Samsung BD-D8200S, BD-D8509S Service Manual

Blu-rayDiscPlayer

BASIC:BD-D8909S

Application Models

ApplicationAreaZG

MANUAL

BD-D8200S / BD-D8509S

SERVICE

Blu-RayDiscPlayer

1.Precautions

2.ProductSpecications

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagrams

6.SchematicDiagrams

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precautions......................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.2.1.GeneralServicingPrecautions.......................................................................................1−3

1.2.2.InsulationCheckingProcedure.......................................................................................1−3

1.3.ESDPrecautions......................................................................................................................1−4

1.4.Handlingtheopticalpick-up......................................................................................................1−5

2.ProductSpecications........................................................................................................................2−1

2.1.ProductSpecication................................................................................................................2−1

2.1.1.PlayerFeatures...........................................................................................................2−2

2.1.2.Blu-rayDiscFeatures...................................................................................................2−2

2.1.3.DiscTypesandContentsthatcanbeplayed......................................................................2−3

2.1.4.Disctypesthatcannotbeplayed.....................................................................................2−4

2.1.5.Regioncode...............................................................................................................2−4

2.1.6.Blu-rayDiscCompatibility............................................................................................2−6

2.1.7.DiscTypes.................................................................................................................2−6

2.1.8.SupportedFileFormats.................................................................................................2−7

2.2.ChassisProductSpecication.....................................................................................................2−11

2.3.OptionProductSpecication......................................................................................................2−21

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.CabinetandPCB.....................................................................................................................3−1

3.1.1.TopCabinetRemoval...................................................................................................3−1

3.1.2.AssyFront-CabinetRemoval.........................................................................................3−2

3.1.3.AssyDeckRemoval.....................................................................................................3−3

3.1.4.AssyHDDRemoval....................................................................................................3−4

3.1.5.SMPSPCBRemoval....................................................................................................3−5

3.1.6.FanRemoval..............................................................................................................3−6

3.1.7.MainPCBRemoval.....................................................................................................3−7

3.1.8.AssyLEDPCBRemoval..............................................................................................3−8

3.2.PCBLocation.........................................................................................................................3−9

4.Troubleshooting................................................................................................................................4−1

4.1.Troubleshooting......................................................................................................................4−2

4.2.SoftwareUpdate......................................................................................................................4−24

4.2.1.Upgrade.....................................................................................................................4−24

5.PCBDiagrams..................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−2

5.2.MainPCB..............................................................................................................................5−3

5.3.S.M.P.SPCB...........................................................................................................................5−6

Contents

5.4.FrontPCB..............................................................................................................................5−8

5.5.USBPCB...............................................................................................................................5−9

5.6.TopLEDPCB.........................................................................................................................5−10

6.SchematicDiagrams..........................................................................................................................6−1

6.1.AllBlockDiagram...................................................................................................................6−2

6.2.Power....................................................................................................................................6−3

6.2.1.AboutS.M.P.S(RingingChokeConverterMethod)............................................................6−3

6.2.2.Circuitdescripcotion[FLY -BackRCC(RingingChokeConverter)]Control............................6−3

6.2.3.InternalBlockDiagram(InternalBlockDiagramofS.M.P .SCircuit)....................................6−5

6.3.S.M.P.S(S.M.P .SPCB).............................................................................................................6−6

6.4.AnalogA VOut(MainPCB)......................................................................................................6−7

6.5.USB_EthernetBlock(MainPCB)...............................................................................................6−9

6.6.HDMI1Out(MainPCB)...........................................................................................................6−10

6.7.HDMI2Out(AudioOnly)(MainPCB)........................................................................................6−11

6.8.DDR3-SDRAMBlock(MainPCB).............................................................................................6−12

6.9.PeripheralInterface(MainPCB).................................................................................................6−13

6.10.SATAInterface(MainPCB)......................................................................................................6−14

