Samsung BD-F8900M, BD-F8900N, BD-F8909S, BD-F8500, BD-F8500A Service Manual

...

Blu-rayDiscPlayer

BD-F8500

Application Models

Application Area BAS, EN, XE, XN, XU, XY, ZF, ZG

BD-F8500 / BD-F8500A / BD-F8500M / BD-F8500N / BD-F8509S / BD-F8900 / BD-F8900A / BD-F8900M / BD-F8900N / BD-F8909S

MANUAL

SERVICE

Blu-RayDiscPlayer

1.Precautions

2.ProductSpecications

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagrams

6.SchematicDiagrams

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precautions......................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.2.1.GeneralServicingPrecautions.......................................................................................1−3

1.2.2.InsulationCheckingProcedure.......................................................................................1−3

1.3.ESDPrecautions......................................................................................................................1−4

1.4.Handlingtheopticalpick-up......................................................................................................1−5

2.ProductSpecications........................................................................................................................2−1

2.1.ProductSpecication................................................................................................................2−1

2.1.1.PlayerFeatures...........................................................................................................2−2

2.1.2.Blu-rayDiscFeatures...................................................................................................2−2

2.1.3.Disctypesandcontentsyourproductcanplay..................................................................2−3

2.1.4.Disctypesyourproductcannotplay................................................................................2−4

2.1.5.AvailableRecordingTimeforinternalHDD.....................................................................2−4

2.1.6.Regioncode...............................................................................................................2−5

2.1.7.LogosofDiscstheproductcanplay................................................................................2−5

2.1.8.SupportedFormats.......................................................................................................2−6

2.2.ChassisProductSpecication.....................................................................................................2−10

2.3.OptionProductSpecication......................................................................................................2−20

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.CabinetandPCB.....................................................................................................................3−1

3.1.1.TopCabinetRemoval...................................................................................................3−1

3.1.2.Wi-FiModuleRemoval................................................................................................3−2

3.1.3.AssyDeckRemoval.....................................................................................................3−3

3.1.4.AssyS-HDDRemoval.................................................................................................3−4

3.1.5.S.M.P.SPCBRemoval.................................................................................................3−5

3.1.6.Fan&FrontPCBRemoval............................................................................................3−6

3.1.7.MainPCBRemoval.....................................................................................................3−7

3.2.PCBLocation.........................................................................................................................3−8

4.Troubleshooting................................................................................................................................4−1

4.1.Troubleshooting......................................................................................................................4−1

4.2.SoftwareUpdate......................................................................................................................4−13

4.2.1.UpdateNow...............................................................................................................4−13

4.2.2.AutoUpdate...............................................................................................................4−14

4.3.DeckAdjustment.....................................................................................................................4−15

5.PCBDiagrams..................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−2

5.2.MainPCB..............................................................................................................................5−3

Contents

5.3.FrontPCB..............................................................................................................................5−5

5.4.TouchPCB.............................................................................................................................5−6

6.SchematicDiagrams..........................................................................................................................6−1

6.1.AllBlockDiagram...................................................................................................................6−2

6.2.Power....................................................................................................................................6−3

6.2.1.AboutS.M.P .S(RingingChokeConverterMethod)............................................................6−3

6.2.2.Circuitdescripcotion[FL Y -BackRCC(RingingChokeConverter)]Control............................6−3

6.2.3.InternalBlockDiagram(InternalBlockDiagramofS.M.P .SCircuit)....................................6−5

6.3.S.M.P.S(S.M.P .SPCB).............................................................................................................6−6

6.4.PowerBlock(MainPCB)..........................................................................................................6−7

6.5.FrontEndSC75011(MainPCB)................................................................................................6−8

6.6.FrontEndSC75012(MainPCB)................................................................................................6−9

6.7.F_Micom(MainPCB).............................................................................................................6−10

6.8.HDMI_GPIO(MainPCB).........................................................................................................6−11

6.9.Ethernet_USB(MainPCB)........................................................................................................6−12

6.10.FOX-BMMCFlash(MainPCB)................................................................................................6−13

