

OE#

Output Enable.

OE# is an active low output which is driven to the PC Card to gate Memory Read data from memory PC Cards.

WE#/PRGM#

Write Enable.

This outputis usedby the host for gating Memory Write data. WE# is also used for memory PC Cards that have programmable memory.

REG#

Attribute Memory Select.

This output is inactive (high) for all normal accesses to the Main Memory of the PC Card. I/O PC Cards will only respond to IORD# or IOWR# when REG# is active (low). Also see Section 3.2.6

CD1#, CD2#

Card Detect.

These inputs provide for the detection of correct card insertion. CD#1 and CD#2 are positioned at opposite ends of the connector to assist in the detection process. These inputs are internally grounded on the PC Card therefore they will be forced low whenever a card is inserted in a socket.

CE1#, CE2#

Card Enable

. These are active low output signals provided from the PCIC. CE#1 enables even Bytes, CE#2 odd Bytes.

ENABLE#

Enable.

Thisoutput is used to activate/ select a PC Card socket. ENABLE# controls the external address buffer logic.C card has been detected (CD#1 and CD#2 = ’0’).

ENIF#

ENIF

. This output is used to activate/select

a PC Card socket.

EXT_DIR

EXternal Transreceiver Direction Con-

trol.

This outputis high during a read and low during a write. The default power up condition is write (low). Used for both Low and High Bytes of the Data Bus.

VCC_EN#, VPP1_EN0, VPP1_EN1, VPP 2_EN0, VPP2_EN1

Power Control.

Five output signals used to control voltages (VPP1, VPP2 and VCC) to a PC Card socket. Also see Section 16.7.5

GPI#

General Purpose Input. This signal is hard-

wired to 1.

PIN DESCRIPTION

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3.2.11 CARDBUS INTERFACE (Combined with PCI / PCMCIA)

For card bus pinouts, refer to the PCI pinout.

3.2.12 PCI INTERFACE

AD[31:0]

PCI Address/Data.

This is the 32-bit multiplexed address and databus of the PCI. This bus is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions.

BE[3:0]#

Bus Commands/Byte Enables.

These are the multiplexed command and Byte enable signals of the PCI bus. During the address phase they define the command and during the data phase they carry the Byte enable information. These pins are inputs when a PCI master other than the STPC Industrial owns the bus and outputs when the STPC Industrial owns the bus.

FRAME#

Cycle Frame.

This is the frame signal of the PCIbus. Itis aninput when aPCI master owns the bus and is an output when STPC Industrial owns the PCI bus.

TRDY#

Target Ready.

This is the target ready signal of the PCI bus. It is driven as an output when the STPCIndustrial is the target of the current bus transaction. It is used as an input when STPC Industrial initiates a cycle on the PCI bus.

IRDY#

Initiator Ready.

This is the initiator ready signal of the PCI bus. It is used as an output when the STPC Industrial initiates a bus cycle on the PCI bus. It is used as an input during the PCI cycles targeted to the STPC Industrial to determine when the current PCI master is ready to complete the current transaction.

STOP#

Stop Transaction.

STOP# is used to implement the disconnect, retry and abort protocol of the PCI bus. It is used as an input for the bus cycles initiated by the STPC Industrial and is used as an output when a PCI master cycle is targeted to the STPC Industrial.

DEVSEL#

I/O Device Select.

This signal is used as an input when the STPC Industrial initiates a bus cycle on the PCI bus to determine if a PCI slave device has decoded itself to be the target of the current transaction. It is asserted as an output either when the STPC Industrial is the target of the current PCI transaction or when no other device asserts DEVSEL# prior to the subtractive decode phase of the current PCI transaction.

PAR

Parity Signal Transactions.

This is the parity signal of the PCI bus. This signal is used to guarantee even parity across AD[31:0], CBE[3:0]#, and PAR. This signal is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions. (Its assertion is identical to that of the AD bus delayed by one PCI clock cycle)

SERR#

System Error.

This is the system error signal of the PCI bus. It may, if enabled, be asserted for one PCI clock cycle if target aborts a STPC Industrial initiated PCI transaction. Its assertion by either the STPC Industrial or by another PCI bus agent will trigger the assertion of NMI to the host CPU. This is an open drain output.

LOCK#

PCI Lock.

This is the lock signal of the PCI bus and is used to implement the exclusive bus operations when acting as a PCI target agent.

PCI_REQ#[2:0]

PCI Request.

These pins are the three external PCI master request pins. They indicates to the PCI arbiter that the external agents desire use of the bus.

PCI_GNT#[2:0]

PCI Grant.

These pins indicate that the PCI bus has been granted to the master requesting it on its PCI_REQ#.

PCI_INT[3:0]

PCI Interrupt Request.

These are the PCI bus interrupt signals. They are to be encoded before connection to the STPC Industrial using ISACLK and ISACLKX2 as the input selection strobes.