6.11.SLC-NANDFlash(MainPCB)..................................................................................................6−15

6.12.DVB-S2Nim_DUALLNB(MainPCB)......................................................................................6−16

6.13.USBHUB(MainPCB).............................................................................................................6−17

6.14.CIMAX+(MainPCB)..............................................................................................................6−18

6.15.2CISLOT(MainPCB).............................................................................................................6−19

6.16.Front-Micom(MainPCB).........................................................................................................6−20

6.17.SOCPowerSupply(MainPCB).................................................................................................6−21

6.18.SystemPowerSupply(MainPCB)..............................................................................................6−22

6.19.JTAG-Debug(MainPCB).........................................................................................................6−23

6.20.MotorDriver_OPUConnection(MainPCB).................................................................................6−24

6.21.Front-EndConnection(MainPCB).............................................................................................6−25

6.22.Front(FrontPCB)....................................................................................................................6−26

6.23.USB(USBPCB).....................................................................................................................6−27

6.24.TopLED(LEDPCB)...............................................................................................................6−28

1.Precautions

1.1.SafetyPrecautions

1)Beforereturninganinstrumenttothecustomer,alwaysmakeasafetycheckoftheentireinstrument,including,butnot limitedto,thefollowingitems:

a)Besurethatnobuilt-inprotectivedevicesaredefectiveorhavebeendefeatedduringservicing

i)Protectiveshieldsareprovidedtoprotectboththetechnicianandthecustomer.Correctlyreplaceallmissing

protectiveshields,includinganyremovedforservicingconvenience.

ii)Whenreinstallingthechassisand/orotherassemblyinthecabinet,besuretoputbackinplaceallprotective

devices,including,butnotlimitedto,nonmetalliccontrolknobs,insulatingshpapers,adjustmentand compartmentcovers/shields,andisolationresistor/capacitornetworks.Donotoperatethisinstrumentorpermit ittobeoperatedwithoutallprotectivedevicescorrectlyinstalledandfunctioning.

b)Besurethattherearenocabinetopeningsthroughwhichadultsorchildrenmightbeabletoinserttheirngersand

contactahazardousvoltage.Suchopeningsinclude,butarenotlimitedto,excessivelywidecabinetventilation slots,andanimproperlyttedand/orincorrectlysecuredcabinetbackcover.

c)LeakageCurrentHotCheck—Withtheinstrumentcompletelyreassembled,plugtheAClinecorddirectlyintoa

230V(220V~240V)ACoutlet.(Donotuseanisolationtransformerduringthistest.)

UsealeakagecurrenttesterorameteringsystemthatcomplieswithAmericanNationalStandardInstitute(ANSI) C101.1LeakageCurrentforAppliancesandUnderwritersLaboratories(UL)1270(40.7).Withtheinstrument’s ACswitchrstintheONpositionandthenintheOFFposition,measurefromaknownearthground(metal waterpipe,conduit,etc.)toallexposedmetalpartsoftheinstrument(antennas,handlebrackets,metalcabinets, screwheads,metallicoverlays,controlshafts,etc.),especiallyanyexposedmetalpartsthatofferanelectrical returnpathtothechassis.

Anycurrentmeasuredmustnotexceed0.5mA.

Reversetheinstrumentpowercordplugintheoutletandrepeatthetest.See

Anymeasurementsnotwithinthelimitsspeciedhereinindicateapotentialshockhazardthatmustbeeliminated beforereturningtheinstrumenttothecustomer.