6.11.FOX-BDDR3(MainPCB)........................................................................................................6−14

6.12.FOX-BInterface(MainPCB)....................................................................................................6−15

6.13.SAT A_USB(MainPCB)...........................................................................................................6−16

6.14.TSD_Power(MainPCB)...........................................................................................................6−17

6.15.Tuner_LNB(MainPCB)...........................................................................................................6−18

6.16.2-CI(MainPCB).....................................................................................................................6−19

6.17.Front(FrontPCB)....................................................................................................................6−20

6.18.Touch(TouchPCB)..................................................................................................................6−21

1.Precautions

1.1.SafetyPrecautions

1)Beforereturninganinstrumenttothecustomer,alwaysmakeasafetycheckoftheentireinstrument,including,butnot limitedto,thefollowingitems:

a)Besurethatnobuilt-inprotectivedevicesaredefectiveorhavebeendefeatedduringservicing

i)Protectiveshieldsareprovidedtoprotectboththetechnicianandthecustomer .Correctlyreplaceallmissing

protectiveshields,includinganyremovedforservicingconvenience.

ii)Whenreinstallingthechassisand/orotherassemblyinthecabinet,besuretoputbackinplaceallprotective

devices,including,butnotlimitedto,nonmetalliccontrolknobs,insulatingshpapers,adjustmentand compartmentcovers/shields,andisolationresistor/capacitornetworks.Donotoperatethisinstrumentorpermit ittobeoperatedwithoutallprotectivedevicescorrectlyinstalledandfunctioning.

b)Besurethattherearenocabinetopeningsthroughwhichadultsorchildrenmightbeabletoinserttheirngersand

contactahazardousvoltage.Suchopeningsinclude,butarenotlimitedto,excessivelywidecabinetventilation slots,andanimproperlyttedand/orincorrectlysecuredcabinetbackcover.

c)LeakageCurrentHotCheck—Withtheinstrumentcompletelyreassembled,plugtheAClinecorddirectlyintoa

230V(220V~240V)ACoutlet.(Donotuseanisolationtransformerduringthistest.)

UsealeakagecurrenttesterorameteringsystemthatcomplieswithAmericanNationalStandardInstitute(ANSI) C101.1LeakageCurrentforAppliancesandUnderwritersLaboratories(UL)1270(40.7).Withtheinstrument’s ACswitchrstintheONpositionandthenintheOFFposition,measurefromaknownearthground(metal waterpipe,conduit,etc.)toallexposedmetalpartsoftheinstrument(antennas,handlebrackets,metalcabinets, screwheads,metallicoverlays,controlshafts,etc.),especiallyanyexposedmetalpartsthatofferanelectrical returnpathtothechassis.

Anycurrentmeasuredmustnotexceed0.5mA.

Reversetheinstrumentpowercordplugintheoutletandrepeatthetest.See

Anymeasurementsnotwithinthelimitsspeciedhereinindicateapotentialshockhazardthatmustbeeliminated beforereturningtheinstrumenttothecustomer.

Figure1.1ACLeakageT est

d)InsulationResistanceTestColdCheck—(1)Unplugthepowersupplycordandconnectajumperwirebetween

thetwoprongsoftheplug.(2)Turnonthepowerswitchoftheinstrument.(3)Measuretheresistancewith anohmmeterbetweenthejumperedACplugandallexposedmetalliccabinetpartsontheinstrument,suchas screwheads,antenna,controlshafts,handlebrackets,etc.Whenanexposedmetallicparthasareturnpathtothe chassis,thereadingshouldbebetween1and5.2megohm.Whenthereisnoreturnpathtothechassis,thereading mustbeinnite.Ifthereadingisnotwithinthelimitsspecied,thereisthepossibilityofashockhazard,andthe instrumentmustberepairedandrecheckedbeforeitisreturnedtothecustomer.See

1.Precautions

2)Readandcomplywithallcautionandsafetyrelatednotesonorinsidethecabinet,oronthechassis.