3.2.13 MONITOR INTERFACE

RED, GREEN, BLUE

RGB Video Outputs.

These

are the 3 analog color outputs from the RAMDACs

VSYNC

Vertical Synchronisation Pulse.

This is the vertical synchronization signal from the VGA controller.

PIN DESCRIPTION

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HSYNC

Horizontal Synchronisation Pulse.

This is the horizontal synchronization signal from the VGA controller.

VREF_DAC

DAC Voltage reference.

This pin is an input driving the digital to analog converters. This allows an external voltage reference source to be used.

RSET

Resistor Current Set.

This is the reference current input to the RAMDAC. Used to set the fullscale output of the RAMDAC.

COMP

Compensation.

This is the RAMDAC compensation pin. Normally, an external capacitor (typically 10nF) is connected between this pin and VDDto damp oscillations.

DDC[1:0]

Direct Data Channel Serial Link.

These bidirectional pins are connected to CRTC register 3Fh to implement DDC capabilities. They conform to I2C electrical specifications, they have opencollector output drivers which are internally connected to VDDthrough pull-up resistors.

They can instead be used for accessing I C devices on board. DDC1 and DDC0 correspond to SCL and SDA respectively.

3.2.14 FLAT PANEL INTE RFACE SIGNALS (Combined with Serial 1)

FPFRAME,

Vertical Sync. pulse Output.

FPLINE,

Horizontal S ync. Pulse Output.

DE,

Data Enable.

R5-0,

Red Output.

G5-0,

Green Output.

B5-0,

Blue Output

ENAVDD

Enable VDD of Flat Panel.

ENVCC

Enable VCC of Flat Panel.

PWM

PWM Back-Light Control.

3.2.15 MISCELLANEOUS

SPKRD

Speaker Drive.

This is the output t o the speaker and is th e AND of the counter 2 output with bit1 of Port 61h and drives an external speaker driver. This output should be connected to a 7407 type high voltage driver.

SCAN_ENABLE

Reserved

. This pin is reserved for Test and Miscellaneous functions. It has t o be set to ‘0’ or connected to ground in normal operation.

PIN DESCRIPTION

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Table 3-3. Signals sharing the same pin

ISA BUS / IPC LOCAL BUS PARALLEL PORT SERIAL INTERFACE

LA[23:22] FCS#[0], PRD#[1] LA[21:20] PA[21:20] LA[19:17] PRD#[0], PWR#[1:0] SA[19:1] PA[19:1] SA[0] PRDY# SD[15:0] PD[15:0] BHE# FCS#[1] MEMR#, MEMW# IOCS[3:2] SMEMR#, SMEMW# IOCS[1:0] GPIOCS# PE IOCHRDY SLCT IOR# BUSY# IOW# ERR# MASTER# ACK# MCS16# PDDIR# IOCS16# INIT# REF# AUTPFDX# AEN SLCTIN# IOCHCK# PPD[7] RTCRW# PPD[5] RTCDS# PPD[4] RTCAS# PPD[3] RMRTCCS# PPD[2] ALE PPD[1] DACK_ENC[0:2] DCD2#, DSR2#, SIN2 DREQ_MUX[0:1] CTS2#, RTS2# TC SOUT2

TFT INTERFACE SERIAL 1

B[0,1] DCD1#, CTS1# G[0,1] DSR1#, RTS1# R[0,1] SIN1, SOUT1

PCI CARDBUS PCMCIA

CCLK A[16]

CRST# RESET AD[31:27] CAD[31:27] D[10,9,1,8,0] AD[26:20] CAD[26:20] A[0:6]

PIN DESCRIPTION

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PCI CARDBUS PCMCIA

AD[19] CAD[19] A[25] AD[18] CAD[18] A[7] AD[17] CAD[17] A[24] AD[16] CAD[16] A[17] AD[15] CAD[15] IOWR# AD[14] CAD[14] A[9] AD[13] CAD[13] IORD# AD[12] CAD[12] A[11] AD[11] CAD[11] OE# / TCw AD[10] CAD[10] CE[2] AD[9] CAD[9] A[10] AD[8:0] CAD[8:0] D[15,7,13,6,12,5,11,4,3] BE[3] CBE[3] DACK/REG# BE[2] CBE[2] A[12] BE[1] CBE[1] A[8] BE[0] CBE[0] CE[1] FRAME# CFRAME# A[23] TRDY# CTRDY# A[22] IRDY# CIRDY# A[15] STOP# CSTOP# A[20] DEVSEL# CDEVSEL# A[21] PAR CPAR A[13]

CPERR# A[14] SERR# CSERR# WAIT LOCK# CBLOCK# A[19] PCIREQ#[2] CREQ# INPACK# PCIREQ#[1] CCD1 CD1# PCIREQ#[0] CSTSCHG# BVD1 PCIGNT#[2] CGNT# WE# / TCr PCIGNT#[1] CCD2 CD2# PCIGNT#[0] BVD2 PCI_INT[3] VCC3_EN PCI_INT[2] VCC5_EN PCI_INT[1] VPP_PGM PCI_INT[0] CINT# READY#

CLKRUN DREQ# / WP / IOIS16#

A[18]

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Table 3-4. Pinout.

