Samsung BD-E6300, BD-E6300S Service Manual

Blu-rayDiscPlayer

BD-E6300

Application Models

Application Area BAS, EN, ZF

BD-E6300/BD-E6300S

MANUAL

SERVICE

Blu-RayDiscPlayer

1.Precautions

2.ProductSpecications

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagrams

6.SchematicDiagrams

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precautions......................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.2.1.GeneralServicingPrecautions.......................................................................................1−3

1.2.2.InsulationCheckingProcedure.......................................................................................1−3

1.3.ESDPrecautions......................................................................................................................1−4

1.4.Handlingtheopticalpick-up......................................................................................................1−5

2.ProductSpecications........................................................................................................................2−1

2.1.ProductSpecication................................................................................................................2−1

2.1.1.PlayerFeatures...........................................................................................................2−1

2.1.2.Blu-rayDiscFeatures...................................................................................................2−2

2.1.3.DiscTypesandContentsthatcanbeplayed......................................................................2−3

2.1.4.LogosofDiscstheplayercanplay..................................................................................2−4

2.1.5.Disctypesyourproductcannotplay................................................................................2−4

2.1.6.Regioncode...............................................................................................................2−4

2.1.7.SupportedFileFormats.................................................................................................2−5

2.2.ChassisProductSpecication.....................................................................................................2−9

2.3.OptionProductSpecication......................................................................................................2−19

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.CabinetandPCB.....................................................................................................................3−1

3.1.1.TopCabinetRemoval...................................................................................................3−1

3.1.2.AssyFront-CabinetRemoval.........................................................................................3−2

3.1.3.AssyDeckRemoval.....................................................................................................3−3

3.1.4.Bracket-SlotRemoval..................................................................................................3−4

3.1.5.MainPCB&S.M.P.SPCB&A_VPCBRemoval.............................................................3−5

3.2.PCBLocation.........................................................................................................................3−6

4.Troubleshooting................................................................................................................................4−1

4.1.Troubleshooting......................................................................................................................4−1

4.2.SoftwareUpdate......................................................................................................................4−23

4.2.1.Upgrade.....................................................................................................................4−23

5.PCBDiagrams..................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−2

5.2.MainPCB(BD-E6300).............................................................................................................5−3

5.3.MainPCB(BD-E6300S)...........................................................................................................5−6

5.4.S.M.P.SPCB...........................................................................................................................5−8

5.5.FunctionPCB.........................................................................................................................5−10

5.6.LEDPCB...............................................................................................................................5−11

5.7.A VPCB.................................................................................................................................5−12

Contents

6.SchematicDiagrams..........................................................................................................................6−1

6.1.AllBlockDiagram...................................................................................................................6−2

6.2.Power....................................................................................................................................6−3

6.2.1.AboutS.M.P .S(RingingChokeConverterMethod)............................................................6−3

6.2.2.Circuitdescripcotion[FL Y-BackRCC(RingingChokeConverter)]Control............................6−3

6.2.3.InternalBlockDiagram(InternalBlockDiagramofS.M.P .SCircuit)....................................6−5

6.3.S.M.P.S(S.M.P .SPCB).............................................................................................................6−6

6.4.Audio_VideoAnalogOutput(MainPCB)(BD-E6300)...................................................................6−7

6.5.Audio_VideoAnalogOutput(MainPCB)(BD-E6300S).................................................................6−9

6.6.USB_EthernetBlock(MainPCB)(BD-E6300).............................................................................6−10

6.7.USB_EthernetBlock(MainPCB)(BD-E6300S)............................................................................6−11

6.8.HDMI_1VideoOutput(MainPCB)(BD-E6300)...........................................................................6−12

6.9.HDMI_1VideoOutput(MainPCB)(BD-E6300S).........................................................................6−13

6.10.InterfaceBlock(MainPCB)(BD-E6300).....................................................................................6−14

6.11.InterfaceBlock(MainPCB)(BD-E6300S)...................................................................................6−15

6.12.SAT AInterface(MainPCB)(BD-E6300).....................................................................................6−16

