ROHM SCT2450KEC Datasheet

Page 1
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Datasheet
SCT2450KE
N-channel SiC power MOSFET
V
DSS
R
DS(on)
(Typ.)
I
D
P
D
Features
1) Low on-resistance
2) Fast switching speed
3) Fast reverse recovery
4) Easy to parallel
5) Simple to drive
6) Pb-free lead plating ; RoHS compliant
1200V
450m
10A
85W
Outline
TO-247
(2)
(1)
Inner circuit
(2)
(1)
*1
(3)
Packaging specifications
Packaging
(3)
(1) Gate (2) Drain (3) Source
*1 Body Diode
Tube
Application
• Solar inverters
• Switch mode power supplies
• Induction heating
• Motor drives
Absolute maximum ratings (Ta = 25°C)
Parameter
Drain - Source voltage
T
= 25°C
c
Continuous drain current
T
= 100°C
c
Pulsed drain current
Reel size (mm) Tape width (mm) -
Type
Basic ordering unit (pcs) Packing code Marking
SCT2450KE
Symbol Value Unit
V
DSS
I
D
I
D
I
D,pulse
*1
*1
*2
1200 V
10 A
7A
25 A
-
30
C
Gate - Source voltage (DC) Gate - Source surge voltage (T Power dissipation (T
= 25°C) P
c
Junction temperature Range of storage tem per at ure
˂ 300nsec)
surge
1/12
V
GSS
V
GSS-surge
T
T
stg
6 to 22
*3
D
j
10 to 26
85 W
175 °C
55 to 175
2017.07 - Rev.D
V V
°C
Page 2
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Datasheet
SCT2450KE
Thermal resistance
Parameter Symbol
Values
Unit
Min. Typ. Max. Thermal resistance, junction - case Thermal resistance, junction - am bient Soldering temperature, wavesoldering for 10s
Electrical characteristics (T
= 25°C)
a
Parameter Symbol Conditions
Drain - Source breakdown voltage
Zero gate voltage drain current
Gate - Source leakage curr ent
V
(BR)DSSVGS
I
DSS
I
GSS
= 0V, ID = 1mA
V
= 1200V, V
DS
T
= 25°C
j
T
= 150°C
j
V
= 22V, V
GS
R R
T
DS
thJC
thJA
sold
GS
= 0V
= 0V
- 1.36 1.77 °C/W
--50
- - 265
Values
Min. Typ. Max.
1200 -
-V
-110
-2
-
- - 100 nA
°C/W
°C
Unit
A
Gate - Source leakage curr ent Gate threshold voltage
I
GSS
V
GS (th)
V
GS
V
DS
*1 Limited only by maximum temperature allowed. *2 PW 10s, Duty cycle 1%
*3 Example of acceptable Vgs waveform
= 6V, V
DS
= 0V
= VGS, ID = 0.9mA
--
1.6 2.8
100
4.0 V
nA
*4 Pulsed
2/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristics (T
Parameter Symbol Conditions
Static drain - source on - state resistance
Gate input resistance Transconductance Input capacitance
Reverse transfer capacitance Effective output capacitance,
energy related Turn - on delay time
Rise time Turn - off delay time Fall time
= 25°C)
a
R
DS(on)
R
g
C
C
C
C
t
d(on)
t
t
d(off)
t
G
fs
iss
oss
rss
o(er)
*4
r
*4
f
V
= 18V, ID = 3A
GS
*4
= 25°C
T
j
T
= 125°C
j
f = 1MHz, open drain - 25
*4
V
= 10V, ID = 3A
DS
V
= 0V
GS
= 800V
V
DS
f = 1MHz ­V
= 0V
GS
= 0V to 500V
V
DS
*4
V
*4
= 400V, V
DD
= 3A
I
D
RL = 133
GS
= 18V
RG = 0
Values
Min. Typ. Max.
- 450 585
- 610 -
-
- 1.0 -
- 463 -
-21­4-
-31-
-19-
-17-
-38-
-34-
Unit
m
S
pFOutput capacitance
pF
ns
Turn - on switching loss
Turn - off switching loss
Gate Charge characteristics (T
Parameter Symbol Conditions
Total gate charge
Gate - Drain charge Gate plateau voltage
*4
E
on
*4
E
off
= 25°C)
a
*4
Q
g
*4
Q
gs
*4
Q
gd
V
(plateau)
VDD = 600V, ID=3A
= 18V/0V
V
GS
= 0, L=500H
R
G
includes diode
*E
on
reverse recovery
V
= 400V
DD
ID = 3A VGS = 18V V
= 400V, ID = 3A
DD
-47-
-17-
Values
Min. Typ. Max.