Pin # Pin name

SYSRSTI#

A3 SYSRSTO# AB25 XTALI AB23 XTALO G25 PCI_CLKI H23 PCI_CLKO B20 ISA_CLK A20 ISA_CLK2X AC26 CLK14M H26 HCLK J26 DEV_CLK AC15 GCLK2X AD16 DCLK

AE13 MA[0] AC12 MA[1] AF13 MA[2] AD12 MA[3] AE14 MA[4] AC14 MA[5] AF14 MA[6] AD13 MA[7] AE15 MA[8] AD14 MA[9] AF15 MA[10] AE16 MA[11] AD15 RAS#[0] AF16 RAS#[1] AC17 RAS#[2] AE18 RAS#[3] AD17 CAS#[0] AF18 CAS#[1] AE19 CAS#[2] AF19 CAS#[3] AD18 CAS#[4] AE20 CAS#[5] AC19 CAS#[6] AF20 CAS#[7] AD19 MWE# AE21 MD[0] AC20 MD[1] AF21 MD[2] AD20 MD[3]

AE22 MD[4] AF22 MD[5] AD21 MD[6] AE23 MD[7] AC22 MD[8] AF23 MD[9] AD22 MD[10] AE24 MD[11] AD23 MD[12] AF24 MD[13] AE26 MD[14] AD25 MD[15] AD26 MD[16] AC25 MD[17] AC24 MD[18] AB24 MD[19] AB26 MD[20] AA25 MD[21] Y23 MD[22] AA24 MD[23] AA26 MD[24] Y25 MD[25] Y26 MD[26] Y24 MD[27] W25 MD[28] V23 MD[29] W26 MD[30] W24 MD[31] V25 MD[32] V26 MD[33] U25 MD[34] V24 MD[35] U26 MD[36] U23 MD[37] T25 MD[38] U24 MD[39] T26 MD[40] R25 MD[41] R26 MD[42] T24 MD[43] P25 MD[44] R23 MD[45] P26 MD[46] R24 MD[47]

Pin # Pin name

N25 MD[48] N23 MD[49] N26 MD[50] P24 MD[51] M25 MD[52] N24 MD[53] M26 MD[54] L25 MD[55] M24 MD[56] L26 MD[57] M23 MD[58] K25 MD[59] L24 MD[60] K26 MD[61] K23 MD[62] J25 MD[63]

B1 PA[0]

P1 LA[17] / PWR#[0] N3 LA[18] / PWR#[1] R2 LA[19] / PRD#[0] C1 LA[20] / PA[20] C2 LA[21] / PA[21] P3 LA[22] / PRD#[1] R1 LA[23] / FCS#[0] P4 SA[0] / PRDY# J2 SA[1] / PA[1] H3 SA[2] / PA[2] H1 SA[3] / PA[3] J4 SA[4] / PA[4] H2 SA[5] / PA[5] G3 SA[6] / PA[6] G1 SA[7] / PA[7] G2 SA[8] / PA[8] F1 SA[9] / PA[9] F3 SA[10] / PA[10] G4 SA[11] / PA[11] F2 SA[12] / PA[12] E1 SA[13] / PA[13] E3 SA[14] / PA[14] E4 SA[15] / PA[15] E2 SA[16] / PA[16] D1 SA[17] / PA[17]

Pin# Pin name

PIN DESCRIPTION

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D3 SA[18] / PA[18] D2 SA[19] / PA[19] P2 SD[0] / PD[0] M3 SD[1] / PD[1] N1 SD[2] / PD[2] M4 SD[3] / PD[3] N2 SD[4] / PD[4] L3 SD[5] / PD[5] M1 SD[6] / PD[6] M2 SD[7] / PD[7] L1 SD[8] / PD[8] K3 SD[9] / PD[9] L2 SD[10] / PD[10] K4 SD[11] / PD[11] K1 SD[12] / PD[12] J3 SD[13] / PD[13] K2 SD[14] / PD[14] J1 SD[15] / PD[15] T2 BHE# / FCS#[1] R3 MEMR# / IOCS#[3] T1 MEMW# / IOCS#[2] R4 SMEMR# / IOCS#[1] U2 SMEMW# / IOCS#[0] AB2 IOCHRDY / SLCT AB1 IOR# / BUSY# Y3 GPIOCS# / PE AA3 IOW# / ERR# AC2 MASTER# / ACK# AB4 MCS16# / PDDIR# AB3 IOCS16# / INIT# AD2 REF# / AUTPFDX# AC3 AEN / SLCTIN# E25 IOCHCK# / PPD[7] E26 PPD[6] F24 RTCRW# / PPD[5] D25 RTCDS# / PPD[4] E23 RTCAS# / PPD[3] D26 RMRTCCS# / PPD[2] E24 ALE / PPD[1] C25 PPD[0] AC1 STROBE#