6.13.SAT AInterface(MainPCB)(BD-E6300S)...................................................................................6−17

6.14.EMMCMOV1-NAND1GBFlash(MainPCB)(BD-E6300)...........................................................6−18

6.15.EMMCMOV1-NAND1GBFlash(MainPCB)(BD-E6300S).........................................................6−19

6.16.TunerDVB-T_C_T2Nim(MainPCB)(BD-E6300).......................................................................6−20

6.17.DVB-S2Nim(MainPCB)(BD-E6300S).....................................................................................6−21

6.18.DDR3Memory(MainPCB)(BD-E6300).....................................................................................6−22

6.19.DDR3Memory(MainPCB)(BD-E6300S)...................................................................................6−23

6.20.CI_CI+Interface(MainPCB)(BD-E6300)...................................................................................6−24

6.21.CI_CI+Interface(MainPCB)(BD-E6300S).................................................................................6−25

6.22.FrontMicom(MainPCB)(BD-E6300)........................................................................................6−26

6.23.FrontMicom(MainPCB)(BD-E6300S)......................................................................................6−27

6.24.SystemPower(MainPCB)(BD-E6300)......................................................................................6−28

6.25.SystemPower(MainPCB)(BD-E6300S).....................................................................................6−29

6.26.PowerSupply(MainPCB)(BD-E6300).......................................................................................6−30

6.27.PowerSupply(MainPCB)(BD-E6300S).....................................................................................6−31

6.28.JTAG-Debug(MainPCB)(BD-E6300)........................................................................................6−32

6.29.JTAG-Debug(MainPCB)(BD-E6300S)......................................................................................6−33

6.30.MotorDriver_OPUConnector(MainPCB)(BD-E6300).................................................................6−34

6.31.MotorDriver_OPUConnector(MainPCB)(BD-E6300S)...............................................................6−35

6.32.Front-EndController(MainPCB)(BD-E6300).............................................................................6−36

6.33.Front-EndController(MainPCB)(BD-E6300S)............................................................................6−37

6.34.Front(FunctionPCB)...............................................................................................................6−38

6.35.LED(LEDPCB).....................................................................................................................6−39

6.36.A V(A VPCB).........................................................................................................................6−40

1.Precautions

1.1.SafetyPrecautions

1)Beforereturninganinstrumenttothecustomer,alwaysmakeasafetycheckoftheentireinstrument,including,butnot limitedto,thefollowingitems:

a)Besurethatnobuilt-inprotectivedevicesaredefectiveorhavebeendefeatedduringservicing

i)Protectiveshieldsareprovidedtoprotectboththetechnicianandthecustomer.Correctlyreplaceallmissing

protectiveshields,includinganyremovedforservicingconvenience.

ii)Whenreinstallingthechassisand/orotherassemblyinthecabinet,besuretoputbackinplaceallprotective

devices,including,butnotlimitedto,nonmetalliccontrolknobs,insulatingshpapers,adjustmentand compartmentcovers/shields,andisolationresistor/capacitornetworks.Donotoperatethisinstrumentorpermit ittobeoperatedwithoutallprotectivedevicescorrectlyinstalledandfunctioning.

b)Besurethattherearenocabinetopeningsthroughwhichadultsorchildrenmightbeabletoinserttheirngersand

contactahazardousvoltage.Suchopeningsinclude,butarenotlimitedto,excessivelywidecabinetventilation slots,andanimproperlyttedand/orincorrectlysecuredcabinetbackcover .

c)LeakageCurrentHotCheck—Withtheinstrumentcompletelyreassembled,plugtheAClinecorddirectlyintoa

230V(220V~240V)ACoutlet.(Donotuseanisolationtransformerduringthistest.)

UsealeakagecurrenttesterorameteringsystemthatcomplieswithAmericanNationalStandardInstitute(ANSI) C101.1LeakageCurrentforAppliancesandUnderwritersLaboratories(UL)1270(40.7).Withtheinstrument’ s ACswitchrstintheONpositionandthenintheOFFposition,measurefromaknownearthground(metal waterpipe,conduit,etc.)toallexposedmetalpartsoftheinstrument(antennas,handlebrackets,metalcabinets, screwheads,metallicoverlays,controlshafts,etc.),especiallyanyexposedmetalpartsthatofferanelectrical returnpathtothechassis.