3)DesignAlterationWarning—Donotalteroraddtothemechanicalorelectricaldesignofthisinstrument.

Designalterationsandadditions,includingbutnotlimitedto,circuitmodicationsandtheadditionofitemssuchas auxiliaryaudiooutputconnections,mightalterthesafetycharacteristicsofthisinstrumentandcreateahazardtothe user.Anydesignalterationsoradditionswillmakeyou,theservicer,responsibleforpersonalinjuryorproperty damageresultingtherefrom.

4)Observeoriginalleaddress.Takeextracaretoassurecorrectleaddressinthefollowingareas:

(1)nearsharpedges,(2)nearthermallyhotparts(besurethatleadsandcomponentsdonottouchthermallyhotparts), (3)theACsupply,(4)highvoltage,and(5)antennawiring.Alwaysinspectinallareasforpinched,out-of-place,or frayedwiring,Donotchangespacingbetweenacomponentandtheprinted-circuitboard.ChecktheACpowercord fordamage.

5)Components,parts,and/orwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith components,partsand/orwiringthatmeetoriginalspecications.

Additionally,determinethecauseofoverheatingand/ordamageand,ifnecessary,takecorrectiveactiontoremove anypotentialsafetyhazard.

6)ProductSafetyNotice—Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichare oftennotevidentfromvisualinspection,norcantheprotectiontheygivenecessarilybeobtainedbyreplacingthemwith componentsratedforhighervoltage,wattage,etc.Partsthathavespecialsafetycharacteristicsareidentiedbyshading, an(

)schematicsandpartslists.Useofasubstitutereplacementthatdoesnothavethesamesafetycharacteristics astherecommendedreplacementpartmightcreateshock,reand/orotherhazards.Productsafetyisunderreview continuouslyandnewinstructionsareissuedwheneverappropriate.

1.Precautions

1.2.ServicingPrecautions

CAUTION

Beforeservicingunitscoveredbythisservicemanualanditssupplements,readandfollowtheSafetyPrecautions sectionofthismanual.

NOTE

Ifunforeseencircumstancescreateconictbetweenthefollowingservicingprecautionsandanyofthesafetyprecautions, alwaysfollowthesafetyprecautions.Remember:SafetyFirst.

1.2.1.GeneralServicingPrecautions

1)a.Alwaysunplugtheinstrument’sACpowercordfromtheACpowersourcebefore(1)removingorreinstallingany component,circuitboard,moduleoranyotherinstrumentassembly,(2)disconnectinganyinstrumentelectricalplugor otherelectricalconnection,(3)connectingatestsubstituteinparallelwithanelectrolyticcapacitorintheinstrument.

b.Donotdamageanyplug/socketB+voltageinterlockswithwhichinstrumentscoveredbythisservicemanual mightbeequipped.

c.DonotapplyACpowertothisinstrumentandoranyofitselectricalassembliesunlessallsolid-statedeviceheat sinksarecorrectlyinstalled.

d.Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthetestinstrument positivelead.Alwaysremovethetestinstrumentgroundleadlast.

NOTE

RefertotheSafetyPrecautionssectiongroundleadlast.

2)Theserviceprecautionsareindicatedorprintedonthecabinet,chassisorcomponents.Whenservicing,followthe printedorindicatedserviceprecautionsandservicematerials.

3)Thecomponentsusedintheunithaveaspeciedameresistanceanddielectricstrength.Whenreplacingcomponents, usecomponentswhichhavethesame.Componentsidentiedbyshading,inthecircuitdiagramareimportantforsafety orforthecharacteristicsoftheunit.Alwaysreplacethemwiththeexactreplacementcomponents.

4)Aninsulationtubeortapeissometimesusedandsomecomponentsareraisedabovetheprintedwiringboardfor safety.Theinternalwiringissometimesclampedtopreventcontactwithheatingcomponents.Installsuchelements astheywere.

5)Afterservicing,alwayscheckthattheremovedscrews,components,andwiringhavebeeninstalledcorrectlyandthat theportionaroundtheservicedparthasnotbeendamagedandsoon.

