Samsung S3CB018, S3FB018 Datasheet

S3CB018/FB018 PRODUCT OVERVIEW
1 PRODUCT OVERVIEW
CALMRISC OVERVIEW
The S3CB018/FB018 single-chip CMOS microcontroller is designed for high performance using Samsung’ s newest 8-bit CPU core, CalmRISC.
CalmRISC is an 8-bit low power RISC microcontroller. Its basic architecture follows Harvard style, that is, it has separate program memory and data memory. Both instruction and data can be fetched simultaneously without causing a stall, using separate paths for memory access. Represented below is the top block diagram of the CalmRISC microcontroller.
1-1
PRODUCT OVERVIEW S3CB018/FB018
S3CB018/FB018 OVERVIEW
FEATURES SUMMARY CPU
8-Bit RISC architecture
Memory
ROM: 4 Kword (8 K-byte)
RAM: 3072 (1024+2048) byte
1024 (X-memory) byte 2048 (Y-memory) byte
Stack
size: maximum 16 (word)-level
26 I/O Pins
I/O: 26 pins, including 8 S/W open drain pins
8-Bit Basic Timer
Programmable interval timer
8 kinds of clock source
Watchdog Timer
System reset when 11-bit counter overflows
16-Bit Timer/Counter
Programmable interval timer
Two 8-bit timer counter mode and one 16-bit
timer counter mode, selectable by S/W
Watch Timer
Real time clock or interval time measurement
Four frequency outputs for buzzer sound
8-Bit Serial I/O Interface
8-bit transmit/receive mode
8-bit receive mode
LSB first or MSB first transmission selectable
Internal and external clock source
16-Bit Serial I/O Interface
16-bit transmit/receive mode
External clock source
Coprocessor
MAC 816
8 x 16, 16 x 16 Multiply and Accumulation
Arithmetic operation
Two Power-Down Modes
Idle mode: only CPU clock stop
Stop mode: selected system clock and CPU
clock stop
Oscillation Sources
Crystal and Ceramic (0.4-20MHz), RC
Oscillation
Programmable oscillation source
Instruction Execution Times
50ns at 20MHz for 1 cycle instruction
100ns at 20MHz for 2 cycle instruction
1-2
S3CB018/FB018 PRODUCT OVERVIEW
DO[7:0]
DI[7:0]
PA[19:0] PD[15:0]
Program Memory Address
Generation Unit
TBH TBL
ABUS[7:0]
ALUL ALUR
ALU
PC[19:0]
20
HS[0]
Hardware
Stack
HS[15]
BBUS[7:0]
Flag
RBUS
20
8
8
R0 R1 R2 R3
GPR
DA[15:0]
ILHILX ILL
Data Memory
Address
Generation Unit
Bank 0,1
IDH
Figure 1-1. Top Block Diagram of CalmRISC
SR0SR1
IDL0
IDL1
SPR
1-3
PRODUCT OVERVIEW S3CB018/FB018
The CalmRISC building blocks consist of: — An 8-bit ALU
— 16 general purpose registers (GPR) — 11 special purpose registers (SPR) — 16-level hardware stack — Program memory address generation unit — Data memory address generation unit
16 GPR’ s are grouped into four banks (Bank0 to Bank3) and each bank has four 8-bit registers (R0, R1, R2, and R3). SPR’ s, designed for special purposes, include status registers, link registers for branch-link instructions, and data memory index registers. The data memory address generation unit provides the data memory address (denoted as DA[15:0] in the top block diagram) for a data memory access instruction. Data memory contents are accessed through DI[7:0] for read operations and DO[7:0] for write operations. The program memory address generation unit contains a program counter, PC[19:0], and supplies the program memory address through PA[19:0] and fetches the corresponding instruction through PD[15:0] as the result of the program memory access. CalmRISC has a 16-level hardware stack for low power stack operations as well as a temporary storage area.
CalmRISC has a 3-stage pipeline as described below:
Instruction Fetch
(IF)
Instruction Decode/
Data Memory Access
(ID/MEM)
Execution/Writeback
(EXE/WB)
Figure 1-2. CalmRISC Pipeline Diagram
As can be seen in the pipeline scheme, CalmRISC adopts a register-memory instruction set. In other words, data memory where R is a GPR, can be one operand of an ALU instruction as shown below:
The first stage (or cycle) is Instruction Fetch stage (IF for short), where the instruction pointed to by the program counter, PC[19:0] , is read into the Instruction Register (IR for short). The second stage is Instruction Decode and Data Memory Access stage (ID/MEM for short), where the fetched instruction (stored in IR) is decoded and data memory access is performed, if necessary. The final stage is Execute and Write-back stage (EXE/WB), where the required ALU operation is executed and the result is written back into the destination registers.
Since CalmRISC instructions are pipelined, the next instruction fetch is not postponed until the current instruction is completely finished, but is performed immediately after the current instruction fetch is done. The pipeline stream of instructions is illustrated in the following diagram.