D5 IRQ_MUX[0] A4 IRQ_MUX[1]

Pin # Pin name

C5 IRQ_MUX[2] B3 IRQ_MUX[3] AD1 SPKRD V3 DACK_ENC[0]/DCD2# Y2 DACK_ENC[1]/DSR2# W4 DACK_ENC[2] / SIN2 Y1 DREQ_MUX[0]/CTS2# W3 DREQ_MUX[1]/RTS2# AA2 TC / SOUT2

Y4 DTR2# AA1 RI2# U4 SIN1 / R[0] V1 SOUT1 / R[1] V2 CTS1 / B[1] U3 RTS1# / G[1] U1 DSR1# / G[0] W2 DTR1# T3 DCD1# / B[0] W1 RI1#

F25 KBCLK F26 KBDATA G24 MCLK G23 MDATA

D18 RESET C18 A[0] A17 A[1] D17 A[2] B16 A[3] C17 A[4] A16 A[5] B15 A[6] A15 A[7] C16 A[8] B14 A[9] D15 A[10] A14 A[11] C15 A[12] B13 A[13] D13 A[14] A13 A[15] C14 A[16]

Pin # Pin name

B12 A[17] C13 A[18] A12 A[19] B11 A[20] A11 A[21] D12 A[22] B10 A[23] C11 A[24] A10 A[25] D10 D[0] B9 D[1] C10 D[2] A9 D[3] B8 D[4] C9 D[5] B7 D[6] D8 D[7] A7 D[8] B6 D[9] D7 D[10] A6 D[11] C7 D[12] A5 D[13] C6 D[14] B4 D[15] B22 IORD# D22 IOWR# D24 WP A18 BVD1 C26 BVD2 A21 READY# C19 WAIT# A25 INPACK# C22 OE# B18 WE# B19 REG# B24 CD1# A24 CD2# B23 CE1# C23 CE2# C20 VS1# A19 VS2# D20 VCC5_EN C21 VCC3_EN

Pin# Pin name

PIN DESCRIPTION

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B21 VPP_PGM A22 VPP_VCC

AD4 RED AF4 GREEN AE5 BLUE AF3 VSYNC AE4 HSYNC AF5 VREF_DAC AE6 RSET AF6 COMP AE3 SDA / DDC[1] AF2 SCL / DDC[0]

AE7 B[2] AF7 G[2] AD7 R[2] AE8 B[3] AC9 G[3] AF8 R[3] AD8 B[4] AE9 G[4] AF9 R[4] AE10 B[5] AD9 G[5] AF10 R[5] AC10 RESERVED AD10 FPLINE AE11 FPFRAME AF11 DE AE12 ENAVDD AF12 ENVCC AD11 PWM

C8 SCAN_ENABLE

AD5 VDD_DAC1 AC5 VDD_DAC2 AE17 VDD_GCLK_PLL AF17 VDD_DCLK_PLL K24 VDD_ZCLK_PLL H25 VDD_DEVCLK_PLL J24 VDD_HCLK_PLL

Pin # Pin name

A8 RESERVED A23 RESERVED B5 RESERVED B17 RESERVED C12 RESERVED

D6 VDD D11 VDD D16 VDD D21 VDD F4 VDD F23 VDD L4 VDD L23 VDD T4 VDD T23 VDD AA4 VDD AA23 VDD AC6 VDD AC11 VDD AC16 VDD AC21 VDD

AC7 VSS_DAC1 AD6 VSS_DAC2 G26 VSS_DLL H24 VSS_DLL A1 VSS A2 VSS A26 VSS B2 VSS B25 VSS B26 VSS C3 VSS C24 VSS D4 VSS D9 VSS D14 VSS D19 VSS D23 VSS H4 VSS J23 VSS L11:16 VSS M11:16 VSS

Pin # Pin name

N4 VSS N11:16 VSS P11:16 VSS P23 VSS R11:16 VSS T11:16 VSS V4 VSS W23 VSS AC4 VSS AC8 VSS AC13 VSS AC18 VSS AC23 VSS AD3 VSS AD24 VSS AE1 VSS AE2 VSS AE25 VSS AF1 VSS AF25 VSS AF26 VSS

Pin# Pin name

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4 ELECTRICAL SPECIFICATIONS

4.1 INTRODUCTION

The electrical specifications in this chapter are valid for the STPC Industrial.