Further,checktheinsulationbetweenthebladesoftheattachmentplugandaccessibleconductiveparts.

1.2.2.InsulationCheckingProcedure

DisconnecttheattachmentplugfromtheACoutletandturnthepowerON.Connecttheinsulationresistancemeter(500V) tothebladesoftheattachmentplug.Theinsulationresistancebetweeneachbladeoftheattachmentplugandaccessible conductiveparts(seenote)shouldbemorethan1Megohm.

NOTE

Accessibleconductivepartsincludemetalpanels,inputterminals,earphonejacks,etc.

1.Precautions

1.3.ESDPrecautions

ElectrostaticallySensitiveDevices(ESD)

Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity .

SuchcomponentscommonlyarecalledElectrostaticallySensitiveDevices(ESD).ExamplesoftypicalESDdevicesare integratedcircuitsandsomeeld-effecttransistorsandsemiconductorchipcomponents.Thefollowingtechniquesshould beusedtohelpreducetheincidenceofcomponentdamagecausedbystaticelectricity.

1)Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffany electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively,obtainandwearacommercially availabledischargingwriststrapdevice,whichshouldberemovedforpotentialshockreasonspriortoapplyingpower totheunitundertest.

2)AfterremovinganelectricalassemblyequippedwithESDdevices,placetheassemblyonaconductivesurfacesuchas aluminumfoil,topreventelectrostaticchargebuilduporexposureoftheassembly.

3)Useonlyagrounded-tipsolderingirontosolderorunsolderESDdevices.

4)Useonlyananti-staticsolderremovaldevices.Somesolderremovaldevicesnotclassiedas“anti-static”cangenerate electricalchargessufcienttodamageESDdevices.

5)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufcienttodamageESDdevices.

6)DonotremoveareplacementESDdevicefromitsprotectivepackageuntilimmediatelybeforeinstallingit.(Most replacementESDdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,aluminumfoilor comparableconductivematerials).

7)ImmediatelybeforeremovingtheprotectivematerialsfromtheleadsofareplacementESDdevice,touchtheprotective materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

CAUTION

Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDdevices.

(Otherwiseharmlessmotionssuchasthebrushingtogetherofyourclothesfabricortheliftingofyourfootfroma carpetedoorcangeneratestaticelectricitysufcienttodamageanESDdevice).

1.Precautions

1.4.Handlingtheopticalpick-up

Thelaserdiodeintheopticalpickupmaysufferelectrostaticbreakdownbecauseofpotentialstaticelectricityfrom clothingandyourbody.

Thefollowingmethodisrecommended.

1)Placeaconductivesheetontheworkbench(Theblacksheetusedforwrappingrepairparts.)

2)Placethesetontheconductivesheetsothatthechassisisgroundedtothesheet.

3)Placeyourhandsontheconductivesheet(Thisgivesthemthesamegroundasthesheet.)

4)Removetheopticalpickupblock

5)Performworkontopoftheconductivesheet.Becarefultoletyourclothesoranyotherstaticsourcestouchtheunit.

NOTE

•Besuretoputonawriststrapgroundedtothesheet.

•Besuretolayaconductivesheet,thatisgroundedtothetable,madeofcopper.

Fig.1-3

6)ShorttheshortterminalonthePCB,whichisinsidethePick-UpASS’Y ,beforereplacingthePick-Up.(Theshort terminalisshortedwhenthePick-UpAss’yisbeingliftedormoved.)

7)AfterreplacingthePick-up,opentheshortterminalonthePCB.

2.ProductSpecications

2.1.ProductSpecication

2.ProductSpecications

2.1.1.PlayerFeatures

•SupportsaV arietyofDiscTypes

-Blu-ray(BD-ROM,BD-RE,BD-R),DVDVideo,DVD-RW/-R(Vmodeandnalizedonly)discsandAudioCD.

-CD-RW/CD-R,DVD-RW/-RandUSBstoragedevicecontentsuchasMP3,JPEGandDivXles.