Anycurrentmeasuredmustnotexceed0.5mA.

Reversetheinstrumentpowercordplugintheoutletandrepeatthetest.See

Anymeasurementsnotwithinthelimitsspeciedhereinindicateapotentialshockhazardthatmustbeeliminated beforereturningtheinstrumenttothecustomer.

Figure1.1ACLeakageT est

d)InsulationResistanceTestColdCheck—(1)Unplugthepowersupplycordandconnectajumperwirebetween

thetwoprongsoftheplug.(2)Turnonthepowerswitchoftheinstrument.(3)Measuretheresistancewith anohmmeterbetweenthejumperedACplugandallexposedmetalliccabinetpartsontheinstrument,suchas screwheads,antenna,controlshafts,handlebrackets,etc.Whenanexposedmetallicparthasareturnpathtothe chassis,thereadingshouldbebetween1and5.2megohm.Whenthereisnoreturnpathtothechassis,thereading mustbeinnite.Ifthereadingisnotwithinthelimitsspecied,thereisthepossibilityofashockhazard,andthe instrumentmustberepairedandrecheckedbeforeitisreturnedtothecustomer.See

1.Precautions

2)Readandcomplywithallcautionandsafetyrelatednotesonorinsidethecabinet,oronthechassis.

3)DesignAlterationWarning—Donotalteroraddtothemechanicalorelectricaldesignofthisinstrument.

Designalterationsandadditions,includingbutnotlimitedto,circuitmodicationsandtheadditionofitemssuchas auxiliaryaudiooutputconnections,mightalterthesafetycharacteristicsofthisinstrumentandcreateahazardtothe user.Anydesignalterationsoradditionswillmakeyou,theservicer,responsibleforpersonalinjuryorproperty damageresultingtherefrom.

4)Observeoriginalleaddress.Takeextracaretoassurecorrectleaddressinthefollowingareas:

(1)nearsharpedges,(2)nearthermallyhotparts(besurethatleadsandcomponentsdonottouchthermallyhotparts), (3)theACsupply,(4)highvoltage,and(5)antennawiring.Alwaysinspectinallareasforpinched,out-of-place,or frayedwiring,Donotchangespacingbetweenacomponentandtheprinted-circuitboard.ChecktheACpowercord fordamage.

5)Components,parts,and/orwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith components,partsand/orwiringthatmeetoriginalspecications.

Additionally,determinethecauseofoverheatingand/ordamageand,ifnecessary,takecorrectiveactiontoremove anypotentialsafetyhazard.

6)ProductSafetyNotice—Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichare oftennotevidentfromvisualinspection,norcantheprotectiontheygivenecessarilybeobtainedbyreplacingthemwith componentsratedforhighervoltage,wattage,etc.Partsthathavespecialsafetycharacteristicsareidentiedbyshading, an(

)schematicsandpartslists.Useofasubstitutereplacementthatdoesnothavethesamesafetycharacteristics astherecommendedreplacementpartmightcreateshock,reand/orotherhazards.Productsafetyisunderreview continuouslyandnewinstructionsareissuedwheneverappropriate.

1.Precautions

1.2.ServicingPrecautions

CAUTION

Beforeservicingunitscoveredbythisservicemanualanditssupplements,readandfollowtheSafetyPrecautions sectionofthismanual.

NOTE

Ifunforeseencircumstancescreateconictbetweenthefollowingservicingprecautionsandanyofthesafetyprecautions, alwaysfollowthesafetyprecautions.Remember:SafetyFirst.