Figure1.1ACLeakageTest

d)InsulationResistanceTestColdCheck—(1)Unplugthepowersupplycordandconnectajumperwirebetween

thetwoprongsoftheplug.(2)Turnonthepowerswitchoftheinstrument.(3)Measuretheresistancewith anohmmeterbetweenthejumperedACplugandallexposedmetalliccabinetpartsontheinstrument,suchas screwheads,antenna,controlshafts,handlebrackets,etc.Whenanexposedmetallicparthasareturnpathtothe chassis,thereadingshouldbebetween1and5.2megohm.Whenthereisnoreturnpathtothechassis,thereading mustbeinnite.Ifthereadingisnotwithinthelimitsspecied,thereisthepossibilityofashockhazard,andthe instrumentmustberepairedandrecheckedbeforeitisreturnedtothecustomer.See

1.Precautions

2)Readandcomplywithallcautionandsafetyrelatednotesonorinsidethecabinet,oronthechassis.

3)DesignAlterationWarning—Donotalteroraddtothemechanicalorelectricaldesignofthisinstrument.

Designalterationsandadditions,includingbutnotlimitedto,circuitmodicationsandtheadditionofitemssuchas auxiliaryaudiooutputconnections,mightalterthesafetycharacteristicsofthisinstrumentandcreateahazardtothe user.Anydesignalterationsoradditionswillmakeyou,theservicer,responsibleforpersonalinjuryorproperty damageresultingtherefrom.

4)Observeoriginalleaddress.Takeextracaretoassurecorrectleaddressinthefollowingareas:

(1)nearsharpedges,(2)nearthermallyhotparts(besurethatleadsandcomponentsdonottouchthermallyhotparts), (3)theACsupply,(4)highvoltage,and(5)antennawiring.Alwaysinspectinallareasforpinched,out-of-place,or frayedwiring,Donotchangespacingbetweenacomponentandtheprinted-circuitboard.ChecktheACpowercord fordamage.

5)Components,parts,and/orwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith components,partsand/orwiringthatmeetoriginalspecications.

Additionally,determinethecauseofoverheatingand/ordamageand,ifnecessary,takecorrectiveactiontoremove anypotentialsafetyhazard.

6)ProductSafetyNotice—Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichare oftennotevidentfromvisualinspection,norcantheprotectiontheygivenecessarilybeobtainedbyreplacingthemwith componentsratedforhighervoltage,wattage,etc.Partsthathavespecialsafetycharacteristicsareidentiedbyshading, an(

)schematicsandpartslists.Useofasubstitutereplacementthatdoesnothavethesamesafetycharacteristics astherecommendedreplacementpartmightcreateshock,reand/orotherhazards.Productsafetyisunderreview continuouslyandnewinstructionsareissuedwheneverappropriate.

1.Precautions

1.2.ServicingPrecautions

CAUTION

Beforeservicingunitscoveredbythisservicemanualanditssupplements,readandfollowtheSafetyPrecautions sectionofthismanual.

NOTE

Ifunforeseencircumstancescreateconictbetweenthefollowingservicingprecautionsandanyofthesafetyprecautions, alwaysfollowthesafetyprecautions.Remember:SafetyFirst.

1.2.1.GeneralServicingPrecautions

1)a.Alwaysunplugtheinstrument’ sACpowercordfromtheACpowersourcebefore(1)removingorreinstallingany component,circuitboard,moduleoranyotherinstrumentassembly ,(2)disconnectinganyinstrumentelectricalplugor otherelectricalconnection,(3)connectingatestsubstituteinparallelwithanelectrolyticcapacitorintheinstrument.

b.Donotdamageanyplug/socketB+voltageinterlockswithwhichinstrumentscoveredbythisservicemanual mightbeequipped.

c.DonotapplyACpowertothisinstrumentandoranyofitselectricalassembliesunlessallsolid-statedeviceheat sinksarecorrectlyinstalled.

d.Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthetestinstrument positivelead.Alwaysremovethetestinstrumentgroundleadlast.

NOTE

RefertotheSafetyPrecautionssectiongroundleadlast.

2)Theserviceprecautionsareindicatedorprintedonthecabinet,chassisorcomponents.Whenservicing,followthe printedorindicatedserviceprecautionsandservicematerials.