-27-
-7-
-9-
- 10.5 -
J
Unit
nCGate - Source charge
V
3/12
2017.07 - Rev.D
Page 4
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Datasheet
SCT2450KE
Body diode electrical characteristics (Source-Drain) (T
Parameter Symbol Conditions
Inverse diode continuous, forward current
*1
I
S
Tc = 25°C
Inverse diode direct current, pulsed
Forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current
*2
I
SM
*4
V
V
SD
*4
t
rr
*4
Q
rr
*4
I
rrm
= 0V, IS = 3A
GS
IF = 3A, VR = 400V di/dt = 110A/s
= 25°C)
a
Values
Unit
Min. Typ. Max.
--10
A
--25A
-4.3-
V
-19-ns
-13-nC
-1.4- A
Typical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
R
th1
R
th2
R
th3
230m 687m 441m
K/W
C
th1
C
th2
C
th3
219
1.29m
13.1m
Ws/K
4/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
90 80 70
[W]
D
60 50 40 30 20
Power Dissipation : P
10
0
0 50 100 150 200
Junction Temperature : Tj[°C]
Fig.2 Maximum Safe Operating Area
100
PW = 100s
10
[A]
D
1
Operation in this area
Drain Current : I
0.1
0.01
0.1 1 10 100 1000 10000
is limited by R
Ta=25ºC Single Pulse
DS
Drain - Source Voltage : V
PW = 1ms
PW = 10ms
(on)
PW = 100ms
[V]
DS
Fig.3 Typical Transient Thermal
Resistance vs. Pulse Width
10
[K/W]
th
Transient Thermal Resistance : R
0.01
Ta=25ºC Single Pulse
1
0.1
0.0001 0.001 0.01 0.1 1 10
Pulse Width : PW[s]
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2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.4 Typical Output Characteristics(I)
10
[A]
D
Drain Current : I
8
6
4
2
0
0246810
20V
18V
16V
Ta=25ºC Pulsed
VGS= 8V
Drain - Source Voltage : VDS[V]
14V
12V
10V
Fig.5 Typical Output Characteristics(II)
[A]
D
Drain Current : I
5
4
3
2
1
0
012345
20V
18V
16V
Drain - Source Voltage : V
14V
12V
10V
VGS= 8V
Ta=25ºC Pulsed
[V]
DS
[A]
D
Drain Current : I
Fig.6 T
= 150°C Typical Output
j
Characteristics(I)
10
Ta=150ºC Pulsed
8
16V
6
4
2
0
0246810
14V
Drain - Source Voltage : VDS[V]
20V
18V
12V
10V
VGS= 8V
[A]
D
Drain Current : I
Fig.7 T
= 150°C Typical Output
j
Characteristics(II)
5
20V
4
3
2
1
0
012345
Drain - Source Voltage : VDS[V]
16V
14V
18V
12V
10V
VGS= 8V
Ta=150ºC Pulsed
6/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.9 Typical Transfer Characteristics (II)Fig.8 Typical Transfer Characteristics (I)
10
VDS= 10V Plused
1
[A]
D
0.1
Drain Current : I
0.01
0.001 0 2 4 6 8 10 12 14 16 18 20
Gate - Source Voltage : V
Fig.10 Gate Threshold Voltage
vs. Junction Temperature
5
4.5
[V]
4
GS(th)
3.5 3
Ta=150ºC Ta=75ºC
=25ºC
T
a
T
= 25ºC
a
VDS= 10V ID= 1mA
GS
[V]
10
VDS= 10V
9
Plused
8 7
[A]
D
6 5
Drain Current : I
4 3 2
Ta=150ºC Ta=75ºC
=25ºC
T
a
T
= 25ºC
a
1 0
0 2 4 6 8 10 12 14 16 18 20
Gate - Source Voltage : V
GS
[V]
Fig.11 Transconductance vs. Drain Current
10
VDS= 10V Plused
[S]
fs
1
2.5 2
1.5 1
0.5
Gate Threshold Voltage : V
0
-50 0 50 100 150 200
Junction Temperature : Tj[°C]
7/12
0.1 Ta=150ºC
Ta=75ºC
Transconductance : g
=25ºC
T
a
T
= 25ºC
a
0.01
0.01 0.1 1 10
Drain Current : ID[A]
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
1.4
1.2
1
ID = 6A
Static Drain - Source On-State Resis tance
[]
DS(on)
: R
0.8
0.6
0.4
0.2
0
6 8 10 12 14 16 18 20 22
ID = 3A
Gate - Source Voltage : VGS[V]
Ta=25ºC Pulsed
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
1
VGS= 18V
0.9
Plused
0.8
Static Drain - Source On-State Resis tance
0.7
0.6
[]
0.5
DS(on)
0.4
: R
0.3
0.2
0.1
0
-50 0 50 100 150 200
Junction Temperature : Tj[ºC]
ID = 6A
ID = 3A
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current
10
VGS= 18V Plused
[]
1
DS(on)
: R
0.1
Static Drain - Source On-State Resis tance
0.1 1 10 100
Drain Current : ID[A]
Ta=150ºC Ta=125ºC
=75ºC
T
a
=25ºC
T
a
T
= 25ºC
a
8/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.15 Typical Capacitance
vs. Drain - Source Voltage
10000
1000
100
Capacitance : C [pF]
10
Ta=25ºC
Ta=25ºC f = 1MHz
f = 1MHz
= 0V
= 0V
V
V
GS
GS
1
0.1 1 10 100 1000
Drain - Source Voltage : VDS[V]
Fig.16 Coss Stored Energy
10
Ta=25ºC
9
[J]
8
C
C
iss
iss
C
C
oss
oss
C
C
rss
rss
OSS