4.2 ELECTRICAL CONNECTIONS

4.2.1 Power/Ground Connections/Decoupling

Due to the high frequency of operation of the STPC Industrial, it is necessary to install and test this device using standard high frequency techniques. The high clock frequencies used in the STPC Industrial and its output buffer circuits can cause transient power surges when several output buffers switch output levels simultaneously. These effects can be minimized by filtering the DC power leads with low-inductance decoupling capacitors, using low impedance wiring, and by utilizing all of the VSS and VDD pins.

4.2.2 Unused Input Pins

All inputs not used by the designer and not listed

in the table of pin connections in Section 3 should be connected either to VDD or to VSS. Connect active-high inputs to VDD through a 20 kΩ (±10%) pull-down resistor and active-low inputs to VSS and connect active-low inputs to VCC through a 20 kΩ (±10%) pull-up resistor to prevent spurious operation.

4.2.3 Reserved Designated Pins

Pins designated reserved should be left disconnected. Connecting a reserved pin to a pull-up resistor, pull-down resistor, or an active signal could cause unexpected results and possible circuit malfunctions.

4.3 ABSOLUTE MAXIMUM RATINGS

The following table lists the absolute maximum ratings for the STPC Industrial device. Stresses beyond those listed under Table 4-1 limits may cause permanent damage to the device. These are stress ratings only and do not imply that operation under any conditions other than those specified in section ”Operating Conditions”.

Exposure to conditions beyond those outlined in Table 4-1 may (1) reduce devicereliability and (2) result in premature failure even when there is no immediately apparent sign of failure. Prolonged exposure to conditions at or near the absolute maximum ratings (Table 4-1) may also result in reduced useful life and reliability.

4.3.1 5V Tolerance

The STPC is capable of running with I/O systems that operate at 5V such as PCI and ISA devices. Certain pins of the STPC tolerate inputs up to

5.5V. Above this limit thecomponent is likely to sustain permanent damage.

All the pin that are V5Thave been denoted with a * besides the Signal Name in Table 3-1 .

Table 4-1. Absolute Maximum Ratings

Symbol Parameter Minimum Maximum Units

DDx

DC Supply Voltage -0.3 4.0 V

I,VO

Digital Input and Output Voltage -0.3 VDD + 0.3 V

5Volt Tolerance 2.5 5.5

STG

Storage Temperature -40 +150 °C

OPER

Operating Temperature 0 +70 °C

TOT

Maximum Power Dissipation - 4.8 W

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4.4 DC CHARACTERISTICS

Notes:

1. MHz ratings refer to CPU clock frequency.

2. Not yet released.

4.5 AC CHARACTERISTICS

Table 4-5 through Table 4-14 list the AC characteristics including output delays, input setup requirements, input hold requirements and output float delays. These measurements are based on the measurement points identified in Figure 4-1. The rising clock edge reference level VREF , and other reference levels are shown in Table 4-4 below for the STPC Industrial. Input or output signals must cross these levels during testing.

Figure 4-1 shows output delay (A and B) and input setup and hold times (C and D). Input setup and hold times(C and D) arespecified minimums, defining the smallest acceptable sampling window a synchronous input signal must be stable for correct operation.

Table 4-2. DC Characteristics

Recommended Operating conditions : VDD = 3.3V ±0.3V, Tcase = 0 to 100°C unless otherwise specified

Symbol Parameter Test conditions Min Typ Max Unit

Operating Voltage 3.0 3.3 3.6 V

Supply Power VDD= 3.3V, H

CLK

= 66Mhz 3.2 3.9 W

CLK

Internal Clock (Note 1) 80 Mhz

DAC

DAC Voltage Reference 1.215 1.235 1.255 V

Output Low Voltage I

Load

=1.5 to 8mA depending of the pin 0.5 V

Output High Voltage I

Load

=-0.5 to -8mA depending of the pin 2.4 V

ILD

Input Low Voltage Except XTALI -0.3 0.8 V

XTALI -0.3 0.5 V

IHD

Input High Voltage Except XTALI 2.1 VDD+0.3 V

XTALI 2.35 V

+0.3 V

Input Leakage Current Input, I/O -5 5 µA

Input Capacitance (Note 2) pF

OUT

Output Capacitance (Note 2) pF

CLK

Clock Capacitance (Note 2) pF

Table 4-3. RAMDAC DC Specification

Symbol Parameter Min Nom Max

Vref Voltage Reference 1.00V 1.12V 1.24V

INL Integrated Non Linear Error - - 2 lsb

DNL Differentiated Non Linear Error - - 1lsb

FS Full Scale - - 20mA FSR Full Scale Range 14.00 mA 16.50mA 19.00 mA LSB Least Significant Byte Size 54uA 63uA 72uA

Zero Zero Scale @ 7.5IRE Mode 0.95mA 1.44mA 1.90mA

Compare DAC to DAC matching - - +/- 5%

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Note: Refer to Figure 4-1.