3)Thecomponentsusedintheunithaveaspeciedameresistanceanddielectricstrength.Whenreplacingcomponents, usecomponentswhichhavethesame.Componentsidentiedbyshading,inthecircuitdiagramareimportantforsafety orforthecharacteristicsoftheunit.Alwaysreplacethemwiththeexactreplacementcomponents.

4)Aninsulationtubeortapeissometimesusedandsomecomponentsareraisedabovetheprintedwiringboardfor safety.Theinternalwiringissometimesclampedtopreventcontactwithheatingcomponents.Installsuchelements astheywere.

5)Afterservicing,alwayscheckthattheremovedscrews,components,andwiringhavebeeninstalledcorrectlyandthat theportionaroundtheservicedparthasnotbeendamagedandsoon.

Further,checktheinsulationbetweenthebladesoftheattachmentplugandaccessibleconductiveparts.

1.2.2.InsulationCheckingProcedure

DisconnecttheattachmentplugfromtheACoutletandturnthepowerON.Connecttheinsulationresistancemeter(500V) tothebladesoftheattachmentplug.Theinsulationresistancebetweeneachbladeoftheattachmentplugandaccessible conductiveparts(seenote)shouldbemorethan1Megohm.

NOTE

Accessibleconductivepartsincludemetalpanels,inputterminals,earphonejacks,etc.

1.Precautions

1.3.ESDPrecautions

ElectrostaticallySensitiveDevices(ESD)

Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity.

SuchcomponentscommonlyarecalledElectrostaticallySensitiveDevices(ESD).ExamplesoftypicalESDdevicesare integratedcircuitsandsomeeld-effecttransistorsandsemiconductorchipcomponents.Thefollowingtechniquesshould beusedtohelpreducetheincidenceofcomponentdamagecausedbystaticelectricity.

1)Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffany electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively ,obtainandwearacommercially availabledischargingwriststrapdevice,whichshouldberemovedforpotentialshockreasonspriortoapplyingpower totheunitundertest.

2)AfterremovinganelectricalassemblyequippedwithESDdevices,placetheassemblyonaconductivesurfacesuchas aluminumfoil,topreventelectrostaticchargebuilduporexposureoftheassembly.

3)Useonlyagrounded-tipsolderingirontosolderorunsolderESDdevices.

4)Useonlyananti-staticsolderremovaldevices.Somesolderremovaldevicesnotclassiedas“anti-static”cangenerate electricalchargessufcienttodamageESDdevices.

5)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufcienttodamageESDdevices.

6)DonotremoveareplacementESDdevicefromitsprotectivepackageuntilimmediatelybeforeinstallingit.(Most replacementESDdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,aluminumfoilor comparableconductivematerials).

7)ImmediatelybeforeremovingtheprotectivematerialsfromtheleadsofareplacementESDdevice,touchtheprotective materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

CAUTION

Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDdevices.

(Otherwiseharmlessmotionssuchasthebrushingtogetherofyourclothesfabricortheliftingofyourfootfroma carpetedoorcangeneratestaticelectricitysufcienttodamageanESDdevice).

1.Precautions

1.4.Handlingtheopticalpick-up

Thelaserdiodeintheopticalpickupmaysufferelectrostaticbreakdownbecauseofpotentialstaticelectricityfrom clothingandyourbody.

Thefollowingmethodisrecommended.

1)Placeaconductivesheetontheworkbench(Theblacksheetusedforwrappingrepairparts.)

2)Placethesetontheconductivesheetsothatthechassisisgroundedtothesheet.

3)Placeyourhandsontheconductivesheet(Thisgivesthemthesamegroundasthesheet.)

4)Removetheopticalpickupblock

5)Performworkontopoftheconductivesheet.Becarefultoletyourclothesoranyotherstaticsourcestouchtheunit.

NOTE

•Besuretoputonawriststrapgroundedtothesheet.

•Besuretolayaconductivesheet,thatisgroundedtothetable,madeofcopper.