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S3CB018/FB018 PRODUCT OVERVIEW
/ 1
ID/MEM
/ 2
EXE/WBIF
IF
ID/MEM
/ 3
IF
/ 4
EXE/WB
ID/MEM
IF IF
EXE/WB
/ 5
ID/MEM
IF
/ 6
EXE/WB
ID/MEM
IF
EXE/WB
ID/MEM
EXE/WB
Figure 1-3. CalmRISC Pipeline Stream Diagram
Most CalmRISC instructions are 1-word instructions, while same branch instructions such as “LCALL” and “LJT” instructions are 2-word instructions. In Figure 1-3, the instruction, I4, is a long branch instruction and it takes two clock cycles to fetch the instruction. As indicated in the pipeline stream, the number of clocks per instruction (CPI) is 1 except for long branches, which take 2 clock cycles per instruction.
1-5
PRODUCT OVERVIEW S3CB018/FB018
P3.0 - P3.1
P2.0 - P2.7
P1.0 - P1.7
P0.0 - P0.7
Port 3
Port 2
Port 1
Port 0
OSC
Control
X-Memory
1024 Byte
MAC
816
WT BT/WDT
CalmRISC
CPU
Y-Memory 2048 Byte
Control Register
128 Byte
(38 Byte)
Figure 1-4. S3CB018/FB018 Block Diagram
SIO
Timer A
Timer B
SIO
SI S0 SCK
TACLK TAOUT
TBCLK TBOUT
ADDA
1-6
S3CB018/FB018 PRODUCT OVERVIEW
PIN ASSIGNMENTS
VSS
XOUT
X
TEST
SI/P0.0
SO/P0.1
RESET
SCK/P0.2 BUZ/P0.3
CSI/P0.4
CSO/P0.5
CSCK/P0.6
CFSYNC/P0.7
CFSYNC/P0.7
P1.0 P1.1 P1.7
VSS
X
OUT
XIN
TEST
SI/P0.0
SO/P0.1
RESET
SCK/P0.2 BUZ/P0.3
CSI/P0.4
CSO/P0.5
CSCK/P0.6
P1.0 P1.1
1 2 3
IN
4 5 6 7 8 9 10 11 12 13 14 15 16
S3CB018
32-SOP
(Top-View)
Figure 1-5. 32-SOP Pin Assignment
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
S3CB018
30-SDIP
(Top View)
VDD
32
P3.1/SCLK/INT01
31
P3.0/SDAT/INT00
30
P2.7/TACLK
29
P2.6/TBOUT
28
P2.5/TBCLK
27
P2.4/TAOUT
26
P2.3/INT13
25
P2.2/INT12
24
P2.1/INT11
23
P2.0/INT10
22
P1.2
21
P1.3
20
P1.4
19
P1.5
18
P1.6
17
VDD
30
P3.1/SCLK/INT01
29
P3.0/SDAT/INT00
28
P2.7/TACLK
27
P2.6/TBOUT
26
P2.5/TBCLK
25
P2.4/TAOUT
24
P2.3/INT13
23
P2.2/INT12
22
P2.1/INT11
21
P2.0/INT10
20
P1.2
19
P1.3
18
P1.4
17
P1.5
16
Figure 1-6. 30-SDIP Pin Assignment
1-7
PRODUCT OVERVIEW S3CB018/FB018
I/O PIN DESCRIPTION
Table 1-1. S3CB018/FB018 Pin Descriptions (32-SOP)
Pin
Name
Pin
Type
P0.0-P0.7 I/O I/O port with bit programmable pins; Input and output mode are
selectable by software; Software assignable pull-up. P0.4-P0.7 can be used as inputs for comparator input CIN0-CIN3.; Alternately they can be used as SI, SO, SCK, BUZ, CSI, CSO, CSCK, CFSYNC.
P1.0-P1.7 O Output port with bit programmable pins; Push-pull output mode
and open-drain output mode are selected by software; Software assignable pull-up.
P2.0-P2.7 I/O I/O port with bit programmable pins; Input and output mode are
selectable by software; Software assignable pull-up; P2.0-P2.3 can be used as inputs for external interrupts INT10-INT13. (with noise filter) ; Alternately they can be used as TAOUT, TACLK or TBOUT, TBCLK.
P3.0-P3.1 I/O I/O port with bit programmable pins; Input or output mode
selected by software; software assignable pull-up; P3.0-P3.1 can be used as inputs for external interrupts INT00-INT01. (with noise filter and interrupt polarity control)
Pin Description
Circuit
Type
D-2
F-10
Share
Pins
SI, SO, SCK BUZ, CSI, CSO, CSCK, CFSYNC
E-2
D-4
INT10-INT13
D-2
TAOUT TACLK TBOUT TBCLK
D-4 INT00-INT01
Table 1-2. S3CB018/FB018 Pin Descriptions (30-SDIP)
Pin
Name
Pin
Type
Pin Description Circuit
P0.0-P0.7 I/O I/O port with bit programmable pins; Input and output mode are
selectable by software; Software assignable pull-up. P0.4-P0.7 can be used as SI, SO, SCK, BUZ, CSI, CSO, CSCK, CFSYNC, Alternately.