Table 4-4. Drive Level and Measurement Points for Switching Characteristics

Symbol Value Units

REF

1.5 V

IHD

3.0 V

ILD

0.0 V

Figure 4-1. Drive Level and Measurement Points for Switching Characteristics

CLK:

Ref

ILD

IHD

LEGEND: A - Maximum Output Delay Specification

B - Minimum Output Delay Specification C - Minimum Input Setup Specification D - Minimum Input Hold Specification

Ref

Va lid

Valid

OUTPUTS:

INPUTS:

Output n

Output n+1

Input

MAX

MIN

Ref

ILD

IHD

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Table 4-5. DRAM Bus AC Timing

Name Parameter Min Max Unit

t1 HCLK to RAS#[3:0] valid 16 ns t2 HCLK to CAS#[7:0] bus valid 16 ns t3 HCLK to MA[11:0] bus valid 16 ns t4 HCLK to MWE# valid 16 ns t5 HCLK to MD[63:0] bus valid 16 ns t6 MD[63:0] Generic setup 9 ns t7 GCLK2X to RAS#[3:0] valid 17 ns t8 GCLK2X to CAS#[7:0] valid 17 ns

t9 GCLK2X to MA[11:0] bus valid 17 ns t10 GCLK2X to MWE# valid 17 ns t11 GCLK2X to MD[63:0] bus valid 17 ns t12 MD[63:0] Generic hold 5 ns

Table 4-6. PCI Interface AC TImings

Name Parameter Min Max Unit

t13 PCI_CLKI to FRAME# valid 15 nS t14 PCI_CLKI to TRDY# valid 15 nS t15 PCI_CLKI to IRDY# valid 15 nS t16 PCI_CLKI to STOP# valid 15 nS t17 PCI_CLKI to DEVSEL# valid 15 nS

Table 4-7. Graphics Adapter (VGA) AC Timing

Name Parameter Min Max Unit

t18 DCLK to VSYNC valid 27 ns t19 DCLK to HSYNC valid 27 ns

Table 4-8. IPC Interface AC Timings

Name Parameter Min Max Unit

t20 XTALO to DACK_EN[2:0] valid 71 nS t21 XTALO to TC valid 68 nS t22 IRQ_MUX Input setup to ISACLK2X 0 - nS t23 DREQ_MUX[1:0] Input setup to ISACLK2X 0 - nS

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Table 4-9. PCMCIA Interface AC Timing

Name Parameters Min Max Units

t24 Input setup to ISACLK2X 24 nS t25 Input hold from ISACLK2X 5 nS t28 ISACLK2X to IORD - 55 nS t29 ISACLK2X to IORW - 55 nS t30 ISACLK2X to AD[25:0] - 25 nS t31 ISACLK2X to OE# 2 55 nS t32 ISACLK2X to WE# 2 55 nS t33 ISACLK2X to DATA[15:0] 0 35 nS t34 ISACLK2X to INPACK 2 55 nS t35 ISACLK2X to CE1# 7 65 nS t36 ISACLK2X to CE2# 7 65 nS t37 ISACLK2X to RESET 2 55 nS

Table 4-10. Parallel Interface AC Timing

Name Parameters Min Max Units

t37 STROBE# to BUSY setup 0 - nS t38 PD bus to AUTPFD# hold 0 - nS t39 PB bus to BUSY setup 0 - nS

Table 4-11. Keyboard Interface AC Timing

Name Parameters Min Max Units

t40 Input setup to KBCLK 5 - nS t41 Input hold to KBCLK 1 - nS t42 KBCLK to KBDATA - 12 nS

Table 4-12. Mouse Interface AC Timing

Name Parameters Min Max Units

t43 Input setup to MCLK 5 - nS t44 Input hold to MCLK 1 - nS t45 MCLK to MDATA - 12 nS

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Table 4-13. Local Bus Interface AC Timing

Name Parameters Min Max Units

t46 PRDY# Input hold to HCLK 2 nS t47 PD[15:0] Input hold to HCLK 2 nS t48 PRDY# Input setup to HCLK 1 - nS t49 PD[15:0] Input setup to HCLK 2 4 nS t50 HCLK to PA bus - 15 nS t51 HCLK to PD bus - 15 nS t52 HCLK to PWR0# - 15 nS t53 HCLK to PWR1# - 15 nS t54 HCLK to PRD0# - 15 nS t55 HCLK to PRD1# - 15 nS t56 HCLK to FCS0# - 15 nS t57 HCLK to FCS1# - 15 nS t58 HCLK to IOCS#[3:0] - 15 nS

Table 4-14. TFT Interface Timing

Name Parameters Min Max Units

t59 DCLK to FPLINE 15 nS t60 DCLK to R[2] 15 nS t61 DCLK to R[3] 15 nS t62 DCLK to R[4] 15 nS t63 DCLK to R[5] 15 nS t64 DCLK to G[2] 15 nS t65 DCLK to G[3] 15 nS t66 DCLK to G[4] 15 nS t67 DCLK to G[5] 15 nS t68 DCLK to B[2] 15 nS t68 DCLK to B[3] 15 nS t69 DCLK to B[4] 15 nS t70 DCLK to B[5] 15 nS t71 DCLK to FPFRAME 15 nS

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MECHANICAL DATA

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5. MECHANICAL DATA

5.1 388-PIN PACKAGE DIMENSION

The pin numbering for the STPC 388-pin Plastic BGA package is shown in Figure 5-1.