1.2.1.GeneralServicingPrecautions

1)a.Alwaysunplugtheinstrument’sACpowercordfromtheACpowersourcebefore(1)removingorreinstallingany component,circuitboard,moduleoranyotherinstrumentassembly,(2)disconnectinganyinstrumentelectricalplugor otherelectricalconnection,(3)connectingatestsubstituteinparallelwithanelectrolyticcapacitorintheinstrument.

b.Donotdamageanyplug/socketB+voltageinterlockswithwhichinstrumentscoveredbythisservicemanual mightbeequipped.

c.DonotapplyACpowertothisinstrumentandoranyofitselectricalassembliesunlessallsolid-statedeviceheat sinksarecorrectlyinstalled.

d.Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthetestinstrument positivelead.Alwaysremovethetestinstrumentgroundleadlast.

NOTE

RefertotheSafetyPrecautionssectiongroundleadlast.

2)Theserviceprecautionsareindicatedorprintedonthecabinet,chassisorcomponents.Whenservicing,followthe printedorindicatedserviceprecautionsandservicematerials.

3)Thecomponentsusedintheunithaveaspeciedameresistanceanddielectricstrength.Whenreplacingcomponents, usecomponentswhichhavethesame.Componentsidentiedbyshading,inthecircuitdiagramareimportantforsafety orforthecharacteristicsoftheunit.Alwaysreplacethemwiththeexactreplacementcomponents.

4)Aninsulationtubeortapeissometimesusedandsomecomponentsareraisedabovetheprintedwiringboardfor safety.Theinternalwiringissometimesclampedtopreventcontactwithheatingcomponents.Installsuchelements astheywere.

5)Afterservicing,alwayscheckthattheremovedscrews,components,andwiringhavebeeninstalledcorrectlyandthat theportionaroundtheservicedparthasnotbeendamagedandsoon.

Further,checktheinsulationbetweenthebladesoftheattachmentplugandaccessibleconductiveparts.

1.2.2.InsulationCheckingProcedure

DisconnecttheattachmentplugfromtheACoutletandturnthepowerON.Connecttheinsulationresistancemeter(500V) tothebladesoftheattachmentplug.Theinsulationresistancebetweeneachbladeoftheattachmentplugandaccessible conductiveparts(seenote)shouldbemorethan1Megohm.

NOTE

Accessibleconductivepartsincludemetalpanels,inputterminals,earphonejacks,etc.

1.Precautions

1.3.ESDPrecautions

ElectrostaticallySensitiveDevices(ESD)

Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity .

SuchcomponentscommonlyarecalledElectrostaticallySensitiveDevices(ESD).ExamplesoftypicalESDdevicesare integratedcircuitsandsomeeld-effecttransistorsandsemiconductorchipcomponents.Thefollowingtechniquesshould beusedtohelpreducetheincidenceofcomponentdamagecausedbystaticelectricity.

1)Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffany electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively ,obtainandwearacommercially availabledischargingwriststrapdevice,whichshouldberemovedforpotentialshockreasonspriortoapplyingpower totheunitundertest.

2)AfterremovinganelectricalassemblyequippedwithESDdevices,placetheassemblyonaconductivesurfacesuchas aluminumfoil,topreventelectrostaticchargebuilduporexposureoftheassembly .

3)Useonlyagrounded-tipsolderingirontosolderorunsolderESDdevices.

4)Useonlyananti-staticsolderremovaldevices.Somesolderremovaldevicesnotclassiedas“anti-static”cangenerate electricalchargessufcienttodamageESDdevices.

5)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufcienttodamageESDdevices.

6)DonotremoveareplacementESDdevicefromitsprotectivepackageuntilimmediatelybeforeinstallingit.(Most replacementESDdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,aluminumfoilor comparableconductivematerials).

7)ImmediatelybeforeremovingtheprotectivematerialsfromtheleadsofareplacementESDdevice,touchtheprotective materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

CAUTION

Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDdevices.

(Otherwiseharmlessmotionssuchasthebrushingtogetherofyourclothesfabricortheliftingofyourfootfroma carpetedoorcangeneratestaticelectricitysufcienttodamageanESDdevice).

1.Precautions

1.4.Handlingtheopticalpick-up

Thelaserdiodeintheopticalpickupmaysufferelectrostaticbreakdownbecauseofpotentialstaticelectricityfrom clothingandyourbody.