Coss Stored Energy : E
7 6 5 4 3 2 1 0
0 200 400 600 800
Drain - Source Voltage : VDS[V]
Fig.17 Switching Characteristics
10000
t
t
d(on)
f
t
d(off)
t
r
Drain Current : ID[A]
Switching Time : t [ns]
1000
100
10
1
0.1 1 10 100
Ta= 25ºC VDD= 400V
= 18V
V
GS
R
= 0
G
Pulsed
Fig.18 Dynamic Input Characteristics
20
Ta= 25ºC
[V]
GS
Gate - Source Voltage : V
VDD= 400V
= 3A
I
D
Pulsed
15
10
5
0
0 5 10 15 20 25 30
Total Gate Charge : Qg[nC]
9/12
2017.07 - Rev.D
Page 10
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.19 Typical Switching Loss
vs. Drain - Source Voltage
100
Ta= 25ºC
90
ID= 3A
= 18V/0V
V
80 70 60 50 40 30
Switching Energy : E [J]
20 10
GS
R
= 0
G
L=500H
0
0 200 400 600 800 1000
Drain - Source Voltage : VDS[V]
Fig.20 Typical Switching Loss
vs. Drain Current
300
Ta= 25ºC
250
E
on
200
150
100
E
off
Switching Energy : E [J]
VDD= 600V
= 18V/0V
V
GS
R
= 0
G
L=500H
E
on
E
50
off
0
024681012
Drain Current : ID[A]
Fig.21 Typical Switching Loss
vs. External Gate Resistance
120 110 100
90 80 70 60 50 40 30
Switching Energy : E [J]
20 10
Ta= 25ºC VDD= 600V
= 3A
I
D
= 18V/0V
V
GS
L=500H
0
0 5 10 15 20 25 30
External Gate Resistance : RG[]
E
on
E
off
10/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Electrical characteristic curves
Fig.22 Inverse Diode Forward Current
vs. Source - Drain Voltage
10
[A]
S
0.1
Inverse Diode Forward Current : I
0.01
VGS=0V Pulsed
1
Ta=150ºC Ta=75ºC
=25ºC
T
a
T
= 25ºC
a
012345678
Source - Drain Voltage : VSD[V]
Fig.23 Reverse Recovery Time
vs.Inverse Diode Forward Current
1000
Ta=25ºC
[ns]
rr
100
Reverse Recovery Time : t
10
110
Inverse Diode Forward Current : IS[A]
di / dt = 110A / s V
R
VGS= 0V Pulsed
= 400V
11/12
2017.07 - Rev.D
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Datasheet
SCT2450KE
Measurement circuits
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms
Pulse width
50%
10%
90%
10% 10%
RG
VGS
D.U.T.
D
I
VDS
RL
V
GS
V
DS
VDD
90% 90%
t
d(on)
t
r
t
on
t
d(off)
t
off
Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform
V
G
Q
g
V
GS
Q
gs
Q
gd
I
G(Const.)
V
GS
D
I
V
DS
R
L
D.U.T.
V
DD
Charge
Fig.3-1 Switching Energy Measurement Circuit Fig.3-2 Switching Waveforms
Same type
D.U. T.
device as D.U.T.
R
G
Eon= ID×V
L
I
F
V
DRIVER MOSFET
D.U.T.
I
D
DD
V
DS
I
D
DS
I
rr
E
off
50%
t
= ID×V
f
DS
V
surge
Fig.4-1 Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform
I
F
D.U.T.
D.U. T.
R
G
I
F
DRIVER MOSFET
L
V
DD
0
t
rr
rr
I
d
rr
Irr 90%
Irr 100%
/ d
Irr 10%
t
12/12
2017.07 - Rev.D
Page 13
Notes
The information contained herein is subject to change without notice.
1)
Before you use our Products, please contact our sales representative and verify the latest specifica-
2) tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
3) ductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
4) provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
5) examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information.
Notice
The Products specified in this document are not designed to be radiation tolerant.
6)
For use of our Products in applications requiring a high degree of reliability (as exemplified
7) below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
8) equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
9) the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
10) document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.
Please use the Products in accordance with any applicable environmental laws and regulations,
11) such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
12) you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
13) ROHM.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
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R1102
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Page 14
DatasheetDatasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall not be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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