Dimensions are shown in Figure 5-2, Table 5-1 and Figure 5-3, Table 5-2.

Figure 5-1. 388-Pin PBGA Package - Top View

A B

D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF

1 3 5 7 9 11 13 15 17 19 21 23 25

2468101214161820222426

A B

D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF

1 3 5 7 9 1113151719212325

2468101214161820222426

MECHANICAL DATA

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Figure 5-2. 388-pin PBGA Package - PCB Dimensions

Table 5-1. 388-pin PBGA Package - PCB Dimensions

Symbols

mm inches

Min Typ Max Min Typ Max A 34.95 35.00 35.05 1.375 1.378 1.380 B 1.22 1.27 1.32 0.048 0.050 0.052 C 0.58 0.63 0.68 0.023 0.025 0.027 D 1.57 1.62 1.67 0.062 0.064 0.066 E 0.15 0.20 0.25 0.006 0.008 0.001 F 0.05 0.10 0.15 0.002 0.004 0.006

G 0.75 0.80 0.85 0.030 0.032 0.034

Detail

A1 Ball Pad Corner

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Figure 5-3. 388-pin PBGA Package - Dimensions

Table 5-2. 388-pin PBGA Package - Dimensions

Symbols

mm inches

Min Typ Max Min Typ Max A 0.50 0.56 0.62 0.020 0.022 0.024 B 1.12 1.17 1.22 0.044 0.046 0.048

C 0.60 0.76 0.92 0.024 0.030 0.036 D 0.52 0.53 0.54 0.020 0.021 0.022

E 0.63 0.78 0.93 0.025 0.031 0.037 F 0.60 0.63 0.66 0.024 0.025 0.026

G 30.0 11.8

Solderball

Solderball after collapse

MECHANICAL DATA

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5.2 388-PIN PACKAGE THERMAL DATA

388-pin PBGA package has a Power Dissipation Capability of 4.5W which increases to 6W when used with a Heatsink.

Structure in shown in Figure 5-4. Thermal dissipation options are illustrated in Fig-

ure 5-5 and Figure 5-6.

Figure 5-4. 388-Pin PBGA structure

Thermal balls

Power & Ground layersSignal layers

Figure 5-5. Thermal dissipation without heatsink

Ambient

Board

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

1258.5

Rja = 13 °C/W

Airflow = 0

Board dimensions:

The PBGA is centered on board

Copper thickness:

-17

m for internal layers

-34

m for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices 1 via pad per ground ball (8-mil wire) 40% copper on signal layers

Board temperature taken at the center balls

MECHANICAL DATA

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Figure 5-6. Thermal dissipation with heatsink

Board

Ambient

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

508.5

Rja = 9.5 °C/W

Airflow = 0

Board dimensions:

The PBGA is centered on board

Copper thickness:

-17

m for internal layers

-34

m for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices

Heat sink is 11.1

C/W

1 via pad per ground ball (8-mil wire) 40% copper on signal layers

Board temperature taken at the center balls

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BOARD LAYOUT

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6. BOARD LAYOUT

6.1 THERMAL DISSIPATION

Thermal dissipation of the STPC depends mainly on supply voltage. As a result, when the system does notneed to workat 3.3V, it may be to reduce the voltage to 3.15V for example. This may save few 100’s of mW.

The second area that can be concidered is unused interfaces and functions. Depending on the application, some input signals can be grounded, and some blocks not powered or shutdown. Clock speed dynamic adjustment is also a solution that can be usedalong with the integrated power management unit.

The standard way to route thermal balls to internal ground layerimplements only one viapad for each ball pad, connected using a 8-mil wire.

With such configuration thePlastic BGA 388 packagedissipates 90%of the heat through theground balls, and especially the central thermal balls which are directly connected to the die, the remaining 10% is dissipated through the case. Adding a heat sink reduces this value to 85%.

As a result, some basic rules have to be applied when routing the STPC in order to avoid thermal problems.

First of all, the whole ground layer acts as a heat sink and ground balls must be directly connected to it as illustrated in Figure 6-1.

If one ground layer is not enough, a second ground plane may be added on the solder side.

Figure 6-1. Ground routing

Pad for ground ball Thru hole to ground layer

(

)

Note: For better visibility, ground balls are not all routed.

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When considering thermal dissipation, the most important - and not the more obvious - part of the layout is the connection between the ground balls and the ground layer.