•HDMI(HighDenitionMultimediaInterface)

HDMIreducespicturenoisebyallowingapuredigitalvideo/audiosignalpathfromtheplayertoyourTV .

2.1.2.Blu-rayDiscFeatures

Blu-rayDiscscanstore25GB(singlelayer)or50GB(duallayer)onasinglesideddisc-about5to10timesthecapacity ofaDVD.Blu-rayDiscsalsosupportthehighestqualityHDvideoavailableintheindustry(upto1920x1080at40 Mbit/sec)–Largecapacitymeansnocompromiseonvideoquality.Furthermore,aBlu-rayDischasthesamefamiliarsize andlookasDVD.

NOTE

ThefollowingBlu-rayDiscfeaturesarediscdependantandwillvary.

Appearanceandnavigationoffeatureswillalsovaryfromdisctodisc.

Notalldiscswillhavethefeaturesdescribedbelow .

•Videohighlights

TheBD-ROMformatformoviedistributionsupportsthreehighlyadvancedvideocodecs,includingA VC,VC-1, andMPEG-2.

HDvideoresolutionsarealsoavailable:

-1920x1080HD

-1280x720HD

•ForHigh-DenitionPlayback

Toviewhigh-denitioncontentsinBDdiscs,anHDTV(HighDenitionTelevision)isrequired.Somediscsmay requireusingtheplayer'sHDMIOUTtoviewhigh-Denitioncontent.Theabilitytoviewhigh-Denitioncontenton BDdiscsmaybelimiteddependingontheresolutionofyourTV.

•Graphicplanes

Twoindividual,fullHDresolution(1920x1080)videolayersareavailableontopoftheHDvideolayer.

Onelayerisassignedtovideo-relatedgraphics(likesubtitles),andtheotherlayerisassignedtointeractiveelements, suchasbuttonsormenus.V ariouswipes,fadesandscrolleffectsmaybeavailableonbothlayers.

•Menugraphics

Support256fullcolorresolutiongraphicsandanimation,therebygreatlysurpassingthecapabilitiesofDVDVideo. UnlikeDVD,Menuscanbeaccessedduringvideoplayback.

2.ProductSpecications

•Menusounds

WhenyouhighlightorselectamenuoptiononaBlu-raydisc,soundscanbeheardsuchasbuttonclicksoravoice overexplainingthehighlightedmenuchoice.

•Multi-page/PopUpMenus

WithDVD-Video,playbackisinterruptedeachtimeanewmenuscreenisaccessed.DuetoBlu-rayDisc'sabilityto preloaddatafromthediscwithoutinterruptingplayback,amenumayconsistofseveralpages.

Youcanbrowsethroughthemenupagesorselectdifferentmenupaths,whiletheaudioandvideoremainplaying inthebackground.

•Interactivity

CertainBlu-rayDiscsmaycontainAnimatedmenusandTriviagames.

•UserBrowsableSlideshows

WithBlu-rayDiscs,youcanbrowsethroughvariousstillpictureswhiletheaudioremainsplaying.

•Subtitles

DependingonwhatiscontainedontheBlu-rayDisc,youmaybeabletoselectdifferentfontstyles,sizesandcolorsfor thesubtitles,Subtitlesmayalsobeanimated,scrolledorfadedinandout.

•BD-LIVE

YoucanuseaBlu-rayDiscsupportingBD-LIVEthroughnetworkconnectiontoenjoyvariouscontentsprovided bythediscmanufacturer.

2.1.3.Disctypesandcontentsyourproductcanplay

2.ProductSpecications

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD-Rbecauseofthedisctypeorrecordingconditions.

•IfaDVD-RW/-RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD-Ratabit-ratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RorUSBdeviceatabitratethatexceeds25Mbps.

2.1.4.Disctypesyourproductcannotplay

•HDDVD

•DVD-RAM

•DVD-RW(VRmode)

•3.9GBDVD-RforAuthoring.

•DVD-ROM/PD/MVDisc,etc

•SuperAudioCD(exceptCDlayer)

•CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gsplayaudioonly,notgraphics.)