Fig.1-3

6)ShorttheshortterminalonthePCB,whichisinsidethePick-UpASS’Y ,beforereplacingthePick-Up.(Theshort terminalisshortedwhenthePick-UpAss’yisbeingliftedormoved.)

7)AfterreplacingthePick-up,opentheshortterminalonthePCB.

2.ProductSpecications

2.1.ProductSpecication

2.ProductSpecications

2.1.1.PlayerFeatures

•SupportsaV arietyofDiscTypes

-Blu-ray(BD-ROM,BD-RE,BD-R),DVDVideo,DVD-RW/-R(Vmodeandnalizedonly)discsandAudioCD.

-CD-RW/CD-R,DVD-RW/-RandUSBstoragedevicecontentsuchasMP3,JPEGandDivXles.

•HDMI(HighDenitionMultimediaInterface)

HDMIreducespicturenoisebyallowingapuredigitalvideo/audiosignalpathfromtheplayertoyourTV .

2.1.2.Blu-rayDiscFeatures

Blu-rayDiscscanstore25GB(singlelayer)or50GB(duallayer)onasinglesideddisc-about5to10timesthecapacity ofaDVD.Blu-rayDiscsalsosupportthehighestqualityHDvideoavailableintheindustry(upto1920x1080at40 Mbit/sec)–Largecapacitymeansnocompromiseonvideoquality.Furthermore,aBlu-rayDischasthesamefamiliarsize andlookasDVD.

NOTE

ThefollowingBlu-rayDiscfeaturesarediscdependantandwillvary.

Appearanceandnavigationoffeatureswillalsovaryfromdisctodisc.

Notalldiscswillhavethefeaturesdescribedbelow.

•Videohighlights

TheBD-ROMformatformoviedistributionsupportsthreehighlyadvancedvideocodecs,includingA VC,VC-1, andMPEG-2.

HDvideoresolutionsarealsoavailable:

-1920x1080HD

-1280x720HD

•ForHigh-DenitionPlayback

Toviewhigh-denitioncontentsinBDdiscs,anHDTV(HighDenitionTelevision)isrequired.Somediscsmay requireusingtheplayer'sHDMIOUTtoviewhigh-Denitioncontent.Theabilitytoviewhigh-Denitioncontenton BDdiscsmaybelimiteddependingontheresolutionofyourTV .

•Graphicplanes

Twoindividual,fullHDresolution(1920x1080)videolayersareavailableontopoftheHDvideolayer.

Onelayerisassignedtovideo-relatedgraphics(likesubtitles),andtheotherlayerisassignedtointeractiveelements, suchasbuttonsormenus.Variouswipes,fadesandscrolleffectsmaybeavailableonbothlayers.

•Menugraphics

Support256fullcolorresolutiongraphicsandanimation,therebygreatlysurpassingthecapabilitiesofDVDVideo. UnlikeDVD,Menuscanbeaccessedduringvideoplayback.

2.ProductSpecications

•Menusounds

WhenyouhighlightorselectamenuoptiononaBlu-raydisc,soundscanbeheardsuchasbuttonclicksoravoice overexplainingthehighlightedmenuchoice.

•Multi-page/PopUpMenus

WithDVD-Video,playbackisinterruptedeachtimeanewmenuscreenisaccessed.DuetoBlu-rayDisc'sabilityto preloaddatafromthediscwithoutinterruptingplayback,amenumayconsistofseveralpages.

Youcanbrowsethroughthemenupagesorselectdifferentmenupaths,whiletheaudioandvideoremainplaying inthebackground.

•Interactivity

CertainBlu-rayDiscsmaycontainAnimatedmenusandTriviagames.

•UserBrowsableSlideshows

WithBlu-rayDiscs,youcanbrowsethroughvariousstillpictureswhiletheaudioremainsplaying.