A 1-wire connection is shown in Figure 6-2. The use of a 8-mil wire results in a thermal resistance of 105°C/W assuming copper is used (418 W/ m.°K). This high value is due to the thickness (34 µm) of the copper on the external side of the PCB.

Considering only the central matrix of 36 thermal balls and one via for each ball, the global thermal resistance is 2.9°C/W. This can be easily improved by using four 10 mil wires to connect to the four vias around the ground pad link as in Figure 6-3. This gives a total of 49 vias and a global resistance for the 36 thermal balls of 0.6°C/W.

The use of a ground plane like in Figure 6-4 is even better.

To avoidsolder wickingover to the via padsduring soldering, it is important to have a solder mask of 4 mil around the pad (NSMD pad), this gives a diameter of 33 mil for a 25 mil ground pad.

To obtain the optimum ground layout, place the vias directly under the ball pads. In this case no local boar d distortion is tolerated.

The thickness of the copper on PCB layers is typically 34µm for external layers and17 µm for internal layers. This means thermal dissipation is not good and temperature of the board is concentrated around the devices and falls quickly with increased distance.

When it is possible to place a metal layer inside the PCB, this improves dramatically the heat spreading and hence thermal dissipation of the board.

Figure 6-2. Recommended 1-wire ground pad layout

Figure 6-3. Recommended 4-wire ground pad layout

Solder Mask (4 mil)

Pad for ground ball (diameter = 25 mil)

Hole to ground layer (diameter = 12 mil)

Connection Wire (width = 10 mil)

Via (diameter = 24 mil)

1 mil = 0.0254 mm

4 via pads for each ground ball

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The PBGA Package also dissipates heat through peripheral ground balls. When a heat sink is placed on the device, heat is more uniformely spread throughout the moulding increasing heat dissipation through the peripheral ground balls.

The more via pads are connected to each ground ball, the more heat is dissipated . The only limitation is the risk of lossing routing channels.

Figure 6-5 shows a routing with a good trade off between thermal dissipation and number of routing channels.

Figure 6-4. Optimum layout for central ground ball

Via to Ground layer

Pad for ground ball

Clearance = 6mil

diameter = 25 mil

hole diameter = 14 mil Solder mask

diameter = 33 mil

External diameter = 37 mil

connections = 10 mil

Figure 6-5. Global ground layout for good thermal dissipation

Ground pad

Via to ground layer

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A local ground plane on opposite side of the board as shown in Figure 6-6 improves thermal dissipation. It is used to connect decoupling capacitances but can also be usedfor connection to a heat sink or to the system’s metal box for better dissipation.

This possibility of using the whole system’s box for thermal dissipation is very usefull in case of high temperature inside the system and low temperature outside. In that case, both sides of the PBGA should be thermally connected to the metal chassis in order to propagate the heat through the metal. Figure 6-7 illustrates such an implementation.

Figure 6-6. Bottom side layout and decoupling

Ground plane for thermal dissipation

Via to ground layer

Figure 6-7. Use of metal plate for thermal dissipation

Metal planes Thermal conductor

Board

Die

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6.2 HIGH SPEED SIGNALS

Some Interfaces of the STPC run at high speed and have to be carefully routed or even shielded.

Here is the list of these interfaces, in decreasing speed order:

- Memory Interface.

- Graphics and video interfaces

- PCI bus

- 14MHz oscillator stage

All the clocks have to be routed first and shielded for speeds of 27MHz or more. The high speed signals have the same contrainsts as some of the memory interface control signals.

The next interfaces to be routed are Memory, Video/graphics, and PCI.

All the analog noise sensitive signals have to be routed in a separate area and hence can be routed indepedently.

Figure 6-8. Shielding signals

ground ring

ground pad

shielded signal line

ground pad

shielded signal lines

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ORDERING DATA

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7 ORDERING DATA

7.1 ORDERING CODES

ST PC I01 66 BT C 3

STMicroelectronics

Prefix

Product Family

PC: PC Compatible

Product ID

I01: Industrial

Core Speed

66: 66MHz 80: 80MHz

Package

BT: 388 Overmoulded BGA

Temperature Range

C: Commercial

Tcase = 0 to +100°C

I: Industrial

Tcase = -40 to +100°C

Operating Voltage

3 : 3.3V ± 0.3V

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7.2 AVAILABLE PART NUMBERS

Part Number

Core Frequency

(MHz)

CPU Mode

Tcase Range

(C)

Operating Voltage

(V)

STPCI0166BTC3 66 DX

0°C to +100°C

3.3V ± 0.3V

STPCI0180BTC3 80 DX STPCI0166BTI3 66 DX

-40°C to +100°C

STPCI0180BTI3 80 DX

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of useof such information nor for any infringement ofpatents or other rights of third parties which may result from itsuse. No license isgranted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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Issue 1.1

Datasheet STPCI01 Datasheet (SGS Thomson Microelectronics)

Specifications and Main Features

Frequently Asked Questions

User Manual