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD±RW/±Rbecauseoftherecordingconditions.

•IfaDVD±RW/±RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD±RW/±Ratabit-ratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RE/Ratabitratethatexceeds25Mbps.

•Playbackmaynotworkforsometypesofdiscs,orwhenyouusespecicoperations,suchasanglechangeandaspectratio adjustment.Informationaboutthediscsiswrittenindetailonthediscbox.Pleaserefertothisifnecessary.

•WhenyouplayaBD-Jtitle,loadingmaytakelongerthananormaltitleorsomefunctionsmayperformslowly .

2.1.5.AvailableRecordingTimeforinternalHDD

YoucanrecorddigitalbroadcastontheinternalHDDasbelow.Dependingontheactualbroadcast,availablerecordingtime maybedifferentwiththetableshownbelowInOnScreenDisplay,youcancheckavailablerecordingtimeasshownin "high"caseinthetableshownbelow.

2.ProductSpecications

NOTE

•Sincetheproduct'sTimeshiftandotherimplementedfunctionsrequireacertainamountofHDDspaceallocatedinternally,

thetotalsizeshowninthe"StorageDeviceManager"ofSettingsmenumaydifferfromtheHDD'scapacityshownin themanual.

2.1.6.Regioncode

Boththeproductandthediscsarecodedbyregion.Theseregionalcodesmustmatchinordertoplaythedisc.Ifthecodes donotmatch,thediscwillnotplay.TheRegionNumberforthisproductisdescribedontherearpaneloftheproduct.

2.1.7.LogosofDiscstheproductcanplay

2.ProductSpecications

2.1.8.SupportedFormats

VideoFileSupport

•Limitations

-Evenwhentheleisencodedbyasupportedcodeclistedabove,alemightnotbeplayedifitscontenthas

aproblem.

-Normalplaybackisnotguaranteedifthele’scontainerinformationiswrongortheleitselfiscorrupted.

-FileshavinghigherBitrate/frameratethanstandardmaystutterwhenplayedback.

-Seek(skip)functionisnotavailableifthele’sindextableisdamaged.

-Whenyouplaybackaleremotelythroughanetworkconnection,videoplaybackmaystutterdependingon

thenetworkspeed.

-SomeUSB/Digitalcameradevicesmaynotbecompatiblewiththeplayer.

•Videodecoder

-SupportsuptoH.264Level4.1

-DoesnotsupportH.264FMO/ASO/RS,VC1SP/MP/APL4.

-CODECsexceptforMVC,VP8,VP6

1)Below1280x720:60framesmax.

2)Above1280x720:30framesmax.

3)DoesnotsupportGMC2orhigher.

-SupportsSV AFTop/Bottom,SidebySide.

-SupportsBDMVCSpec.

•Audiodecoder

-SupportsWMA10PRO(Upto5.1).

-DoesnotsupportWMAlosslessaudio.

-DoesnotsupportQCELP/AMRNB/WB.

-Supportsvorbis(Upto2ch),Supportscodeconlyinwebmcontainer.

-SupportedADPCMIMA,MS.(MULA W ,ALA Warenotsupported)

NOTE

•PlaybackofsomeMKVorMP4lemaynotbesupporteddependingontheirvideoresolutionandframerate.

SupportedSubtitleFileFormats

2.ProductSpecications

MusicFileSupport

PictureFileSupport

2.ProductSpecications

NotesontheUSBconnection

•YourproductsupportsUSBstoragemedia,MP3products,digitalcameras,andUSBcardreaders.

•SomeUSB/digitalcameradevicesmaynotbecompatiblewiththeproduct.

•YourproductsupportstheFA T16,FA T32,andNTFSlessystems(readonly).

•ConnectUSBdevicesdirectlytotheproduct’sUSBport.ConnectingthroughaUSBcablemaycausecompatibility

problems.

•Insertingmorethanonememorydeviceintoamulti-cardreadermaycausethereadertooperateimproperly .

