SGS Thomson Microelectronics M48T559Y Datasheet

M48T559Y
64 Kbit (8Kb x8) TIMEKEEPER® SRAM
with ADDRESS/DATA MULTIPLEXED
SOFTWARE and HARDWARE RESET for
WATCHDOG T IM ER
TIMEKEEPER SRAM
ADDRESS/DATA MULTIPL EXED I/O PINS
WATCHDOG TIMER - MONITORS OUT of
CONTROL PROCESSOR or HUNG BU S
ALARM with WAKE-UP in BATTERY MODE
INTEGRATED ULTRA LOW POWER SRAM,
REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY
FREQUENCY TEST OUTPUT for REAL TIME
CLOCK
AUTOMATIC POWER-FAIL CHIP DESELECT
and WRITE PROTECTION
WRITE PROTECT VOLTAGE
(V
= Power-fail Deselect Voltage):
PFD
– M48T559Y: 4.2V V
PACKAGING INCLU DES a 28- L EAD SOIC
and SNAPHAT
®
TOP
PFD
4.5V
(to be Ordered Separately)
SOIC PACKAGE PROVIDES D IREC T
CONNECTION for a SNAPHAT TOP CONTAINS the BATTERY and CRYSTAL
MICROPROCESSOR POWER-ON RESET
(Valid even during battery back-up mode)
PROGRAMM ABLE A L A R M O U TPUT ACTIVE
in the BATTERY BACK-UP MODE
SNAPHAT (SH)
Battery/Crystal
28
1
SOH28 (MH)
Figure 1. Logic Diagram
V
CC
AS0 AS1
W
R
RSTIN1
M48T559Y
8
AD0-AD7
RST IRQ/FT
DESCRIPTION
The M48T559Y TI MEKEEPER
®
RAM is an 8K x 8 non-volatile static RAM and real time clock. The monolithic chip is available in the SNAPHAT pack­age to provide a highly integrated battery backed­up memory and real time clock solution.
The 28 pin 330mil SOIC provides sockets with gold plated contacts at both ends for direct con­nection to a separate SNAPHAT housing cont ain­ing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process.
RSTIN2
WDI
E
V
SS
AI01674B
1/18February 2000
M48T559Y
Figure 2. SOIC Connections
RST V
WDI RSTIN1 RSTIN2
DU NC NC NC
NC AD0 AD1
V
SS SS
1 2 3 4 5 6 7
M48T559Y
8 9 10 11 12 13 14
AI01675B
28 27 26 25 24 23 22 21 20 19 18 17 16 15
CC
W IRQ/FT DU DU AS1 AS0 R E AD7 AD6 AD5AD2 AD4 AD3V
Table 1. Signal Names
AD0-AD7 Address/Data AS0
-AS1 Address Strobes W R E WDI Watchdog Input RSTIN1
RST
IRQ V
V NC Not Connected Internally
DU
-RSTIN2 Reset Input
/FT
CC SS
Write Enable Read Enable Chip Enable
Power Fail Reset Output (Open Drain)
Interrupt / Frequency Test Output (Open Drain)
Supply Voltage Ground
Don’t Use must be connected
or V
to V
CC
SS
Table 2. Absolute Maximum Ratings
Symbol Parameter Value Unit
T
A
T
STG
V
IO
V
CC
I
O
P
D
Note: Stress es greate r than t hose listed unde r "Absolute Maxi m um Ratings" may c ause perm anent damage to the device. This is a stress
rating onl y and fun ct i onal oper at i on of the device at these or any other conditions above t hose indicated in the operat i onal section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect reliability.
CAUTION: Negative undershoo ts bel ow –0.3V are not allowed on any pi n while in the B at tery Back- up mode. CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Ambient Operating Temperature 0 to 70 °C Storage Temperature (VCC Off, Oscillator Off) Input or Output Voltages –0.3 to 7 V Supply Voltage –0.3 to 7 V Output Current 20 mA Power Dissipation 1 W
–40 to 85 °C
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device sur­face-mounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery/crystal packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For t he 2 8 le ad S OIC , t he ba t­tery/crystal package (i.e. SNAPHAT) part number is "M4T28-BR12SH1".
Caution: Do not place the SNAPHAT battery/crys­tal top in conductive foam, as this will drain the lith­ium button-cell battery.
As Figure 3 shows, the static memory array and the quartz controlled clock oscillator of the M48T559Y are integrated on one silicon chip. The
2/18
two circuits are interconnected at the up per eight memory locations to provide user accessible
BYTEWIDE™ clock information in the by tes with addresses 1FF8h-1FFFh. The clock locations contain the year, month, date, day, ho ur, minute, and second in 24 hour BCD format. Corrections for 28, 29 (leap year), 30, and 31 day months are made automatically. Byte 1FF8h is the clock con­trol register. This byte controls us er ac cess to t he clock information and also stores the clock calibra­tion setting.