Thefollowingmethodisrecommended.

1)Placeaconductivesheetontheworkbench(Theblacksheetusedforwrappingrepairparts.)

2)Placethesetontheconductivesheetsothatthechassisisgroundedtothesheet.

3)Placeyourhandsontheconductivesheet(Thisgivesthemthesamegroundasthesheet.)

4)Removetheopticalpickupblock

5)Performworkontopoftheconductivesheet.Becarefultoletyourclothesoranyotherstaticsourcestouchtheunit.

NOTE

•Besuretoputonawriststrapgroundedtothesheet.

•Besuretolayaconductivesheet,thatisgroundedtothetable,madeofcopper.

Fig.1-3

6)ShorttheshortterminalonthePCB,whichisinsidethePick-UpASS’Y ,beforereplacingthePick-Up.(Theshort terminalisshortedwhenthePick-UpAss’yisbeingliftedormoved.)

7)AfterreplacingthePick-up,opentheshortterminalonthePCB.

2.ProductSpecications

2.1.ProductSpecication

2.1.1.PlayerFeatures

•SupportsaV arietyofDiscTypes

-Blu-ray(BD-ROM,BD-RE,BD-R),DVDVideo,DVD-RW/-R(Vmodeandnalizedonly)discsandAudioCD.

-CD-RW/CD-R,DVD-RW/-RandUSBstoragedevicecontentsuchasMP3,JPEGandDivXles.

•HDMI(HighDenitionMultimediaInterface)

HDMIreducespicturenoisebyallowingapuredigitalvideo/audiosignalpathfromtheplayertoyourTV .

2.ProductSpecications

2.1.2.Blu-rayDiscFeatures

Blu-rayDiscscanstore25GB(singlelayer)or50GB(duallayer)onasinglesideddisc-about5to10timesthecapacity ofaDVD.Blu-rayDiscsalsosupportthehighestqualityHDvideoavailableintheindustry(upto1920x1080at40 Mbit/sec)–Largecapacitymeansnocompromiseonvideoquality.Furthermore,aBlu-rayDischasthesamefamiliarsize andlookasDVD.

NOTE

ThefollowingBlu-rayDiscfeaturesarediscdependantandwillvary.

Appearanceandnavigationoffeatureswillalsovaryfromdisctodisc.

Notalldiscswillhavethefeaturesdescribedbelow.

•Videohighlights

TheBD-ROMformatformoviedistributionsupportsthreehighlyadvancedvideocodecs,includingA VC,VC-1, andMPEG-2.

HDvideoresolutionsarealsoavailable:

-1920x1080HD

-1280x720HD

•ForHigh-DenitionPlayback

Toviewhigh-denitioncontentsinBDdiscs,anHDTV(HighDenitionT elevision)isrequired.Somediscsmay requireusingtheplayer'sHDMIOUTtoviewhigh-Denitioncontent.Theabilitytoviewhigh-Denitioncontenton BDdiscsmaybelimiteddependingontheresolutionofyourTV .

•Graphicplanes

Twoindividual,fullHDresolution(1920x1080)videolayersareavailableontopoftheHDvideolayer.

Onelayerisassignedtovideo-relatedgraphics(likesubtitles),andtheotherlayerisassignedtointeractiveelements, suchasbuttonsormenus.V ariouswipes,fadesandscrolleffectsmaybeavailableonbothlayers.

•Menugraphics

Support256fullcolorresolutiongraphicsandanimation,therebygreatlysurpassingthecapabilitiesofDVDV ideo. UnlikeDVD,Menuscanbeaccessedduringvideoplayback.

•Menusounds

WhenyouhighlightorselectamenuoptiononaBlu-raydisc,soundscanbeheardsuchasbuttonclicksoravoice overexplainingthehighlightedmenuchoice.

•Multi-page/PopUpMenus

WithDVD-Video,playbackisinterruptedeachtimeanewmenuscreenisaccessed.DuetoBlu-rayDisc'sabilityto preloaddatafromthediscwithoutinterruptingplayback,amenumayconsistofseveralpages.