•TheproductsupportsthePTPprotocol.

•DonotdisconnectaUSBdeviceduringa"loading"process.

•Thebiggertheimageresolution,thelongertheimagetakestodisplay.

•ThisproductcannotplayMP3leswithDRM(DigitalRightsManagement)downloadedfromcommercialsites.

•Yourproductonlysupportsvideothatisunder30fps(framerate).

•YourproductonlysupportsUSBMassStorageClass(MSC)devicessuchasthumbdrives,ashcardreadersandUSB

HDD.(HUBisnotsupported.)

•CertainUSBHDDDevices,multi-cardreadersandthumbdrivesmaynotbecompatiblewiththisproduct.

•IfsomeUSBdevicesrequireexcessivepower,theymaybelimitedbythecircuitsafetydevice.

•IfplaybackfromaUSBHDDisunstable,provideadditionalpowerbypluggingtheHDDintoawallsocket.Ifthe

problemcontinues,contacttheUSBHDDmanufacturer.

•YoumustremovetheUSBstoragedevicesafely(byperformingthe"SafelyRemoveUSB"functiontopreventpossible

damagetotheUSBmemory).

•SAMSUNGisnotresponsibleforanydataledamageordataloss.

•Yourproductdoesnotsupportcompressionle,sparseleandencrptionleofNTFS.

-BeforedisconnectingaUSBdevice,pleaseuseUSBSafetyRemoval.

-Ifyoudon'tuseUSBSafetyRemoval,yourdataonUSBdevicecanbecorruptedorlost

-YoucanrepairorformataUSBdeviceonyourDesktopPC.(MS-WindowsOSonly)

ConnectaUSBdevicebeforeusingtheTimeshiftandRecordedTVfunctions

2.ProductSpecications

•TousetheTimeshiftmodeortheRecordedTVfunction,aconnectedUSBdevicemustbeexecutetheDeviceFormat

functiontoproperformforrecording.

-Duringthedeviceformatting,donotdisconnectthedevicewhileformattingisinprogress.Ifyouformatthe

device,allleswillbedeleted.

-Beforeformattingyourdevicetothisproduct,pleasebackupyourlestopreventthemfromdamageorlossof

data.SAMSUNGisnotresponsibleforanydataledamageordataloss.

•RecordedvideosareDRM(digitalrightsmanagements)protectedandcannotbeplayedonaPCorotherproduct.Note

thatlessavedontheTVcannotbeusedafterthemainboardischanged.

•Atleast100MBoffreespaceisrequiredforrecording.

•Recordingwillstopifthestorage'sfreespacebecomeslessthan50MB.

•IftheUSBdevicehasfailedtheDevicePerformanceTest,theUSBdevicemustgothroughtheDeviceFormatand

DevicePerformanceTestagainbeforeyourecordwiththeGuideorChannelManager.Ifthedevicehasfailedthe PerformanceTest,Itcannotbeusedforrecording.

A VCHD(AdvancedVideoCodecHighDenition)

•ThisproductcanplaybackA VCHDformatdiscs.Thesediscsarenormallyrecordedandusedincamcorders.

•TheA VCHDformatisahighdenitiondigitalvideocameraformat.

•TheMPEG-4A VC/H.264formatcompressesimageswithgreaterefciencythantheconventionalimagecompressing

format.

•SomeA VCHDdiscsusethe"x.v.Color"format.ThisproductcanplaybackA VCHDdiscsthatuse"x.v .Color"format.

•"x.v.Color"isatrademarkofSonyCorporation.

•"A VCHD"andtheA VCHDlogoaretrademarksofMatsushitaElectronicIndustrialCo.,Ltd.andSonyCorporation.

NOTE

•SomeA VCHDformatdiscsmaynotplay,dependingontherecordingcondition.A VCHDformatdiscsneedtobenalized.

•"x.v.Colour"offersawidercolourrangethannormalDVDcamcorderdiscs.

2.ProductSpecications

2.2.ChassisProductSpecication

2.ProductSpecications

+ 56 hidden pages