The eight clock bytes are not the actual clock counters themselves; they are memory locations consisting of BiPORT™ read/write memory cells.
The M48T559Y includes a clock control circuit which updates the clock bytes with current infor-
Figure 3. Block Diagram
M48T559Y
IRQ/FT
OSCILLATOR AND
CLOCK CHAIN
32,768 Hz CRYSTAL
POWER
LITHIUM
CELL
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
RSTIN1
V
CC
Table 3. Operating Modes
Mode
V
CC
RSTIN2
(1)
Deselect Write
4.5V to 5.5V
Read Read Deselect
Deselect
Note: 1. X = VIH or VIL; VSO = Battery Back-up Swit ch ov er Volta ge.
2. See Table 7 for details.
3. AD0-AD7, AS0
V
to V
SO
PFD
V
SO
, AS1 active when E is high and VCC > V
(min)
(2)
V
PFD
RST
E R W AD0-AD7 Power
V
IH
V
IL
V
IL
V
IL
X X X High Z CMOS Standby X X X High Z Battery Back-up Mode
PFD
16 x 8 BiPORT SRAM ARRAY
8176 x 8
SRAM ARRAY
V
SS
E
X X High Z
V
IH
V
IL
V
IH
.
V
IL
V
IH
V
IH
DATA
TRANSCEIVER
UPPER
ADDRESS
LATCH
LOWER
ADDRESS
LATCH
AD0-AD7
Standby
D
D
OUT
IN
Active Active
High Z Active
W R
AS1
AS0
AI01676B
(3)
mation once per second. The information can be accessed by the user i n t he sa me m anner as any other location in the static memory array.
The M48T559Y also has its own Power-fail Detect circuit. The control circuitry constantly monitors the single 5V supply for an out of tolerance condi­tion.
When VCC is out of tolerance, the circuit write pro­tects the SRAM, providing a h igh degree of data security in the midst of unpredictable system oper­ation brought on by low V
. As VCC falls be low
CC
approximately 3V, the control circuitry connects the battery which maintains data and clock opera­tion until valid power returns.
3/18
M48T559Y
Table 4. AC Measurement Conditions
Input Rise and Fall Times 5ns
Figure 4. AC Testing Load Circuit
5V
Input Pulse Voltages 0 to 3V Input and Output Timing Ref. Voltages 1.5V
Note that Output Hi-Z is defined as the point where data is no longer driven.
Table 5. Capacitance
= 25 °C, f = 1 MHz)
(T
A
(1, 2)
DEVICE
UNDER
TEST
1k
CL includes JIG capacitance
1.9k
OUT
CL = 100pF
Symbol Parameter Test Condition Min Max Unit
V
V
IN
OUT
= 0V
= 0V
10 pF 10 pF
C
IN
C
IO
Note: 1. Effectiv e capacitance measured with power suppl y at 5V .
2. Sampled only, not 100% tested.
3. Outputs deselected.
Input Capacitance
(3)
Input / Output Capacitance
AI01673
Table 6. DC Characteristics
= 0 to 70 °C; VCC = 4.5V to 5.5V)
(T
A
Symbol Parameter Test Condition Min Max Unit
(1)
Input Leakage Current
I
LI
(1)
I
LO
I
LRST
I
I
CC1
I
CC2
V
IL
V
Output Leakage Current
(2)
Input Leakage Current Supply Current Outputs open 50 mA
CC
Supply Current (Standby) TTL
(3)
Supply Current (Standby) CMOS
(4)
Input Low Voltage –0.3 0.8 V Input High Voltage 2.2
IH
Output Low Voltage
V
OL
Output Low Voltage (IRQ
(6)
V
OH
Note: 1. Outputs deselected.
Output High Voltage
2. Input leakage current on input RESET p i ns.
3. AD0-AD7, AS0
4. Ne ga t i ve spik e s of –1V allo wed for up t o 10 ns once pe r cycle .
5. The IRQ
6. Measured with Control Bits set as follows: R = '1'; W, ST , FT = '0'.
, AS1 active when E is high and VCC > V
pins is Open Drain.
/FT)
(5)
PFD
0V V
0V V
0V V
E
.
V
IN
CC
V
OUT
V
IN
CC
E
= V
IH
= VCC – 0.2V
I
= 2.1mA
OL
IOL = 10mA I
= –1mA
OH
CC
±1 µA ±5 µA
100 µA
10 mA
7mA
V
+ 0.3
CC
0.4 V
0.4 V
2.4 V
V
4/18
M48T559Y
Table 7. Power Down/Up Trip Points DC Characteristics
(1)
(TA = 0 to 70 °C)
Symbol Parameter Min Typ Max Un it
V
PFD
V
SO
t
DR
Note: 1. All voltages referenced to VSS.