•Subtitles

DependingonwhatiscontainedontheBlu-rayDisc,youmaybeabletoselectdifferentfontstyles,sizesandcolorsfor thesubtitles,Subtitlesmayalsobeanimated,scrolledorfadedinandout.

•BD-LIVE

YoucanuseaBlu-rayDiscsupportingBD-LIVEthroughnetworkconnectiontoenjoyvariouscontentsprovided bythediscmanufacturer.

2.1.3.DiscTypesandContentsthatcanbeplayed

2.ProductSpecications

NOTE

•TheproductmaynotplaycertainCD-RW/-RandDVD-Rduetothedisctypeorrecordingconditions.

•IfaDVD-RW/-RdischasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

2.1.4.Disctypesthatcannotbeplayed

•Blu-rayDiscswitharegioncodeotherthan"RegionB".

•DVD-VIDEOwitharegionnumberotherthan"2"or"ALL"(BD-D8900/D8900M/D8900N).

•DVD-VIDEOwitharegionnumberotherthan"4"or"ALL"(BD-D8900A).

•HDDVD

•DVD-RAM

•DVD-RW(VRmode)

•3.9GBDVD-RDiscforAuthoring.

•DVD-ROM/PD/MVDisc,etc

•SuperAudioCD(exceptCDlayer)

•CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gsplayaudioonly,notgraphics.)

NOTE

-SomecommercialdiscsandDVDdiscspurchasedoutsideyourregionmaynotbeplayablewiththisproduct.Y oumay

receiveoneofthefollowingerrormessages; either"Thisdisccannotbeplayed."or"Pleasechecktheregionalcodeofthedisc."willbedisplayed.

-Playbackmaynotworkforsometypesofdiscs,orwhenspecicoperations,suchasanglechangeandaspectratio

adjustment,arebeingperformed. Informationaboutthediscsiswrittenindetailonthediscbox.Pleaserefertothisifnecessary.

-Donotallowthedisctobecomedirtyorscratched.Fingerprints,dirt,dust,scratchesordepositsofcigarettesmokeon

therecordingsurfacemaymakeitimpossibletousethediscforplayback.

-DiscswithP ALprogramsrecordedonthemcannotbeplayedusingthisproduct.

-ThisproductiscompatiblewiththeNTSCcolorsystemonly.

-WhenaBD-Jtitleisplayed,loadingmaytakelongerthananormaltitle,orsomefunctionsmayperformslowly.

-ThisproductmaynotrespondtoalloperatingcommandsbecausesomeBlu-ray ,DVDandCDdiscsallowspecicor

limitedoperationandfeaturesduringplayback. Pleasenotethatthisisnotadefectintheproduct.

-SamsungcannotassurethatthisproductwillplayeverydiscbearingtheBlu-rayDisc,DVDorCDlogobecausedisc

formatsevolve,andproblemsanderrorsmayoccurduringthecreationofBlu-rayDisc,DVD,CDsoftwareand/or themanufactureofdiscs. PleasecontacttheSAMSUNGcustomercarecenterifyouhavequestionsorencounterdifcultyinplayingBlu-ray Disc,DVD,CDdiscsinthisproduct.Also,refertorestofthisusermanualforadditionalinformationonplayback restrictions.

2.1.5.Regioncode

codesdonotmatch,thediscwillnotplay .

TheRegionNumberforthisproductisdescribedontherearpaneloftheproduct.

2.ProductSpecications

2.1.6.Blu-rayDiscCompatibility

Blu-rayDiscisanewandevolvingformat.Accordingly,disccompatibilityissuesarepossible.Notalldiscsarecompatible andnoteverydiscwillplayback.Foradditionalinformation,refertotheComplianceandCompatibilityNoticesection ofthisManual.Ifyouencountercompatibilityproblems,pleasecontacttheSAMSUNGcustomercarecenter.This SamsungBlu-raydiscplayersupportsonlytheBDROMProle2(a.k.a.BD-LIVE).Ifyouwanttoplaylaterversiondiscs, youmayneedtoupdateplayer'srmware.Pleaserefertohttp://www.samsung.com carecenterat1-800SAMSUNG.

orcontactSAMSUNGcustomer

2.1.7.DiscTypes

•BD-ROM

-Blu-rayROMdiscscanonlybeplayedback.Thisproductcanplaybackpre-recordedcommercialBD-ROMdiscs.