Youcanbrowsethroughthemenupagesorselectdifferentmenupaths,whiletheaudioandvideoremainplaying inthebackground.

•Interactivity

CertainBlu-rayDiscsmaycontainAnimatedmenusandTriviagames.

2.ProductSpecications

•UserBrowsableSlideshows

WithBlu-rayDiscs,youcanbrowsethroughvariousstillpictureswhiletheaudioremainsplaying.

•Subtitles

DependingonwhatiscontainedontheBlu-rayDisc,youmaybeabletoselectdifferentfontstyles,sizesandcolorsfor thesubtitles,Subtitlesmayalsobeanimated,scrolledorfadedinandout.

•BD-LIVE

YoucanuseaBlu-rayDiscsupportingBD-LIVEthroughnetworkconnectiontoenjoyvariouscontentsprovided bythediscmanufacturer.

2.1.3.DiscTypesandContentsthatcanbeplayed

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD-Rbecauseofthedisctypeorrecordingconditions.

•IfaDVD-RW/-RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourplayerwillnotplaycontentthathasbeenrecordedonaDVD-Ratabit-ratethatexceeds10Mbps.

•YourplayerwillnotplaycontentthathasbeenrecordedonaBD-RorUSBdeviceatabitratethatexceeds25Mbps.

2.ProductSpecications

2.1.4.LogosofDiscstheplayercanplay

2.1.5.Disctypesyourproductcannotplay

•HDDVD

•DVD-RAM

•DVD-RW(VRmode)

•3.9GBDVD-RforAuthoring.

•DVD-ROM/PD/MVDisc,etc

•SuperAudioCD(exceptCDlayer)

•CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gsplayaudioonly,notgraphics.)

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD±RW/±Rbecauseoftherecordingconditions.

•IfaDVD±RW/±RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD±RW/±Ratabit-ratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RE/Ratabitratethatexceeds25Mbps.

•Playbackmaynotworkforsometypesofdiscs,orwhenyouusespecicoperations,suchasanglechangeandaspectratio adjustment.Informationaboutthediscsiswrittenindetailonthediscbox.Pleaserefertothisifnecessary.

•WhenyouplayaBD-Jtitle,loadingmaytakelongerthananormaltitleorsomefunctionsmayperformslowly.

2.1.6.Regioncode

Boththeproductandthediscsarecodedbyregion.Theseregionalcodesmustmatchinordertoplaythedisc.Ifthecodes donotmatch,thediscwillnotplay.TheRegionNumberforthisproductisdescribedontherearpaneloftheproduct.

2.ProductSpecications

2.1.7.SupportedFileFormats

NotesontheUSBconnection

•YourproductsupportsUSBstoragemedia,MP3products,digitalcameras,andUSBcardreaders.

•SomeUSB/digitalcameradevicesmaynotbecompatiblewiththeproduct..

•YourproductsupportstheF A T16,FA T32,andNTFSlessystems(readonly).

•ConnectUSBdevicesdirectlytotheproduct’ sUSBport.ConnectingthroughaUSBcablemaycausecompatibility

problems.

•Insertingmorethanonememorydeviceintoamulti-cardreadermaycausethereadertooperateimproperly.

•TheproductsupportsthePTPprotocol.

•DonotdisconnectaUSBdeviceduringa"loading"process.

•Thebiggertheimageresolution,thelongertheimagetakestodisplay .

•ThisproductcannotplayMP3leswithDRM(DigitalRightsManagement)downloadedfromcommercialsites.

•Yourproductonlysupportsvideothatisunder30fps(framerate).

•YourproductonlysupportsUSBMassStorageClass(MSC)devicessuchasthumbdrives,ashcardreadersandUSB

HDD.(HUBisnotsupported.)

•CertainUSBHDDDevices,multi-cardreadersandthumbdrivesmaynotbecompatiblewiththisproduct.

•IfsomeUSBdevicesrequireexcessivepower,theymaybelimitedbythecircuitsafetydevice.

•IfplaybackfromaUSBHDDisunstable,provideadditionalpowerbypluggingtheHDDintoawallsocket.Ifthe

problemcontinues,contacttheUSBHDDmanufacturer.