2. At 25°C.
Power-fail Deselect Voltage 4.2 4.35 4.5 V Battery Back-up Switchover Voltage 3.0 V
(2)
Expected Data Retention Time 7 YEARS
Table 8. Power Down/Up AC Characteristics
(T
= 0 to 70 °C)
A
Symbol Parameter Min Max Unit
t
PD
(1)
t
F
(2)
t
FB
t
R
t
RB
t
REC
Note: 1. V
2. V
PFD
es V
PFD
E at VIH before Power Down
V
(max) to V
PFD
V
(min) to VSS VCC Fall Time
PFD
V
(min) to V
PFD
VSS to V V
(max) to V
(min).
PFD
(min) to VSS fall time of less than tFB may cause corruption of RAM data.
PFD
(max) to RST High
PFD
(min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after VCC pass-
PFD
(min) VCC Fall Time
PFD
(max) VCC Rise Time
PFD
(min) VCC Rise Time
0 µs
300 µs
10 µs 10 µs
s
40 200 ms
Figure 5. Power Down/Up Mode AC Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
VSO
tF
tFB
RST
INPUTS
OUTPUTS
VALID VALID
(PER CONTROL INPUT)
tDR
tRB
DON'T CARE
HIGH-Z
tR
tRECtPD
RECOGNIZEDRECOGNIZED
(PER CONTROL INPUT)
AI01384D
5/18
M48T559Y
Table 9. AC Characteristics
(T
= 0 to 70 °C; VCC = 4.5V to 5.5V)
A
Symbol Parameter
t
AS
t
AH
t
DS
t
DH
t
RLDV
t
RLRH
t
RHDZ
t
WLWH
t
ELEH
t
ASLASH
t
ASHRL
t
ASHWL
t
ELRL
t
EHDZ
t
ELWL
Address Setup Time 20 ns Address Hold Time 0 ns Data Setup Time 60 ns Data Hold Time 0 ns Read Enable Access Time 70 ns R Pulse Width Low 70 ns Read Enable High to Output High Z 25 ns W Pulse Width Low 50 ns E Pulse Width Low 50 ns AS0, AS1 Pulse Width Low 15 ns AS0, AS1 High to R Low 15 ns AS0, AS1 High to W Low 15 ns Chip Enable Low to Read Enable Low 0 ns Chip Enable High to Data Output Hi-Z 0 ns Chip Enable Low to Write Enable Low 0 ns
M48T559Y
Unit
Min Max
RAM OPERATION
Four control signals, AS0
, AS1, R and W, ar e us ed to access the M48T559Y. The address latches are loaded from the address/data b us in respon se to rising edge signals applied to the Address Strobe 0 (AS0
) and Address Strobe 1 (AS1) signals. AS0 is used to latch the lower 8 b its of address, and AS1
is used to latch the upper 5 bits of address.
It is not however necessary to follow any particular order. The inputs are in parallel for the two ad­dress bytes (upper and lower) and can be latched in any order as long as the correct strobe is used. It is necessary to meet the set-up and hold times given in the AC specifications with valid address information in order to properly latch the address. If the upper and/or lower order addresses are cor­rect from a prior cycle, it is not necessary to repeat the address latching sequence.
A write operation requires valid dat a to be placed on the bus (AD0-AD7), followed by the activation of the Write Enabl e (W
) line. Data on t he bus wi ll be written to the RAM, provided that the write tim­ing specific ations are met. During a read cycl e, the Read Enable (R
) signal is driven active. Data from the RAM will become valid on the bus provided that the RAM read access timing specifications are met.
The W
and R signals should never be active at the
same time. In addition, E
must be active before any control line is recognized (except for AD0-AD7 and AS0
, AS1).
RESET INPUT
The M48T559Y provides two debounced inputs which can generate an output Reset. The duration and function of the Reset output is identical to a Reset generated by a power cycle. Pulses shorter than t
and tR2 will not generate a Reset condi-
R1
tion (see Table 12 and Figure 13).
DATA RETENTION MODE
Should the supply voltage decay, the RAM will au­tomatically power-fail deselect, write protecting it­self w hen V
falls within the V
CC
PFD
(max), V
PFD
(min) window. All outputs become high imped­ance, and all inputs are treated as "don't care."
Note: A power failure during a write cycle may cor­rupt data at the currently addressed location, but does not jeopardize the rest of the RAM's content. At voltages below V
(min), the user can be as-
PFD
sured the memory will be in a write protected state, provided the V
fall time is no t les s than tF.
CC
6/18
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