•BD-RE/-R

-Blu-rayRE/-Rdiscscanberecordedonandplayedback.ThisproductcanplaybackaBD-RE/-Rdiscrecordedby

othercompatibleBlu-raydiscrecorders.

•DVD-VIDEO

-Thisproductcanplaybackpre-recordedcommercialDVDdiscs(DVD-VIDEOdiscs)withmovies.

-Whenswitchingfromtherstlayertothesecondlayerofadual-layeredDVD-VIDEOdisc,theremaybe

momentarydistortionintheimageandsound.Thisisnotamalfunctionoftheproduct

•DVD-RW/-R/+R

-ThisproductcanplaybackaDVD-RW/-R/+RdiscrecordedandnalizedwithaDVDvideorecorder.Theability

toplaybackmaydependonrecordingconditions.

•DVD-RW

-ThisproductcanplaybackaDVD+RWdiscrecordedwithaDVDVideorecorder.Theabilitytoplaybackmay

dependonrecordingconditions.

•AudioCD(CD-DA)

-ThisproductcanplaybackCD-DAformataudioCD-RW/-Rdiscs.

-TheproductmaynotbeabletoplaysomeCD-RW/-Rdiscsduetotheconditionoftherecording.

•CD-RW/-R

-Usea700MB(80minutes)CD-RW/-Rdisc.Ifpossible,donotusea800MB(90minutes)orabovedisc,asthe

discmaynotplayback.

-IftheCD-RW/-Rdiscwasnotrecordedasaclosedsession,youmayexperiencedelayswhenplayingbackthe

beginningofthediscorallrecordedlesmaynotplay.

-SomeCD-RW/-Rdiscsmaynotbeplayablewiththisproduct,dependingonthedevicewhichwasusedtoburn

them.ForcontentsrecordedonCD-RW/-RmediafromCDsforyourpersonaluse,playabilitymayvarydepending oncontentsanddiscs.

2.ProductSpecications

•A VCHD(AdvancedVideoCodecHighDenition)

-ThisproductcanplaybackA VCHDformatdiscs.Thesediscsarenormallyrecordedandusedincamcorders.

-TheA VCHDformatisahighdenitiondigitalvideocameraformat.

-TheMPEG-4A VC/H.264formatcompressesimageswithgreaterefciencythantheconventionalimage

compressingformat.

-SomeA VCHDdiscsusethe“x.v.Colour”format.ThisproductcanplaybackA VCHDdiscsthatuse“x.v.Colour”

format.

-“x.v.Colour”isatrademarkofSonyCorporation.

-“AVCHD”andtheA VCHDlogoaretrademarksofMatsushitaElectronicIndustrialCo.,Ltd.andSonyCorporation.

NOTE

•SomeA VCHDformatdiscsmaynotplay,dependingontherecordingcondition.A VCHDformatdiscsneedtobenalized.

•“x.v.Colour”offersawidercolourrangethannormalDVDcamcorderdiscs.

•SomeDivX,MKVandMP4formatdiscsmaynotplay,dependingonthevideoresolutionandframeratecondition.

2.1.8.SupportedFileFormats

VideoFileSupport

2.ProductSpecications

2.2.ChassisProductSpecication

2.ProductSpecications

2.3.OptionProductSpecication

2.ProductSpecications

3.DisassemblyandReassembly

3.1.CabinetandPCB

NOTE

ConnectorMustberemovedwithcare

3.1.1.T opCabinetRemoval

+ 74 hidden pages