
SCT3120AL
N-channel SiC power MOSFET
lPackaging specifications
6) Pb-free lead plating ; RoHS compliant
Basic ordering unit (pcs)
・Switch mode power supplies
lAbsolute maximum ratings (Ta = 25°C)
Recommended Drive Voltage
Continuous drain current
Tc = 25°C
Range of storage temperature
Gate - Source voltage (DC)
Gate-Source Surge Voltage (t
surge
< 300nsec)
(1) Gate
(2) Drain
(3) Source
*1 Body Diode
(1)
(2)
(3)
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Thermal resistance, junction - case
lElectrical characteristics (Ta = 25°C)
Zero gate voltage
drain current
Drain - Source breakdown
voltage
Gate - Source leakage current
Gate - Source leakage current
Static drain - source
on - state resistance
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lElectrical characteristics (Ta = 25°C)
Reverse transfer capacitance
Effective output capacitance,
energy related
V
GS
= 0V
V
DS
= 0V to 300V
Turn - off switching loss
VDD = 300V, ID=6.7A
V
GS
= 18V/0V
RG = 0W L=500mH
*Eon includes diode
reverse recovery
lGate Charge characteristics (Ta = 25°C)
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lBody diode electrical characteristics (Source-Drain) (Ta = 25°C)
*1 Limited only by maximum temperature allowed.
*2 PW 10ms, Duty cycle 1%
*3 Example of acceptable Vgs waveform
*4 Please be advised not to use SiC-MOSFETs with Vgs below 13V as doing so may cause
thermal runaway.
*5 Pulsed
Inverse diode direct current,
pulsed
Inverse diode continuous,
forward current
IF = 6.7A, VR = 300V
di/dt = 1100A/ms
Peak reverse recovery current
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lElectrical characteristic curves
0
20
40
60
80
100
120
0 50 100 150 200
0.001
0.01
0.1
1
10
0.0001 0.001 0.01 0.1 1 10
Fig.1 Power Dissipation Derating Curve
Power Dissipation : P
D
[W]
Case Temperature : TC[°C]
Fig.2 Maximum Safe Operating Area
Drain Current : I
D
[A]
Drain - Source Voltage : VDS[V]
Fig.3 Typical Transient Thermal
Resistance vs. Pulse Width
Transient Thermal Resistance : R
th
[K/W]
0.1
1
10
100
1000
0.1 1 10 100 1000
Operation in this area is limited by R
DS(ON)
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lElectrical characteristic curves
Fig.4 Typical Output Characteristics(I)
Drain Current : I
D
[A]
Drain - Source Voltage : VDS[V]
Fig.5 Typical Output Characteristics(II)
Drain - Source Voltage : VDS[V]
Fig.6 Tj= 150ºC Typical Output
Characteristics(I)
Drain Current : I
D
[A]
Drain - Source Voltage : VDS[V]
Fig.7 Tj= 150ºC Typical Output
Characteristics(II)
Drain Current : I
D
[A]
Drain - Source Voltage : VDS[V]
Drain Current : I
D
[A]
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10
0
1
2
3
4
5
6
7
8
9
10
0 1 2 3 4 5
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10
0
1
2
3
4
5
6
7
8
9
10
0 1 2 3 4 5
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lElectrical characteristic curves
Fig.8 Typical Transfer Characteristics (I)
Drain Current : I
D
[A]
Gate - Source Voltage : VGS[V]
Fig.9 Typical Transfer Characteristics (II)
Gate - Source Voltage : VGS[V]
Fig.10 Gate Threshold Voltage
vs. Junction Temperature
Gate Threshold Voltage : V
GS(th)
[V]
Junction Temperature : Tj[ºC]
Fig.11 Transconductance vs. Drain Current
Transconductance : g
fs
[S]
Drain Current : ID[A]
Drain Current : I
D
[A]
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
0
1
2
3
4
5
6
-50 0 50 100 150 200
0.01
0.1
1
10
100
0 2 4 6 8 10 12 14 16 18 20
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10 12 14 16 18 20
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
V
DS
= 10V
Pulsed
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lElectrical characteristic curves
Fig.12 Static Drain - Source On - State
Resistance vs. Gate - Source Voltage
Static Drain - Source On-State Resistance