•YoumustremovetheUSBstoragedevicesafely(byperformingthe"SafelyRemoveUSB"functiontopreventpossible

damagetotheUSBmemory).

•SAMSUNGisnotresponsibleforanydataledamageordataloss.

2.ProductSpecications

•Yourproductdoesnotsupportcompressionle,sparseleandencrptionleofNTFS.

-BeforedisconnectingaUSBdevice,pleaseuseUSBSafetyRemoval.

-Ifyoudon'tuseUSBSafetyRemoval,yourdataonUSBdevicecanbecorruptedorlost

-YoucanrepairorformataUSBdeviceonyourDesktopPC.(MS-WindowsOSonly)

ConnectaUSBdevicebeforeusingtheTimeshiftandRecordedTVfunctions

•TousetheTimeshiftmodeortheRecordedTVfunction,aconnectedUSBdevicemustbeexecutetheDeviceFormat

functiontoproperformforrecording.

-Duringthedeviceformatting,donotdisconnectthedevicewhileformattingisinprogress.Ifyouformatthe

device,allleswillbedeleted.

-Beforeformattingyourdevicetothisproduct,pleasebackupyourlestopreventthemfromdamageorlossof

data.SAMSUNGisnotresponsibleforanydataledamageordataloss.

•RecordedvideosareDRM(digitalrightsmanagements)protectedandcannotbeplayedonaPCorotherproduct.Note

thatlessavedontheTVcannotbeusedafterthemainboardischanged.

•Atleast100MBoffreespaceisrequiredforrecording.

•Recordingwillstopifthestorage'sfreespacebecomeslessthan50MB.

•IftheUSBdevicehasfailedtheDevicePerformanceTest,theUSBdevicemustgothroughtheDeviceFormatand

DevicePerformanceTestagainbeforeyourecordwiththeGuideorChannelManager.Ifthedevicehasfailedthe PerformanceT est,Itcannotbeusedforrecording.

VideoFileSupport

2.ProductSpecications

•Limitations

-Evenwhentheleisencodedbyasupportedcodecmentionedabove,alemightnotbeplayedifitscontenthas

aproblem.

-Normalplaybackisnotguaranteedifthele'scontainerinformationiswrongortheleitselfiscorrupted.

-FileshavinghigherBitrate/frameratethanstandardmaystutterwithsound/videoplayback.

-Seek(skip)functionisnotavailableifthele'sindextableisdamaged.

-Whenyouplaybackaleremotelythroughnetworkconnection,videoplaybackmaystutterdependingon

establishednetworkspeed.

•Videodecoder

-SupportsuptoH.264Level4.1

-DoesnotsupportH.264FMO/ASO/RS,VC1SP/MP/APL4andA VCHD

-XVid,MPEG4SP,ASP:Below1280x720:60framesmaxAbove1280x720:30framesmax

-DoesnotsupportGMC2orhigher

•Audiodecoder

-SupportsWMA7,8,9andSTD

-DoesnotsupportWMA9PROmulti-channellosslessaudiodecodingifnumberofchannelsismorethan2

-DoesnotsupportWMAsamplingrateof220/50Hzmono

-SupportsDTSCore(5.1ch,16bit,48kHz)only

-DoesnotsupportAPDCMMULAW ,ALA W

•OpticalMedia

-CDMediaBitRate:Max9.6Mbps

-DVDMediaBitRate:Max22.16Mbps

SupportedDivXsubtitleleformats

*.ttxt,*.smi,*.srt,*.sub,*.txt

MusicFileSupport

2.2.ChassisProductSpecication

2.ProductSpecications

2.3.OptionProductSpecication

2.ProductSpecications

3.DisassemblyandReassembly

3.1.CabinetandPCB

NOTE

ConnectorMustberemovedwithcare

3.1.1.TopCabinetRemoval

3.1.2.AssyFront-CabinetRemoval

3.DisassemblyandReassembly

3.1.3.AssyDeckRemoval

+ 82 hidden pages