P1.0-P1.5 O O port with bit programmable pins; Push-pull output mode and
open-drain output mode are selected by software; Software assignable pull-up.
P2.0-P2.7 I/O I/O port with bit programmable pins; Input and output mode are
selectable by software; Software assignable pull-up; P2.0-P2.3 can be used as inputs for external interrupts INT10-INT13. (with noise filter); Alternately they can be used as TAOUT, TACLK or TBOUT, TBCLK.
P3.0-P3.1 I/O I/O port with bit programmable pins; Input or output mode
selected by software; software assignable pull-up; P3.0-P3.1 can be used as inputs for external interrupts INT00-INT01. (with noise filter and interrupt polarity control)
NOTE: In S3CB018/FB018, the CSI, CSO, CSCK, CFSYNC pins are shared with P0.7-P0.4.
Share
Type
D-2
F-10
Pins
SI, SO, SCK BUZ, CSI, CSO, CSCK, CFSYNC
E-2
D-4
INT10-INT13
D-2
TAOUT TACLK TBOUT TBCLK
D-4 INT00-INT01
1-8
S3CB018/FB018 PRODUCT OVERVIEW
Table 1-3. I/O Pin Description
Pin Name Pin Type Description
CSI I AD/DA Serial Input (from codec) CSO O AD/DA Serial Output (to codec) CSCK I AD/DA Serial Clock (from codec) CFSYNC I AD/DA Sync signal (from codec) SI I/O Serial data input SO I/O Serial data output SCK I/O Serial I/O interface clock signal BUZ I/O 0.5 kHz, 1 kHz, 2 kHz, or 4 kHz frequency output at 4.19 MHz for buzzer sound INT10-INT13 I External interrupts. Stop release. Can’ t be masked by S/W individually but
wholly. TAOUT I/O Timer A interval mode output TACLK I/O Timer A counter external clock input TBOUT I/O Timer B interval mode output TBCLK I/O Timer B counter external clock input INT00-INT01 I External interrupts. Stop release. Can be masked by S/W individually. SDAT I Serial data for Programmable memory SCLK I Serial clock for Programmable memory VDD Power supply VSS Ground TEST Test signal input RESET I Reset signal XIN, X
OUT
Crystal, ceramic and RC oscillator signal for system clock (For external clock
input, use XIN and input XIN's reverse phase to X
OUT
)
1-9
PRODUCT OVERVIEW S3CB018/FB018
PIN ASSIGNMENTS
P0.0 P0.1 P0.2
V P0.3 P0.4 P0.5
GND
P0.6 P0.7
V P1.0 P1.1 P1.2 P1.3
GND
P1.4 P1.5 P1.6 P1.7
GND
X
XOUT
V
DDI/VDD
P2.0 P2.1 P2.2
V P2.3 P2.4
GND
P2.5 P2.6 P2.7
VDD P3.0 P3.1
GND
TMODE
PIN_RESB
CFSYNC
CSOUT
CSCLK
CSIN
V
DD
156
157
158
159
160
1 2 3 4
DD
5 6 7 8 9 10 11
DD
12 13 14 15 16 17 18 19 20 21 22
IN
23 24 25 26 27 28
DD
29 30 31 32 33 34 35 36 37 38 39 40
45
44
434241
PTMS
PTCK_MCLK
V
PNTRST_STATEINIT
JTAGSEL
DD
/V
DDI
EVENIO
WENIO
OENIO
153
154
155
484746
GND
PTDO_TXD
PTDI_RXD
CSNWIO
CSNBIO
GND
150
151
152
50
49
NPMCS
NPMOE
NPMWE
WENX
OENX
148
149
535251
VDD
RUNST
VDD/VDDI
CSNXH
CSNXL
XD15
144
145
146
147
(Top-View)
57
565554
NP64KW
XDOCNT
DOCNTX
OUTDIS
XD10
XD11
XD12
XD13
XD14
GND
138
139
140
141
142
143
S3EB010
160-QFP
636261
605958
PD12
PD13
VDD/VDDI
PD14
PD15
GND
XD9
137
64
PD11
XD8
136
65
GND
V
DD
135
66
PD10
XD7
134
67
PD9
XD6
133
68
PD8
XD5
132
69
V
DD
/V
DDI
XD4
131
70
PD7
GND
130
71
PD6
XD3
129
72
PD5
XD2
128
73
PD4
XD1
127
GND
XD0
126
PD3
VDD
125
767574
PD2
XDA1
XDA0
123
124
78
77
PD0
PD1
XDA3
XDA2
121
122
80
79
ICLKO
GND
120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
XDA4 XDA5 XDA6 GND XDA7 XDA8 XDA9 VDD/V
DDI
XDA10 XDA11 XDA12 XDA13 GND TEST PA0 PA1 PA2 VDD/VDDI PA3 PA4 PA5 GND PA6 PA7 V
DD
PA8 PA9 PA10 PA11 GND PA12 PA13 PA14 PA15 VDD PA16 PA17 PA18 PA19 BKREQX
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Figure 1-7. S3EB010 Pin Diagram
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