: R
DS(on)
[W]
Gate - Source Voltage : VGS[V]
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
Junction Temperature : Tj[ºC]
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current
Drain Current : ID[A]
Static Drain - Source On-State Resistance
: R
DS(on)
[W]
Static Drain - Source On-State Resistance
: R
DS(on)
[W]
0
0.1
0.2
0.3
0.4
0.5
6 8 10 12 14 16 18 20 22
0
0.1
0.2
0.3
0.4
0.5
-50 0 50 100 150 200
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lElectrical characteristic curves
Fig.15 Typical Capacitance
vs. Drain - Source Voltage
Capacitance : C [pF]
Drain - Source Voltage : VDS[V]
Fig.16 Coss Stored Energy
Drain - Source Voltage : VDS[V]
Fig.17 Switching Characteristics
Switching Time : t [ns]
Drain Current : ID[A]
Fig.18 Dynamic Input Characteristics
Gate - Source Voltage : V
GS
[V]
Total Gate Charge : Qg[nC]
Coss Stored Energy : E
OSS
[mJ]
0
1
2
3
4
5
6
0 100 200 300 400
1
10
100
1000
10000
0.1 1 10 100 1000
0
5
10
15
20
0 10 20 30 40
Ta = 25ºC
VDD= 300V
ID = 6.7A
1
10
100
1000
10000
0.1 1 10 100
t
d(on)
t
d(off)
Ta = 25ºC
V
DD
= 300V
V
GS
= 18V
RG = 0W
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lElectrical characteristic curves
Fig.19 Typical Switching Loss
vs. Drain - Source Voltage
Switching Energy : E [mJ]
Drain - Source Voltage : VDS[V]
Fig.20 Typical Switching Loss
vs. Drain Current
Drain Current : ID[A]
Fig.21 Typical Switching Loss
vs. External Gate Resistance
Switching Energy : E [mJ]
External Gate Resistance : RG[W]
Switching Energy : E [mJ]
0
50
100
150
200
0 5 10 15 20
0
10
20
30
40
50
60
70
80
90
100
100 200 300 400 500
0
50
100
150
200
0 5 10 15 20 25 30
Ta= 25ºC
VDD=300V
ID=6.7A
VGS= 18V/0V
L=500mH
E
on
E
off
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lElectrical characteristic curves
Fig.22 Inverse Diode Forward Current
vs. Source - Drain Voltage
Inverse Diode Forward Current : I
S
[A]
Source - Drain Voltage : VSD[V]
Fig.23 Reverse Recovery Time
vs.Inverse Diode Forward Current
Inverse Diode Forward Current : IS[A]
Reverse Recovery Time : t
rr
[ns]
0.01
0.1
1
10
100
0 1 2 3 4 5 6 7 8
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
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Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Switching Energy Measurement Circuit Fig.3-2 Switching Waveforms
Fig.4-1 Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform
V
surge
I
rr
Eon= ID×V
DS
E
off
= ID×V
DS
I
D
V
DS
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Notes
The information contained herein is subject to change without notice.
1)
Before you use our Products, please contact our sales representative and verify the latest specifica-
2)
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
3)
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
4)
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
5)
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
Notice
The Products specified in this document are not designed to be radiation tolerant.
6)
For use of our Products in applications requiring a high degree of reliability (as exemplified
7)
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
8)
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
9)
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
10)
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
11)
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
12)
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
13)
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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R1102
S

SCT3120AL - Web Page
Datasheet
Distribution Inventory
Part Number SCT3120AL
Package TO-247N
Unit Quantity 450
Minimum Package Quantity 30
Packing Type Tube
Constitution Materials List inquiry
RoHS Yes